TW201212146A - Handling device - Google Patents

Handling device Download PDF

Info

Publication number
TW201212146A
TW201212146A TW100109550A TW100109550A TW201212146A TW 201212146 A TW201212146 A TW 201212146A TW 100109550 A TW100109550 A TW 100109550A TW 100109550 A TW100109550 A TW 100109550A TW 201212146 A TW201212146 A TW 201212146A
Authority
TW
Taiwan
Prior art keywords
inspection
air
space
unit
outer layer
Prior art date
Application number
TW100109550A
Other languages
English (en)
Chinese (zh)
Inventor
Tomoaki Hasegawa
Tomokazu Kiuchi
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW201212146A publication Critical patent/TW201212146A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F7/00—Ventilation
    • F24F7/04—Ventilation with ducting systems, e.g. by double walls; with natural circulation
    • F24F7/06—Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ventilation (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Prevention Of Fouling (AREA)
TW100109550A 2010-04-12 2011-03-21 Handling device TW201212146A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010091608A JP2011220631A (ja) 2010-04-12 2010-04-12 処理装置

Publications (1)

Publication Number Publication Date
TW201212146A true TW201212146A (en) 2012-03-16

Family

ID=44961973

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100109550A TW201212146A (en) 2010-04-12 2011-03-21 Handling device

Country Status (4)

Country Link
JP (1) JP2011220631A (ko)
KR (1) KR20120042608A (ko)
CN (1) CN102243986A (ko)
TW (1) TW201212146A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641850B (zh) * 2015-03-16 2018-11-21 日商精工愛普生股份有限公司 Electronic component conveying device and electronic component inspection device
TWI641849B (zh) * 2015-03-16 2018-11-21 日商精工愛普生股份有限公司 電子零件搬送裝置及電子零件檢查裝置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6043123B2 (ja) * 2012-08-22 2016-12-14 オイレス工業株式会社 非接触支持装置及び塗布装置
JP7018368B2 (ja) * 2018-07-12 2022-02-10 東京エレクトロン株式会社 検査装置及び検査装置の清浄化方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641850B (zh) * 2015-03-16 2018-11-21 日商精工愛普生股份有限公司 Electronic component conveying device and electronic component inspection device
TWI641849B (zh) * 2015-03-16 2018-11-21 日商精工愛普生股份有限公司 電子零件搬送裝置及電子零件檢查裝置
US10416231B2 (en) 2015-03-16 2019-09-17 Seiko Epson Corporation Electronic component transport apparatus and electronic component inspection apparatus

Also Published As

Publication number Publication date
JP2011220631A (ja) 2011-11-04
KR20120042608A (ko) 2012-05-03
CN102243986A (zh) 2011-11-16

Similar Documents

Publication Publication Date Title
JP5755038B2 (ja) 組立装置及び生産システム
TWI486578B (zh) Plate glass inspection unit and manufacturing equipment
JP7351543B2 (ja) インクジェットプリンタ
JP5912552B2 (ja) Ｘ線検査装置
JP5773316B2 (ja) 基板処理設備及び基板処理方法
TW201212146A (en) Handling device
US10976212B2 (en) Leak inspection assistance device and leak inspection method using same
JP2007107945A5 (ko)
WO2011108215A1 (ja) 基板収納装置
TW201230237A (en) Inspection device
TW201230230A (en) Inspection device and positioning method for substrate
WO2003102475A1 (fr) Module d'assemblage propre, appareillage de production le contenant, robot industriel et systeme antipollution
TWI757473B (zh) 晶圓檢查裝置
KR20130007389A (ko) 기판 처리 설비 및 기판 처리 방법
JP7219148B2 (ja) 検査システム及び検査システムの駆動方法
JPH1020478A (ja) 露光装置
JP2010243439A (ja) 外観検査装置
JP6977557B2 (ja) 検査装置
KR101682038B1 (ko) 검사 장치
JP2004299885A (ja) 気流制御構造及び気流制御方法
JPS62157127A (ja) クリ−ンル−ム等における被加工物の搬送方法および搬送装置
JPH0273141A (ja) レーザ検査装置
TW202410511A (zh) 低粒氣體封裝系統與方法
KR20110122415A (ko) 백라이트 유닛의 광학시트 자동 조립 시스템 및 방법
TW201227866A (en) Processing apparatus