TW201119782A - Glass-fiber-reinforced resin film and a method of cutting the same, glass-fiber-reinforced resin panel and a method of manufacturing the same - Google Patents

Glass-fiber-reinforced resin film and a method of cutting the same, glass-fiber-reinforced resin panel and a method of manufacturing the same Download PDF

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Publication number
TW201119782A
TW201119782A TW099137971A TW99137971A TW201119782A TW 201119782 A TW201119782 A TW 201119782A TW 099137971 A TW099137971 A TW 099137971A TW 99137971 A TW99137971 A TW 99137971A TW 201119782 A TW201119782 A TW 201119782A
Authority
TW
Taiwan
Prior art keywords
glass fiber
resin film
reinforced resin
fiber reinforced
glass
Prior art date
Application number
TW099137971A
Other languages
English (en)
Chinese (zh)
Inventor
Hideki Goto
Daisuke Isobe
Hiroyuki Ohtsuka
Masafumi Morita
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW201119782A publication Critical patent/TW201119782A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Reinforced Plastic Materials (AREA)
  • Photovoltaic Devices (AREA)
TW099137971A 2009-11-06 2010-11-04 Glass-fiber-reinforced resin film and a method of cutting the same, glass-fiber-reinforced resin panel and a method of manufacturing the same TW201119782A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009255190A JP2011098381A (ja) 2009-11-06 2009-11-06 ガラス繊維強化樹脂フィルムおよびその切断方法、ならびにガラス繊維強化樹脂パネルおよびその製造方法

Publications (1)

Publication Number Publication Date
TW201119782A true TW201119782A (en) 2011-06-16

Family

ID=43954595

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099137971A TW201119782A (en) 2009-11-06 2010-11-04 Glass-fiber-reinforced resin film and a method of cutting the same, glass-fiber-reinforced resin panel and a method of manufacturing the same

Country Status (4)

Country Link
JP (1) JP2011098381A (ja)
KR (1) KR20110050363A (ja)
CN (1) CN102049618A (ja)
TW (1) TW201119782A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI794192B (zh) * 2016-11-15 2023-03-01 日商維亞機械股份有限公司 基板的加工方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5889758B2 (ja) * 2012-09-19 2016-03-22 ビアメカニクス株式会社 レーザ加工方法
JPWO2016151776A1 (ja) * 2015-03-24 2017-04-27 三菱電機株式会社 レーザ加工方法、レーザ加工機、加工プログラム生成装置およびレーザ加工システム
US10804407B2 (en) 2016-05-12 2020-10-13 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus and stack processing apparatus
KR20190041306A (ko) * 2017-10-12 2019-04-22 주식회사 엘지화학 이종 소재 접합체의 제조방법
US11548099B2 (en) 2018-12-03 2023-01-10 Mitsubishi Electric Corporation Laser processing method and laser processing apparatus
CN113319450B (zh) * 2021-06-25 2022-03-18 深圳市华中通用技术有限公司 一种保护膜切割工艺及激光切割设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001239384A (ja) * 2000-02-25 2001-09-04 Nippon Sharyo Seizo Kaisha Ltd レーザ切断方法およびその装置
JP2006219569A (ja) * 2005-02-09 2006-08-24 Sumitomo Bakelite Co Ltd 透明複合シートの製造方法
JP2008080346A (ja) * 2006-09-26 2008-04-10 Sony Corp レーザ加工装置及び加工方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI794192B (zh) * 2016-11-15 2023-03-01 日商維亞機械股份有限公司 基板的加工方法

Also Published As

Publication number Publication date
KR20110050363A (ko) 2011-05-13
JP2011098381A (ja) 2011-05-19
CN102049618A (zh) 2011-05-11

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