TW201222689A - Method for manufacturing electronic device, device and a pair of pressurization members thereof - Google Patents

Method for manufacturing electronic device, device and a pair of pressurization members thereof Download PDF

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Publication number
TW201222689A
TW201222689A TW100113854A TW100113854A TW201222689A TW 201222689 A TW201222689 A TW 201222689A TW 100113854 A TW100113854 A TW 100113854A TW 100113854 A TW100113854 A TW 100113854A TW 201222689 A TW201222689 A TW 201222689A
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TW
Taiwan
Prior art keywords
laminated body
electronic component
terminal
groove
laminated
Prior art date
Application number
TW100113854A
Other languages
Chinese (zh)
Inventor
Toru Meura
Hiroki Nikaido
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW201222689A publication Critical patent/TW201222689A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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Abstract

The present invention relates to the method for manufacturing electronic device comprising the first electronic component (1) and the second electronic component (2); the first electronic component (1) includes the first end with soldering layer on its surface, and the second electronic component (2) includes the second end connecting to the first end of the first electronic component (1). The method comprising the steps of disposing a plurality of the first end of the first electronic component (1) opposing to a plurality of the second end of the second electronic component (2), respectively; providing a resin layer (3) between each first end and second end to form a plurality of laminated body; heating the plurality of laminated body at the same time while clamping the plurality of laminated body from the direction of laminating the laminated body.

Description

201222689 六、發明說明： 【發明所屬之技術領域】 本發明，係關於一種使相對之端子，以焊錫所接合之電子 裝置之製造方法及裝置，和其一對挾壓構件。 【先前技術】 電子裝置，例如，係藉由將半導體元件之端子與其他半導 體元件之端子、半導體元件之端子與基板之端子、或者、基 板之端子與其他基板之端子，運用焊錫進行接合步驟而加以 製造。 在於使用焊錫進行接合後之半導體元件間、半導體元件與 基板之間、或基板間（以下，稱為半導體元件間等），因為會 產生空隙，故必須利用樹脂之固化物填埋空隙。 習知，係於使用焊錫進行接合後，會使流動性之熱固化性 樹脂，流入至半導體元件間等，然後，藉由使樹脂固化，填 埋半導體元件間等之空隙。然而，於上述方法中，因為難以 使具流動性之熱固化性樹脂不留空隙地流入至，半導體元件 間等，因此於專利文獻1中，提出有如下方法。 於專利文獻1中，揭示有於基板表面配置薄膜狀之止封樹 脂(underfill resin)，其後，於止封樹脂上搭載半導體元件之 方法及裝置。於專利文獻1，若在止封樹脂上搭載半導體元 件之後，將半導體元件壓接於基板，在形成半導體元件與基 板之積層體之後，於高壓環境中使止封樹脂固化。 100113854 4 201222689 [先前技術文獻] [專利文獻] 專利文獻1 :曰本專利特開2004-311709號公報 【發明内容】 (發明所欲解決之問題） 本發明者等’於電子裝置之量產時，思考過以下的方法。 首先，於熱板上，配置使熱固化性樹脂層分別配置之複數片 之基板。其後，於熱固化性樹脂層上，配置半導體元件。 此時，將半導體元件之端子貫通熱固化性樹脂層，並以與 基板之端子接觸之方式，對熱固化性樹脂層上之半導體元件 細加負重，壓接成為積層體。重複此操作而獲得複數個之積 層體。其後，將積層體之半導體元件、及基板之同為端子互 相接合，同時對樹脂層進行加壓硬化。 然而，於此方法中，由於熱固化性樹脂層藉由熱板，成為 加熱狀態，故會使固化緩慢地進行。於壓接第一個積層體之 基板與半導體元件L將導致與上述基板不同之其他基 板上之熱固化性樹脂層之固化持續進行。 因此’壓接第-個基板與半導體元件之力道、與塵接最後 之基板與半㈣元件之力叙差異很大。藉此，在設置於基 板之端子與設置於半導體元件之端子之間產生導通不良，而 有信賴性降低之擔憂。 再者’在此處’雖然已針對製作基板與半導體元件之積層 100113854 5 201222689 體之情形進行陳述，但不限定於此，於製作同為基板、同為 半導體元件之積層體時，亦會產生同樣之問題。 本發明係鑒於如上所述之問題而完成者，其在於提供一種 可穩定地製造可靠性高之電子裝置的電子裝置之製造方法 及裝置、和其挾麗構件。 (解決問題之手段） 根據本發明，係提供一種電子裝置之製造方法，該電子裝 置具備：第一電子零件，其包含於表面具有焊錫層之第一端 子；及第二電子零件，其包含接合於此第一電子零件之第一 端子之第二端子； 提供包含： 將含有助焊活性化合物與熱固化性樹脂之樹脂層，配置於 第一電子零件之第一端子與第二電子零件之第二端子之 間，以獲得積層體之步驟； 將積層體加熱至第一端子之焊錫層之熔點以上而使第一 端子與第二端子進行焊接之步驟；及 利用流體一邊對積層體加壓一邊使樹脂層固化之步驟； 於獲得積層體之步驟，將複數個之第一電子零件之第一端 子與複數個之第二零件之第二端子分別配置為對向， 於各第一端子與第二端子之間配置樹脂層而形成複數個 之積層體。 一邊加熱複數個之積層體一邊將複數個之積層體同時自 100113854 6 201222689 積層體的積層方向挾壓。 根據本發明，一邊加熱複數個之積層體，一邊將複數個之 積層體同時自積層體之積層方向挾壓。藉此，於一邊加熱第 一個積層體之第一電子零件與第二電子零件一邊進行挾壓 之期間，可抑制構成其他積層體之熱固化性樹脂之固化持續 進行。因此，可穩定地製造可靠性高之電子裝置。 又，根據本發明，亦可提供一種裝置，於包含在表面具有 焊錫層之第一端子之第一電子零件的上述第一端子，與具有 接合於此第一電子零件的上述第一端子之第二端子之第二 電子零件的上述第二端子之間，配合含有助焊活性化合物與 熱固化性樹脂之樹脂層，並於形成積層體之後，用以使上述 第一端子與上述第二端子接觸，並具備同時夾壓複數個積層 體之挾壓構件。 再者，根據本發明，亦可提供上述電子裝置之製造裝置之 挾壓構件。即，根據本發明，亦可提供一種挾壓構件，該挾 壓構件形成一對挾壓構件之溝槽，且形成至少一方為上下對 稱。 (發明效果） 根據本發明，係提供可穩定地製造可靠性高之電子裝置之 電子裝置之製造方法及裝置。 【實施方式】 以下，根據圖式說明本發明之實施形態。首先，參照圖1 100113854 7 201222689 至圖5’針對本實施形態之電子裝置之製造方法之概 說明。 丁 本實施形態之電子裝置之製造方法，該電子裝置係具備： 第一電子零件卜其包含於表面具有焊錫層112之第—端子 11，及第二電子零件2 ,其包含接合於此第一電子零件1之 第一端子11之第二端子21。 此電子裝置之製造方法，係包含：於第一電子零件】之第 -端子U與第二電子零件2之第二端子21 &間，配置含有 助焊活性化合物與熱固化性樹脂之樹脂層3以獲得積層體* 之步驟；將積層體4加熱至第一端子n之焊錫層ιΐ2之炫 點以上，而使第一端+ u與第二端+ 21進行焊接之步驟； 以及-邊藉由流體對積層體4加壓，—邊使樹脂層⑽化之 步驟。 於獲得積層體4之上述步驟，使複數個之第一電子零件^ 之第-端子11與複數個之第二電子零件2之第二端子 分別配置為對向，並於各第—端子u與各第二端子Μ之間 配置樹脂層3而形成複數個之積層體4，一邊對複數個之積 層體4進行加熱，—邊自積層體4之積層方向㈣挾屢複數 個之積層體4。 /妾著W對本實施形態之電子裝置之製造方法詳細地進行 說明。首先，如圖1所示，準備第—電子零件1。此第—電 子零件卜係例如’為基板(軟性基板、剛性基板、陶究基 100113854 201222689 板等）、半導體晶片、搭載半導體元件之基板等。 此第一電子零件1具備第—端子u，而此第-端子u， 係包含第-端子本體m、及設置於第—端子本體⑴表面 之焊錫層112。第-端子本冑lu之形狀，並無特別之限定， 可列舉凸狀者或凹狀者。又，第—端子本體⑴之材質，並 無特別之限制’可列舉金、銅、鎳、鈀、鋁。 焊錫層112之材料，並無特別之限制，可列舉由锡、銀、 船、鋅，、銦及銅所組成之群組中選擇至少包含兩種以上 之合金等。此等之中，由錫、銀、錯、鋅、銅所組成之群組 中選擇至少包含兩種以上之合金為佳。 日焊錫層m之炼點，為110〜25(rc，較佳為17〇〜2赃。 知錫層112，亦可為對第—端子本體⑴進行焊劑電鍵者， 又’亦可為對第—端子本體ηι配置焊錫球或焊錫膏，並由 焊錫凸塊等所構成者。 ，於此’如圖6所示，第—電子零件卜係由複數個相連) 瓜成例如’當第—電子零件丨為基板時，各同為基板互 連接而構成-塊大型的基板。再者，於大型基板上，/ :虛線所示’形成有用以切開同為第一電子零件丨之切彳 /妾著’準備第二電子零件2(參照圖1}。第二電子零件 係例如’為半導體晶片、或搭财導體元件之基板。此寄 電子零件2 ’具有第二端子21。 100113854 201222689 第一端子21之形狀， 端子"為可進行焊接之形狀只㈣ 或凹狀者。又，第二踹；，， 幻舉凸狀者、 . 子21之材質，並無特別之限制，可 列舉金、銅、鎳、鈀、鋁等。 ^ 接著，·如圖2所示，於第一電子零们之第-端子u、 =一電子零件2之第二端子21之間配置含有助焊活性化 =、及_化性樹脂之樹脂層3,並將第—端子u與第 一立而子21進行對位。 於此處，將複數個之第—電子零件1與複數個之第二電子 零件2進行對位’此步驟中，可獲得使樹脂層3配置於第 -電子零件卜與第二電子零件2之間之複數個之積層體心 再者’複數個之積層體4，例如排列於面内方向。 於此處，第二電子零件2之第二端子2卜並未成為壓陷 入樹脂層3而與第—端子η接觸之狀態。但是，在使樹脂 層3介入於第一端子】！與第二端子21之間的狀態下，第一 端子11與第二端子21亦可接觸。 樹脂層3之構成，係含有可填埋於第一電子零件丨、與第 二電子零件2之空隙之熱固化性樹脂。樹脂層3所含之熱固 化性樹脂，可使用例如環氧樹脂、氧雜環丁烷樹脂、酚樹脂、 (曱基）丙烯酸酯樹脂、不飽和聚酯樹脂、鄰苯二甲酸二稀丙 酉曰树脂、馬來酿亞胺樹脂寺。此等’可單獨或將兩種以上混 合使用。 100113854 10 201222689 其中’以使用有固化性與保存性、固化物之耐熱性、抗濕 性、及抗樂性優異之環氧樹脂為佳。樹脂層3在於⑽〜 2〇〇°C時之最低熔融黏度，較佳為】〜〗〇〇〇&· s，特佳為1 〜500 Pa · s。 由於樹脂層3在於100〜·。c時之最低溶融黏度位於上 述摩巳圍’固化物中將難以產生空隙(孔隙）。最低炫融黏度， 例如，使用作為黏彈性測定裝置之流變計（rheometer)a 10 c/分之升溫速度對薄膜狀態之樣本賦予頻率為】Hz之剪力 (shear)以進行測定。 樹脂層3，係於焊接時，$有將焊錫^ 112之表面之氧化 覆膜去除之作㈣樹脂層。樹脂層3，因為藉由具有助焊作 用’將覆蓋焊錫層112之表面之氧化覆膜去除，故可進行焊 接。 為使樹脂層3具有助焊作用，樹脂層3，必須含有助焊活 性化合物。作為職層3所含有之料活性化合物，只要為 可用於焊接者，雖然並無_之限制，但以含㈣基、酶經 基之任-者、或具備、—基之兩者之化合物等為佳。 _ 樹脂層3中之助焊活性化合物之組合量，係以卜30重量 %為佳’以3〜2 0重量％為牲/土 lXt 巧特佳。樹脂層3中之助焊活性化 -^物之組合量’根據上述_，可使樹脂層3之助焊活性提 门同夺於防止Μ月日層3中’可防止熱固化性樹脂與未反應 之助焊活性化合物之殘留。 100113854 11 201222689 再者，若有未反應之助焊活性化合物殘留，就可能會產生 位移（migration)。又，於作為熱固化性樹脂之固化劑而發揮 作用之化合物中，存在亦具有助焊作用之化合物（以下，將 此種化合物亦記載為助焊活性固化劑）。 例如，作為環氧樹脂之固化劑而發揮作用之酚系酚醛清漆 樹脂、曱酚酚醛清漆樹脂、脂肪族二羧酸、芳香族二羧酸等， 亦具有助焊作用。 如此，將含有作為助焊活性化合物既可發揮作用，且作為 熱固化性樹脂之固化劑亦可發揮作用之助焊活性固化劑作 為熱固化性樹脂之固化劑之樹脂層3，係成為具有助焊作用 之樹脂層3。 再者，所謂具備羧基之助焊活性化合物，係指於分子中存 在一個以上之羧基者，既可為液狀亦可為固體。又，所謂具 備紛系經基之助焊活性化合物，係指於分子中存在一個以上 之酚系羥基者，既可為液狀，亦可為固體。 又，所謂具備羧基及酚系羥基之助焊活性化合物，係指於 分子中分別存在一個以上之羧基及酚系羥基者，既可為液 狀，亦可為固體。 於此等之中，作為具備羧基之助焊活性化合物，可列舉脂 肪族酸酐、脂環族酸酐、芳香族酸酐、脂肪族羧酸、及芳香 族缓酸等。 作為關於具備羧基之助焊活性化合物之脂肪族酸酐，可列 100113854 12 201222689 舉軸'聚己二酸軒、聚壬二酸軒、及聚癸二_等。 :作―具倾基之助焊活性化合物之脂環族酸肝’可列 牛甲土四氫苯—甲H甲基六氫笨二甲酸酐、甲基雙環庚 浠二甲酸酐、六氫笨二甲酸酐、四氫苯二甲酸酐、三烧基四 氫苯二曱酸酐、及曱基環己烯二甲酸酐等。 作為關於具備縣之助焊活性化合物之芳香紐針，可列 舉鄰苯二甲酸酐、偏笨三酸酐、均苯四甲酸二針、二苯甲綱 四曱酉文一酐、乙—醇雙偏苯三酸酐§旨、及三偏苯三甲酸甘油 酯等。 作為關於具備羧基之助焊活性化合物之脂肪族羧酸，可列 舉於下述通式（1)所表示之化合物、或甲酸、乙酸、丙酸、 丁酉义、戊酉欠、二曱基乙酸、己酸、辛酸、月桂酸、肉豆籍酸、 棕櫚酸、硬脂酸、丙烯酸、曱基丙烯酸、丁烯酸、油酸、反 丁烯二酸、順丁烯二酸、草酸、丙二酸、及琉珀酸等。 [化1] HOOC-(CH2)n-COOH (1) 式（1)中，η表示20以下之自然數。 作為關於具備羧基之助焊活性化合物之芳香族羧酸’可列 ，- 舉苯甲酸、鄰苯二甲酸、間苯二甲酸、對苯二曱酸、丨，2,3· ' 苯三甲酸、偏苯三甲酸、均苯三甲酸、丨，2,3,5-苯四曱酸、 1，2,3,4-苯四甲酸、均苯四甲酸、苯六甲酸、甲苯酸、二甲 基苯甲酸、2,3-二曱基苯甲酸、3,5-二甲基苯甲酸、2,3,4-二 100113854 13 201222689 曱基苯曱酸、曱苯曱酸、肉桂酸、水揚酸、2,3_二羥基苯曱 酸、2,4-二羥基苯曱酸、龍膽酸(2,5-二羥基苯曱酸）、2,6_二 羥基苯甲酸、3,5-二羥基苯曱酸、浸食子酸(3,4,5_三羥基苯 曱酸）、1,4-二羥基-2-萘曱酸、3,5-二羥基萘甲酸等之萘甲 酸衍生物、及還原酚酞、雙酚酸等。 於此等具備叛基之助焊活性化合物之中，就助焊活性化合 物所具有之活性度、於樹脂層固化時之釋氣(〇utgas)之產生 量、及固化後之樹脂層之彈性模數或玻璃轉移溫度等之平衡 性良好而言’以於上述通式（1)所表示之化合物為佳。 而且，於上述通式（1)所表示之化合物中，就式（1)中之n 為3〜10之化合物’可抑制於固化後之樹脂層之彈性模數的 增加’同時可提升第一電子零件1與第二電子零件2之黏著 性而言，係為特佳。 於上述通式（1)所表示之化合物中，作為式（1)中之η為3201222689 VI. Description of the Invention: [Technical Field] The present invention relates to a method and an apparatus for manufacturing an electronic device in which opposite terminals are soldered, and a pair of rolling members. [Prior Art] For example, the electronic device is bonded to the terminal of the semiconductor element, the terminal of the semiconductor element, the terminal of the semiconductor element, the terminal of the substrate, or the terminal of the substrate and the terminal of the other substrate by soldering. Made. In the case of bonding between semiconductor elements after soldering using solder, between semiconductor elements and substrates, or between substrates (hereinafter referred to as between semiconductor elements), voids are generated, and it is necessary to fill voids with a cured resin. Conventionally, after bonding by soldering, a fluid thermosetting resin is allowed to flow into the semiconductor element or the like, and then the resin is cured to fill a space between the semiconductor elements. However, in the above method, it is difficult to cause the fluid curable thermosetting resin to flow into the semiconductor element or the like without leaving a gap. Therefore, Patent Document 1 proposes the following method. Patent Document 1 discloses a method and an apparatus for mounting a film-shaped underfill resin on a substrate surface, and then mounting a semiconductor element on a sealing resin. In Patent Document 1, after the semiconductor element is mounted on the sealing resin, the semiconductor element is pressure-bonded to the substrate, and after forming the laminated body of the semiconductor element and the substrate, the sealing resin is cured in a high-pressure environment. [PRIOR ART DOCUMENT] [Patent Document 1] Patent Document 1: JP-A-2004-311709 (Summary of the Invention) The present inventors have been in the mass production of electronic devices. I thought about the following methods. First, a plurality of substrates each having a thermosetting resin layer disposed thereon are disposed on a hot plate. Thereafter, a semiconductor element is placed on the thermosetting resin layer. At this time, the terminal of the semiconductor element is passed through the thermosetting resin layer, and the semiconductor element on the thermosetting resin layer is finely loaded so as to be in contact with the terminal of the substrate, and is pressure-bonded to form a laminate. Repeat this operation to obtain a plurality of layers. Thereafter, the semiconductor element of the laminated body and the substrate are bonded to each other as a terminal, and the resin layer is press-hardened. However, in this method, since the thermosetting resin layer is heated by the hot plate, the curing proceeds slowly. The bonding of the substrate of the first laminate to the semiconductor element L causes the curing of the thermosetting resin layer on the other substrate different from the above substrate to continue. Therefore, the force of crimping the first substrate and the semiconductor element, and the force of the last substrate and the half (four) element of the dust are greatly different. As a result, a conduction failure occurs between the terminal provided on the substrate and the terminal provided on the semiconductor element, and the reliability is lowered. In addition, although "herein" has been described for the case where the substrate and the semiconductor device are laminated 100113854 5 201222689, the present invention is not limited thereto, and may be produced when a laminate which is the same substrate and is also a semiconductor element is produced. The same problem. The present invention has been made in view of the above problems, and provides a method and an apparatus for manufacturing an electronic device which can stably manufacture an electronic device having high reliability, and a beautiful member thereof. Means for Solving the Problems According to the present invention, there is provided a method of manufacturing an electronic device comprising: a first electronic component including a first terminal having a solder layer on a surface thereof; and a second electronic component including a bonding a second terminal of the first terminal of the first electronic component; providing: a resin layer containing the fluxing active compound and the thermosetting resin, disposed in the first terminal and the second electronic component of the first electronic component a step of obtaining a laminated body between the two terminals; a step of heating the laminated body to a temperature higher than a melting point of the solder layer of the first terminal to solder the first terminal and the second terminal; and pressurizing the laminated body while using the fluid a step of curing the resin layer; in the step of obtaining the laminated body, the first terminal of the plurality of first electronic components and the second terminal of the plurality of second components are respectively disposed opposite to each other A resin layer is disposed between the second terminals to form a plurality of laminated bodies. While heating a plurality of laminated bodies, a plurality of laminated bodies are simultaneously pressed from the lamination direction of the laminated body of 100113854 6 201222689. According to the invention, a plurality of the laminated bodies are heated while simultaneously pressing a plurality of laminated bodies from the laminated direction of the laminated body. Thereby, while the first electronic component and the second electronic component of the first laminated body are heated while being pressed, the curing of the thermosetting resin constituting the other laminated body can be suppressed from continuing. Therefore, it is possible to stably manufacture an electronic device with high reliability. Moreover, according to the present invention, a device may be provided for the first terminal of the first electronic component including the first terminal of the solder layer on the surface, and the first terminal having the first electronic component bonded to the first electronic component. a resin layer containing a fluxing active compound and a thermosetting resin is interposed between the second terminals of the second electronic component of the two terminals, and after forming the laminated body, the first terminal is in contact with the second terminal And a rolling member that simultaneously clamps a plurality of laminated bodies. Furthermore, according to the present invention, it is also possible to provide a rolling member for the manufacturing apparatus of the above electronic device. That is, according to the present invention, it is also possible to provide a rolling member which forms a groove of a pair of rolling members and which forms at least one of the upper and lower symmetry. According to the present invention, there is provided a method and an apparatus for manufacturing an electronic device which can stably manufacture an electronic device having high reliability. [Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. First, referring to Fig. 1, 100113854 7 201222689 to Fig. 5', an outline of a method of manufacturing the electronic device of the present embodiment will be described. A method of manufacturing an electronic device according to the embodiment of the present invention, comprising: a first electronic component including a first terminal 11 having a solder layer 112 on a surface thereof, and a second electronic component 2 including the first electronic component 2 The second terminal 21 of the first terminal 11 of the electronic component 1. The manufacturing method of the electronic device includes: arranging a resin layer containing a flux active compound and a thermosetting resin between the first terminal U of the first electronic component and the second terminal 21 & of the second electronic component 2 3, the step of obtaining the laminated body *; heating the laminated body 4 to the bright point of the solder layer ι2 of the first terminal n, and performing the step of soldering the first end + u with the second end + 21; The step of pressurizing the laminated body 4 with a fluid to form a resin layer (10). In the above step of obtaining the laminated body 4, the first terminal 11 of the plurality of first electronic components and the second terminals of the plurality of second electronic components 2 are respectively arranged to face each other, and at each of the first terminals u and The resin layer 3 is disposed between each of the second terminals, and a plurality of the laminated bodies 4 are formed, and the plurality of laminated bodies 4 are heated, and the plurality of laminated bodies 4 are repeatedly formed from the laminated direction (four) of the laminated body 4. The method of manufacturing the electronic device of the present embodiment will be described in detail below. First, as shown in FIG. 1, the first electronic component 1 is prepared. The first electronic component is, for example, a substrate (a flexible substrate, a rigid substrate, a ceramic substrate 100113854 201222689 plate, etc.), a semiconductor wafer, a substrate on which a semiconductor element is mounted, or the like. The first electronic component 1 includes a first terminal u, and the first terminal u includes a first terminal body m and a solder layer 112 provided on a surface of the first terminal body (1). The shape of the first terminal 胄lu is not particularly limited, and examples thereof include a convex shape or a concave shape. Further, the material of the first terminal body (1) is not particularly limited, and examples thereof include gold, copper, nickel, palladium, and aluminum. The material of the solder layer 112 is not particularly limited, and examples thereof include at least two or more alloys selected from the group consisting of tin, silver, boat, zinc, indium, and copper. Among these, it is preferable to select at least two or more alloys from the group consisting of tin, silver, aluminum, zinc, and copper. The refining point of the daily solder layer m is 110 to 25 (rc, preferably 17 〇 to 2 赃. The known tin layer 112 may also be a solder bond for the first terminal body (1), and may also be the first - the terminal body ηι is provided with a solder ball or solder paste, and is composed of solder bumps, etc., as shown in Fig. 6, the first electronic component is connected by a plurality of) When the part 丨 is a substrate, the substrates are connected to each other to form a large-sized substrate. Further, on the large substrate, the : / : is formed by a broken line to form a second electronic component 2 (see FIG. 1 ) for cutting the same first electronic component ( (see FIG. 1 ). The second electronic component is, for example, 'It is a substrate for a semiconductor wafer or a wealthy conductor element. This electronic component 2' has a second terminal 21. 100113854 201222689 The shape of the first terminal 21, the terminal " is only (4) or concave in shape that can be welded. Further, the second 踹;,, the genius of the genius, the material of the sub-21 is not particularly limited, and examples thereof include gold, copper, nickel, palladium, aluminum, etc. ^ Next, as shown in Fig. 2, A resin layer 3 containing a flux activation activation code and a _-chemical resin is disposed between the first terminal of the first electronic component and the second terminal 21 of the electronic component 2, and the first terminal u and the first terminal are disposed. The alignment of the plurality of electronic components 1 and the plurality of second electronic components 2 is performed. In this step, the resin layer 3 can be disposed on the first electronic component. a plurality of laminated body cores between the second electronic component 2 and a plurality of layers 4, for example, arranged in the in-plane direction. Here, the second terminal 2 of the second electronic component 2 does not become in a state of being pressed into the resin layer 3 and coming into contact with the first terminal n. However, the resin layer 3 is interposed. In a state between the first terminal 】! and the second terminal 21, the first terminal 11 and the second terminal 21 may also be in contact with each other. The resin layer 3 is configured to be buryable in the first electronic component 与, and The thermosetting resin of the gap of the two electronic parts 2. The thermosetting resin contained in the resin layer 3 can be, for example, an epoxy resin, an oxetane resin, a phenol resin, a (meth) acrylate resin, or an unsaturated layer. Polyester resin, di-propylene phthalate resin, and maleic imide resin temple. These can be used alone or in combination of two or more. 100113854 10 201222689 where 'the use is curable and preservative, The epoxy resin having excellent heat resistance, moisture resistance, and abrasion resistance of the cured product is preferred. The resin layer 3 has a minimum melt viscosity at (10) to 2 ° C, preferably 〜 〇〇〇 amp & · s, especially preferably 1 to 500 Pa · s. Since the resin layer 3 is 1 The minimum melt viscosity at 00 to ·c is difficult to produce voids (porosity) in the above-mentioned cured material. The minimum viscous viscosity, for example, using a rheometer as a viscoelasticity measuring device a 10 c / The temperature increase rate is given to the sample of the film state by applying a shear of a frequency of Hz for measurement. The resin layer 3 is used for soldering, and the oxide film of the surface of the solder 112 is removed (4) Resin layer 3. The resin layer 3 can be soldered by removing the oxide film covering the surface of the solder layer 112 by the fluxing action. In order to provide the resin layer 3 with a soldering action, the resin layer 3 must be assisted. Welding active compound. The active compound contained in the active layer 3 may be a compound containing a (tetra) group, an enzyme, or a compound, as long as it is a weldable material. It is better. _ The combined amount of the fluxing active compound in the resin layer 3 is preferably 30% by weight, and is preferably 3 to 20% by weight of the animal/earth lXt. According to the above-mentioned, the fluxing activity of the resin layer 3 can be improved by preventing the thermosetting resin from being cured in the layer 3 of the moon layer 3 Residue of the reactive active compound of the reaction. 100113854 11 201222689 Furthermore, if there is residual unreacted fluxing active compound, migration may occur. Further, among the compounds which function as a curing agent for the thermosetting resin, there is a compound which also has a fluxing action (hereinafter, such a compound is also referred to as a fluxing active curing agent). For example, a phenolic novolak resin, a nonylphenol novolak resin, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, or the like which functions as a curing agent for an epoxy resin also has a fluxing action. In this way, the resin layer 3 which acts as a curing agent for the thermosetting resin and which acts as a fluxing active compound, and which acts as a curing agent for the thermosetting resin, acts as a curing agent for the thermosetting resin. The resin layer 3 for welding action. Further, the flux-active compound having a carboxyl group means that one or more carboxyl groups are present in the molecule, and may be liquid or solid. Further, the active compound having a plurality of flux-based radicals means that one or more phenolic hydroxyl groups are present in the molecule, and may be either liquid or solid. Further, the flux-active compound having a carboxyl group and a phenolic hydroxyl group means that one or more carboxyl groups and a phenolic hydroxyl group are present in the molecule, and they may be in the form of a liquid or a solid. Among these, examples of the flux-active compound having a carboxyl group include aliphatic acid anhydrides, alicyclic acid anhydrides, aromatic acid anhydrides, aliphatic carboxylic acids, and aromatic acid buffers. As the aliphatic acid anhydride having a flux-active compound having a carboxyl group, it can be listed as 100113854 12 201222689, and it can be used as an axis of polydipic acid, polyphthalic acid, and polyfluorene. : as an alicyclic acid liver with a tilt-based fluxing active compound, can be listed as a sulphuric acid, tetrahydrobenzene, methyl H-hexahydrophthalic anhydride, methylbicycloheptadic anhydride, hexahydro Dicarboxylic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, and nonylcyclohexene dicarboxylic anhydride. Examples of the aromatic needles having the active active compound of the preservative include phthalic anhydride, trimellitic anhydride, pyromellitic acid two-needle, diphenylmethyltetradecanoic anhydride, and ethyl alcohol trimellitic anhydride. § Purpose, and trimellitic acid glycerides. Examples of the aliphatic carboxylic acid having a carboxyl group-containing flux-active compound include a compound represented by the following formula (1), or formic acid, acetic acid, propionic acid, butyl hydrazine, valence oxime, dimercaptoacetic acid, Caproic acid, caprylic acid, lauric acid, myristoyl acid, palmitic acid, stearic acid, acrylic acid, methacrylic acid, crotonic acid, oleic acid, fumaric acid, maleic acid, oxalic acid, malonic acid And strontium acid and the like. HOOC-(CH2)n-COOH (1) In the formula (1), η represents a natural number of 20 or less. As an aromatic carboxylic acid having a flux-active compound having a carboxyl group, benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, anthracene, 2,3·'benzenetricarboxylic acid, Trimellitic acid, trimesic acid, hydrazine, 2,3,5-benzenetetradecanoic acid, 1,2,3,4-benzenetetracarboxylic acid, pyromellitic acid, mellitic acid, toluic acid, dimethyl Benzoic acid, 2,3-dimercaptobenzoic acid, 3,5-dimethylbenzoic acid, 2,3,4-di 100113854 13 201222689 mercaptobenzoic acid, pyromellitic acid, cinnamic acid, salicylic acid , 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, 3,5-di a naphthoic acid derivative such as hydroxybenzoic acid, gallic acid (3,4,5-trihydroxybenzoic acid), 1,4-dihydroxy-2-naphthoic acid or 3,5-dihydroxynaphthoic acid, And reducing phenolphthalein, bisphenolic acid and the like. Among these reactive active compounds having a rebel basis, the activity of the active compound, the amount of gas released during curing of the resin layer, and the elastic modulus of the cured resin layer It is preferable that the compound represented by the above formula (1) is preferable because the balance of the number or the glass transition temperature or the like is good. Further, in the compound represented by the above formula (1), the compound of the formula (1) wherein n is 3 to 10 can inhibit the increase in the elastic modulus of the resin layer after curing, and the first one can be improved. The adhesion between the electronic component 1 and the second electronic component 2 is particularly excellent. In the compound represented by the above formula (1), η in the formula (1) is 3

〜10之化合物，例如， 可 列 舉η =3 之 戊二酸 (HOOC-(CH2)3-COOH)、 η = 4 之 己 二酸 (HOOC-(CH2)4-COOH)、 η —rr 5 之 庚 二酸 (HOOC-(CH2)5-COOH)、 η = 8 之 癸 二酸 (HOOC-(CH2)8-COOH)及 n = 10 之 HOOC-(CH2)10-COOH 等。 作為具備酚系羥基之助焊活性化合物，可列舉酚類，具體 而言，例如’苯酚、鄰曱酚、2,6-二曱苯酚、對甲酚、間曱 100113854 14 201222689 酚、鄰乙基苯酚、2,4-二曱苯酚、2,5-二曱苯酚、間乙基苯 酚、2,3-二曱苯酚、2,4,6-三曱苯酚、3,5-二曱苯酚、對第三 丁基苯酚、鄰苯二酚、對第三戊基苯酚、間苯二酚、對辛基 苯盼、對苯基苯紛、雙酌· A、雙酌· F、雙盼AF、聯苯S分、 二烯丙基雙酚F、二烯丙基雙酚A、三笨酚、四苯酚等含有 酚系羥基之單體類，酚系酚醛清漆樹脂、鄰曱酚酚醛清漆樹 脂、雙盼F盼酸清漆樹脂、及雙紛A盼酸·清漆樹脂等。 如上述具備羧基、或酚羥基之任一者、或者羧基及酚羥基 之兩者之化合物，係藉由與如環氧樹脂之熱固化性樹脂之反 應而以三維地被併入。 因此，就促進固化後之環氧樹脂之三維之網狀結構形成之 觀點而言，作為助焊活性化合物，係以具有助焊作用，而且， 以作為環氧樹脂之固化劑發揮作用之助焊活性固化劑為佳。 作為助焊活性固化劑，例如，於1分子中，可列舉具備可 附加於環氧樹脂之二個以上之酚系羥基、及直接鍵結於顯示 助焊作用（還原作用）之芳香族之一個以上之羧基之化合物。 作為如此之助焊活性固化劑，可列舉：2,3-二羥基苯曱 酸、2,4-二羥基苯曱酸、龍膽酸(2,5-二羥基苯曱酸）、2,6·二 羥基苯曱酸、3,4-二羥基苯曱酸、沒食子酸(3,4,5-三羥基苯 曱酸）等苯曱酸衍生物；1，4-二羥基-2-萘曱酸、3,5-二羥基-2-萘甲酸、3,7-二羥基-2-萘曱酸等萘曱酸衍生物；還原酚酞； 及雙酚酸等；此等可為單獨一種、或者可為組合兩種以上。 100113854 15 201222689 其中，為使第一端子11及第二端子21之接合良好，以使 用還原酚酞為特佳。可推測係藉由使用還原酚酞，將焊錫層 112之表面之氧化物去除之後，而可使環氧樹脂固化。 因此，可抑制環氧樹脂，於焊錫層112之表面之氧化物未 被去除之狀態下固化，且可使第一端子11及第二端子21 成為良好之焊接者。 又，樹脂層3中，助焊活性固化劑之組合量，以1〜3 0 重量％為佳，3〜20重量％為特佳。而樹脂層3中之助焊活 性固化劑之組合量，藉由為上述範圍，可使樹脂層之助焊活 性提高，同時可防止樹脂層中，殘留熱固化性樹脂與未反應 之助焊活性固化劑。 再者，當殘留有未反應之助焊活性固化劑，就會產生位 移。又，樹脂層3，亦可含有無機填充材。藉由使樹脂層3 中含有無機填充材，提高樹脂層3之最低炫融黏度，可抑制 於第一端子11與第二端子21之間形成空隙。 再者，當樹脂層3之最低熔融黏度非常低時，有時會使樹 脂層3之流動性變得非常高，且樹脂層3進入至第一端子 11與第二端子21之間，使得第一端子11與第二端子21分 開之情形。 於此處，作為無機填充材，可列舉氧化矽、或氧化鋁等。 而且，樹脂層3，亦可包含固化觸媒。固化觸媒，雖然可對 應樹脂層3中之熱固化性樹脂之種類加以適當地選擇，但是 100113854 16 201222689 例如，就提高塗膜成形性之觀點而言，可使用咪唑化合物。 作為咪唑化合物，可列舉2-苯基羥基咪唑、及2-苯基-4-曱基羥基咪唑等。 又，固化觸媒之配合比例，係當將樹脂層3之構成成分之 合計設為100時，設為例如0.01重量％以上5重量％以下。 藉由將固化觸媒之配合比例設為0.01重量％以上，可更有 效地發揮作為固化觸媒之功能，而提高樹脂層3之固化性。 又，藉由將固化觸媒之配合比例設為5重量％以下，可進一 步提高樹脂層3之保存性。 作為於第一電子零件1、與第二電子零件2之間配置樹脂 層3之方法，可列舉例如： (1) 準備使含有助焊活性化合物之樹脂組成物成形為薄膜 狀之樹脂膜，並將此樹脂膜，貼合於第一電子零件1、或第 二電子零件2 ; (2) 準備含有助焊活性化合物之液狀之樹脂組成物，將此 液狀之樹脂組成物，塗佈於第一電子零件1、或第二電子零 件2之表面； (3) 使含有助焊活性化合物之樹脂組成物溶解，或者，準 備分散之樹脂清漆，並將此樹脂清漆，塗佈於第一電子零件 1、或第二電子零件2之表面，然後，使樹脂清漆中之溶劑 揮發。再者，關於方法(2)之液狀之樹脂組成物，係不含有 溶劑。 100113854 17 201222689 :此處，如圖6所示’樹脂層3,係以複數個相連，構成 :5於複數個第-電子零件I上之】片樹腊m詳細地 Γ說明，則_係由複數個之樹脂層3、及使同為樹脂 層3互相連接之連結部分所構成，同為樹脂層3係互相經由 連結部分而相連。 接著’ -邊對複數個積層體 β a + i e 疋叮加热，一邊沿積層體4 之積層方向挾歷，如圖3所干，势 所不以第一端子11與第二端子 21接觸之方式使第-诚；广 乐鲕于 文弟—鳊子21 ’壓陷入樹脂層3。 二者，於本步财，藉由第一端子U之谭錫層112，第 知子11與第二端子21並無焊接之情形。於此步驟中，使 用圖4〜圖5所示之農置5。 裳置5 ’係在包含於表面具有焊錫層112之第-端子u 第電子令件1之第一端子11、與包含接合於此第一電 子零件1之第一晚；1彳姑 之第二端子21之第二電子零件2 之第一端子21之間’配置含有助焊活性化合物、及熱固化 性樹脂之樹脂層3，在形成積層體4之後 11與第二端子21接觸之裝置。 &子 装置5係、具備作為將複數個積層體4同時狹壓之挟壓 構件之夹具53。若更詳細地進行說明，縣置$具備：爐(加 熱爐)51 ’其於内部配置有複數個積層體4 ·’上熱板52f、下 熱板522 ’其作為配置於爐51内之壓製構件；及失具53。 爐51 ’係由上模511、與下模512所構成，於由上模511 職13854 201222689 與下模512所構成之空間内配置有上熱板521、下熱板似。 上熱板521、下熱板522，係配置為對肖，並於上熱板521 與下熱板522之間，酉己置有夹具53及複數個積層體4。一 對熱板521、522係成為溫度未達焊錫詹m之溶點之溫度。 爽具53 ’係具備形成有溝槽之上側加壓構件531及平板 狀之下側加壓構件532。於上側加壓構件別及下側加屋構 件532間配置有複數個積層體4。上侧加壓構件卜係為 板狀’且為平面矩形形狀。 於上側加壓構件531中，亦如圖6、7所示，形成有複數 個溝槽531A’ -部分同為溝槽53ia者互相交叉。於本實 施形態中，溝槽531A形成為格子狀。 以溝槽531A所劃分之區域5仙抵接於積層體4之第二 電子零件2。相對於—個區域53ib抵接有—個積層體*之 第二電子零件2。下側加壓構件532，係為平面矩形形狀， 於下側加£構件532並未形成溝槽，而以表面平坦之板材所 構成。 下侧加C構件532 ’係與上側加壓構件切之溝槽$退 斤升/成之φ為對向。積層體4之第—電子零件卜係抵接 於下侧加壓構件532。於此處，作為下側加壓構件似、上 1 β、冓件531之材料’亚無特別之限制，可列舉金屬板、 陶瓷板等。 作為金屬板，可列舉，例如不鏽鋼板、鈦板、船板。又， 100113854 19 201222689 作為陶魏’可列舉玻魏、氧化純、氮切板、及氧化 鍅板。但是，以導熱性良好者為佳。 接著，針對裝置5之使用方法進行說明。首先，於爐51 = 外，如圖6所示，於夾具53之上侧加壓構件53ι與下側加 · 壓構件532之間配置複數個積層體4,藉由上側加壓構件531 及下側加壓構件532夾持複數個積層體4。 2時’如圖6所示’溝槽531A之寬度Wl(與溝槽53ia 之延伸方向正交之方向之長度較鄰接之積層體4之間之 空隙W2 A。換·r之’抵接於以溝槽531A所劃分之上述區 域531B之第二電子零件2之端面（側面），較溝槽別a之側 面531C更向溝槽531A之内側突出。如上述以上側加壓構 件^31之寬度W1之溝槽531八所劃分之區域53汨，形成為 較第二電子零件2之第二端子21更位於外側之形狀。 又’鄰接之積層體4之中，雖然同為樹脂層3者係互相相 連所I成’但因為於鄰接之第二電子零件2之間形成有空 隙’故藉由樹脂層3相連所構成之樹脂片之—部分自上述空 审疼出；月曰片之路出部分，係與溝槽別A為對向。' 圖6 ’係表示以上側加壓構件531及下側加壓構件532夾 持複數個積層體4之狀態之圖式。然後，將夾具$ 個積層體4搬送至爐51内。 β田將夾具53及稷數個積層體4 - 、 '盧5丨内時，亦可使用搬送膜等。 於此處，事先，使上熱板521、下熱板522成為已加熱之 100113854 20 201222689 狀態。其後，將上模511移動至下模512側，封閉上模511 及下模512間之空隙。夾具53之下側加壓構件532，為下 熱板522所抵接（參照圖4)。 其後，如圖5所示，使上熱板521向下方移動，並使上熱 板521抵接於夾具53之上側加壓構件531。夾具53之上側 加壓構件531由上熱板521向下方推壓，夾具53，以下熱 板522與上熱板521進行挾壓，並藉由夾具53之上側加壓 構件531、下側加壓構件532將複數個積層體4進行挾壓。 即，將複數個積層體4以未達焊錫層112之熔點、且未達 樹脂層3之固化溫度，即未達樹脂層3之熱固化性樹脂之固 化溫度（於樹脂層3所含之熱固化性樹脂，未達成以 JISK6900為依據之C-階段(C-stage)之溫度）一邊進行加熱， 一邊沿積層體4之積層方向挾壓，以使第一端子11與第二 端子21接觸之方式使第二端子21，壓陷入樹脂層3。 接著，使上模511、下模512分開，自爐51内，將複數 個積層體4搬出。再者，當挾壓複數個積層體4時亦可於真 空下進行挾壓。藉此，可抑制樹脂層3之空隙之產生。其後， 使用圖8所示之裝置6，將複數個積層體4加熱至第一端子 11之焊錫層112之熔點以上，使第一端子11、與第二端子 21進行焊接。 裝置6，因為可於加壓環境下對積層體4進行加熱，作為 構造，例如，具有將積層體4收納於内部之容器61、及用 100113854 21 201222689 以將流體導入此容器61内之配管62。 容器61之特徵係為壓力容器，於容器61内設置積層體4 之後，藉由使自配管62所加熱，而且加壓之流體流入容器 61内，對積層體4進行加熱加壓。 又，使流體自配管62流入容器61内，藉由一邊於加壓環 境下，一邊對容器61加熱，亦可對積層體4進行加熱。作 為容器61之材料，可列舉金屬，例如為不鏽鋼、鈦、銅、 及此等之合金等。 藉由流體，對積層體4加壓時之加壓力，為0.1〜10 MPa， 以0.5〜5 Mpa為佳。藉由如此之方式，於固化之樹脂層3 中難以產生空隙（孔隙）。 再者，於本發明中，所謂以流體進行加壓，係指使積層體 4之環境壓力，較大氣壓僅高於加壓力之部分。即，所謂加 壓力10 Mpa，係表示相較於大氣壓，作用於積層體之壓力 大 10 MPa。 於容器61内設置積層體4之後，對積層體4加熱，同時 對積層體4加壓。對積層體4加壓之流體，係自配管62導 入容器61内，而對積層體4進行加壓。作為對積層體4加 壓之流體，以氮氣、氬氣等非氧化性氣體、空氣等氣體為佳。 其中，以使用非氧化性氣體為佳。藉由使用非氧化性氣 體，可使第一端子11及第二端子21之接合更為良好。再者， 所謂非氧化性氣體，係為惰性氣體、氮氣之意。 100113854 22 201222689 於積層體4之溫度達到焊錫層112之熔點之後，一邊保持 容器61内之溫度及壓力，一邊以既定時間，對積層體4， 進行加熱及加壓。藉此，使積層體4中之樹脂層3固化。 其後，自裝置6取出積層體4，視需要使積層體4再次固 化。藉由以上，可獲得電子裝置(參照圖9)。於圖9中，使 第一端子11與第二端子21藉由焊錫層112所接合，並使第 二端子21之前端成為壓陷入焊錫層112之狀態。再者，根 據圖6所示之虛線之切斷線，藉由將第一電子零件1之間、 樹脂層3間切斷，可獲得分離之複數個電子裝置。 接著，針對本實施形態之作用效果進行說明。於本實施形 態中，將複數個積層體4 一邊進行加熱，一邊自積層體4 之積層方向同時挾壓複數個積層體4。藉此，可於挾壓第一 個積層體4之第一電子零件1與第二電子零件2之期間，抑 制其他積層體4之樹脂層3進行固化。因此，可穩定地製造 可靠性高之電子裝置。 又，於本實施形態中，由於藉由加壓流體對積層體4進行 加壓而使樹脂層3固化，故可抑制產生樹脂層3之固化物中 之氣泡等空隙。而且，當將第一端子11及第二端子21進行 焊接時，若藉由流體對積層體4加壓，就會提高樹脂層3 之密度並藉由減少體積，可將力朝壓接有第一端子11與第 二端子21之方向產生作用。 而且，當將第一端子11及第二端子21進行接合時，若藉 100113854 23 201222689 由流體對積層體4加壓，則可抑制藉由樹脂層3之發泡所致 之樹脂流動，可確實地減少第—端子η及第二端子21間之 偏移。 又i於本實施形ϋ巾，於挾壓積層體4之上側加壓構件 531 $成有私531Α。當挾壓積層體4時，雖然會有積層 體4之樹脂層3自積層…滿出之情形，但可使滿出之樹脂 層3流至溝槽531Α内。藉此，可防止樹脂進入至第二電子 零件2與上側加壓構件531之間。 而且，於本實施形態中，使抵接於由溝槽MM所劃分之 上述區域531Β之第二電子零件2之端面，較溝槽篇之 側面531C更突出於溝槽531Α内側。 f挟壓積層艘4時’會有自積層體4滿出之樹脂沿積層 體4之第二電子零件2之端面爬上之情形。因為雖然溝槽 531A之側面531C，並去护铱不7 9 未H電子零件2之端面更突出於 ^ ’故可抑频上第二電子零件2之端面之樹 Γ之者ΓΓ㈣構件531。因此，可防止由上側加壓構件 531之相·脂所致之污染。 二層:在:::壓構件5M未形成溝槽遍時’有可能 積層體之Γ脂會附著於上述構件而使上述構件之 重會有產生偏差广坦者。因此’作用於積層體4之負 如上所述可 ± 。相對於此，於本實施形態中，由於 100113854 方止祕恥附著於上側加壓構件531，故可抑制作 24 201222689 用於積層體4之負重產生偏差。 再者’本發明並不限定於上述之實施形態，於可達成本發 明之目的之範圍内之變形、改良等係包括於本發明。例如， 於上述形態中，雖然於裝置5使用失具53，但並不限於此， 亦可不使用夾具53。 又’於上述形態中，雖然同為第一電子零件1者、及同為 樹脂層3者彼此相連，但並不限於此。例如，事先使同為第 一電子零件1者、及同為樹脂層3者互相分開，而於第一電 子令件1之間、樹脂層3之間可存在間隙（空隙）。 ^ 曰 ’於上述形態中，雖然使上側加壓構件531抵接於第 —電子零件2，但並不限於此’亦可使上側加壓構件531抵 接於第一電子零件i。 又亦可於一積層體4中，使上側加壓構件531抵接於第 —電子裳朱1 ^ ，而於另一積層體4中，使上側加壓構件531 抵接於第-雷z 子零件2。但是，就同為端子者之接合稃定性 之觀點而t4 " 〇上述形態，以接觸於上側加壓構件531之愛 件為相同之零件者為佳。 π 而且，於上述形態中對抵接於積層體4之 之區域53lB、i 电卞+仵2 進仃劃分之溝槽531A僅形成於下表面，上表 面係以平扭夕L , 叫工衣 、 —上側加壓構件531作為比擬。 然而，如·| Λ 與下表面挾壓構件耻擬之·加壓構件533, « 531Α相同之溝槽533Αφ形成於上表 100113854 25 201222689 劃分區域533B，亦可實施上下對稱之上側加壓構件533等。 於此處所謂之上下方向，係對應於圖1〇之上下方向。即’ 與積層體4之積層方向一致。 如此之上側加壓構件533 ’由於為上下對稱’故可良好地 防止由加壓所致之.彎曲，且可更均等地將複數個苐二電子零 件2加壓於第一電子零件1。並且，如上述之上側加壓構件 5 3 3由於為上下對稱’故亦可防止因製造時之壓力等所導致 朝上下方向彎曲等情形。 又’於上述形態中於電子裝置之製造方法中，在獲得積層 體4之步驟中，僅以一邊以未達樹脂層3之固化溫度之溫度 加熱積層體4，一邊藉由作為壓製構件之熱板521、522沿 積層體4之積層方向對積層體4進行機械性地加壓作為比 擬。 然而，當如此對積層體4機械性地加壓時，亦可進一步藉 由空氣等流體對積層體4進行加壓（未圖示）。此時，不僅可 均勻地對積層體4加壓，亦可防止於樹㈣3所產生之氣泡 之膨服。 而且，於獲得上述積層體4之步驟中，可於未達樹脂層3 之固化溫度，且樹脂層3之黏度為i Pa · s以上、i 〇_ pa · s以下之溫度對積層體4進行加熱。又，於獲得上述積層體 4之步驟中，可於作為容器之容㈣内配置積層體4，並將 流體導入容器61内，藉由流體，對積層體4加壓。如此之 100113854 26 201222689 流體係可利用空氣或氮氣。 再者，如上述對積層體4加壓之流體之壓力，係成為使爐 — 51之上模511與下模512開放之内壓。因此，如圖11所示， ； 可將爐51之上模511與下模512封閉之壓力、對積層體4 直接加壓之熱板521、522之壓力、及對積層體4加壓之爐 51内之氣壓分別控制者為佳。 本申請案，係主張以於2010年4月23日所申請之日本專 利申請特願2010-099553、於2010年7月1曰所申請之曰 本專利申請特願2010-150827、及於2010年8月24日所申 請之曰本專利申請特願2010-186870為基礎之優先權，並將 其揭示之全部内容併入本案中。 【圖式簡單說明】 圖1係表示關於本發明之一實施形態之電子裝置之製造 步驟的步驟剖面圖。 圖2係表示電子裝置之製造步驟之步驟剖面圖。 圖3係表示電子裝置之製造步驟之步驟剖面圖。 圖4係表示電子裝置之製造裝置之剖面圖。 圖5係表示電子裝置之製造裝置之剖面圖。 - 圖6係表示使複數個積層體由夾具所夾持之狀態之剖面 * 圖。 圖7係表示構成夾具之構件之俯視圖。 圖8係表示電子裝置之製造步驟之步驟剖面圖。 100113854 27 201222689 圖9係表示電子裝置之剖面圖。 圖10係表示一變形例之電子裝置之製造裝置之剖面圖。 圖11係表示另一變形例之電子裝置之製造裝置之剖面 圖。 【主要元件符號說明】 1 第一電子零件 2 第二電子零件 3 樹脂層 4 積層體 5、6 裝置 11 第一端子 21 第二端子 51 爐 53 夾具 61 容器 62 配管 111 第一端子本體 112 焊錫層 511 上模 512 下模 521 上熱板 522 下熱板 100113854 28 201222689 531 、 532 、 533 加壓構件 531A、533A 溝槽 531B 、 533B 區域 531C 溝槽之側面 W1 寬度 W2 間隙 100113854 29Examples of the compound of 10, for example, glutaric acid (HOOC-(CH2)3-COOH) of η=3, adipic acid of η=4 (HOOC-(CH2)4-COOH), and η-rr 5 Pimelic acid (HOOC-(CH2)5-COOH), η=8 azelaic acid (HOOC-(CH2)8-COOH) and n=10 HOOC-(CH2)10-COOH. Examples of the flux-active compound having a phenolic hydroxyl group include phenols, and specifically, for example, 'phenol, o-nonylphenol, 2,6-diindol, p-cresol, m-100100854 14 201222689 phenol, o-ethyl Phenol, 2,4-diindol, 2,5-diindol, m-ethylphenol, 2,3-diindol, 2,4,6-trimethylphenol, 3,5-diindol, pair Third butyl phenol, catechol, p-tert-amyl phenol, resorcinol, p-octyl benzene, p-phenyl benzene, double discretion, A, double discretion, F, double expectation AF, joint a phenolic hydroxyl group-containing monomer such as benzene S, diallyl bisphenol F, diallyl bisphenol A, trisphenol, tetraphenol, etc., phenolic novolac resin, o-nonphenol novolac resin, double Look forward to F-acid varnish resin, and a pair of A-acid and varnish resins. The compound having either a carboxyl group or a phenolic hydroxyl group or both a carboxyl group and a phenolic hydroxyl group is incorporated in three dimensions by a reaction with a thermosetting resin such as an epoxy resin. Therefore, from the viewpoint of promoting the formation of the three-dimensional network structure of the epoxy resin after curing, as the flux-active compound, it is a flux-assisting compound, and it acts as a curing agent for the epoxy resin. A reactive curing agent is preferred. For example, one of the phenolic hydroxyl groups which may be added to the epoxy resin and one of the aromatics which are directly bonded to the display of the fluxing action (reduction) are exemplified as the flux-forming active curing agent. A compound of the above carboxyl group. Examples of such a flux-active curing agent include 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), and 2,6. · benzoic acid derivatives such as dihydroxybenzoic acid, 3,4-dihydroxybenzoic acid, gallic acid (3,4,5-trihydroxybenzoic acid); 1,4-dihydroxy-2- Naphthoic acid derivatives such as naphthoic acid, 3,5-dihydroxy-2-naphthoic acid, 3,7-dihydroxy-2-naphthoic acid; reduced phenolphthalein; and bisphenolic acid; etc.; these may be a single type Or it may be a combination of two or more types. 100113854 15 201222689 Among them, in order to make the bonding of the first terminal 11 and the second terminal 21 good, it is particularly preferable to use reduced phenolphthalein. It is presumed that the epoxy resin can be cured by removing the oxide of the surface of the solder layer 112 by using reduced phenolphthalein. Therefore, the epoxy resin can be suppressed from being solidified in a state where the oxide on the surface of the solder layer 112 is not removed, and the first terminal 11 and the second terminal 21 can be made into a good solder. Further, in the resin layer 3, the combined amount of the fluxing active curing agent is preferably from 1 to 30% by weight, particularly preferably from 3 to 20% by weight. Further, the combined amount of the flux-active curing agent in the resin layer 3 can increase the flux activity of the resin layer by the above range, and can prevent the residual thermosetting resin and the unreacted flux activity in the resin layer. Hardener. Further, when an unreacted flux-active curing agent remains, a displacement occurs. Further, the resin layer 3 may contain an inorganic filler. By including the inorganic filler in the resin layer 3, the minimum scattering viscosity of the resin layer 3 is increased, and the formation of a gap between the first terminal 11 and the second terminal 21 can be suppressed. Further, when the lowest melt viscosity of the resin layer 3 is extremely low, the fluidity of the resin layer 3 sometimes becomes very high, and the resin layer 3 enters between the first terminal 11 and the second terminal 21, so that A case where one terminal 11 is separated from the second terminal 21. Here, examples of the inorganic filler include cerium oxide, alumina, and the like. Further, the resin layer 3 may also contain a curing catalyst. The curing catalyst can be appropriately selected depending on the type of the thermosetting resin in the resin layer 3, but 100113854 16 201222689 For example, an imidazole compound can be used from the viewpoint of improving the formability of the coating film. Examples of the imidazole compound include 2-phenylhydroxyimidazole and 2-phenyl-4-mercaptohydroxyimidazole. In addition, when the total of the constituent components of the resin layer 3 is 100, the blending ratio of the curing catalyst is, for example, 0.01% by weight or more and 5% by weight or less. By setting the blending ratio of the curing catalyst to 0.01% by weight or more, the function as a curing catalyst can be more effectively exhibited, and the curability of the resin layer 3 can be improved. Further, by setting the blending ratio of the curing catalyst to 5% by weight or less, the storage stability of the resin layer 3 can be further improved. As a method of disposing the resin layer 3 between the first electronic component 1 and the second electronic component 2, for example, (1) preparing a resin film in which a resin composition containing a flux-active compound is formed into a film shape, and The resin film is bonded to the first electronic component 1 or the second electronic component 2; (2) preparing a liquid resin composition containing the flux active compound, and applying the liquid resin composition to the resin composition a surface of the first electronic component 1 or the second electronic component 2; (3) dissolving the resin composition containing the flux-active compound, or preparing a resin varnish for dispersion, and applying the resin varnish to the first electron The surface of the part 1, or the second electronic part 2, and then the solvent in the resin varnish is volatilized. Further, the liquid resin composition of the method (2) does not contain a solvent. 100113854 17 201222689 : Here, as shown in Fig. 6, 'resin layer 3, which is connected in plurality, is composed of 5 on a plurality of first-electronic parts I.] The sheet tree wax m is explained in detail, then A plurality of resin layers 3 and a connecting portion which are also connected to each other by the resin layer 3 are formed, and the resin layers 3 are connected to each other via a connecting portion. Then, the '-side is heated by a plurality of laminated bodies β a + ie ,, and is traversed along the laminated direction of the laminated body 4, as shown in FIG. 3, and the potential is not in contact with the second terminal 21 by the first terminal 11 Make the first - honest; Guangle 鲕 in the Wendi - 鳊子 21 'pressure into the resin layer 3. In both cases, in the case of the tan layer 112 of the first terminal U, the first and second terminals 21 are not soldered. In this step, the farm 5 shown in Figs. 4 to 5 is used. The skirt 5' is attached to the first terminal 11 of the first terminal electronic component 1 including the solder layer 112 on the surface, and the first night including the first electronic component 1; The resin layer 3 containing the flux-active compound and the thermosetting resin is disposed between the first terminals 21 of the second electronic component 2 of the terminal 21, and is placed in contact with the second terminal 21 after the laminated body 4 is formed. The & sub-device 5 is provided with a jig 53 as a rolling member that simultaneously presses a plurality of laminated bodies 4 at the same time. In more detail, the prefecture is provided with a furnace (heating furnace) 51' which is internally provided with a plurality of laminated bodies 4, 'upper hot plate 52f, lower hot plate 522' as a press disposed in the furnace 51. Components; and a missing piece 53. The furnace 51' is composed of an upper mold 511 and a lower mold 512, and is disposed in a space formed by the upper mold 511, 13854 201222689 and the lower mold 512, in which a hot plate 521 and a lower heat plate are disposed. The upper hot plate 521 and the lower hot plate 522 are arranged to be opposite to each other, and between the upper hot plate 521 and the lower hot plate 522, a clamp 53 and a plurality of laminated bodies 4 are placed. A pair of hot plates 521, 522 are at a temperature at which the temperature does not reach the melting point of the solder. The cooling device 53' includes a groove upper pressing member 531 and a flat lower pressing member 532. A plurality of laminated bodies 4 are disposed between the upper pressing member and the lower housing member 532. The upper pressing member is in the form of a plate and is a flat rectangular shape. In the upper pressing member 531, as shown in Figs. 6 and 7, a plurality of grooves 531A' are formed - the portions which are the same as the grooves 53ia cross each other. In the present embodiment, the grooves 531A are formed in a lattice shape. The region 5, which is divided by the groove 531A, abuts against the second electronic component 2 of the laminated body 4. The second electronic component 2 of the laminated body* is abutted against the area 53ib. The lower pressing member 532 has a flat rectangular shape, and the lower member 532 is not formed with a groove but is formed of a flat plate. The lower side C-member 532' is opposite to the groove θ which is cut by the upper pressing member. The first electronic component of the laminated body 4 abuts against the lower pressing member 532. Here, the material of the lower pressing member, the upper 1β, and the material 531 is not particularly limited, and examples thereof include a metal plate and a ceramic plate. Examples of the metal plate include a stainless steel plate, a titanium plate, and a ship plate. Further, 100113854 19 201222689 As a ceramic Wei, the glass, the oxidized pure, the nitrogen cutting board, and the yttrium oxide sheet can be cited. However, it is preferred that the thermal conductivity is good. Next, a method of using the device 5 will be described. First, as shown in Fig. 6, a plurality of laminated bodies 4 are disposed between the upper pressing member 53ι and the lower pressing member 532, as shown in Fig. 6, by the upper pressing member 531 and the lower side. The side pressing member 532 sandwiches the plurality of laminated bodies 4. At 2 o'clock, as shown in FIG. 6, the width W1 of the groove 531A (the length in the direction orthogonal to the extending direction of the groove 53ia is smaller than the gap W2 A between the adjacent laminated bodies 4. The end surface (side surface) of the second electronic component 2 of the above-described region 531B divided by the groove 531A protrudes toward the inner side of the groove 531A from the side surface 531C of the groove a. The width of the above-mentioned side pressing member ^31 is as described above. The region 53汨 defined by the groove 531 of the W1 is formed to be located outside the second terminal 21 of the second electronic component 2. Further, among the adjacent laminated bodies 4, the same resin layer 3 is used. Connected to each other, but because of the formation of a gap between the adjacent second electronic components 2, the resin sheet formed by the connection of the resin layer 3 is partially damaged from the above-mentioned void; The part is the opposite direction to the groove A. Fig. 6' is a view showing a state in which the plurality of laminated bodies 4 are sandwiched by the upper side pressing member 531 and the lower side pressing member 532. Then, the jigs are clamped. The laminated body 4 is transferred to the inside of the furnace 51. When the jig 53 and the plurality of laminated bodies 4 - and 'Lu 5' are inside, Here, the transfer film or the like is used. Here, the upper hot plate 521 and the lower hot plate 522 are heated to the state of 100113854 20 201222689. Thereafter, the upper mold 511 is moved to the lower mold 512 side, and the upper mold 511 and the lower portion are closed. The gap between the molds 512. The lower pressing member 532 of the clamp 53 abuts against the lower hot plate 522 (see Fig. 4). Thereafter, as shown in Fig. 5, the upper hot plate 521 is moved downward and The upper hot plate 521 abuts against the upper pressing member 531 of the jig 53. The upper pressing member 531 of the jig 53 is pressed downward by the upper hot plate 521, and the jig 53 and the lower hot plate 522 and the upper hot plate 521 are pressed. The plurality of laminated bodies 4 are pressed by the upper pressing member 531 and the lower pressing member 532 of the jig 53. That is, the plurality of laminated bodies 4 are not at the melting point of the solder layer 112, and the resin layer is not reached. The curing temperature of 3, that is, the curing temperature of the thermosetting resin which does not reach the resin layer 3 (the temperature of the C-stage based on the thermosetting resin contained in the resin layer 3, which is not based on JIS K6900) While heating, pressing along the lamination direction of the laminated body 4 to make the first terminal 11 and the second end In the contact mode, the second terminal 21 is pressed into the resin layer 3. Next, the upper mold 511 and the lower mold 512 are separated, and a plurality of laminated bodies 4 are carried out from the furnace 51. Further, when a plurality of laminated layers are pressed The body 4 can also be subjected to rolling under vacuum, whereby the generation of voids in the resin layer 3 can be suppressed. Thereafter, the plurality of laminated bodies 4 are heated to the first terminal 11 by using the apparatus 6 shown in FIG. The first terminal 11 and the second terminal 21 are welded to each other at a melting point of the solder layer 112. The device 6 can heat the laminated body 4 in a pressurized environment, and has a structure in which, for example, the laminated body 4 is housed. The inner container 61 and the pipe 62 for introducing fluid into the container 61 are used in 100113854 21 201222689. The container 61 is characterized by a pressure vessel. After the laminated body 4 is placed in the container 61, the pressurized body fluid flows into the container 61 by heating from the pipe 62, and the laminated body 4 is heated and pressurized. Further, the fluid is allowed to flow from the pipe 62 into the container 61, and the container 61 can be heated while heating the container 61 while being pressurized. Examples of the material of the container 61 include metals such as stainless steel, titanium, copper, and the like. The pressure applied to the laminated body 4 by the fluid is 0.1 to 10 MPa, preferably 0.5 to 5 Mpa. In this way, it is difficult to generate voids (pores) in the cured resin layer 3. Further, in the present invention, the term "pressurizing with a fluid" means the ambient pressure of the laminated body 4, and the atmospheric pressure is only higher than the applied pressure. Namely, the so-called pressing pressure of 10 Mpa means that the pressure acting on the laminated body is 10 MPa larger than that of the atmospheric pressure. After the laminated body 4 is placed in the container 61, the laminated body 4 is heated and the laminated body 4 is pressurized. The fluid pressurized to the laminated body 4 is introduced into the container 61 from the pipe 62, and the laminated body 4 is pressurized. As the fluid to be applied to the laminated body 4, a non-oxidizing gas such as nitrogen or argon or a gas such as air is preferred. Among them, it is preferred to use a non-oxidizing gas. By using a non-oxidizing gas, the joining of the first terminal 11 and the second terminal 21 can be made better. Further, the non-oxidizing gas is intended to be an inert gas or a nitrogen gas. 100113854 22 201222689 After the temperature of the laminated body 4 reaches the melting point of the solder layer 112, the laminated body 4 is heated and pressurized for a predetermined period of time while maintaining the temperature and pressure in the container 61. Thereby, the resin layer 3 in the laminated body 4 is hardened. Thereafter, the laminated body 4 is taken out from the apparatus 6, and the laminated body 4 is cured again as needed. From the above, an electronic device can be obtained (refer to FIG. 9). In Fig. 9, the first terminal 11 and the second terminal 21 are joined by the solder layer 112, and the front end of the second terminal 21 is brought into a state of being pressed into the solder layer 112. Further, according to the broken line of the broken line shown in Fig. 6, by separating the first electronic component 1 and the resin layer 3, a plurality of separated electronic devices can be obtained. Next, the effects of the present embodiment will be described. In the present embodiment, a plurality of laminated bodies 4 are simultaneously heated by the plurality of laminated bodies 4, and a plurality of laminated bodies 4 are simultaneously pressed from the laminated direction of the laminated body 4. Thereby, the resin layer 3 of the other laminated body 4 can be suppressed from being solidified while the first electronic component 1 and the second electronic component 2 of the first laminated body 4 are pressed. Therefore, a highly reliable electronic device can be stably manufactured. Further, in the present embodiment, since the resin layer 3 is cured by pressurizing the laminated body 4 by the pressurized fluid, voids such as bubbles in the cured product of the resin layer 3 can be suppressed. Further, when the first terminal 11 and the second terminal 21 are welded, if the laminated body 4 is pressurized by the fluid, the density of the resin layer 3 is increased and the force is pressed toward the pressure by reducing the volume. The direction of one terminal 11 and the second terminal 21 acts. Further, when the first terminal 11 and the second terminal 21 are joined, if the laminated body 4 is pressurized by the fluid by 100113854 23 201222689, the flow of the resin by the foaming of the resin layer 3 can be suppressed, and it can be confirmed. The offset between the first terminal η and the second terminal 21 is reduced. Further, in the present embodiment, the pressing member 531 is placed on the upper side of the laminated layer body 4 with a private 531 Α. When the laminated body 4 is pressed, the resin layer 3 of the laminated body 4 may be filled from the laminated layer, but the filled resin layer 3 may flow into the groove 531. Thereby, the resin can be prevented from entering between the second electronic component 2 and the upper pressing member 531. Further, in the present embodiment, the end surface of the second electronic component 2 abutting on the region 531 defined by the groove MM protrudes further from the side surface 531C of the groove than the groove 531. When the laminate is 4 o'clock, the resin which is filled with the self-assembled layer 4 may climb up along the end face of the second electronic component 2 of the laminated body 4. Since the side surface 531C of the groove 531A and the shin guard are not protruded, the end surface of the electronic component 2 is more prominent than ^', so that the end face of the second electronic component 2 can be suppressed (4) member 531. Therefore, contamination by the phase and grease of the upper pressing member 531 can be prevented. Two layers: When::: When the pressing member 5M does not form a groove, it is possible that the resin of the laminated body adheres to the above-mentioned member, and the weight of the above-mentioned member may vary widely. Therefore, the negative effect on the laminated body 4 can be as described above. On the other hand, in the present embodiment, since the 100113854 is attached to the upper pressing member 531, it is possible to suppress the variation in the load applied to the laminated body 4 by 24 201222689. Further, the present invention is not limited to the above-described embodiments, and modifications, improvements, etc. within the scope of the purpose of the invention are included in the present invention. For example, in the above embodiment, the dislocation 53 is used in the device 5, but the invention is not limited thereto, and the jig 53 may not be used. Further, in the above embodiment, the first electronic component 1 and the resin layer 3 are connected to each other, but the invention is not limited thereto. For example, the first electronic component 1 and the resin layer 3 are separated from each other in advance, and a gap (void) may exist between the first electronic component 1 and the resin layer 3. In the above-described embodiment, the upper pressing member 531 is brought into contact with the first electronic component 2, but the upper pressing member 531 may be abutted against the first electronic component i. Further, in the laminated body 4, the upper pressing member 531 may be brought into contact with the first electron-emitting body 1^, and in the other laminated body 4, the upper pressing member 531 may be brought into contact with the first-thrace Part 2. However, in the above-described form, it is preferable that the contact with the upper pressing member 531 is the same as the point of view of the joint stability of the terminal. π Moreover, in the above-described form, the groove 531A which is divided into the region 53lB, i, which is in contact with the laminated body 4, is formed only on the lower surface, and the upper surface is formed in a flat twist, which is called a work clothes. - The upper side pressing member 531 is used as a comparison. However, if the 沟槽 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 Α Α Α Α Α Α Α 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 533 Wait. The so-called upper and lower directions here correspond to the upper and lower directions of FIG. That is, 'the direction of the laminate of the laminated body 4 is the same. Thus, since the upper side pressing member 533' is vertically symmetrical, bending due to pressurization can be satisfactorily prevented, and a plurality of second electronic parts 2 can be more uniformly pressurized to the first electronic component 1. Further, since the upper side pressing member 533 is vertically symmetrical, it is possible to prevent the upper side from being bent in the vertical direction due to pressure during production or the like. Further, in the method of manufacturing an electronic device according to the above aspect, in the step of obtaining the laminated body 4, the laminated body 4 is heated only at a temperature that does not reach the curing temperature of the resin layer 3, and the heat is used as the pressing member. The plates 521 and 522 are mechanically pressurized with the laminated body 4 in the lamination direction of the laminated body 4. However, when the laminated body 4 is mechanically pressurized as described above, the laminated body 4 may be further pressurized by a fluid such as air (not shown). At this time, not only the laminated body 4 can be uniformly pressurized, but also the expansion of the bubbles generated by the tree (4) 3 can be prevented. Further, in the step of obtaining the laminated body 4, the laminated body 4 can be applied to the laminate 4 without the curing temperature of the resin layer 3 and the viscosity of the resin layer 3 being i Pa · s or more and i 〇 _ pa · s or less. heating. Further, in the step of obtaining the laminated body 4, the laminated body 4 can be placed in the container (4) as a container, and the fluid can be introduced into the container 61, and the laminated body 4 can be pressurized by the fluid. Such a 100113854 26 201222689 flow system can utilize air or nitrogen. Further, the pressure of the fluid which pressurizes the laminated body 4 as described above is the internal pressure at which the upper mold 511 and the lower mold 512 of the furnace 51 are opened. Therefore, as shown in Fig. 11, the pressure at which the upper mold 511 and the lower mold 512 of the furnace 51 are closed, the pressure of the hot plates 521 and 522 which directly pressurize the laminated body 4, and the furnace for pressurizing the laminated body 4 can be obtained. The pressure inside the 51 is better controlled by the controller. This application claims the Japanese Patent Application No. 2010-099553 filed on Apr. 23, 2010, and the Japanese Patent Application No. 2010-150827 filed on July 1, 2010, and in 2010. Priority is claimed on August 24th, the entire disclosure of which is hereby incorporated by reference. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing the steps of a manufacturing process of an electronic device according to an embodiment of the present invention. 2 is a cross-sectional view showing the steps of a manufacturing step of the electronic device. 3 is a cross-sectional view showing the steps of a manufacturing step of the electronic device. 4 is a cross-sectional view showing a manufacturing apparatus of an electronic device. Fig. 5 is a cross-sectional view showing the manufacturing apparatus of the electronic device. - Fig. 6 is a cross-sectional view showing a state in which a plurality of laminated bodies are held by a jig. Fig. 7 is a plan view showing members constituting the jig. Fig. 8 is a cross-sectional view showing the steps of a manufacturing step of the electronic device. 100113854 27 201222689 FIG. 9 is a cross-sectional view showing an electronic device. Fig. 10 is a cross-sectional view showing a manufacturing apparatus of an electronic device according to a modification. Figure 11 is a cross-sectional view showing a manufacturing apparatus of an electronic device according to another modification. [Description of main component symbols] 1 First electronic component 2 Second electronic component 3 Resin layer 4 Laminated body 5, 6 Device 11 First terminal 21 Second terminal 51 Furnace 53 Jig 61 Container 62 Pipe 111 First terminal body 112 Solder layer 511 Upper die 512 Lower die 521 Upper hot plate 522 Lower hot plate 100113854 28 201222689 531, 532, 533 Pressurizing members 531A, 533A Grooves 531B, 533B Area 531C Side of the groove W1 Width W2 Clearance 100113854 29

Claims (1)

201222689 七、申請專利範圍： 1. 一種電子裝置之製造方法，該電子裝置係具備：第一電 子零件，其包含於表面具有焊錫層之第一端子；及第二電子 零件，其包含接合於此第一電子零件之上述第一端子之第二 端子；該電子裝置之製造方法包括： 於上述第一電子零件之第一端子、與上述第二電子零件之 第二端子之間配置含有助焊活性化合物、及熱固化性樹脂之 樹脂層而獲得積層體之步驟； 將上述積層體加熱至上述第一端子之上述焊錫層之熔點 以上，並將上述第一端子與上述第二端子進行焊接之步驟； 以及 一邊藉由流體對上述積層體加壓，一邊使上述樹脂層固化 之步驟； 於獲得上述積層體之上述步驟中， 使複數個第一電子零件之第一端子、與複數個第二電子零 件之第二端子分別對向配置，並於各第一端子與各第二端子 之間配置上述樹脂層而形成複數個積層體，一邊對複數個積 層體進行加熱，一邊自上述積層體之積層方向同時挾壓上述 複數個積層體。 2. 如申請專利範圍第1項之電子裝置之製造方法，其中， 上述複數個積層體係排列於面内方向。 3. 如申請專利範圍第1或2項之電子裝置之製造方法，其 100113854 30 201222689 中， 於獲得積層體之上述步驟中， 以一對挾壓構件挾壓上述複數個積層體， 件 上述-對挾壓構射，—方之挾壓構件係形成有溝槽之構 當使形成有溝槽之上述構件抵接於上述積層體時， 使以-方之挾壓構件之上述溝槽所劃分之各區域分別抵 接於上述積層體之第—電子零件«二電子科，且，使抵 接於以上述溝槽所劃分之上述區域之第—電子零件或第二 包子零件之端面’較上麵槽之側面更突出於溝槽内側。 (如申請專利範圍第3項之電子裝置之製造方法，其中， 田使形成有相之上述構件抵接於上述積層體時， 於以上述溝才曰所劃分之上述區域，係抵接各積層體之第一 電子零件及第二電子零件巾之—方之零件， 複數個積層體之各樹脂層相連，而構成樹脂片， 自上述積層體之積層方向觀看，上述樹脂片之一部分自鄰 接之積層體之上述一方之零件間露出， 當使形成有溝槽之上述構件抵接於上述積層體時，使露出 之上述樹脂片之一部分與上述溝槽為對向。 5.如申請專利範圍第1項之電子裝置之製造方法，其中， 於獲得積層體之上述步驟中， 以未達上述樹脂層之固化溫度之溫度一邊對上述積層體 100113854 31 1 201222689 上述積層體之積層方向對上 體對上述積層體進行加壓。 子裝置之製造方法，其中， 進行加熱，一邊藉由壓製構件沿 述積層體進行加壓，同時藉由流 6.如申請專利範圍第5項之電 於獲得上述積層體之上述步驟中 上述d構件係、為熱板，藉由使上述熱板抵接於積層體， 而對上述積層體進行加熱。 7.如申請專利範圍第5或6項之電子裝置之製造方法，其 中， 於ϋ得上述積層體之上述步驟中，於容器内配置上述積層 體，並將上述流體導人上述容器内，藉由上述流體對上述積 層體進行加壓。 8·如申明專利|&圍第丨或2項之電子裝置之製造方法，其 中， 獲知·積層體之上述步驟係包括： 藉由一對挾壓構件挾壓上述複數個積層體之步驟； 藉由以未達上述樹脂層之固化溫度之溫度一邊對上述積 層體進行加熱，-邊藉由壓製構件自上述積層體之積層方向 挾壓上述-對挾壓構件，從而沿上述積層體之積層方向對上 述積層體進行加壓，同時藉由流體對上述積層體進行加壓之.. 步驟； 、 上述-對挾壓構件中，一方之挾壓構件係形成有溝槽之構 件， 100113854 32 201222689 當使形成有溝槽之上述構件抵接於上述積層體時， 使以一方之挾壓構件之上述溝槽所劃分之各區域分別抵 ； 接於上述積層體之第一電子零件或第二電子零件，且，使抵 接於以上述溝槽所劃分之上述區域之第一電子零件或第二 電子零件之端面，較上述溝槽之侧面更突出於溝槽内側。 9. 如申請專利範圍第1項之電子裝置之製造方法，其中， 於獲得上述積層體之上述步驟中， 以上述樹脂層之黏度為1 Pa · S以上、10000 Pa · s以下 之溫度對上述積層體進行加熱。 10. —種裝置，其係在包含於表面具有焊錫層之第一端子 之第一電子零件之上述第一端子、與包含接合於此第一電子 零件之上述第一端子之第二端子之第二電子零件之上述第 二端子之間，配置含有助焊活性化合物、及熱固化性樹脂之 樹脂層，而形成積層體之後，用以使上述第一端子、與上述 第二端子接觸；其中， 具備同時挾壓複數個積層體之挾壓構件。 11. 如申請專利範圍第10項之裝置，其中， 上述挾壓構件係同時挾壓排列於面内方向之上述複數個 '* 積層體。 - 12.如申請專利範圍第10或11項之裝置，其中， 係以上述挾壓構件係具有挾壓上述複數個積層體之一對 挾壓構件， 100113854 33 201222689 上述一對挾壓構件中，至少一方之挾壓構件係形成有溝槽 之構件， 當使形成有溝槽之上述構件抵接於上述積層體時， 使以一方之挾壓構件之上述溝槽所劃分之各區域分別抵 接於上述積層體之第一電子零件或第二電子零件，且，使抵 接於以上述溝槽所劃分之上述區域之第一電子零件或第二 電子零件之端面，較上述溝槽之側面更突出於溝槽内側之方 式構成。 13. 如申請專利範圍第10項之裝置，其中， 係以利用未達上述樹脂層之固化溫度之溫度一邊對上述 積層體進行加熱，一邊藉由壓製構件沿上述積層體之積層方 向對上述積層體進行加壓，同時藉由流體對上述積層體進行 加壓之方式所構成。 14. 如申請專利範圍第13項之裝置，其中， 係以上述壓製構件為熱板，且藉由使上述熱板抵接於積層 體，而對上述積層體進行加熱之方式所構成。 15. 如申請專利範圍第13或14項之裝置，其中， 係以於容器内配置上述積層體，並將上述流體導入上述容 器内，從而藉由上述流體對上述積層體進行加壓之方式所構 成。 16. 如申請專利範圍第10項之裝置，其中， 係以利用上述積層體之上述樹脂層之黏度為1 Pa*s以上、 100113854 34 201222689 進行加熱之方式所構 10000 Pa · S以下之溫度對上述積層體 成0 17.如申请專利範圍第12項之裝置，其中， 一對上述挾壓構件中形成有上述溝槽之至少一方 挾壓構件，係上下對稱地形成。 之上述 18.如申請專利範圍第17項之裝置，其中， 上述-對挾壓構件中至少—方之挾壓構件，係與形 接於上述第二電子零件之下表面之上述溝槽上在抵 於上表面形成有溝槽。 '冉地亦 19. 一種一對挾麗構件，其係申請專利範圍第” 之一對挾壓構件，其中， 、之裝置 形成有上述溝槽之至少一方之挟壓構件，係上 成。 對稱地形 20.如申請專利範圍第19項之—對挾壓構件，其中， 至少-方之挾麼構件，係與形成在抵接於上述第二電子零 件之下表©之上述溝槽±下對稱地亦赴表㈣成有溝槽。 100113854 35201222689 VII. Patent Application Range: 1. A method for manufacturing an electronic device, comprising: a first electronic component including a first terminal having a solder layer on a surface thereof; and a second electronic component including a second terminal of the first terminal of the first electronic component; the method of manufacturing the electronic device includes: disposing a soldering activity between the first terminal of the first electronic component and the second terminal of the second electronic component a step of obtaining a laminate by a resin layer of a compound and a thermosetting resin; heating the laminate to a temperature equal to or higher than a melting point of the solder layer of the first terminal, and soldering the first terminal and the second terminal And a step of curing the resin layer while pressurizing the laminate by a fluid; and in the step of obtaining the laminate, the first terminal of the plurality of first electronic components and the plurality of second electrons The second terminals of the component are respectively disposed opposite to each other, and the resin layer is disposed between each of the first terminals and each of the second terminals Forming a plurality of laminate, while a plurality of the laminate is heated while the above-described self-laminating direction of the laminate while the nip pressure of the plurality of laminate. 2. The method of manufacturing an electronic device according to claim 1, wherein the plurality of laminated systems are arranged in an in-plane direction. 3. In the method of manufacturing an electronic device according to claim 1 or 2, in the above step of obtaining the laminated body, in the above step of obtaining the laminated body, the plurality of laminated bodies are pressed by a pair of rolling members, and the above- In the case of the rolling structure, the rolling member is formed with a groove, and when the member in which the groove is formed is brought into contact with the layered body, the groove is divided by the groove of the square pressing member. Each of the regions is in contact with the first electronic component «two electrons of the laminated body, and the end face of the first electronic component or the second bun component that is in contact with the region defined by the groove is upper The side of the face groove protrudes more from the inside of the groove. (A method of manufacturing an electronic device according to claim 3, wherein, when the member in which the phase is formed is in contact with the laminated body, the region which is divided by the groove is abutted against each of the layers a part of the first electronic component and the second electronic component towel, the resin layers of the plurality of laminated bodies are connected to form a resin sheet, and a part of the resin sheet is self-adjacent as viewed from a lamination direction of the laminated body When the member in which the groove is formed is brought into contact with the laminated body, one of the exposed resin sheets is opposed to the groove. 5. The method for producing an electronic device according to the first aspect, wherein, in the step of obtaining the laminated body, the laminated body of the laminated body 100113854 31 1 201222689 is disposed at a temperature not lower than a curing temperature of the resin layer. The laminated body is pressurized. The manufacturing method of the sub-device, wherein heating is performed, and the pressing member is added along the laminated body At the same time, by the flow 6. The electric component of the above-mentioned step of obtaining the above-mentioned laminated body in the above-mentioned step of obtaining the above-mentioned laminated body, the hot plate is abutted to the laminated body by the above-mentioned thermal layer 7. The method of manufacturing the electronic device according to claim 5, wherein in the step of obtaining the laminated body, the laminated body is disposed in the container, and the fluid is introduced into the above In the container, the above-mentioned laminated body is pressurized by the above-mentioned fluid. The method of manufacturing the electronic device of the present invention, wherein the above steps of the known laminated body include: a step of rolling the plurality of laminated bodies by a pair of rolling members; heating the laminated body at a temperature that does not reach a curing temperature of the resin layer, and by pressing the member from the laminated direction of the laminated body Pressing the above-mentioned pressing member to pressurize the laminated body along the laminating direction of the laminated body, and pressurizing the laminated body by a fluid. Step; In the case of the rolling member, one of the rolling members is a member in which a groove is formed, and 100113854 32 201222689 when the member in which the groove is formed is brought into contact with the laminated body, the above-described one of the rolling members is formed Each of the regions defined by the trenches respectively abuts the first electronic component or the second electronic component of the laminated body, and abuts the first electronic component or the second electronic component of the region defined by the trench The end face of the part is protruded from the inner side of the groove. The manufacturing method of the electronic device according to claim 1, wherein in the above step of obtaining the laminated body, the resin layer is The laminated body is heated at a temperature of 1 Pa · S or more and 10000 Pa · s or less. 10. A device comprising: the first terminal of a first electronic component including a first terminal having a solder layer on a surface thereof; and the second terminal including the first terminal of the first electronic component bonded to the first electronic component Between the second terminals of the two electronic components, a resin layer containing a fluxing active compound and a thermosetting resin is disposed to form a laminated body, and then the first terminal is in contact with the second terminal; A rolling member that simultaneously presses a plurality of laminated bodies. 11. The apparatus according to claim 10, wherein the rolling member simultaneously presses the plurality of '* laminated bodies arranged in the in-plane direction. 12. The apparatus of claim 10, wherein the rolling member has one of a plurality of laminated bodies of the plurality of laminated bodies, 100113854 33 201222689; At least one of the rolling members is a member in which a groove is formed, and when the member in which the groove is formed is brought into contact with the laminated body, each region divided by the groove of one of the rolling members is abutted And a first electronic component or a second electronic component of the laminated body, and an end surface of the first electronic component or the second electronic component that abuts on the region defined by the trench is more than a side surface of the trench It is formed by protruding from the inside of the groove. 13. The apparatus according to claim 10, wherein the laminated body is heated while using a temperature that does not reach a curing temperature of the resin layer, and the laminated layer is laminated along a laminated direction of the laminated body by a pressing member. The body is pressurized while being pressurized by the fluid to the laminate. 14. The apparatus according to claim 13, wherein the pressing member is a hot plate, and the laminated body is heated by abutting the hot plate against the laminated body. 15. The apparatus according to claim 13 or 14, wherein the laminated body is disposed in the container, and the fluid is introduced into the container, thereby pressurizing the laminated body by the fluid. Composition. 16. The apparatus of claim 10, wherein the temperature of the resin layer of the laminate is 1 Pa*s or more and 100113854 34 201222689 is heated to a temperature of 10000 Pa·s or less The apparatus according to claim 12, wherein at least one of the pair of the above-mentioned rolling members is formed with the above-mentioned groove, and is formed vertically symmetrically. The device of claim 17, wherein the at least one of the rolling members is attached to the groove on the lower surface of the second electronic component. A groove is formed on the upper surface. '冉地19. A pair of beautiful members, which is the patent application scope'. One of the rolling members, wherein the device is formed with at least one of the above-mentioned grooves, which is formed into a symmetrical structure. Terrain 20. As claimed in claim 19, for the rolling member, wherein at least the member is formed to be symmetrical with the groove formed under the contact of the second electronic component. The ground also went to the table (four) into a groove. 100113854 35
TW100113854A 2010-04-23 2011-04-21 Method for manufacturing electronic device, device and a pair of pressurization members thereof TW201222689A (en)

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