WO2011132384A1 - Device and method for producing electronic device, and pair of compressed members thereof - Google Patents

Device and method for producing electronic device, and pair of compressed members thereof Download PDF

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Publication number
WO2011132384A1
WO2011132384A1 PCT/JP2011/002184 JP2011002184W WO2011132384A1 WO 2011132384 A1 WO2011132384 A1 WO 2011132384A1 JP 2011002184 W JP2011002184 W JP 2011002184W WO 2011132384 A1 WO2011132384 A1 WO 2011132384A1
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WIPO (PCT)
Prior art keywords
laminate
terminal
groove
electronic component
manufacturing
Prior art date
Application number
PCT/JP2011/002184
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French (fr)
Japanese (ja)
Inventor
和布浦 徹
Hiroki NIKAIDO (二階堂 広基)
Original Assignee
住友ベークライト株式会社
二階堂 美奈
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Application filed by 住友ベークライト株式会社, 二階堂 美奈 filed Critical 住友ベークライト株式会社
Priority to JP2012511532A priority Critical patent/JPWO2011132384A1/en
Priority to CN2011800204408A priority patent/CN102859674A/en
Priority to KR1020127030656A priority patent/KR20130054283A/en
Publication of WO2011132384A1 publication Critical patent/WO2011132384A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613Polymers, e.g. resins
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Definitions

  • the present invention relates to a method and apparatus for manufacturing an electronic device in which opposing terminals are joined by solder, and a pair of pinching members thereof.
  • the electronic device performs, for example, a step of bonding a terminal of a semiconductor element and a terminal of another semiconductor element, a terminal of the semiconductor element and a terminal of a substrate, or a terminal of the substrate and a terminal of another substrate using solder. It is manufactured by.
  • the gap is filled with a cured resin.
  • Patent Document 1 discloses a method and apparatus for disposing a film-like underfill resin on a substrate surface and then mounting a semiconductor element on the underfill resin.
  • the semiconductor element is pressed against a substrate to form a laminate of the semiconductor element and the substrate, and then the underfill resin is cured in a high-pressure atmosphere. .
  • the present inventors have considered the following method for mass production of electronic devices. First, a plurality of substrates each provided with a thermosetting resin layer are arranged on a hot plate. Then, a semiconductor element is arrange
  • thermosetting resin layer a load is applied to the semiconductor element on the thermosetting resin layer so that the terminal of the semiconductor element penetrates the thermosetting resin layer and comes into contact with the terminal of the substrate, thereby forming a laminate.
  • This operation is repeated to obtain a plurality of laminated bodies. Then, while joining the terminal of the semiconductor element of a laminated body, and the terminal of a board
  • thermosetting resin layer is heated by the hot plate, curing proceeds gradually. While the substrate of the first laminate and the semiconductor element are in pressure contact with each other, curing of the thermosetting resin layer on another substrate different from the substrate proceeds.
  • the force that presses the first substrate and the semiconductor element and the force that presses the last substrate and the semiconductor element are greatly different.
  • the present invention has been made in view of the above-described problems, and provides a method and apparatus for manufacturing an electronic device and a pinching member thereof that can stably manufacture a highly reliable electronic device. is there.
  • an electronic device comprising: a first electronic component having a first terminal having a solder layer on the surface; and a second electronic component having a second terminal joined to the first terminal of the first electronic component. And a resin layer containing a flux active compound and a thermosetting resin is disposed between the first terminal of the first electronic component and the second terminal of the second electronic component to obtain a laminate.
  • the first terminals of the plurality of first electronic components and the second terminals of the plurality of second electronic components are arranged to face each other, and between each first terminal and each second terminal.
  • a plurality of laminates are formed by arranging resin layers, and a plurality of products are heated while heating the plurality of laminates.
  • the plurality of laminates are simultaneously pressed from the stacking direction of the laminates while heating the plurality of laminates.
  • curing of the thermosetting resin constituting the other laminate proceeds. Is suppressed. Therefore, a highly reliable electronic device can be manufactured stably.
  • an apparatus used in the above-described electronic device manufacturing method can also be provided. That is, according to the present invention, the first terminal of the first electronic component having the first terminal having the solder layer on the surface, and the second terminal having the second terminal joined to the first terminal of the first electronic component. A resin layer containing a flux active compound and a thermosetting resin is disposed between the second terminals of the two electronic components to form a laminate, and then the first terminal and the second terminal are brought into contact with each other. It is an apparatus for carrying out, Comprising: The apparatus provided with the clamping member which clamps a some laminated body simultaneously can also be provided.
  • a pinching member for the electronic device manufacturing apparatus described above. That is, according to the present invention, it is possible to provide a pressing member in which grooves of a pair of pressing members are formed and at least one of them is formed vertically symmetrical.
  • an electronic device manufacturing method and apparatus capable of stably manufacturing a highly reliable electronic device are provided.
  • the electronic device manufacturing method of the present embodiment includes a first electronic component 1 having a first terminal 11 having a solder layer 112 on the surface, and a second terminal 21 joined to the first terminal 11 of the first electronic component 1. And a second electronic component 2 having an electronic device manufacturing method.
  • a resin layer 3 containing a flux active compound and a thermosetting resin is disposed between a first terminal 11 of a first electronic component 1 and a second terminal 21 of a second electronic component 2.
  • a resin layer 3 containing a flux active compound and a thermosetting resin is disposed between a first terminal 11 of a first electronic component 1 and a second terminal 21 of a second electronic component 2.
  • the first terminals 11 of the plurality of first electronic components 1 and the second terminals 21 of the plurality of second electronic components 2 are arranged to face each other, and each first terminal 11 and each second
  • the resin layer 3 is disposed between the two terminals 21 to form a plurality of stacked bodies 4, and the plurality of stacked bodies 4 are simultaneously pressed from the stacking direction of the stacked bodies 4 while heating the plurality of stacked bodies 4.
  • the first electronic component 1 is prepared.
  • the first electronic component 1 is, for example, a substrate (flexible substrate, rigid substrate, ceramic substrate, etc.), a semiconductor chip, a semiconductor element mounting substrate, or the like.
  • the first electronic component 1 has a first terminal 11, and the first terminal 11 includes a first terminal body 111 and a solder layer 112 provided on the surface of the first terminal body 111.
  • the shape of the first terminal body 111 is not particularly limited, and examples thereof include a convex shape and a concave shape.
  • the material in particular of the 1st terminal main body 111 is not restrict
  • the material of the solder layer 112 is not particularly limited, and examples thereof include an alloy including at least two selected from the group consisting of tin, silver, lead, zinc, bismuth, indium, and copper. Among these, an alloy containing at least two selected from the group consisting of tin, silver, lead, zinc, and copper is preferable.
  • the melting point of the solder layer 112 is 110 to 250 ° C., preferably 170 to 230 ° C.
  • the solder layer 112 may be solder-plated with respect to the first terminal main body 111, and is configured by solder balls or solder paste disposed on the first terminal main body 111 to form solder bumps or the like. There may be.
  • a plurality of first electronic components 1 are formed in series.
  • the substrates are connected to form a single large substrate.
  • disconnecting the 1st electronic components 1 is formed in the large sized board
  • the second electronic component 2 is prepared (see FIG. 1).
  • the second electronic component 2 is, for example, a semiconductor chip or a semiconductor element mounting substrate.
  • the second electronic component 2 has a second terminal 21.
  • the shape of the second terminal 21 is not particularly limited as long as it can be soldered to the first terminal 11, and examples thereof include a convex shape and a concave shape. Moreover, the material in particular of the 2nd terminal 21 is not restrict
  • the plurality of first electronic components 1 and the plurality of second electronic components 2 are aligned.
  • a plurality of laminated bodies 4 in which the resin layer 3 is disposed between the first electronic component 1 and the second electronic component 2 are obtained.
  • the some laminated body 4 is arranged in an in-plane direction, for example.
  • the second terminal 21 of the second electronic component 2 does not bite into the resin layer 3 and is not in contact with the first terminal 11.
  • the first terminal 11 and the second terminal 21 may be in contact with each other in a state where the resin is interposed between the first terminal 11 and the second terminal 21.
  • the resin layer 3 includes a thermosetting resin that can fill a gap between the first electronic component 1 and the second electronic component 2.
  • a thermosetting resin contained in the resin layer 3 for example, epoxy resin, oxetane resin, phenol resin, (meth) acrylate resin, unsaturated polyester resin, diallyl phthalate resin, maleimide resin, and the like can be used. These can be used individually or in mixture of 2 or more types.
  • the minimum melt viscosity at 100 to 200 ° C. of the resin layer 3 is preferably 1 to 1000 Pa ⁇ s, particularly preferably 1 to 500 Pa ⁇ s.
  • the minimum melt viscosity at 100 to 200 ° C. of the resin layer 3 is in the above range, voids (voids) are hardly generated in the cured product.
  • the minimum melt viscosity is measured, for example, using a rheometer, which is a viscoelasticity measuring device, by applying shear shear with a frequency of 1 Hz to a sample in a film state at a heating rate of 10 ° C./min.
  • the resin layer 3 is a resin layer having an action of removing an oxide film on the surface of the solder layer 112 during solder joining. Since the resin layer 3 has a flux action, the oxide film covering the surface of the solder layer 112 is removed, so that solder bonding can be performed.
  • the resin layer 3 In order for the resin layer 3 to have a flux action, the resin layer 3 needs to contain a flux active compound.
  • the flux active compound contained in the resin layer 3 is not particularly limited as long as it is used for solder bonding, but includes any of a carboxyl group, a phenol hydroxyl group, a compound having both a carboxyl group and a phenol hydroxyl group, and the like. preferable.
  • the blending amount of the flux active compound in the resin layer 3 is preferably 1 to 30% by weight, particularly preferably 3 to 20% by weight.
  • the flux activity of the resin layer 3 can be improved, and the thermosetting resin and unreacted flux activity in the resin layer 3 can be improved. The compound is prevented from remaining.
  • phenol novolak resin cresol novolak resin, aliphatic dicarboxylic acid, aromatic dicarboxylic acid and the like that act as a curing agent for epoxy resin also have a flux action.
  • the resin layer 3 containing the flux active curing agent that acts as a flux active compound and also acts as a curing agent for the thermosetting resin as a curing agent for the thermosetting resin has a flux effect.
  • Resin layer 3 is formed.
  • the flux active compound having a carboxyl group means a compound having one or more carboxyl groups in the molecule, and may be liquid or solid.
  • the flux active compound having a phenolic hydroxyl group means a compound having one or more phenolic hydroxyl groups in the molecule, and may be liquid or solid.
  • the flux active compound having a carboxyl group and a phenolic hydroxyl group means a compound having one or more carboxyl groups and phenolic hydroxyl groups in the molecule, and may be liquid or solid.
  • examples of the flux active compound having a carboxyl group include aliphatic acid anhydrides, alicyclic acid anhydrides, aromatic acid anhydrides, aliphatic carboxylic acids, and aromatic carboxylic acids.
  • Examples of the aliphatic acid anhydride related to the flux active compound having a carboxyl group include succinic anhydride, polyadipic acid anhydride, polyazeline acid anhydride, polysebacic acid anhydride, and the like.
  • Examples of alicyclic acid anhydrides related to flux active compounds having a carboxyl group include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylhymic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydro Examples thereof include phthalic anhydride and methylcyclohexene dicarboxylic acid anhydride.
  • aromatic acid anhydride related to the flux active compound having a carboxyl group phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimellitate, glycerol tris trimellitate, Etc.
  • Examples of the aliphatic carboxylic acid related to the flux active compound having a carboxyl group include compounds represented by the following general formula (1), formic acid, acetic acid, propionic acid, butyric acid, valeric acid, pivalic acid caproic acid, caprylic acid, and lauric acid. , Myristic acid, palmitic acid, stearic acid, acrylic acid, methacrylic acid, crotonic acid, oleic acid, fumaric acid, maleic acid, oxalic acid, malonic acid, oxalic acid, and the like.
  • general formula (1) formic acid, acetic acid, propionic acid, butyric acid, valeric acid, pivalic acid caproic acid, caprylic acid, and lauric acid.
  • n a natural number of 20 or less.
  • Aromatic carboxylic acids related to flux active compounds with carboxyl groups include benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, hemimellitic acid, trimellitic acid, trimesic acid, merophanic acid, planitic acid, pyromellitic acid, merit Acid, triyl acid, xylyl acid, hemelic acid, mesitylene acid, prenylic acid, toluic acid, cinnamic acid, salicylic acid, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxy) Benzoic acid), 2,6-dihydroxybenzoic acid, 3,5-dihydroxybenzoic acid, gallic acid (3,4,5-trihydroxybenzoic acid), 1,4-dihydroxy-2-naphthoic acid, 3,5 -Naphthoic acid derivatives such as dihydroxy-2-naphthoic acid, phenolphthaline
  • the compound represented by the general formula (1) is preferable.
  • the compound in which n in the formula (1) is 3 to 10 can suppress an increase in elastic modulus in the resin layer after curing. It is particularly preferable in that the adhesion between the first electronic component 1 and the second electronic component 2 can be improved.
  • Examples of the flux active compound having a phenolic hydroxyl group include phenols. Specifically, for example, phenol, o-cresol, 2,6-xylenol, p-cresol, m-cresol, o-ethylphenol, 2 , 4-xylenol, 2,5 xylenol, m-ethylphenol, 2,3-xylenol, meditol, 3,5-xylenol, p-tertiarybutylphenol, catechol, p-tertiaryamylphenol, resorcinol, p-octylphenol, Monomers containing phenolic hydroxyl groups such as p-phenylphenol, bisphenol A, bisphenol F, bisphenol AF, biphenol, diallyl bisphenol F, diallyl bisphenol A, trisphenol, tetrakisphenol , Phenol novolak resins, o- cresol novolak resin, bisphenol F novo
  • the above-described carboxyl group or phenol hydroxyl group, or a compound having both a carboxyl group and a phenol hydroxyl group is taken in three-dimensionally by reaction with a thermosetting resin such as an epoxy resin.
  • the flux active compound there is a flux active curing agent having a flux action and acting as a curing agent for the epoxy resin. preferable.
  • Examples of the flux active curing agent include, in one molecule, two or more phenolic hydroxyl groups that can be added to an epoxy resin, and one or more carboxyls directly bonded to an aromatic group that exhibits a flux action (reduction action). And a compound having a group.
  • flux active curing agents examples include 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, 3,4- Benzoic acid derivatives such as dihydroxybenzoic acid and gallic acid (3,4,5-trihydroxybenzoic acid); 1,4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2-naphthoic acid, 3,7- Examples thereof include naphthoic acid derivatives such as dihydroxy-2-naphthoic acid; phenolphthaline; and diphenolic acid. These may be used alone or in combination of two or more.
  • phenolphthaline it is estimated that the epoxy resin can be cured after removing the oxide on the surface of the solder layer 112.
  • the amount of the flux active curing agent in the resin layer 3 is preferably 1 to 30% by weight, and particularly preferably 3 to 20% by weight.
  • the blending amount of the flux active curing agent in the resin layer 3 is in the above range, the flux activity of the resin layer can be improved, and the resin layer has a flux active curing that has not reacted with the thermosetting resin. The agent is prevented from remaining.
  • the resin layer 3 may contain the inorganic filler.
  • the minimum melt viscosity of the resin layer 3 can be increased and the formation of a gap between the first terminal 11 and the second terminal 21 can be suppressed.
  • the fluidity of the resin layer 3 becomes very high, the resin layer 3 enters between the first terminal 11 and the second terminal 21, and the first The one terminal 11 and the second terminal 21 may be separated from each other.
  • examples of the inorganic filler include silica and alumina.
  • the resin layer 3 may contain a curing catalyst.
  • a curing catalyst can be suitably selected according to the kind of thermosetting resin in the resin layer 3, an imidazole compound can be used from a viewpoint of a coating-film moldability improvement, for example.
  • imidazole compound examples include 2-phenylhydroxyimidazole and 2-phenyl-4-methylhydroxyimidazole.
  • the blending ratio of the curing catalyst is, for example, 0.01% by weight or more and 5% by weight or less when the total of the constituent components of the resin layer 3 is 100.
  • the blending ratio of the curing catalyst is set to 0.01% by weight or more, the function as the curing catalyst can be exhibited more effectively and the curability of the resin layer 3 can be improved.
  • the preservability of the resin layer 3 can further be improved by setting the blending ratio of the curing catalyst to 5% by weight or less.
  • a method of arranging the resin layer 3 between the first electronic component 1 and the second electronic component 2 for example, (1) A method of preparing a resin film obtained by forming a resin composition containing a flux active compound into a film, and laminating the resin film on the first electronic component 1 or the second electronic component 2; (2) A method of preparing a liquid resin composition containing a flux active compound and applying the liquid resin composition to the surface of the first electronic component 1 or the second electronic component 2; (3) A resin varnish in which a resin composition containing a flux active compound is dissolved or dispersed in a solvent is prepared, and this resin varnish is applied to the surface of the first electronic component 1 or the second electronic component 2 Applying, and then volatilizing the solvent in the resin varnish, Is mentioned.
  • the liquid resin composition which concerns on the method (2) does not contain a solvent.
  • a plurality of resin layers 3 are connected to each other to constitute one resin sheet straddling the plurality of first electronic components 1. If it demonstrates in detail, the resin sheet will be comprised by the some resin layer 3, and the connection part which has connected resin layers 3, and resin layers 3 are connected via the connection part.
  • the second terminals are pressed in the stacking direction of the stacked bodies 4 so that the first terminals 11 and the second terminals 21 are in contact with each other as shown in FIG. 3. 21 is embedded in the resin layer 3.
  • the first terminal 11 and the second terminal 21 are not soldered by the solder layer 112 of the first terminal 11.
  • the apparatus 5 shown in FIGS. 4 to 5 is used.
  • the device 5 includes a first terminal 11 of the first electronic component 1 having a first terminal 11 having a solder layer 112 on the surface, and a second terminal 21 joined to the first terminal 11 of the first electronic component 1.
  • the resin layer 3 including the flux active compound and the thermosetting resin is disposed between the second terminal 21 of the second electronic component 2 and the laminate 4 is formed, the first terminal 11, This is a device for contacting the two terminals 21.
  • the apparatus 5 includes a jig 53 that is a clamping member that simultaneously clamps the plurality of stacked bodies 4. More specifically, the apparatus 5 includes a furnace (heating furnace) 51 in which a plurality of laminated bodies 4 are disposed, an upper heating plate 521 and a lower heating plate 522 that are press members disposed in the furnace 51. And a jig 53.
  • the furnace 51 includes an upper mold 511 and a lower mold 512, and an upper heating plate 521 and a lower heating plate 522 are arranged in a space formed by the upper mold 511 and the lower mold 512.
  • the upper heating plate 521 and the lower heating plate 522 are arranged to face each other, and the jig 53 and the plurality of laminated bodies 4 are arranged between the upper heating plate 521 and the lower heating plate 522.
  • the pair of hot plates 521 and 522 are at a temperature lower than the melting point of the solder layer 112.
  • the jig 53 includes an upper pressure member 531 having a groove and a flat plate-like lower pressure member 532.
  • a plurality of stacked bodies 4 are arranged between the upper pressure member 531 and the lower pressure member 532.
  • the upper pressure member 531 has a plate shape and a planar rectangular shape.
  • the upper pressure member 531 is formed with a plurality of grooves 531A, and some of the grooves 531A intersect each other.
  • the grooves 531A are formed in a lattice shape.
  • the region 531B partitioned by the groove 531A comes into contact with the second electronic component 2 of the laminate 4.
  • the second electronic component 2 of one stacked body 4 comes into contact with one region 531B.
  • the lower pressure member 532 has a planar rectangular shape, and no groove is formed in the lower pressure member 532, and the lower pressure member 532 is made of a plate material having a flat surface.
  • the lower pressure member 532 and the surface of the upper pressure member 531 on which the groove 531A is formed are opposed to each other.
  • the first electronic component 1 of the stacked body 4 is in contact with the lower pressure member 532.
  • the material of the lower pressure member 532 and the upper pressure member 531 is not particularly limited, and examples thereof include a metal plate and a ceramic plate.
  • Examples of the metal plate include a stainless plate, a titanium plate, and a lead plate.
  • Examples of the ceramic plate include a glass plate, an alumina plate, a silicon nitride plate, and a zirconia plate. However, those having good thermal conductivity are preferred.
  • a plurality of laminated bodies 4 are arranged between the upper pressure member 531 and the lower pressure member 532 of the jig 53, and the upper pressure member 531 and the lower pressure member 532.
  • a plurality of laminates 4 are sandwiched between members 532.
  • the width W1 of the groove 531A (the length in the direction orthogonal to the extending direction of the groove 531A) is larger than the gap W2 between the adjacent stacked bodies 4.
  • the end surface (side surface) of the second electronic component 2 that abuts on the region 531B defined by the groove 531A protrudes inside the groove 531A from the side surface 531C of the groove 531A.
  • the region 531 ⁇ / b> B defined by the groove 531 ⁇ / b> A having the width W ⁇ b> 1 of the upper pressure member 531 is formed in a shape located outside the second terminal 21 of the second electronic component 2.
  • the resin layers 3 of the adjacent laminates 4 are formed continuously, but since a gap is formed between the adjacent second electronic components 2, the resin layer 3 is connected from the gap. A part of the resin sheet constituted by is exposed. The exposed portion of the resin sheet faces the groove 531A.
  • FIG. 6 is a view showing a state in which a plurality of stacked bodies 4 are sandwiched between the upper pressure member 531 and the lower pressure member 532.
  • the jig 53 and the plurality of stacked bodies 4 are transported into the furnace 51.
  • a transport film or the like may be used.
  • the upper heating plate 521 and the lower heating plate 522 are in a heated state in advance. Thereafter, the upper mold 511 is moved to the lower mold 512 side, and the gap between the upper mold 511 and the lower mold 512 is closed. The lower heat plate 522 comes into contact with the lower pressure member 532 of the jig 53 (see FIG. 4).
  • the upper heating plate 521 is moved downward, and the upper heating plate 521 comes into contact with the upper pressure member 531 of the jig 53.
  • the upper pressing member 531 of the jig 53 is pushed downward by the upper heating plate 521, the jig 53 is clamped by the lower heating plate 522 and the upper heating plate 521, and the upper pressing members 531, 532 of the jig 53 A plurality of laminated bodies 4 will be pinched.
  • the plurality of laminates 4 are less than the melting point of the solder layer 112 and less than the curing temperature of the resin layer 3, that is, less than the curing temperature of the thermosetting resin of the resin layer 3 (the thermosetting resin contained in the resin layer 3
  • the second terminal 21 is made of resin so that the first terminal 11 and the second terminal 21 come into contact with each other while being heated at a temperature lower than the C-stage in accordance with JISK6900). It will sink into layer 3.
  • the upper mold 511 and the lower mold 512 are separated from each other, and the plurality of stacked bodies 4 are carried out from the furnace 51.
  • the plurality of stacked bodies 4 may be clamped under a vacuum. Thereby, generation
  • the plurality of stacked bodies 4 are heated to the melting point or higher of the solder layer 112 of the first terminal 11, and the first terminal 11 and the second terminal 21 are soldered. .
  • the apparatus 6 can heat the laminated body 4 in a pressurized atmosphere.
  • the structure of the apparatus 6 includes, for example, a container 61 that houses the laminated body 4 and a fluid for introducing the fluid into the container 61. And a pipe 62.
  • the container 61 is characterized by being a pressure vessel. After the laminated body 4 is installed in the container 61, the laminated body 4 is heated by heating from the pipe 62 and flowing a pressurized fluid into the container 61. Pressurize.
  • the laminated body 4 can also be heated by flowing the fluid from the pipe 62 into the container 61 and heating the container 61 in a pressurized atmosphere.
  • the material of the container 61 include metals, such as stainless steel, titanium, copper, and alloys thereof.
  • the pressure applied when the laminate 4 is pressurized with a fluid is 0.1 to 10 MPa, preferably 0.5 to 5 MPa. By doing in this way, it becomes difficult to generate voids in the cured resin layer 3.
  • pressurizing with a fluid refers to making the pressure of the atmosphere of the laminated body 4 higher than atmospheric pressure by the applied pressure. That is, the applied pressure of 10 MPa indicates that the pressure acting on the laminate is 10 MPa greater than the atmospheric pressure.
  • the laminated body 4 After installing the laminated body 4 in the container 61, the laminated body 4 is heated and the laminated body 4 is pressurized.
  • the fluid that pressurizes the stacked body 4 is introduced into the container 61 from the pipe 62 and pressurizes the stacked body 4.
  • a non-oxidizing gas such as nitrogen gas or argon gas, or a gas such as air is preferable.
  • a non-oxidizing gas By using a non-oxidizing gas, the first terminal 11 and the second terminal 21 can be joined better.
  • the non-oxidizing gas means inert gas or nitrogen gas.
  • the laminated body 4 After the temperature of the laminated body 4 reaches the melting point of the solder layer 112, the laminated body 4 is heated and pressurized for a predetermined time while maintaining the temperature and pressure in the container 61. Thereby, the resin layer 3 in the laminated body 4 will harden
  • the laminate 4 is taken out from the apparatus 6 and the laminate 4 is cured again as necessary.
  • an electronic device can be obtained (see FIG. 9).
  • the first terminal 11 and the second terminal 21 are joined by the solder layer 112, and the tip of the second terminal 21 is in a state of being bitten into the solder layer 112.
  • a plurality of separated electronic devices can be obtained by cutting between the first electronic components 1 and between the resin layers 3 according to the dotted cutting line shown in FIG.
  • the plurality of stacked bodies 4 are simultaneously pressed from the stacking direction of the stacked bodies 4 while heating the plurality of stacked bodies 4. Thereby, while the 1st electronic component 1 and the 2nd electronic component 2 of the 1st laminated body 4 are clamped, it is suppressed that hardening of the resin layer 3 of the other laminated body 4 advances. Is done. Therefore, a highly reliable electronic device can be manufactured stably.
  • the laminated body 4 is pressurized with the pressurized fluid and the resin layer 3 is cured, the generation of voids such as bubbles in the cured product of the resin layer 3 can be suppressed. Furthermore, when soldering the first terminal 11 and the second terminal 21, if the laminate 4 is pressurized with a fluid, the density of the resin layer 3 is increased and the volume is reduced. A force can be applied in the direction in which the second terminal 21 is crimped.
  • the laminate 4 is pressurized with a fluid, the resin flow due to foaming of the resin layer 3 can be suppressed, and the first terminal 11 and the second terminal 21 The deviation can be reliably reduced.
  • the groove 531A is formed in the upper pressure member 531 that sandwiches the stacked body 4.
  • the resin layer 3 of the laminate 4 may protrude from the laminate 4, but the protruded resin layer 3 can escape into the groove 531 ⁇ / b> A. Thereby, it is possible to prevent the resin from entering between the second electronic component 2 and the upper pressure member 531.
  • the end surface of the second electronic component 2 that abuts on the region 531B defined by the groove 531A protrudes inside the groove 531A from the side surface 531C of the groove 531A.
  • the resin protruding from the laminated body 4 may crawl up along the end surface of the second electronic component 2 of the laminated body 4. Since the side surface 531C of the groove 531A does not protrude to the inside of the groove 531A from the end surface of the second electronic component 2, the resin scooping up the end surface of the second electronic component 2 adheres to the upper pressure member 531. This can be suppressed. Therefore, contamination of the upper pressure member 531 with the resin can be prevented.
  • the groove 531A is not formed in the upper pressure member 531, there is a possibility that the resin protruding from the laminate 4 adheres to the member and the surface of the member on the laminate 4 side is not flat. is there. Therefore, the load acting on the laminate 4 may vary.
  • the adhesion of the resin to the upper pressure member 531 can be prevented as described above, it is possible to suppress the occurrence of variations in the load acting on the laminate 4.
  • the present invention is not limited to the above-described embodiment, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.
  • the jig 53 is used in the device 5, but the present invention is not limited to this, and the jig 53 may not be used.
  • the first electronic components 1 and the resin layers 3 were connected, it is not restricted to this.
  • the first electronic components 1 and the resin layers 3 may be separated in advance, and there may be a gap (gap) between the first electronic components 1 and between the resin layers 3.
  • the upper pressure member 531 is brought into contact with the second electronic component 2, but the present invention is not limited to this, and the upper pressure member 531 may be brought into contact with the first electronic component 1. Good.
  • the upper pressure member 531 is in contact with the first electronic component 1, and in the other laminate 4, the upper pressure member 531 is in contact with the second electronic component 2. It may be. However, from the viewpoint of the stability of bonding between the terminals, it is preferable that the parts contacting the upper pressure member 531 are the same parts as in the above embodiment.
  • the groove 531A that divides the region 531B in contact with the second electronic component 2 of the laminate 4 is formed only on the lower surface, and the upper pressure member 531 having a flat upper surface is illustrated.
  • the groove 533A identical to the groove 531A on the lower surface is also formed on the upper surface, and the region 533B is partitioned, so that the upper and lower symmetrical upper pressure members are formed.
  • the member 533 and the like can also be implemented.
  • the up-down direction here corresponds to the up-down direction in FIG. That is, it coincides with the stacking direction of the stacked body 4.
  • the upper pressing member 533 is symmetrical in the vertical direction, it is possible to prevent the bending due to the pressing well, and to press the plurality of second electronic components 2 to the first electronic component 1 more evenly.
  • the upper pressure member 533 as described above is vertically symmetric, it can be prevented from being bent in the vertical direction due to pressure during manufacturing.
  • a laminated body is heated by the hot plates 521 and 522 which are press members, heating the laminated body 4 at the temperature below the curing temperature of the resin layer 3. Only the pressurization of the laminate 4 along the four lamination directions is illustrated.
  • the laminate 4 when the laminate 4 is mechanically pressurized in this manner, the laminate 4 may be further pressurized by a fluid such as air (not shown). In this case, not only can the laminated body 4 be pressed uniformly, but also the expansion of bubbles generated in the resin layer 3 can be prevented.
  • a fluid such as air
  • the laminate 4 may be heated at a temperature that is lower than the curing temperature of the resin layer 3 and the viscosity of the resin layer 3 is 1 Pa ⁇ s or more and 10,000 Pa ⁇ s or less. Moreover, in the process of obtaining the above-mentioned laminated body 4, the laminated body 4 may be arrange
  • the pressure of the fluid that pressurizes the stacked body 4 is an internal pressure that opens the upper mold 511 and the lower mold 512 of the furnace 51. Therefore, as shown in FIG. 11, the pressure for closing the upper mold 511 and the lower mold 512 of the furnace 51, the pressure of the hot plates 521 and 522 that directly pressurize the stacked body 4, and the furnace that pressurizes the stacked body 4. It is preferable that the air pressure in 51 can be controlled separately.

Abstract

The disclosed method—for producing an electronic device provided with a first electronic component (1) having a first terminal having a solder layer on the surface and a second electronic component (2) having a second terminal joined to the first terminal of the first electronic component (1)—causes the first terminals of a plurality of the first electronic components (1) and the second terminals of a plurality of the second electronic components (2) to be disposed respectively facing one another, disposes a resin layer (3) between each first terminal and each second terminal, forming a plurality of layered bodies, and simultaneously compresses the plurality of layered bodies in the direction of layering of the layered bodies while heating the plurality of layered bodies.

Description

電子装置の製造方法および装置、その一対の挟圧部材Electronic device manufacturing method and apparatus, and a pair of clamping members
 本発明は、相対する端子が半田で接合されている電子装置の製造方法および装置、その一対の挟圧部材、に関する。 The present invention relates to a method and apparatus for manufacturing an electronic device in which opposing terminals are joined by solder, and a pair of pinching members thereof.
 電子装置は、例えば、半導体素子の端子と他の半導体素子の端子、半導体素子の端子と基板の端子、または、基板の端子と他の基板の端子とを、半田を用いて接合する工程を行うことにより製造される。 The electronic device performs, for example, a step of bonding a terminal of a semiconductor element and a terminal of another semiconductor element, a terminal of the semiconductor element and a terminal of a substrate, or a terminal of the substrate and a terminal of another substrate using solder. It is manufactured by.
 半田を用いて接合を行った後の半導体素子間、半導体素子と基板との間、あるいは基板間(以下、半導体素子間等という)には、隙間ができるので、樹脂の硬化物で隙間を埋める必要がある。 Since there is a gap between the semiconductor elements after bonding using solder, between the semiconductor element and the substrate, or between the substrates (hereinafter referred to as between the semiconductor elements), the gap is filled with a cured resin. There is a need.
 従来は、半田を用いて接合した後に、半導体素子間等に、流動性の熱硬化性樹脂を流し込み、次いで、樹脂を硬化することにより、半導体素子間等の隙間を埋めていた。ところが、上述した方法では、半導体素子間等に、隙間なく流動性の熱硬化性樹脂を流し込むことが難しいため、以下のような方法が特許文献1において、提案されている。 Conventionally, after joining using solder, a fluid thermosetting resin is poured between semiconductor elements, and then the resin is cured to fill gaps between the semiconductor elements. However, in the above-described method, since it is difficult to pour a fluid thermosetting resin between semiconductor elements and the like, the following method is proposed in Patent Document 1.
 特許文献1には、基板表面にフィルム状のアンダーフィル樹脂を配置し、その後、アンダーフィル樹脂上に半導体素子を搭載する方法および装置が開示されている。特許文献1では、アンダーフィル樹脂上に半導体素子を搭載した後、半導体素子を基板に圧接し、半導体素子と基板との積層体を形成した後、高圧雰囲気中でアンダーフィル樹脂を硬化させている。 Patent Document 1 discloses a method and apparatus for disposing a film-like underfill resin on a substrate surface and then mounting a semiconductor element on the underfill resin. In Patent Document 1, after mounting a semiconductor element on an underfill resin, the semiconductor element is pressed against a substrate to form a laminate of the semiconductor element and the substrate, and then the underfill resin is cured in a high-pressure atmosphere. .
特開2004-311709号公報JP 2004-311709 A
 本発明者らは、電子装置の量産に際し、以下の方法を考えた。まず、熱板のうえに、熱硬化性樹脂層がそれぞれ設けられた複数の基板を配置する。その後、熱硬化性樹脂層上に、半導体素子を配置する。 The present inventors have considered the following method for mass production of electronic devices. First, a plurality of substrates each provided with a thermosetting resin layer are arranged on a hot plate. Then, a semiconductor element is arrange | positioned on a thermosetting resin layer.
 このとき、半導体素子の端子が熱硬化性樹脂層を貫通し、基板の端子と接触するように、熱硬化性樹脂層上の半導体素子に荷重をかけ、圧接して積層体とする。この操作を繰り返し複数の積層体を得る。その後、積層体の半導体素子の端子、基板の端子同士を接合するとともに、樹脂層を加圧キュアする。 At this time, a load is applied to the semiconductor element on the thermosetting resin layer so that the terminal of the semiconductor element penetrates the thermosetting resin layer and comes into contact with the terminal of the substrate, thereby forming a laminate. This operation is repeated to obtain a plurality of laminated bodies. Then, while joining the terminal of the semiconductor element of a laminated body, and the terminal of a board | substrate, the resin layer is pressure-cure.
 しかしながら、この方法では、熱硬化性樹脂層が熱板により、加熱状態となるので、徐々に硬化が進行してしまう。一つ目の積層体の基板と半導体素子とを圧接している間に、前記基板とは異なる他の基板上の熱硬化性樹脂層の硬化が進行してしまうのである。 However, in this method, since the thermosetting resin layer is heated by the hot plate, curing proceeds gradually. While the substrate of the first laminate and the semiconductor element are in pressure contact with each other, curing of the thermosetting resin layer on another substrate different from the substrate proceeds.
 従って、一つ目の基板と半導体素子とを圧接する力と、最後の基板と半導体素子とを圧接する力とが大きく異なってしまう。これにより、基板に設けられた端子と半導体素子に設けられた端子との間で導通不良が発生し、信頼性が低下することが懸念される。 Therefore, the force that presses the first substrate and the semiconductor element and the force that presses the last substrate and the semiconductor element are greatly different. As a result, there is a concern that a conduction failure occurs between the terminal provided on the substrate and the terminal provided on the semiconductor element, and the reliability decreases.
 なお、ここでは、基板と半導体素子との積層体を作製する場合について述べたが、これに限らず、基板同士、半導体素子同士の積層体を作製する場合においても、同様の課題が生じる。 In addition, although the case where the laminated body of a board | substrate and a semiconductor element was produced was described here, the same subject arises also when producing the laminated body of not only this but a board | substrate and semiconductor elements.
 本発明は上述のような課題に鑑みてなされたものであり、信頼性の高い電子装置を安定的に製造することができる電子装置の製造方法および装置、その挟圧部材、を提供するものである。 The present invention has been made in view of the above-described problems, and provides a method and apparatus for manufacturing an electronic device and a pinching member thereof that can stably manufacture a highly reliable electronic device. is there.
 本発明によれば、表面に半田層を有する第一端子を有する第一電子部品と、この第一電子部品の第一端子に接合される第二端子を有する第二電子部品とを備える電子装置の製造方法であって、第一電子部品の第一端子と第二電子部品の第二端子との間に、フラックス活性化合物と熱硬化性樹脂とを含む樹脂層を配置して積層体を得る工程と、積層体を第一端子の半田層の融点以上に加熱して第一端子と第二端子とを半田接合させる工程と、流体により積層体を加圧しながら樹脂層を硬化させる工程とを含み、積層体を得る工程では、複数の第一電子部品の第一端子と複数の第二電子部品の第二端子とをそれぞれ対向配置させ、各第一端子と各第二端子との間に樹脂層を配置して複数の積層体を形成し、複数の積層体を加熱しながら複数の積層体を同時に積層体の積層方向から挟圧する電子装置の製造方法が提供される。 According to the present invention, an electronic device comprising: a first electronic component having a first terminal having a solder layer on the surface; and a second electronic component having a second terminal joined to the first terminal of the first electronic component. And a resin layer containing a flux active compound and a thermosetting resin is disposed between the first terminal of the first electronic component and the second terminal of the second electronic component to obtain a laminate. A step of heating the laminated body to a temperature equal to or higher than the melting point of the solder layer of the first terminal to solder-bond the first terminal and the second terminal, and a step of curing the resin layer while pressurizing the laminated body with a fluid. Including, in the step of obtaining the laminate, the first terminals of the plurality of first electronic components and the second terminals of the plurality of second electronic components are arranged to face each other, and between each first terminal and each second terminal. A plurality of laminates are formed by arranging resin layers, and a plurality of products are heated while heating the plurality of laminates. Method of manufacturing an electronic device nipping body simultaneously from the laminate direction of the laminate is provided.
 この発明によれば、複数の積層体を加熱しながら、複数の積層体を同時に積層体の積層方向から挟圧している。これにより、一つ目の積層体の第一電子部品と第二電子部品とを加熱しながら挟圧している間に、他の積層体を構成する熱硬化性樹脂の硬化が進行してしまうことが抑制される。従って、信頼性の高い電子装置を安定的に製造することができる。 According to this invention, the plurality of laminates are simultaneously pressed from the stacking direction of the laminates while heating the plurality of laminates. As a result, while the first electronic component and the second electronic component of the first laminate are sandwiched while being heated, curing of the thermosetting resin constituting the other laminate proceeds. Is suppressed. Therefore, a highly reliable electronic device can be manufactured stably.
 また、本発明によれば、上述した電子装置の製造方法に使用される装置も提供できる。すなわち、本発明によれば、表面に半田層を有する第一端子を有する第一電子部品の前記第一端子と、この第一電子部品の前記第一端子に接合される第二端子を有する第二電子部品の前記第二端子との間に、フラックス活性化合物と熱硬化性樹脂とを含む樹脂層を配置して、積層体を形成した後、前記第一端子と前記第二端子とを接触させるための装置であって、複数の積層体を同時に挟圧する挟圧部材を備える装置も提供できる。 Further, according to the present invention, an apparatus used in the above-described electronic device manufacturing method can also be provided. That is, according to the present invention, the first terminal of the first electronic component having the first terminal having the solder layer on the surface, and the second terminal having the second terminal joined to the first terminal of the first electronic component. A resin layer containing a flux active compound and a thermosetting resin is disposed between the second terminals of the two electronic components to form a laminate, and then the first terminal and the second terminal are brought into contact with each other. It is an apparatus for carrying out, Comprising: The apparatus provided with the clamping member which clamps a some laminated body simultaneously can also be provided.
 さらに、本発明によれば、上述した電子装置の製造装置の挟圧部材も提供できる。すなわち、本発明によれば、一対の挟圧部材の溝が形成されていて少なくとも一方は上下対称に形成されている挟圧部材も提供できる。 Furthermore, according to the present invention, it is also possible to provide a pinching member for the electronic device manufacturing apparatus described above. That is, according to the present invention, it is possible to provide a pressing member in which grooves of a pair of pressing members are formed and at least one of them is formed vertically symmetrical.
 本発明によれば、信頼性の高い電子装置を安定的に製造することができる電子装置の製造方法および装置が提供される。 According to the present invention, an electronic device manufacturing method and apparatus capable of stably manufacturing a highly reliable electronic device are provided.
本発明の一実施形態に係る電子装置の製造工程を示す工程断面図である。It is process sectional drawing which shows the manufacturing process of the electronic device which concerns on one Embodiment of this invention. 電子装置の製造工程を示す工程断面図である。It is process sectional drawing which shows the manufacturing process of an electronic device. 電子装置の製造工程を示す工程断面図である。It is process sectional drawing which shows the manufacturing process of an electronic device. 電子装置の製造装置を示す断面図である。It is sectional drawing which shows the manufacturing apparatus of an electronic device. 電子装置の製造装置を示す断面図である。It is sectional drawing which shows the manufacturing apparatus of an electronic device. 複数の積層体が冶具ではさまれた状態を示す断面図である。It is sectional drawing which shows the state with which the some laminated body was pinched with the jig. 冶具を構成する部材を示す平面図である。It is a top view which shows the member which comprises a jig. 電子装置の製造工程を示す工程断面図である。It is process sectional drawing which shows the manufacturing process of an electronic device. 電子装置を示す断面図である。It is sectional drawing which shows an electronic device. 一の変形例の電子装置の製造装置を示す断面図である。It is sectional drawing which shows the manufacturing apparatus of the electronic device of one modification. 他の変形例の電子装置の製造装置を示す断面図である。It is sectional drawing which shows the manufacturing apparatus of the electronic device of another modification.
 以下、本発明の実施形態を図面に基づいて説明する。はじめに、図1ないし図5を参照して、本実施形態の電子装置の製造方法の概要について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, an outline of a method for manufacturing an electronic device according to the present embodiment will be described with reference to FIGS.
 本実施形態の電子装置の製造方法は、表面に半田層112を有する第一端子11を有する第一電子部品1と、この第一電子部品1の第一端子11に接合される第二端子21を有する第二電子部品2と、を備える電子装置の製造方法である。 The electronic device manufacturing method of the present embodiment includes a first electronic component 1 having a first terminal 11 having a solder layer 112 on the surface, and a second terminal 21 joined to the first terminal 11 of the first electronic component 1. And a second electronic component 2 having an electronic device manufacturing method.
 この電子装置の製造方法は、第一電子部品1の第一端子11と第二電子部品2の第二端子21との間に、フラックス活性化合物と熱硬化性樹脂とを含む樹脂層3を配置して積層体4を得る工程と、積層体4を第一端子11の半田層112の融点以上に加熱して、第一端子11と第二端子21とを半田接合させる工程と、流体により積層体4を加圧しながら、樹脂層3を硬化させる工程とを含む。 In this method of manufacturing an electronic device, a resin layer 3 containing a flux active compound and a thermosetting resin is disposed between a first terminal 11 of a first electronic component 1 and a second terminal 21 of a second electronic component 2. To obtain the laminate 4, to heat the laminate 4 to the melting point or higher of the solder layer 112 of the first terminal 11, to solder the first terminal 11 and the second terminal 21, and to laminate by the fluid A step of curing the resin layer 3 while pressurizing the body 4.
 積層体4を得る上記工程では、複数の第一電子部品1の第一端子11と複数の第二電子部品2の第二端子21とを、それぞれ対向配置させ、各第一端子11と各第二端子21との間に樹脂層3を配置して複数の積層体4を形成し、複数の積層体4を加熱しながら、複数の積層体4を同時に積層体4の積層方向から挟圧する。 In the step of obtaining the laminate 4, the first terminals 11 of the plurality of first electronic components 1 and the second terminals 21 of the plurality of second electronic components 2 are arranged to face each other, and each first terminal 11 and each second The resin layer 3 is disposed between the two terminals 21 to form a plurality of stacked bodies 4, and the plurality of stacked bodies 4 are simultaneously pressed from the stacking direction of the stacked bodies 4 while heating the plurality of stacked bodies 4.
 次に、本実施形態の電子装置の製造方法について詳細に説明する。はじめに、図1に示すように、第一電子部品1を用意する。この第一電子部品1は、例えば、基板(フレキシブル基板、リジット基板、セラミック基板等)、半導体チップ、半導体素子搭載基板等である。 Next, a method for manufacturing the electronic device according to this embodiment will be described in detail. First, as shown in FIG. 1, the first electronic component 1 is prepared. The first electronic component 1 is, for example, a substrate (flexible substrate, rigid substrate, ceramic substrate, etc.), a semiconductor chip, a semiconductor element mounting substrate, or the like.
 この第一電子部品1は第一端子11を有し、この第一端子11は、第一端子本体111と、第一端子本体111表面に設けられた半田層112と、を備える。第一端子本体111の形状は、特に限定されず、凸状のものや、凹状のものが挙げられる。また、第一端子本体111の材質は、特に制限されず、金、銅、ニッケル、パラジウム、アルミニウムが挙げられる。 The first electronic component 1 has a first terminal 11, and the first terminal 11 includes a first terminal body 111 and a solder layer 112 provided on the surface of the first terminal body 111. The shape of the first terminal body 111 is not particularly limited, and examples thereof include a convex shape and a concave shape. Moreover, the material in particular of the 1st terminal main body 111 is not restrict | limited, Gold, copper, nickel, palladium, and aluminum are mentioned.
 半田層112の材料は、特に制限されず、錫、銀、鉛、亜鉛、ビスマス、インジウムおよび銅からなる群から選択される少なくとも二種以上を含む合金、等が挙げられる。これらのうち、錫、銀、鉛、亜鉛、銅、からなる群から選択される少なくとも二種以上を含む合金が好ましい。 The material of the solder layer 112 is not particularly limited, and examples thereof include an alloy including at least two selected from the group consisting of tin, silver, lead, zinc, bismuth, indium, and copper. Among these, an alloy containing at least two selected from the group consisting of tin, silver, lead, zinc, and copper is preferable.
 半田層112の融点は、110~250℃、好ましくは170~230℃である。半田層112は、第一端子本体111に対し半田メッキされたものであってもよく、また、第一端子本体111に対し半田ボールや半田ペーストを配置し、半田バンプ等で構成されるものであってもよい。 The melting point of the solder layer 112 is 110 to 250 ° C., preferably 170 to 230 ° C. The solder layer 112 may be solder-plated with respect to the first terminal main body 111, and is configured by solder balls or solder paste disposed on the first terminal main body 111 to form solder bumps or the like. There may be.
 ここで、図6に示すように、第一電子部品1は、複数個連なって形成されている。例えば、第一電子部品1が基板である場合には、各基板同士が接続されて一枚の大型の基板を構成している。なお、大型の基板には、図6の点線で示すように、第一電子部品1同士を切り離すための切断ラインが形成されている。 Here, as shown in FIG. 6, a plurality of first electronic components 1 are formed in series. For example, when the first electronic component 1 is a substrate, the substrates are connected to form a single large substrate. In addition, as shown with the dotted line of FIG. 6, the cutting line for cut | disconnecting the 1st electronic components 1 is formed in the large sized board | substrate.
 次に、第二電子部品2を用意する(図1参照)。第二電子部品2は、例えば、半導体チップや、半導体素子搭載基板である。この第二電子部品2は、第二端子21を有する。 Next, the second electronic component 2 is prepared (see FIG. 1). The second electronic component 2 is, for example, a semiconductor chip or a semiconductor element mounting substrate. The second electronic component 2 has a second terminal 21.
 第二端子21の形状は、特に制限されず、第一端子11に対して半田接合が行える形状であればよく、例えば、凸状のものや、凹状のものが挙げられる。また、第二端子21の材質は、特に制限されず、金、銅、ニッケル、パラジウム、アルミニウム、等が挙げられる。 The shape of the second terminal 21 is not particularly limited as long as it can be soldered to the first terminal 11, and examples thereof include a convex shape and a concave shape. Moreover, the material in particular of the 2nd terminal 21 is not restrict | limited, Gold, copper, nickel, palladium, aluminum, etc. are mentioned.
 次に、図2に示すように、第一電子部品1の第一端子11と、第二電子部品2の第二端子21との間にフラックス活性化合物と、熱硬化性樹脂とを含む樹脂層3を配置し、第一端子11と第二端子21との位置あわせを行う。 Next, as shown in FIG. 2, a resin layer containing a flux active compound and a thermosetting resin between the first terminal 11 of the first electronic component 1 and the second terminal 21 of the second electronic component 2. 3 and the first terminal 11 and the second terminal 21 are aligned.
 ここでは、複数の第一電子部品1と複数の第二電子部品2との位置あわせを行う。この工程では、第一電子部品1と、第二電子部品2との間に樹脂層3が配置された複数の積層体4が得られる。なお、複数の積層体4は、例えば面内方向に配列される。 Here, the plurality of first electronic components 1 and the plurality of second electronic components 2 are aligned. In this step, a plurality of laminated bodies 4 in which the resin layer 3 is disposed between the first electronic component 1 and the second electronic component 2 are obtained. In addition, the some laminated body 4 is arranged in an in-plane direction, for example.
 ここでは、第二電子部品2の第二端子21は、樹脂層3に食い込み、第一端子11と接触する状態とはなっていない。ただし、第一端子11と第二端子21の間に樹脂が介在している状態で、第一端子11と第二端子21が接触していてもよい。 Here, the second terminal 21 of the second electronic component 2 does not bite into the resin layer 3 and is not in contact with the first terminal 11. However, the first terminal 11 and the second terminal 21 may be in contact with each other in a state where the resin is interposed between the first terminal 11 and the second terminal 21.
 樹脂層3は、第一電子部品1と、第二電子部品2との隙間を埋めることができる熱硬化性樹脂を含んで構成される。樹脂層3に含まれる熱硬化性樹脂は、例えば、エポキシ樹脂、オキセタン樹脂、フェノール樹脂、(メタ)アクリレート樹脂、不飽和ポリエステル樹脂、ジアリルフタレート樹脂、マレイミド樹脂、等を用いることができる。これらは、単独または二種以上を混合して用いることができる。 The resin layer 3 includes a thermosetting resin that can fill a gap between the first electronic component 1 and the second electronic component 2. As the thermosetting resin contained in the resin layer 3, for example, epoxy resin, oxetane resin, phenol resin, (meth) acrylate resin, unsaturated polyester resin, diallyl phthalate resin, maleimide resin, and the like can be used. These can be used individually or in mixture of 2 or more types.
 なかでも、硬化性と保存性、硬化物の耐熱性、耐湿性、耐薬品性、に優れるエポキシ樹脂が好適に用いられる。樹脂層3の100~200℃における最低溶融粘度は、好ましくは1~1000Pa・s、特に好ましくは1~500Pa・sである。 Among these, an epoxy resin excellent in curability and storage stability, heat resistance of the cured product, moisture resistance, and chemical resistance is preferably used. The minimum melt viscosity at 100 to 200 ° C. of the resin layer 3 is preferably 1 to 1000 Pa · s, particularly preferably 1 to 500 Pa · s.
 樹脂層3の100~200℃における最低溶融粘度が上記範囲にあることにより、硬化物中に空隙(ボイド)が発生し難くなる。最低溶融粘度は、例えば、粘弾性測定装置であるレオメーターを用いて、フィルム状態のサンプルに10℃/分の昇温速度で、周波数1Hzのずり剪断を与えて測定される。 When the minimum melt viscosity at 100 to 200 ° C. of the resin layer 3 is in the above range, voids (voids) are hardly generated in the cured product. The minimum melt viscosity is measured, for example, using a rheometer, which is a viscoelasticity measuring device, by applying shear shear with a frequency of 1 Hz to a sample in a film state at a heating rate of 10 ° C./min.
 樹脂層3は、半田接合の際に、半田層112の表面の酸化被膜を除去する作用を有する樹脂層である。樹脂層3が、フラックス作用を有することにより、半田層112の表面を覆っている酸化被膜が除去されるので、半田接合を行うことができる。 The resin layer 3 is a resin layer having an action of removing an oxide film on the surface of the solder layer 112 during solder joining. Since the resin layer 3 has a flux action, the oxide film covering the surface of the solder layer 112 is removed, so that solder bonding can be performed.
 樹脂層3がフラックス作用を有するためには、樹脂層3が、フラックス活性化合物を含有する必要がある。樹脂層3に含有されるフラックス活性化合物としては、半田接合に用いられるものであれば、特に制限されないが、カルボキシル基、フェノール水酸基のいずれか、カルボキシル基、フェノール水酸基の両方を備える化合物、等が好ましい。 In order for the resin layer 3 to have a flux action, the resin layer 3 needs to contain a flux active compound. The flux active compound contained in the resin layer 3 is not particularly limited as long as it is used for solder bonding, but includes any of a carboxyl group, a phenol hydroxyl group, a compound having both a carboxyl group and a phenol hydroxyl group, and the like. preferable.
 樹脂層3中のフラックス活性化合物の配合量は、1~30重量%が好ましく、3~20重量%が特に好ましい。樹脂層3中のフラックス活性化合物の配合量が、上記範囲であることにより、樹脂層3のフラックス活性を向上させることができるとともに、樹脂層3中に、熱硬化性樹脂と未反応のフラックス活性化合物が残存するのが防止される。 The blending amount of the flux active compound in the resin layer 3 is preferably 1 to 30% by weight, particularly preferably 3 to 20% by weight. When the blending amount of the flux active compound in the resin layer 3 is within the above range, the flux activity of the resin layer 3 can be improved, and the thermosetting resin and unreacted flux activity in the resin layer 3 can be improved. The compound is prevented from remaining.
 なお、未反応のフラックス活性化合物が残存すると、マイグレーションが発生する可能性がある。また、熱硬化性樹脂の硬化剤として作用する化合物の中には、フラックス作用も有する化合物がある(以下、このような化合物を、フラックス活性硬化剤とも記載する)。 If unreacted flux active compound remains, migration may occur. Among the compounds that act as curing agents for thermosetting resins, there are compounds that also have a flux action (hereinafter, such compounds are also referred to as flux active curing agents).
 例えば、エポキシ樹脂の硬化剤として作用するフェノールノボラック樹脂、クレゾールノボラック樹脂、脂肪族ジカルボン酸、芳香族ジカルボン酸等は、フラックス作用も有している。 For example, phenol novolak resin, cresol novolak resin, aliphatic dicarboxylic acid, aromatic dicarboxylic acid and the like that act as a curing agent for epoxy resin also have a flux action.
 このような、フラックス活性化合物としても作用し、熱硬化性樹脂の硬化剤としても作用するようなフラックス活性硬化剤を、熱硬化性樹脂の硬化剤として含有する樹脂層3は、フラックス作用を有する樹脂層3となる。 The resin layer 3 containing the flux active curing agent that acts as a flux active compound and also acts as a curing agent for the thermosetting resin as a curing agent for the thermosetting resin has a flux effect. Resin layer 3 is formed.
 なお、カルボキシル基を備えるフラックス活性化合物とは、分子中にカルボキシル基が一つ以上存在するものをいい、液状であっても固体であってもよい。また、フェノール性水酸基を備えるフラックス活性化合物とは、分子中にフェノール性水酸基が一つ以上存在するものをいい、液状であっても固体であってもよい。 The flux active compound having a carboxyl group means a compound having one or more carboxyl groups in the molecule, and may be liquid or solid. Further, the flux active compound having a phenolic hydroxyl group means a compound having one or more phenolic hydroxyl groups in the molecule, and may be liquid or solid.
 また、カルボキシル基およびフェノール性水酸基を備えるフラックス活性化合物とは、分子中にカルボキシル基およびフェノール性水酸基がそれぞれ一つ以上存在するものをいい、液状であっても固体であってもよい。 Further, the flux active compound having a carboxyl group and a phenolic hydroxyl group means a compound having one or more carboxyl groups and phenolic hydroxyl groups in the molecule, and may be liquid or solid.
 これらのうち、カルボキシル基を備えるフラックス活性化合物としては、脂肪族酸無水物、脂環式酸無水物、芳香族酸無水物、脂肪族カルボン酸、芳香族カルボン酸、等が挙げられる。 Among these, examples of the flux active compound having a carboxyl group include aliphatic acid anhydrides, alicyclic acid anhydrides, aromatic acid anhydrides, aliphatic carboxylic acids, and aromatic carboxylic acids.
 カルボキシル基を備えるフラックス活性化合物に係る脂肪族酸無水物としては、無水コハク酸、ポリアジピン酸無水物、ポリアゼライン酸無水物、ポリセバシン酸無水物、等が挙げられる。 Examples of the aliphatic acid anhydride related to the flux active compound having a carboxyl group include succinic anhydride, polyadipic acid anhydride, polyazeline acid anhydride, polysebacic acid anhydride, and the like.
 カルボキシル基を備えるフラックス活性化合物に係る脂環式酸無水物としては、メチルテトラヒドロ無水フタル酸、メチルヘキサヒドロ無水フタル酸、無水メチルハイミック酸、ヘキサヒドロ無水フタル酸、テトラヒドロ無水フタル酸、トリアルキルテトラヒドロ無水フタル酸、メチルシクロヘキセンジカルボン酸無水物、等が挙げられる。 Examples of alicyclic acid anhydrides related to flux active compounds having a carboxyl group include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylhymic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydro Examples thereof include phthalic anhydride and methylcyclohexene dicarboxylic acid anhydride.
 カルボキシル基を備えるフラックス活性化合物に係る芳香族酸無水物としては、無水フタル酸、無水トリメリット酸、無水ピロメリット酸、ベンゾフェノンテトラカルボン酸無水物、エチレングリコールビストリメリテート、グリセロールトリストリメリテート、等が挙げられる。 As the aromatic acid anhydride related to the flux active compound having a carboxyl group, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimellitate, glycerol tris trimellitate, Etc.
 カルボキシル基を備えるフラックス活性化合物に係る脂肪族カルボン酸としては、下記一般式(1)で示される化合物や、蟻酸、酢酸、プロピオン酸、酪酸、吉草酸、ピバル酸カプロン酸、カプリル酸、ラウリン酸、ミリスチン酸、パルミチン酸、ステアリン酸、アクリル酸、メタクリル酸、クロトン酸、オレイン酸、フマル酸、マレイン酸、シュウ酸、マロン酸、琥珀酸、等が挙げられる。 Examples of the aliphatic carboxylic acid related to the flux active compound having a carboxyl group include compounds represented by the following general formula (1), formic acid, acetic acid, propionic acid, butyric acid, valeric acid, pivalic acid caproic acid, caprylic acid, and lauric acid. , Myristic acid, palmitic acid, stearic acid, acrylic acid, methacrylic acid, crotonic acid, oleic acid, fumaric acid, maleic acid, oxalic acid, malonic acid, oxalic acid, and the like.
  [化1]
 HOOC-(CH2)n-COOH   (1)
 式(1)中、nは、20以下の自然数を表す。
[Chemical 1]
HOOC- (CH2) n-COOH (1)
In formula (1), n represents a natural number of 20 or less.
 カルボキシル基を備えるフラックス活性化合物に係る芳香族カルボン酸としては、安息香酸、フタル酸、イソフタル酸、テレフタル酸、ヘミメリット酸、トリメリット酸、トリメシン酸、メロファン酸、プレーニト酸、ピロメリット酸、メリット酸、トリイル酸、キシリル酸、ヘメリト酸、メシチレン酸、プレーニチル酸、トルイル酸、ケイ皮酸、サリチル酸、2,3-ジヒドロキシ安息香酸、2,4-ジヒドロキシ安息香酸、ゲンチジン酸(2,5-ジヒドロキシ安息香酸)、2,6-ジヒドロキシ安息香酸、3,5-ジヒドロキシ安息香酸、浸食子酸(3,4,5-トリヒドロキシ安息香酸)、1,4-ジヒドロキシ-2-ナフトエ酸、3,5-ジヒドロキシ-2-ナフトエ酸等のナフトエ酸誘導体、フェノールフタリン、ジフェノール酸、等が挙げられる。 Aromatic carboxylic acids related to flux active compounds with carboxyl groups include benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, hemimellitic acid, trimellitic acid, trimesic acid, merophanic acid, planitic acid, pyromellitic acid, merit Acid, triyl acid, xylyl acid, hemelic acid, mesitylene acid, prenylic acid, toluic acid, cinnamic acid, salicylic acid, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxy) Benzoic acid), 2,6-dihydroxybenzoic acid, 3,5-dihydroxybenzoic acid, gallic acid (3,4,5-trihydroxybenzoic acid), 1,4-dihydroxy-2-naphthoic acid, 3,5 -Naphthoic acid derivatives such as dihydroxy-2-naphthoic acid, phenolphthaline, dipheno Acid, and the like.
 これらのカルボキシル基を備えるフラックス活性化合物のうち、フラックス活性化合物が有する活性度、樹脂層の硬化時におけるアウトガスの発生量、および硬化後の樹脂層の弾性率やガラス転移温度等のバランスが良い点で、上記一般式(1)で示される化合物が好ましい。 Among these flux active compounds having a carboxyl group, there is a good balance between the activity of the flux active compound, the amount of outgas generated when the resin layer is cured, and the elastic modulus and glass transition temperature of the resin layer after curing. The compound represented by the general formula (1) is preferable.
 そして、上記一般式(1)で示される化合物のうち、式(1)中のnが3~10である化合物が、硬化後の樹脂層における弾性率が増加するのを抑制することができるとともに、第一電子部品1と第二電子部品2との接着性を向上させることができる点で、特に好ましい。 Among the compounds represented by the general formula (1), the compound in which n in the formula (1) is 3 to 10 can suppress an increase in elastic modulus in the resin layer after curing. It is particularly preferable in that the adhesion between the first electronic component 1 and the second electronic component 2 can be improved.
 上記一般式(1)で示される化合物のうち、式(1)中のnが3~10である化合物としては、例えば、n=3のグルタル酸(HOOC-(CH2)3-COOH)、n=4のアジピン酸(HOOC-(CH2)4-COOH)、n=5のピメリン酸(HOOC-(CH2)5-COOH)、n=8のセバシン酸(HOOC-(CH2)8-COOH)およびn=10のHOOC-(CH2)10-COOH、等が挙げられる。 Among the compounds represented by the general formula (1), the compound in which n in the formula (1) is 3 to 10 includes, for example, n = 3 glutaric acid (HOOC- (CH2) 3-COOH), n = 4 adipic acid (HOOC- (CH2) 4-COOH), n = 5 pimelic acid (HOOC- (CH2) 5-COOH), n = 8 sebacic acid (HOOC- (CH2) 8-COOH) and n = 10 HOOC— (CH 2) 10 —COOH, and the like.
 フェノール性水酸基を備えるフラックス活性化合物としては、フェノール類が挙げられ、具体的には、例えば、フェノール、o-クレゾール、2,6-キシレノール、p-クレゾール、m-クレゾール、o-エチルフェノール、2,4-キシレノール、2,5キシレノール、m-エチルフェノール、2,3-キシレノール、メジトール、3,5-キシレノール、p-ターシャリブチルフェノール、カテコール、p-ターシャリアミルフェノール、レゾルシノール、p-オクチルフェノール、p-フェニルフェノール、ビスフェノールA、ビスフェノールF、ビスフェノールAF、ビフェノール、ジアリルビスフェノールF、ジアリルビスフェノールA、トリスフェノール、テトラキスフェノール等のフェノール性水酸基を含有するモノマー類、フェノールノボラック樹脂、o-クレゾールノボラック樹脂、ビスフェノールFノボラック樹脂、ビスフェノールAノボラック樹脂、等が挙げられる。 Examples of the flux active compound having a phenolic hydroxyl group include phenols. Specifically, for example, phenol, o-cresol, 2,6-xylenol, p-cresol, m-cresol, o-ethylphenol, 2 , 4-xylenol, 2,5 xylenol, m-ethylphenol, 2,3-xylenol, meditol, 3,5-xylenol, p-tertiarybutylphenol, catechol, p-tertiaryamylphenol, resorcinol, p-octylphenol, Monomers containing phenolic hydroxyl groups such as p-phenylphenol, bisphenol A, bisphenol F, bisphenol AF, biphenol, diallyl bisphenol F, diallyl bisphenol A, trisphenol, tetrakisphenol , Phenol novolak resins, o- cresol novolak resin, bisphenol F novolac resin, bisphenol A novolac resins, and the like.
 上述したようなカルボキシル基、または、フェノール水酸基のいずれか、あるいは、カルボキシル基およびフェノール水酸基の両方を備える化合物は、エポキシ樹脂のような熱硬化性樹脂との反応で三次元的に取り込まれる。 The above-described carboxyl group or phenol hydroxyl group, or a compound having both a carboxyl group and a phenol hydroxyl group is taken in three-dimensionally by reaction with a thermosetting resin such as an epoxy resin.
 そのため、硬化後のエポキシ樹脂の三次元的なネットワークの形成を向上させるという観点からは、フラックス活性化合物としては、フラックス作用を有し、かつ、エポキシ樹脂の硬化剤として作用するフラックス活性硬化剤が好ましい。 Therefore, from the viewpoint of improving the formation of a three-dimensional network of the epoxy resin after curing, as the flux active compound, there is a flux active curing agent having a flux action and acting as a curing agent for the epoxy resin. preferable.
 フラックス活性硬化剤としては、例えば、1分子中に、エポキシ樹脂に付加することができる二つ以上のフェノール性水酸基と、フラックス作用(還元作用)を示す芳香族に直接結合した一つ以上のカルボキシル基とを備える化合物が挙げられる。 Examples of the flux active curing agent include, in one molecule, two or more phenolic hydroxyl groups that can be added to an epoxy resin, and one or more carboxyls directly bonded to an aromatic group that exhibits a flux action (reduction action). And a compound having a group.
 このようなフラックス活性硬化剤としては、2,3-ジヒドロキシ安息香酸、2,4-ジヒドロキシ安息香酸、ゲンチジン酸(2,5-ジヒドロキシ安息香酸)、2,6-ジヒドロキシ安息香酸、3,4-ジヒドロキシ安息香酸、没食子酸(3,4,5-トリヒドロキシ安息香酸)等の安息香酸誘導体;1,4-ジヒドロキシ-2-ナフトエ酸、3,5-ジヒドロキシ-2-ナフトエ酸、3,7-ジヒドロキシ-2-ナフトエ酸等のナフトエ酸誘導体;フェノールフタリン;およびジフェノール酸、等が挙げられ、これらは一種単独、または、二種以上を組み合わせてもよい。 Examples of such flux active curing agents include 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, 3,4- Benzoic acid derivatives such as dihydroxybenzoic acid and gallic acid (3,4,5-trihydroxybenzoic acid); 1,4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2-naphthoic acid, 3,7- Examples thereof include naphthoic acid derivatives such as dihydroxy-2-naphthoic acid; phenolphthaline; and diphenolic acid. These may be used alone or in combination of two or more.
 なかでも、第一端子11および第二端子21の接合を良好なものとするためには、フェノールフタリンを使用することが特に好ましい。フェノールフタリンを使用することで、半田層112の表面の酸化物を除去した後、エポキシ樹脂を硬化することが可能となると推測される。 Especially, in order to make the first terminal 11 and the second terminal 21 to be joined well, it is particularly preferable to use phenolphthaline. By using phenolphthaline, it is estimated that the epoxy resin can be cured after removing the oxide on the surface of the solder layer 112.
 従って、半田層112表面の酸化物が除去されないまま、エポキシ樹脂が硬化してしまうことを抑制でき、第一端子11および第二端子21の半田接合を良好なものとすることができる。 Therefore, it is possible to prevent the epoxy resin from being cured without removing the oxide on the surface of the solder layer 112, and to improve the solder joint between the first terminal 11 and the second terminal 21.
 また、樹脂層3中、フラックス活性硬化剤の配合量は、1~30重量%が好ましく、3~20重量%が特に好ましい。樹脂層3中のフラックス活性硬化剤の配合量が、上記範囲であることにより、樹脂層のフラックス活性を向上させることができるとともに、樹脂層中に、熱硬化性樹脂と未反応のフラックス活性硬化剤が残存するのが防止される。 In addition, the amount of the flux active curing agent in the resin layer 3 is preferably 1 to 30% by weight, and particularly preferably 3 to 20% by weight. When the blending amount of the flux active curing agent in the resin layer 3 is in the above range, the flux activity of the resin layer can be improved, and the resin layer has a flux active curing that has not reacted with the thermosetting resin. The agent is prevented from remaining.
 なお、未反応のフラックス活性硬化剤が残存すると、マイグレーションが発生する。また、樹脂層3は、無機充填材を含んでいてもよい。樹脂層3中に無機充填材を含有させることで、樹脂層3の最低溶融粘度を高め、第一端子11および第二端子21間に隙間が形成されてしまうことを抑制できる。 If unreacted flux active curing agent remains, migration occurs. Moreover, the resin layer 3 may contain the inorganic filler. By including an inorganic filler in the resin layer 3, the minimum melt viscosity of the resin layer 3 can be increased and the formation of a gap between the first terminal 11 and the second terminal 21 can be suppressed.
 なお、樹脂層3の最低溶融粘度が非常に低い場合には、樹脂層3の流動性が非常に高くなり、第一端子11と第二端子21との間に、樹脂層3が入り込み、第一端子11と第二端子21とが離間してしまうことがある。 When the minimum melt viscosity of the resin layer 3 is very low, the fluidity of the resin layer 3 becomes very high, the resin layer 3 enters between the first terminal 11 and the second terminal 21, and the first The one terminal 11 and the second terminal 21 may be separated from each other.
 ここで、無機充填材としては、シリカや、アルミナ、等が挙げられる。さらに、樹脂層3は、硬化触媒を含んでいてもよい。硬化触媒は、樹脂層3中の熱硬化性樹脂の種類に応じて適宜選択できるが、例えば、塗膜成形性向上の観点から、イミダゾール化合物を使用することができる。 Here, examples of the inorganic filler include silica and alumina. Furthermore, the resin layer 3 may contain a curing catalyst. Although a curing catalyst can be suitably selected according to the kind of thermosetting resin in the resin layer 3, an imidazole compound can be used from a viewpoint of a coating-film moldability improvement, for example.
 イミダゾール化合物として、2-フェニルヒドロキシイミダゾール、2-フェニル-4-メチルヒドロキシイミダゾール、等が挙げられる。 Examples of the imidazole compound include 2-phenylhydroxyimidazole and 2-phenyl-4-methylhydroxyimidazole.
 また、硬化触媒の配合比は、樹脂層3の構成成分の合計を100としたときに、例えば0.01重量%以上5重量%以下とする。硬化触媒の配合比を0.01重量%以上とすることにより、硬化触媒としての機能をさらに効果的に発揮させて、樹脂層3の硬化性を向上させることができる。また、硬化触媒の配合比を5重量%以下とすることにより、樹脂層3の保存性をさらに向上させることができる。 Further, the blending ratio of the curing catalyst is, for example, 0.01% by weight or more and 5% by weight or less when the total of the constituent components of the resin layer 3 is 100. By setting the blending ratio of the curing catalyst to 0.01% by weight or more, the function as the curing catalyst can be exhibited more effectively and the curability of the resin layer 3 can be improved. Moreover, the preservability of the resin layer 3 can further be improved by setting the blending ratio of the curing catalyst to 5% by weight or less.
 第一電子部品1と、第二電子部品2との間に樹脂層3を配置する方法としては、例えば、
(1)フラックス活性化合物を含有する樹脂組成物をフィルム状に成形した樹脂フィルムを用意し、この樹脂フィルムを、第一電子部品1、または、第二電子部品2にラミネートする方法、
(2)フラックス活性化合物を含有する液状の樹脂組成物を用意し、この液状の樹脂組成物を、第一電子部品1、または、第二電子部品2の表面に塗布する方法、
(3)フラックス活性化合物を含有する樹脂組成物が溶剤に溶解、または、分散されている樹脂ワニスを用意し、この樹脂ワニスを、第一電子部品1、または、第二電子部品2の表面に塗布し、次いで、樹脂ワニス中の溶剤を揮発させる方法、
が挙げられる。なお、方法(2)に係る液状の樹脂組成物は、溶剤を含有しない。
As a method of arranging the resin layer 3 between the first electronic component 1 and the second electronic component 2, for example,
(1) A method of preparing a resin film obtained by forming a resin composition containing a flux active compound into a film, and laminating the resin film on the first electronic component 1 or the second electronic component 2;
(2) A method of preparing a liquid resin composition containing a flux active compound and applying the liquid resin composition to the surface of the first electronic component 1 or the second electronic component 2;
(3) A resin varnish in which a resin composition containing a flux active compound is dissolved or dispersed in a solvent is prepared, and this resin varnish is applied to the surface of the first electronic component 1 or the second electronic component 2 Applying, and then volatilizing the solvent in the resin varnish,
Is mentioned. In addition, the liquid resin composition which concerns on the method (2) does not contain a solvent.
 ここで、図6に示すように、樹脂層3は複数連なっており、複数の第一電子部品1上にまたがる1枚の樹脂シートを構成している。より詳細に説明すると、樹脂シートは複数の樹脂層3と、樹脂層3同士を連結している連結部分とで構成され、樹脂層3同士は連結部分を介して連なっている。 Here, as shown in FIG. 6, a plurality of resin layers 3 are connected to each other to constitute one resin sheet straddling the plurality of first electronic components 1. If it demonstrates in detail, the resin sheet will be comprised by the some resin layer 3, and the connection part which has connected resin layers 3, and resin layers 3 are connected via the connection part.
 次に、複数の積層体4を加熱しながら、積層体4の積層方向に沿って挟圧し、図3に示すように、第一端子11と第二端子21とが接触するように第二端子21を樹脂層3に、めり込ませる。 Next, while heating the plurality of stacked bodies 4, the second terminals are pressed in the stacking direction of the stacked bodies 4 so that the first terminals 11 and the second terminals 21 are in contact with each other as shown in FIG. 3. 21 is embedded in the resin layer 3.
 なお、本工程では、第一端子11の半田層112により、第一端子11と第二端子21とが半田接合されることはない。この工程では、図4~図5に示す装置5を使用する。 In this step, the first terminal 11 and the second terminal 21 are not soldered by the solder layer 112 of the first terminal 11. In this step, the apparatus 5 shown in FIGS. 4 to 5 is used.
 装置5は、表面に半田層112を有する第一端子11を有する第一電子部品1の第一端子11と、この第一電子部品1の第一端子11に接合される第二端子21を有する第二電子部品2の第二端子21との間に、フラックス活性化合物と、熱硬化性樹脂とを含む樹脂層3を配置して、積層体4を形成した後、第一端子11と、第二端子21とを接触させるための装置である。 The device 5 includes a first terminal 11 of the first electronic component 1 having a first terminal 11 having a solder layer 112 on the surface, and a second terminal 21 joined to the first terminal 11 of the first electronic component 1. After the resin layer 3 including the flux active compound and the thermosetting resin is disposed between the second terminal 21 of the second electronic component 2 and the laminate 4 is formed, the first terminal 11, This is a device for contacting the two terminals 21.
 この装置5は、複数の積層体4を同時に挟圧する挟圧部材である冶具53を備える。より詳細に説明すると、装置5は、内部に複数の積層体4が配置される炉(加熱炉)51と、炉51内に配置されるプレス部材である上熱板521、下熱板522と、冶具53とを備える。 The apparatus 5 includes a jig 53 that is a clamping member that simultaneously clamps the plurality of stacked bodies 4. More specifically, the apparatus 5 includes a furnace (heating furnace) 51 in which a plurality of laminated bodies 4 are disposed, an upper heating plate 521 and a lower heating plate 522 that are press members disposed in the furnace 51. And a jig 53.
 炉51は、上型511と、下型512とで構成され、上型511と下型512とで構成される空間内に上熱板521、下熱板522が配置される。上熱板521、下熱板522は、対向配置され、上熱板521と下熱板522との間には、冶具53および複数の積層体4が配置される。一対の熱板521,522は半田層112の融点未満の温度となっている。 The furnace 51 includes an upper mold 511 and a lower mold 512, and an upper heating plate 521 and a lower heating plate 522 are arranged in a space formed by the upper mold 511 and the lower mold 512. The upper heating plate 521 and the lower heating plate 522 are arranged to face each other, and the jig 53 and the plurality of laminated bodies 4 are arranged between the upper heating plate 521 and the lower heating plate 522. The pair of hot plates 521 and 522 are at a temperature lower than the melting point of the solder layer 112.
 冶具53は、溝が形成された上側加圧部材531および平板状の下側加圧部材532を備える。上側加圧部材531および下側加圧部材532間に複数の積層体4が配置される。上側加圧部材531は、板状であり、平面矩形形状である。 The jig 53 includes an upper pressure member 531 having a groove and a flat plate-like lower pressure member 532. A plurality of stacked bodies 4 are arranged between the upper pressure member 531 and the lower pressure member 532. The upper pressure member 531 has a plate shape and a planar rectangular shape.
 上側加圧部材531には、図6,7にも示すように、複数の溝531Aが形成されており、一部の溝同士531Aが交差している。本実施形態では、溝531Aが格子状に形成されている。 As shown in FIGS. 6 and 7, the upper pressure member 531 is formed with a plurality of grooves 531A, and some of the grooves 531A intersect each other. In the present embodiment, the grooves 531A are formed in a lattice shape.
 溝531Aで区画された領域531Bが積層体4の第二電子部品2に当接する。一つの領域531Bに対し一つの積層体4の第二電子部品2が当接する。下側加圧部材532は、平面矩形形状であり、下側加圧部材532には溝は形成されておらず、表面が平坦な板材で構成されている。 The region 531B partitioned by the groove 531A comes into contact with the second electronic component 2 of the laminate 4. The second electronic component 2 of one stacked body 4 comes into contact with one region 531B. The lower pressure member 532 has a planar rectangular shape, and no groove is formed in the lower pressure member 532, and the lower pressure member 532 is made of a plate material having a flat surface.
 下側加圧部材532と、上側加圧部材531の溝531Aが形成された面とは、対向している。下側加圧部材532には、積層体4の第一電子部品1が当接する。ここで、下側加圧部材532、上側加圧部材531の材料としては、特に制限されず、金属板、セラミック板、等が挙げられる。 The lower pressure member 532 and the surface of the upper pressure member 531 on which the groove 531A is formed are opposed to each other. The first electronic component 1 of the stacked body 4 is in contact with the lower pressure member 532. Here, the material of the lower pressure member 532 and the upper pressure member 531 is not particularly limited, and examples thereof include a metal plate and a ceramic plate.
 金属板としては、例えば、ステンレス板、チタン板、鉛板が挙げられる。また、セラミック板としては、ガラス板、アルミナ板、窒化ケイ素板、ジルコニア板が挙げられる。ただし、熱伝導性の良好なものが好ましい。 Examples of the metal plate include a stainless plate, a titanium plate, and a lead plate. Examples of the ceramic plate include a glass plate, an alumina plate, a silicon nitride plate, and a zirconia plate. However, those having good thermal conductivity are preferred.
 次に、装置5の使用方法について説明する。はじめに、炉51外で、図6に示すように、冶具53の上側加圧部材531および下側加圧部材532間に複数の積層体4を配置し、上側加圧部材531および下側加圧部材532で複数の積層体4をはさむ。 Next, how to use the device 5 will be described. First, outside the furnace 51, as shown in FIG. 6, a plurality of laminated bodies 4 are arranged between the upper pressure member 531 and the lower pressure member 532 of the jig 53, and the upper pressure member 531 and the lower pressure member 532. A plurality of laminates 4 are sandwiched between members 532.
 このとき、図6に示すように、溝531Aの幅W1(溝531Aの延在方向と直交する方向の長さ)は、隣接する積層体4間の隙間W2よりも大きい。言い換えると、溝531Aで区画された上記領域531Bに当接する第二電子部品2の端面(側面)が、溝531Aの側面531Cよりも溝531A内側に突出している。上述のように上側加圧部材531の幅W1の溝531Aで区画された領域531Bは、第二電子部品2の第二端子21より外側に位置する形状に形成されている。 At this time, as shown in FIG. 6, the width W1 of the groove 531A (the length in the direction orthogonal to the extending direction of the groove 531A) is larger than the gap W2 between the adjacent stacked bodies 4. In other words, the end surface (side surface) of the second electronic component 2 that abuts on the region 531B defined by the groove 531A protrudes inside the groove 531A from the side surface 531C of the groove 531A. As described above, the region 531 </ b> B defined by the groove 531 </ b> A having the width W <b> 1 of the upper pressure member 531 is formed in a shape located outside the second terminal 21 of the second electronic component 2.
 また、隣接する積層体4のうち、樹脂層3同士は連なって形成されているが、隣接する第二電子部品2間には空隙が形成されているため、上記空隙から樹脂層3が連なることで構成される樹脂シートの一部が露出することとなる。樹脂シートの露出部分は、溝531Aと対向する。 In addition, the resin layers 3 of the adjacent laminates 4 are formed continuously, but since a gap is formed between the adjacent second electronic components 2, the resin layer 3 is connected from the gap. A part of the resin sheet constituted by is exposed. The exposed portion of the resin sheet faces the groove 531A.
 図6は、上側加圧部材531および下側加圧部材532で複数の積層体4をはさんだ状態を示す図である。次に、炉51内に冶具53および複数の積層体4を搬送する。炉51内に冶具53および複数の積層体4を搬送する際には、搬送フィルム等を使用してもよい。 FIG. 6 is a view showing a state in which a plurality of stacked bodies 4 are sandwiched between the upper pressure member 531 and the lower pressure member 532. Next, the jig 53 and the plurality of stacked bodies 4 are transported into the furnace 51. When the jig 53 and the plurality of laminated bodies 4 are transported into the furnace 51, a transport film or the like may be used.
 ここで、あらかじめ、上熱板521、下熱板522、は加熱された状態となっている。その後、上型511を下型512側に移動させて、上型511および下型512間の隙間を閉じる。冶具53の下側加圧部材532は、下熱板522が当接することとなる(図4参照)。 Here, the upper heating plate 521 and the lower heating plate 522 are in a heated state in advance. Thereafter, the upper mold 511 is moved to the lower mold 512 side, and the gap between the upper mold 511 and the lower mold 512 is closed. The lower heat plate 522 comes into contact with the lower pressure member 532 of the jig 53 (see FIG. 4).
 その後、図5に示すように、上熱板521を下方に移動させ、上熱板521が冶具53の上側加圧部材531に当接する。冶具53の上側加圧部材531は上熱板521により下方に押され、冶具53は、下熱板522と上熱板521とで挟圧され、冶具53の上側加圧部材531、532により、複数の積層体4が挟圧されることとなる。 Thereafter, as shown in FIG. 5, the upper heating plate 521 is moved downward, and the upper heating plate 521 comes into contact with the upper pressure member 531 of the jig 53. The upper pressing member 531 of the jig 53 is pushed downward by the upper heating plate 521, the jig 53 is clamped by the lower heating plate 522 and the upper heating plate 521, and the upper pressing members 531, 532 of the jig 53 A plurality of laminated bodies 4 will be pinched.
 すなわち、複数の積層体4を半田層112の融点未満、かつ、樹脂層3の硬化温度未満、すなわち樹脂層3の熱硬化性樹脂の硬化温度未満(樹脂層3に含まれる熱硬化性樹脂が、JISK6900に準ずるC-ステージとなる温度未満)で加熱しながら、積層体4の積層方向に沿って挟圧し、第一端子11と第二端子21とが接触するように第二端子21が樹脂層3に、めり込むこととなる。 That is, the plurality of laminates 4 are less than the melting point of the solder layer 112 and less than the curing temperature of the resin layer 3, that is, less than the curing temperature of the thermosetting resin of the resin layer 3 (the thermosetting resin contained in the resin layer 3 The second terminal 21 is made of resin so that the first terminal 11 and the second terminal 21 come into contact with each other while being heated at a temperature lower than the C-stage in accordance with JISK6900). It will sink into layer 3.
 次に、上型511、下型512を離間して、炉51内から、複数の積層体4を搬出する。なお、複数の積層体4を挟圧する際に真空下で挟圧してもよい。これにより、樹脂層3でのボイドの発生を抑制することができる。その後、図8に示す装置6を使用して、複数の積層体4を第一端子11の半田層112の融点以上に加熱して、第一端子11と、第二端子21とを半田接合させる。 Next, the upper mold 511 and the lower mold 512 are separated from each other, and the plurality of stacked bodies 4 are carried out from the furnace 51. Note that the plurality of stacked bodies 4 may be clamped under a vacuum. Thereby, generation | occurrence | production of the void in the resin layer 3 can be suppressed. After that, by using the apparatus 6 shown in FIG. 8, the plurality of stacked bodies 4 are heated to the melting point or higher of the solder layer 112 of the first terminal 11, and the first terminal 11 and the second terminal 21 are soldered. .
 装置6は、積層体4を加圧雰囲気下で加熱することができるもので、構造としては、例えば、積層体4を内部に収容する容器61と、この容器61内に流体を導入するための配管62とを有する。 The apparatus 6 can heat the laminated body 4 in a pressurized atmosphere. The structure of the apparatus 6 includes, for example, a container 61 that houses the laminated body 4 and a fluid for introducing the fluid into the container 61. And a pipe 62.
 容器61は圧力容器であることが特徴で、容器61内に積層体4を設置したのち、配管62から加熱し、さらに加圧した流体を容器61内へ流入させることにより、積層体4を加熱加圧することとなる。 The container 61 is characterized by being a pressure vessel. After the laminated body 4 is installed in the container 61, the laminated body 4 is heated by heating from the pipe 62 and flowing a pressurized fluid into the container 61. Pressurize.
 また、配管62から流体を容器61内へ流入させ、加圧雰囲気下にしつつ、容器61を加熱することにより、積層体4を加熱することもできる。容器61の材料としては、金属があげられ、例えば、ステンレス、チタン、銅、これらの合金、等である。 Moreover, the laminated body 4 can also be heated by flowing the fluid from the pipe 62 into the container 61 and heating the container 61 in a pressurized atmosphere. Examples of the material of the container 61 include metals, such as stainless steel, titanium, copper, and alloys thereof.
 流体により、積層体4を加圧する際の加圧力は、0.1~10MPa、好ましくは0.5~5MPaである。このようにすることで、硬化した樹脂層3中に空隙(ボイド)が発生し難くなる。 The pressure applied when the laminate 4 is pressurized with a fluid is 0.1 to 10 MPa, preferably 0.5 to 5 MPa. By doing in this way, it becomes difficult to generate voids in the cured resin layer 3.
 なお、本発明において、流体で加圧するとは、積層体4の雰囲気の圧力を、大気圧より加圧力分だけ高くすることを指す。すなわち、加圧力10MPaとは、大気圧よりも、積層体に作用する圧力が10MPa大きいことを示す。 In addition, in this invention, pressurizing with a fluid refers to making the pressure of the atmosphere of the laminated body 4 higher than atmospheric pressure by the applied pressure. That is, the applied pressure of 10 MPa indicates that the pressure acting on the laminate is 10 MPa greater than the atmospheric pressure.
 容器61内に積層体4を設置した後、積層体4が加熱されるとともに、積層体4が加圧される。積層体4を加圧する流体は、配管62から容器61内に導入され、積層体4を加圧することとなる。積層体4を加圧する流体としては、窒素ガス、アルゴンガス等の非酸化性ガス、空気等のガスが好ましい。 After installing the laminated body 4 in the container 61, the laminated body 4 is heated and the laminated body 4 is pressurized. The fluid that pressurizes the stacked body 4 is introduced into the container 61 from the pipe 62 and pressurizes the stacked body 4. As a fluid for pressurizing the laminate 4, a non-oxidizing gas such as nitrogen gas or argon gas, or a gas such as air is preferable.
 なかでも、非酸化性ガスを使用することが好ましい。非酸化性ガスを使用することで、第一端子11および第二端子21の接合をより良好なものとすることができる。なお、非酸化性ガスとは、不活性ガス、窒素ガスのことを意味する。 Among them, it is preferable to use a non-oxidizing gas. By using a non-oxidizing gas, the first terminal 11 and the second terminal 21 can be joined better. The non-oxidizing gas means inert gas or nitrogen gas.
 積層体4の温度が半田層112の融点に達した後、容器61内の温度および圧力を保ちながら、所定時間、積層体4を、加熱および加圧する。これにより、積層体4中の樹脂層3が硬化することとなる。 After the temperature of the laminated body 4 reaches the melting point of the solder layer 112, the laminated body 4 is heated and pressurized for a predetermined time while maintaining the temperature and pressure in the container 61. Thereby, the resin layer 3 in the laminated body 4 will harden | cure.
 その後、装置6から積層体4を取り出し、必要に応じて積層体4を再度硬化させる。以上により、電子装置を得ることができる(図9参照)。図9では、第一端子11と第二端子21とが半田層112により接合され、第二端子21の先端が、半田層112に食い込んだ状態となっている。なお、図6で示した点線の切断ラインに従い、第一電子部品1間、樹脂層3間を切断することで、分離した複数の電子装置を得ることができる。 Thereafter, the laminate 4 is taken out from the apparatus 6 and the laminate 4 is cured again as necessary. Thus, an electronic device can be obtained (see FIG. 9). In FIG. 9, the first terminal 11 and the second terminal 21 are joined by the solder layer 112, and the tip of the second terminal 21 is in a state of being bitten into the solder layer 112. A plurality of separated electronic devices can be obtained by cutting between the first electronic components 1 and between the resin layers 3 according to the dotted cutting line shown in FIG.
 次に、本実施形態の作用効果について説明する。本実施形態では、複数の積層体4を加熱しながら、複数の積層体4を同時に積層体4の積層方向から挟圧している。これにより、一つ目の積層体4の第一電子部品1と第二電子部品2とを挟圧している間に、他の積層体4の樹脂層3の硬化が進行してしまうことが抑制される。従って、信頼性の高い電子装置を安定的に製造することができる。 Next, the function and effect of this embodiment will be described. In the present embodiment, the plurality of stacked bodies 4 are simultaneously pressed from the stacking direction of the stacked bodies 4 while heating the plurality of stacked bodies 4. Thereby, while the 1st electronic component 1 and the 2nd electronic component 2 of the 1st laminated body 4 are clamped, it is suppressed that hardening of the resin layer 3 of the other laminated body 4 advances. Is done. Therefore, a highly reliable electronic device can be manufactured stably.
 また、本実施形態では、積層体4を加圧流体により加圧して樹脂層3を硬化させているため、樹脂層3の硬化物中の気泡等の空隙の発生を抑制できる。さらに、第一端子11および第二端子21を半田接合する際に、流体により積層体4を加圧すれば、樹脂層3の密度を高めて、体積を低減させることにより、第一端子11と第二端子21とが圧着する方向に力を作用させることが可能となる。 Moreover, in this embodiment, since the laminated body 4 is pressurized with the pressurized fluid and the resin layer 3 is cured, the generation of voids such as bubbles in the cured product of the resin layer 3 can be suppressed. Furthermore, when soldering the first terminal 11 and the second terminal 21, if the laminate 4 is pressurized with a fluid, the density of the resin layer 3 is increased and the volume is reduced. A force can be applied in the direction in which the second terminal 21 is crimped.
 さらに、第一端子11および第二端子21を接合する際に、流体により積層体4を加圧すれば、樹脂層3の発泡による樹脂流動が抑制でき、第一端子11および第二端子21間のずれを確実に低減させることができる。 Further, when the first terminal 11 and the second terminal 21 are joined, if the laminate 4 is pressurized with a fluid, the resin flow due to foaming of the resin layer 3 can be suppressed, and the first terminal 11 and the second terminal 21 The deviation can be reliably reduced.
 また、本実施形態では、積層体4を挟圧する上側加圧部材531に溝531Aを形成している。積層体4を挟圧する際に、積層体4の樹脂層3が積層体4からはみ出すことがあるが、はみ出した樹脂層3を溝531A内に逃がすことができる。これにより、第二電子部品2と上側加圧部材531との間に樹脂が入り込んでしまうことが防止できる。 In this embodiment, the groove 531A is formed in the upper pressure member 531 that sandwiches the stacked body 4. When sandwiching the laminate 4, the resin layer 3 of the laminate 4 may protrude from the laminate 4, but the protruded resin layer 3 can escape into the groove 531 </ b> A. Thereby, it is possible to prevent the resin from entering between the second electronic component 2 and the upper pressure member 531.
 さらに、本実施形態では、溝531Aで区画された上記領域531Bに当接する第二電子部品2の端面が、溝531Aの側面531Cよりも溝531A内側に突出している。 Furthermore, in this embodiment, the end surface of the second electronic component 2 that abuts on the region 531B defined by the groove 531A protrudes inside the groove 531A from the side surface 531C of the groove 531A.
 積層体4を挟圧する際に、積層体4からはみ出した樹脂が、積層体4の第二電子部品2の端面に沿って這い上がってくることがある。溝531Aの側面531Cが、第二電子部品2の端面よりも、溝531A内側に突出していないため、第二電子部品2の端面を這い上がってくる樹脂が上側加圧部材531に付着してしまうことを抑制できる。そのため、上側加圧部材531の樹脂による汚染を防止することができる。 When sandwiching the laminated body 4, the resin protruding from the laminated body 4 may crawl up along the end surface of the second electronic component 2 of the laminated body 4. Since the side surface 531C of the groove 531A does not protrude to the inside of the groove 531A from the end surface of the second electronic component 2, the resin scooping up the end surface of the second electronic component 2 adheres to the upper pressure member 531. This can be suppressed. Therefore, contamination of the upper pressure member 531 with the resin can be prevented.
 また、上側加圧部材531に溝531Aを形成しない場合には、積層体4からはみ出した樹脂が上記部材に付着してしまい上記部材の積層体4側の面が平坦なものでなくなる可能性がある。そのため、積層体4に作用する荷重にばらつきが生じることがある。これに対し、本実施形態では、前述したように上側加圧部材531への樹脂の付着を防止できるので、積層体4に作用する荷重のばらつきの発生を抑制することができる。 Further, when the groove 531A is not formed in the upper pressure member 531, there is a possibility that the resin protruding from the laminate 4 adheres to the member and the surface of the member on the laminate 4 side is not flat. is there. Therefore, the load acting on the laminate 4 may vary. On the other hand, in this embodiment, since the adhesion of the resin to the upper pressure member 531 can be prevented as described above, it is possible to suppress the occurrence of variations in the load acting on the laminate 4.
 なお、本発明は前述の実施形態に限定されるものではなく、本発明の目的を達成できる範囲での変形、改良等は本発明に含まれるものである。例えば、上記形態では、装置5において冶具53を使用していたが、これに限らず、冶具53を使用しなくてもよい。 It should be noted that the present invention is not limited to the above-described embodiment, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention. For example, in the above embodiment, the jig 53 is used in the device 5, but the present invention is not limited to this, and the jig 53 may not be used.
 また、上記形態では、第一電子部品1同士、樹脂層3同士が連なっていたが、これに限られるものではない。例えば、あらかじめ第一電子部品1同士、樹脂層3同士が分離しており、第一電子部品1間、樹脂層3間に隙間(空隙)があってもよい。 Moreover, in the said form, although 1st electronic components 1 and resin layers 3 were connected, it is not restricted to this. For example, the first electronic components 1 and the resin layers 3 may be separated in advance, and there may be a gap (gap) between the first electronic components 1 and between the resin layers 3.
 さらに、上記形態では、第二電子部品2に上側加圧部材531を当接させていたが、これに限られるものではなく、第一電子部品1に上側加圧部材531を当接させてもよい。 Further, in the above embodiment, the upper pressure member 531 is brought into contact with the second electronic component 2, but the present invention is not limited to this, and the upper pressure member 531 may be brought into contact with the first electronic component 1. Good.
 また、一方の積層体4においては、第一電子部品1に上側加圧部材531が当接するようにし、他方の積層体4においては、第二電子部品2に上側加圧部材531が当接するようにしてもよい。ただし、端子同士の接合安定性の観点からは、上記形態のように、上側加圧部材531に接触する部品は同じ部品であることが好ましい。 In one laminate 4, the upper pressure member 531 is in contact with the first electronic component 1, and in the other laminate 4, the upper pressure member 531 is in contact with the second electronic component 2. It may be. However, from the viewpoint of the stability of bonding between the terminals, it is preferable that the parts contacting the upper pressure member 531 are the same parts as in the above embodiment.
 さらに、上記形態では積層体4の第二電子部品2に当接する領域531Bを区画する溝531Aが下面のみに形成されており、上面は平坦な上側加圧部材531を例示した。 Furthermore, in the above embodiment, the groove 531A that divides the region 531B in contact with the second electronic component 2 of the laminate 4 is formed only on the lower surface, and the upper pressure member 531 having a flat upper surface is illustrated.
 しかし、図10に挟圧部材として例示する上側加圧部材533のように、下面の溝531Aと同一の溝533Aが上面にも形成されて領域533Bが区画されており、上下対称の上側加圧部材533なども実施可能である。ここでいう上下方向は、図10の上下方向に対応している。すなわち、積層体4の積層方向と一致している。 However, like the upper pressure member 533 illustrated as a pinching member in FIG. 10, the groove 533A identical to the groove 531A on the lower surface is also formed on the upper surface, and the region 533B is partitioned, so that the upper and lower symmetrical upper pressure members are formed. The member 533 and the like can also be implemented. The up-down direction here corresponds to the up-down direction in FIG. That is, it coincides with the stacking direction of the stacked body 4.
 このような上側加圧部材533は、上下対称なので加圧による湾曲を良好に防止することができ、より均等に複数の第二電子部品2を第一電子部品1に加圧することができる。しかも、上述のような上側加圧部材533は上下対称なので、製造時の圧力等により上下方向に湾曲することなども防止できる。 Since the upper pressing member 533 is symmetrical in the vertical direction, it is possible to prevent the bending due to the pressing well, and to press the plurality of second electronic components 2 to the first electronic component 1 more evenly. In addition, since the upper pressure member 533 as described above is vertically symmetric, it can be prevented from being bent in the vertical direction due to pressure during manufacturing.
 また、上記形態では電子装置の製造方法において、積層体4を得る工程では、樹脂層3の硬化温度未満の温度で積層体4を加熱しながら、プレス部材である熱板521,522により積層体4の積層方向に沿って積層体4を機械的に加圧することのみ例示した。 Moreover, in the manufacturing method of an electronic device in the said form, in the process of obtaining the laminated body 4, a laminated body is heated by the hot plates 521 and 522 which are press members, heating the laminated body 4 at the temperature below the curing temperature of the resin layer 3. Only the pressurization of the laminate 4 along the four lamination directions is illustrated.
 しかし、このように積層体4を機械的に加圧するとき、さらに空気などの流体により積層体4を加圧してもよい(図示せず)。この場合、積層体4を均一に加圧することができるだけでなく、樹脂層3に発生する気泡の膨張も防止することができる。 However, when the laminate 4 is mechanically pressurized in this manner, the laminate 4 may be further pressurized by a fluid such as air (not shown). In this case, not only can the laminated body 4 be pressed uniformly, but also the expansion of bubbles generated in the resin layer 3 can be prevented.
 さらに、上述の積層体4を得る工程では、樹脂層3の硬化温度未満であり、樹脂層3の粘度が1Pa・s以上、10000Pa・s以下となる温度で積層体4を加熱してもよい。また、上述の積層体4を得る工程において、容器である容器61内に積層体4を配置し、容器61内に流体を導入して、流体により、積層体4を加圧してもよい。このような流体は空気や窒素を利用することができる。 Further, in the step of obtaining the laminate 4 described above, the laminate 4 may be heated at a temperature that is lower than the curing temperature of the resin layer 3 and the viscosity of the resin layer 3 is 1 Pa · s or more and 10,000 Pa · s or less. . Moreover, in the process of obtaining the above-mentioned laminated body 4, the laminated body 4 may be arrange | positioned in the container 61 which is a container, a fluid may be introduce | transduced in the container 61, and the laminated body 4 may be pressurized with a fluid. Such fluid can utilize air or nitrogen.
 なお、上述のように積層体4を加圧する流体の圧力は、炉51の上型511と下型512とを開放する内圧となる。そこで、図11に示すように、炉51の上型511と下型512とを閉止する圧力と、積層体4を直接に加圧する熱板521,522の圧力と、積層体4を加圧する炉51内の気圧とを、各々別個に制御できることが好適である。 Note that, as described above, the pressure of the fluid that pressurizes the stacked body 4 is an internal pressure that opens the upper mold 511 and the lower mold 512 of the furnace 51. Therefore, as shown in FIG. 11, the pressure for closing the upper mold 511 and the lower mold 512 of the furnace 51, the pressure of the hot plates 521 and 522 that directly pressurize the stacked body 4, and the furnace that pressurizes the stacked body 4. It is preferable that the air pressure in 51 can be controlled separately.
 この出願は、2010年4月23日に出願された日本特許出願特願2010-099553、2010年7月1日に出願された日本特許出願特願2010-150827、2010年8月24日に出願された日本特許出願特願2010-186870を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application is Japanese Patent Application Japanese Patent Application No. 2010-099553 filed on April 23, 2010, Japanese Patent Application Japanese Patent Application No. 2010-150827 filed on July 1, 2010, and filed on August 24, 2010. Claims the priority based on Japanese Patent Application No. 2010-186870, which is incorporated herein by reference.

Claims (20)

  1.  表面に半田層を有する第一端子を有する第一電子部品と、この第一電子部品の前記第一端子に接合される第二端子を有する第二電子部品とを備える電子装置の製造方法であって、
     前記第一電子部品の第一端子と、前記第二電子部品の第二端子との間にフラックス活性化合物と、熱硬化性樹脂とを含む樹脂層を配置して積層体を得る工程と、
     前記積層体を前記第一端子の前記半田層の融点以上に加熱して、前記第一端子と、前記第二端子とを半田接合させる工程と、
     流体により前記積層体を加圧しながら、前記樹脂層を硬化させる工程とを含み、
     前記積層体を得る前記工程では、
     複数の第一電子部品の第一端子と、複数の第二電子部品の第二端子とをそれぞれ対向配置させ、各第一端子と各第二端子との間に前記樹脂層を配置して複数の積層体を形成し、複数の積層体を加熱しながら、前記複数の積層体を同時に前記積層体の積層方向から挟圧する電子装置の製造方法。
    A method of manufacturing an electronic device comprising: a first electronic component having a first terminal having a solder layer on a surface; and a second electronic component having a second terminal joined to the first terminal of the first electronic component. And
    Placing a resin layer containing a flux active compound and a thermosetting resin between the first terminal of the first electronic component and the second terminal of the second electronic component to obtain a laminate;
    Heating the laminated body to a temperature equal to or higher than the melting point of the solder layer of the first terminal, and soldering the first terminal and the second terminal;
    Curing the resin layer while pressurizing the laminate with a fluid,
    In the step of obtaining the laminate,
    The first terminals of the plurality of first electronic components and the second terminals of the plurality of second electronic components are arranged to face each other, and the resin layer is arranged between each first terminal and each second terminal. A method of manufacturing an electronic device in which the plurality of stacked bodies are simultaneously sandwiched from the stacking direction of the stacked bodies while the plurality of stacked bodies are heated.
  2.  請求項1に記載の電子装置の製造方法において、
     前記複数の積層体は面内方向に配列されている電子装置の製造方法。
    In the manufacturing method of the electronic device according to claim 1,
    The method for manufacturing an electronic device, wherein the plurality of stacked bodies are arranged in an in-plane direction.
  3.  請求項1または2に記載の電子装置の製造方法において、
     積層体を得る前記工程では、
     前記複数の積層体を一対の挟圧部材で挟圧し、
     前記一対の挟圧部材のうち、一方の挟圧部材は、溝が形成された部材であり、
     溝が形成された前記部材を前記積層体に当接させた際に、
     一方の挟圧部材の前記溝で区画された各領域がそれぞれ前記積層体の第一電子部品または第二電子部品に当接し、かつ、前記溝で区画された前記領域に当接する第一電子部品または第二電子部品の端面が、前記溝の側面よりも溝内側に突出する電子装置の製造方法。
    In the manufacturing method of the electronic device according to claim 1 or 2,
    In the step of obtaining a laminate,
    The plurality of laminates are clamped by a pair of clamping members,
    Of the pair of clamping members, one clamping member is a member in which a groove is formed,
    When the member in which the groove is formed is brought into contact with the laminate,
    The first electronic component in which each region defined by the groove of one of the pressing members is in contact with the first electronic component or the second electronic component of the laminate, and is in contact with the region defined by the groove. Or the manufacturing method of the electronic device by which the end surface of a 2nd electronic component protrudes inside a groove | channel rather than the side surface of the said groove | channel.
  4.  請求項3に記載の電子装置の製造方法において、
     溝が形成された前記部材を前記積層体に当接させた際に、
     前記溝で区画された前記領域には、各積層体の第一電子部品および第二電子部品のうち一方の部品が当接し、
     複数の積層体の各樹脂層は連なって、樹脂シートを構成し、
     前記積層体の積層方向からみて、隣接する積層体の前記一方の部品間から前記樹脂シートの一部が露出し、
     溝が形成された前記部材を前記積層体に当接させた際に、露出した前記樹脂シートの一部が前記溝と対向する電子装置の製造方法。
    In the manufacturing method of the electronic device according to claim 3,
    When the member in which the groove is formed is brought into contact with the laminate,
    One of the first electronic component and the second electronic component of each laminated body abuts on the region partitioned by the groove,
    Each resin layer of a plurality of laminates is connected to form a resin sheet,
    A part of the resin sheet is exposed from between the one part of the adjacent laminated body as seen from the lamination direction of the laminated body,
    An electronic device manufacturing method in which a part of the exposed resin sheet faces the groove when the member in which the groove is formed is brought into contact with the laminated body.
  5.  請求項1ないし4の何れか一項に記載の電子装置の製造方法において、
     積層体を得る前記工程では、
     前記樹脂層の硬化温度未満の温度で前記積層体を加熱しながら、プレス部材により前記積層体の積層方向に沿って前記積層体を加圧するとともに、流体により前記積層体を加圧する電子装置の製造方法。
    In the manufacturing method of the electronic device according to any one of claims 1 to 4,
    In the step of obtaining a laminate,
    Manufacture of an electronic device that pressurizes the laminate along the laminating direction of the laminate by a press member while heating the laminate at a temperature lower than the curing temperature of the resin layer, and pressurizes the laminate with a fluid. Method.
  6.  請求項5に記載の電子装置の製造方法において、
     前記積層体を得る前記工程において、
     前記プレス部材は、熱板であり、前記熱板を積層体に当接させることで、前記積層体が加熱される電子装置の製造方法。
    In the manufacturing method of the electronic device according to claim 5,
    In the step of obtaining the laminate,
    The said press member is a hot platen, The manufacturing method of the electronic apparatus with which the said laminated body is heated by making the said hot plate contact | abut to a laminated body.
  7.  請求項5または6に記載の電子装置の製造方法において、
     前記積層体を得る前記工程において、容器内に前記積層体を配置し、前記容器内に前記流体を導入して、前記流体により前記積層体を加圧する電子装置の製造方法。
    In the manufacturing method of the electronic device according to claim 5 or 6,
    In the step of obtaining the laminate, a method of manufacturing an electronic device in which the laminate is disposed in a container, the fluid is introduced into the container, and the laminate is pressurized with the fluid.
  8.  請求項1または2に記載の電子装置の製造方法において、
     積層体を得る前記工程は、
      前記複数の積層体を一対の挟圧部材で挟圧する工程と、
      前記樹脂層の硬化温度未満の温度で前記積層体を加熱しながら、前記一対の狭圧部材をプレス部材によって前記積層体の積層方向から狭圧することにより、前記積層体の積層方向に沿って前記積層体を加圧するとともに、流体により前記積層体を加圧する工程と、
     を含み、
     前記一対の挟圧部材のうち、一方の挟圧部材は、溝が形成された部材であり、
     溝が形成された前記部材を前記積層体に当接させた際に、
     一方の挟圧部材の前記溝で区画された各領域がそれぞれ前記積層体の第一電子部品または第二電子部品に当接し、かつ、前記溝で区画された前記領域に当接する第一電子部品または第二電子部品の端面が、前記溝の側面よりも溝内側に突出する電子装置の製造方法。
    In the manufacturing method of the electronic device according to claim 1 or 2,
    The step of obtaining a laminate includes
    Clamping the plurality of laminates with a pair of clamping members;
    While the laminate is heated at a temperature lower than the curing temperature of the resin layer, the pair of narrow-pressure members are narrowed from the laminate direction of the laminate by a press member so that the laminate along the laminate direction of the laminate. Pressurizing the laminate and pressurizing the laminate with a fluid; and
    Including
    Of the pair of clamping members, one clamping member is a member in which a groove is formed,
    When the member in which the groove is formed is brought into contact with the laminate,
    The first electronic component in which each region defined by the groove of one of the pressing members is in contact with the first electronic component or the second electronic component of the laminate, and is in contact with the region defined by the groove. Or the manufacturing method of the electronic device by which the end surface of a 2nd electronic component protrudes inside a groove | channel rather than the side surface of the said groove | channel.
  9.  請求項1ないし8の何れか一項に記載の電子装置の製造方法において、
     前記積層体を得る前記工程では、
     前記樹脂層の粘度が1Pa・s以上、10000Pa・s以下となる温度で前記積層体を加熱する電子装置の製造方法。
    In the manufacturing method of the electronic device according to any one of claims 1 to 8,
    In the step of obtaining the laminate,
    The manufacturing method of the electronic apparatus which heats the said laminated body at the temperature from which the viscosity of the said resin layer is 1 Pa.s or more and 10000 Pa.s or less.
  10.  表面に半田層を有する第一端子を有する第一電子部品の前記第一端子と、この第一電子部品の前記第一端子に接合される第二端子を有する第二電子部品の前記第二端子との間に、フラックス活性化合物と、熱硬化性樹脂とを含む樹脂層を配置して、積層体を形成した後、前記第一端子と、前記第二端子とを接触させるための装置であって、
     複数の積層体を同時に挟圧する挟圧部材を備える装置。
    The second terminal of the second electronic component having the first terminal of the first electronic component having a first terminal having a solder layer on the surface and the second terminal joined to the first terminal of the first electronic component A resin layer containing a flux active compound and a thermosetting resin is disposed between the first terminal and the second terminal, and then the first terminal and the second terminal are brought into contact with each other. And
    An apparatus provided with a pinching member for simultaneously pinching a plurality of laminated bodies.
  11.  請求項10に記載の装置であって、
     前記狭圧部材は、面内方向に配列された前記複数の積層体を同時に狭圧する装置。
    The apparatus of claim 10, comprising:
    The narrow pressure member is a device for simultaneously narrowing the plurality of stacked bodies arranged in the in-plane direction.
  12.  請求項10または11に記載の装置であって、
     前記挟圧部材は、前記複数の積層体を挟圧する一対の挟圧部材を有し、
     前記一対の挟圧部材のうち、少なくとも一方の挟圧部材は、溝が形成された部材であり、
     溝が形成された前記部材を前記積層体に当接させた際に、
     一方の挟圧部材の前記溝で区画された各領域をそれぞれ前記積層体の第一電子部品または第二電子部品に当接し、かつ、前記溝で区画された前記領域に当接する第一電子部品または第二電子部品の端面が、前記溝の側面よりも溝内側に突出するように構成されている装置。
    The apparatus according to claim 10 or 11, comprising:
    The pinching member has a pair of pinching members that pinch the plurality of stacked bodies,
    Of the pair of clamping members, at least one clamping member is a member in which a groove is formed,
    When the member in which the groove is formed is brought into contact with the laminate,
    A first electronic component that abuts each region defined by the groove of one of the clamping members to the first electronic component or the second electronic component of the laminate and abuts the region defined by the groove. Or the apparatus comprised so that the end surface of a 2nd electronic component may protrude inside a groove | channel rather than the side surface of the said groove | channel.
  13.  請求項10ないし12の何れか一項に記載の装置において、
     前記樹脂層の硬化温度未満の温度で前記積層体を加熱しながら、プレス部材により前記積層体の積層方向に沿って前記積層体を加圧するとともに、流体により前記積層体を加圧するように構成されている装置。
    The device according to any one of claims 10 to 12,
    While the laminate is heated at a temperature lower than the curing temperature of the resin layer, the laminate is pressurized along the lamination direction of the laminate by a press member, and the laminate is pressurized with a fluid. Equipment.
  14.  請求項13に記載の装置において、
     前記プレス部材は、熱板であり、前記熱板を積層体に当接させることで、前記積層体を加熱するように構成されている装置。
    The apparatus of claim 13.
    The said press member is a hot platen, The apparatus comprised so that the said laminated body may be heated by making the said hot plate contact | abut to a laminated body.
  15.  請求項13または14に記載の装置において、
     容器内に前記積層体を配置し、前記容器内に前記流体を導入して、前記流体により前記積層体を加圧するように構成されている装置。
    The device according to claim 13 or 14,
    An apparatus configured to arrange the laminated body in a container, introduce the fluid into the container, and pressurize the laminated body with the fluid.
  16.  請求項10ないし15の何れか一項に記載の装置において、
     前記積層体の前記樹脂層の粘度が1Pa・s以上、10000Pa・s以下となる温度で前記積層体を加熱するように構成されている装置。
    The device according to any one of claims 10 to 15,
    An apparatus configured to heat the laminated body at a temperature at which the viscosity of the resin layer of the laminated body is 1 Pa · s or more and 10,000 Pa · s or less.
  17.  請求項12に記載の装置であって、
     一対の前記挟圧部材のうち前記溝が形成されている少なくとも一方の前記狭圧部材は、上下対称に形成されている装置。
    The apparatus according to claim 12, comprising:
    The apparatus in which at least one of the narrow pressure members in which the groove is formed among the pair of the pressing members is formed vertically symmetrical.
  18.  請求項17に記載の装置であって、
     前記一対の狭圧部材のうち少なくとも一方の狭圧部材は、前記第二電子部品に当接する下面に形成されている前記溝と上下対称に上面にも溝が形成されている装置。
    The apparatus of claim 17, comprising:
    The apparatus in which at least one narrow pressure member of the pair of narrow pressure members has a groove formed on the upper surface symmetrically with the groove formed on the lower surface contacting the second electronic component.
  19.  請求項17または18に記載された装置の一対の挟圧部材であって、
     前記溝が形成されている少なくとも一方の狭圧部材は、上下対称に形成されている一対の挟圧部材。
    A pair of clamping members of the device according to claim 17 or 18,
    The at least one narrow pressure member in which the groove is formed is a pair of pinching members formed symmetrically in the vertical direction.
  20.  請求項19に記載の一対の挟圧部材であって、
     少なくとも一方の狭圧部材は、前記第二電子部品に当接する下面に形成されている前記溝と上下対称に上面にも溝が形成されている一対の挟圧部材。
    A pair of clamping members according to claim 19,
    At least one of the narrow pressure members is a pair of pressing members in which a groove is also formed on the upper surface symmetrically with the groove formed on the lower surface in contact with the second electronic component.
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