TW201220451A - characterized by using plasma to clean the core surface prior to coating a plating on the core - Google Patents

characterized by using plasma to clean the core surface prior to coating a plating on the core Download PDF

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Publication number
TW201220451A
TW201220451A TW099138388A TW99138388A TW201220451A TW 201220451 A TW201220451 A TW 201220451A TW 099138388 A TW099138388 A TW 099138388A TW 99138388 A TW99138388 A TW 99138388A TW 201220451 A TW201220451 A TW 201220451A
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Taiwan
Prior art keywords
silver
core
core wire
wire
alloy
Prior art date
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TW099138388A
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English (en)
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TWI443792B (zh
Inventor
Cheng-Jie Yang
Jian-Min Wang
zhen-chuan Lin
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Yuh Cheng Materials Co Ltd
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Priority to TW099138388A priority Critical patent/TW201220451A/zh
Publication of TW201220451A publication Critical patent/TW201220451A/zh
Application granted granted Critical
Publication of TWI443792B publication Critical patent/TWI443792B/zh

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  • Wire Bonding (AREA)

Description

201220451 六、發明說明： 【發明所屬之技術領域】 本發明係有關於封裝用之導線，特別是指一種封裝用 導線及其製造方法，可快速且完全地將芯線表面清洗乾 淨’並可使鍍層穩固地被覆於芯線外。 【先前技術】 習知封裝用導線以純金線為主，金線在封裝應用上具 • 有良好的電性及穩定的作業性，然而近來因金線成本價格 大漲，致使業界開始尋求替代金線之材料。在電性上具有 良好特性的銅及銀為目前業界嘗試用來取代金的主要標 的，但純銅及純銀線易受溫度及濕度影響，致使在保存及 封裝作業上不如金線之穩定，造成封裝良率的降低，遂有 表面加以鍍層被覆的複合導線產生，鍍層可形成有效保 °蒦，使複合導線達到與金線相當的特性功能。 _ 習知封裝用導線之製造方法是先取一芯線，進行脫脂 處理(degrease)以去除芯線表面之油汙，並以水沖洗後，再 以酸性藥水進行活化處理(acidactive)，以及二次水洗，接 著再於忍線表面以電鑛方式形成一鍍層。惟，形成鍍層前 所進行之脫脂與活化處理，不僅費事，且常因藥水效性變 異，無法完全將芯線表面清潔乾淨，影響鍍層之附著性， 造成鍍層可能意外脫落，並導致封裝導線功能失效。 【發明内容】 201220451 有鑑於此，本發明之主要目的在於提供一種封裝用導 線及其製造方法，可㈣且完全地㈣線表面清洗乾淨， 並可使鍍層穩固地被覆於芯線外。 為達成上揭目的，本發明所提供之封裝用導線包含有 一芯線與一鍍層，該芯線係由銀、銀-金合金、銀-銅合金、 銀-纪合金、銅、IS或其合金所製成，賴層被覆於該芯線 表面且由金、銀、鈀、鉑、釕、鎳或其合金所製成。 本發明所提供之封襞用導線之製造方法包含有以下步 驟.（a)將一芯線通過一反應室，於該反應室中產生電漿以 清潔該芯線表面；以及(b)於該芯線表面被覆一鍍層。 由於電漿可快速且完全地將芯線表面清洗乾淨並加以 活化，故鍍層可穩固地被覆於芯線表面而不易脫落。 【實施方式】 為了詳細說明本發明之結構、特徵及功效所在，茲列 舉一較佳實施例並配合下列圖式說明如後。 第一圖為本發明一較佳實施例之產品立體圖； 第二圖為本發明一較佳實施例之製造方法示意圖。 請參閱第一圖，為本發明一較佳實施例所提供之製造 方法所製成之封裝用導線10，該導線丨〇具有一芯線12以 及一鍵層14 ’該芯線12直徑為o oioomm〜0.0508mm，該 鍵層14厚度則為5nm〜0.001mm，該芯線12係由銀、銅、 鋁或其合金所製成；或者’該芯線可由銀-金合金所製成， 其中金之含量為l〇ppm〜4〇 wt% ;又，該芯線可由銀·銅合 201220451 金所製成，其中銅之含量為10 PPm〜10 wt% :另’該芯線 亦可由銀-鈀合金所製成，其中鈀之含量為10 ppm〜35 wt%。而該鍍層則可由金、銀、鈀、鉑、釕、鎳或其合金 所製成。 如第二圖所杀，該封裝用導線10之製造方法係先將該 芯線12通過一反應室20 ’將氮氣與3°/◦以下氫氣之混合氣 體以每分鐘10扑之流量通入該反應室20中’利用一電源 施以電壓以生成電漿，該電漿即可轟擊該芯線12表面進行 • 清潔、活化處理，完成表面清潔處理後的芯線丨2可直接以 濺鍍或電鍍方式於該芯線12表面被覆一鍍層Η ’即完成 封裝用導線1〇之製造程序。 由於本發明所提供之製造方法利用電漿清洗芯線 12，不僅快速，清潔更為確實。芯線12採捲對捲(Roll t0 Roll) 方式進出反應室20 ’放線速度(wire speed)每分鐘可達三百 来以上，芯線12在反應室20僅需幾亳秒時間即可完全將 φ 芯線12表面之雜質如碳、氧或有機物質去除殆盡，非常適 合封裝用導線10之生產。芯線12進行鍍層14被覆作業後 所形成之導線10，其鍍層14與芯線12之結合性極佳，即 使針對導線10進行後續加工如拉伸處理，鍍層14亦不易 意外脫落。 〃需特別說明的是，形成電漿之氣體可依需要採用氣 氣氯氣、氫氣或其混合氣體，而於这線表面被覆錄層之 方法亦可採用電鍍、濺鑛、蒸錢、化學蒸汽沉積或其複合 方式’其他等效步驟的替代或變化，亦應為本案之申請專 201220451 利範圍所涵蓋。 201220451 【圖式簡單說明】 第一圖為本發明一較佳實施例之產品立體圖； 第二圖為本發明一較佳實施例之製造方法示意圖。 【主要元件符號說明】 10導線 12芯線 14鍍層 20反應室

Claims (1)

  1. 201220451 七、申請專利範圍： 1. 一種封裝用導線之製造方法，包含有以下步驟： (a) 將一芯線通過一反應室，於該反應室中產生電漿 以清潔該芯線表面；以及 (b) 於該芯線表面被覆一鍍層。 2. 如請求項1所述封裝用導線之製造方法，於步驟(a) 中該電漿係採用氮氣、氬氣、氫氣或其混合氣體所生成。 3. 如請求項1所述封裝用導線之製造方法，於步驟(a) 中係將氮氣與至多3%氫氣之混合氣體以10升/分鐘通入反 應室中，以生成該電漿。 4. 如請求項1所述封裝用導線之製造方法，於步驟(b) 中該鍍層係以電鍍、濺鍍、蒸鍍、化學蒸汽沉積或其複合 方式被覆於芯線表面。 5. —種封裝用導線，包含有： 一芯線，係由銀、銀-金合金、銀-銅合金、銀-Ιε合金、 銅、鋁或其合金所製成；以及 一鑛層，被覆於該芯線表面，該鍵層係由金、銀、把、 鉑、釕、鎳或其合金所製成。 6. 如請求項5所述之封裝用導線，其中該銀-金合金 中金之含量為10 ppm〜40 wt%。 7. 如請求項5所述之封裝用導線，其中該銀-銅合金 中銅之含量為10ppm〜10wt°/〇。 8. 如請求項5所述之封裝用導線，其中該銀鈀合金 中纪之含量為10 ppm〜35 wt%。
TW099138388A 2010-11-08 2010-11-08 characterized by using plasma to clean the core surface prior to coating a plating on the core TW201220451A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10332658B2 (en) 2013-10-10 2019-06-25 General Cable Technologies Corporation Method of forming a coated overhead conductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10332658B2 (en) 2013-10-10 2019-06-25 General Cable Technologies Corporation Method of forming a coated overhead conductor

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