TW201222908A - Manufacturing method of piezoelectric device and piezoelectric device - Google Patents

Manufacturing method of piezoelectric device and piezoelectric device Download PDF

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Publication number
TW201222908A
TW201222908A TW100132935A TW100132935A TW201222908A TW 201222908 A TW201222908 A TW 201222908A TW 100132935 A TW100132935 A TW 100132935A TW 100132935 A TW100132935 A TW 100132935A TW 201222908 A TW201222908 A TW 201222908A
Authority
TW
Taiwan
Prior art keywords
base
crystal
electrode
wafer
manufacturing
Prior art date
Application number
TW100132935A
Other languages
English (en)
Chinese (zh)
Inventor
Ryoichi Ichikawa
Yoshiaki Amano
Kenji Kamezawa
Original Assignee
Nihon Dempa Kogyo Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co filed Critical Nihon Dempa Kogyo Co
Publication of TW201222908A publication Critical patent/TW201222908A/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
TW100132935A 2010-09-22 2011-09-14 Manufacturing method of piezoelectric device and piezoelectric device TW201222908A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010212089 2010-09-22
JP2011053848A JP2012090252A (ja) 2010-09-22 2011-03-11 圧電デバイスの製造方法及び圧電デバイス

Publications (1)

Publication Number Publication Date
TW201222908A true TW201222908A (en) 2012-06-01

Family

ID=45817119

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100132935A TW201222908A (en) 2010-09-22 2011-09-14 Manufacturing method of piezoelectric device and piezoelectric device

Country Status (4)

Country Link
US (1) US20120068579A1 (https=)
JP (1) JP2012090252A (https=)
CN (1) CN102412801A (https=)
TW (1) TW201222908A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5384406B2 (ja) * 2010-03-30 2014-01-08 日本電波工業株式会社 音叉型水晶振動片の製造方法、水晶デバイス
JP5588784B2 (ja) * 2010-08-20 2014-09-10 日本電波工業株式会社 圧電デバイスの製造方法及び圧電デバイス
JP2013192027A (ja) * 2012-03-14 2013-09-26 Nippon Dempa Kogyo Co Ltd 圧電デバイス
JP2016039516A (ja) * 2014-08-08 2016-03-22 日本電波工業株式会社 圧電デバイス
US11623247B2 (en) * 2016-02-08 2023-04-11 Konica Minolta, Inc. Method for producing piezoelectric element, and piezoelectric element
CN115955209B (zh) * 2022-12-05 2024-03-19 泰晶科技股份有限公司 一种晶体谐振器及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58146117A (ja) * 1982-02-24 1983-08-31 Kinseki Kk 圧電振動子の製造方法
JP2001267875A (ja) * 2000-03-22 2001-09-28 Seiko Epson Corp 水晶振動子及びその製造方法
WO2001091167A1 (en) * 2000-05-25 2001-11-29 Toppan Printing Co., Ltd. Substrate for transfer mask, transfer mask, and method of manufacture thereof
JP2002033632A (ja) * 2000-07-14 2002-01-31 Seiko Instruments Inc 水晶振動子の製造方法
JP2006238266A (ja) * 2005-02-28 2006-09-07 Seiko Epson Corp 圧電振動片、及び圧電振動子
JP4777744B2 (ja) * 2005-11-01 2011-09-21 セイコーインスツル株式会社 圧電振動子用ウェハ体及び圧電振動子の製造方法
JP4777745B2 (ja) * 2005-11-01 2011-09-21 セイコーインスツル株式会社 圧電振動子及びこれを備える発振器、電波時計並びに電子機器
JP2007258917A (ja) * 2006-03-22 2007-10-04 Epson Toyocom Corp 圧電デバイス
CN101068107A (zh) * 2006-05-01 2007-11-07 爱普生拓优科梦株式会社 压电振子及其制造方法
JP2008283243A (ja) * 2007-05-08 2008-11-20 Nec Tokin Corp 圧電振動子および圧電振動ジャイロ
JP2009060478A (ja) * 2007-09-03 2009-03-19 Nippon Dempa Kogyo Co Ltd 圧電振動片の製造方法及び音叉型圧電振動片
JP5278044B2 (ja) * 2009-02-27 2013-09-04 株式会社大真空 パッケージ部材および該パッケージ部材の製造方法および該パッケージ部材を用いた圧電振動デバイス

Also Published As

Publication number Publication date
JP2012090252A (ja) 2012-05-10
CN102412801A (zh) 2012-04-11
US20120068579A1 (en) 2012-03-22

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