TW201111113A - Grinding machine for plate-like bodies and method of grinding plate-like bodies - Google Patents
Grinding machine for plate-like bodies and method of grinding plate-like bodies Download PDFInfo
- Publication number
- TW201111113A TW201111113A TW99122190A TW99122190A TW201111113A TW 201111113 A TW201111113 A TW 201111113A TW 99122190 A TW99122190 A TW 99122190A TW 99122190 A TW99122190 A TW 99122190A TW 201111113 A TW201111113 A TW 201111113A
- Authority
- TW
- Taiwan
- Prior art keywords
- plate
- polishing
- glass substrate
- pad
- support pad
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
- B24B7/245—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass discontinuous
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009159537 | 2009-07-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201111113A true TW201111113A (en) | 2011-04-01 |
Family
ID=43429186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW99122190A TW201111113A (en) | 2009-07-06 | 2010-07-06 | Grinding machine for plate-like bodies and method of grinding plate-like bodies |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2011004764A1 (ko) |
KR (1) | KR20120033327A (ko) |
CN (1) | CN102548709A (ko) |
TW (1) | TW201111113A (ko) |
WO (1) | WO2011004764A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105397596A (zh) * | 2015-10-21 | 2016-03-16 | 无锡清杨机械制造有限公司 | 一种机械磨削设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0319758A (ja) * | 1989-06-16 | 1991-01-28 | Toshiba Corp | 研削方法 |
JP2000094308A (ja) * | 1998-09-22 | 2000-04-04 | Canon Inc | 矩形基板保持治具および矩形基板研磨方法 |
JP2004090119A (ja) * | 2002-08-30 | 2004-03-25 | Central Glass Co Ltd | 板状体の片面研磨装置および該装置に用いるバックパッドとその成形方法 |
CN100551624C (zh) * | 2005-01-31 | 2009-10-21 | 三芳化学工业股份有限公司 | 用以固定抛光基材的吸附片材及其制造方法及抛光装置 |
JP4862404B2 (ja) * | 2006-01-20 | 2012-01-25 | 旭硝子株式会社 | Fpd用ガラス基板の研磨方法及びその装置 |
JP4756709B2 (ja) * | 2007-10-16 | 2011-08-24 | Sdフューチャーテクノロジー株式会社 | 研磨装置 |
-
2010
- 2010-07-01 JP JP2011521899A patent/JPWO2011004764A1/ja not_active Withdrawn
- 2010-07-01 KR KR1020127000452A patent/KR20120033327A/ko not_active Application Discontinuation
- 2010-07-01 CN CN2010800301761A patent/CN102548709A/zh active Pending
- 2010-07-01 WO PCT/JP2010/061283 patent/WO2011004764A1/ja active Application Filing
- 2010-07-06 TW TW99122190A patent/TW201111113A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2011004764A1 (ja) | 2011-01-13 |
CN102548709A (zh) | 2012-07-04 |
KR20120033327A (ko) | 2012-04-06 |
JPWO2011004764A1 (ja) | 2012-12-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW303488B (ko) | ||
TW383262B (en) | Wafer polishing device and polishing method thereof | |
TWI443768B (zh) | A plate glass conveyance device and an exfoliating device | |
TWI353633B (ko) | ||
TW200819242A (en) | Carrier for double side polishing device, and double side polishing device and double side polishing method using the carrier | |
JP2001205549A (ja) | 基板エッジ部の片面研磨方法およびその装置 | |
JP4862404B2 (ja) | Fpd用ガラス基板の研磨方法及びその装置 | |
JP4756709B2 (ja) | 研磨装置 | |
TW201231175A (en) | Method and apparatus for manufacturing glass plates | |
JP2006346808A (ja) | 研磨パッド貼り付け方法及びワークの製造方法 | |
JP5316910B2 (ja) | 板状体の研磨装置及び板状体の研磨方法 | |
TW201111113A (en) | Grinding machine for plate-like bodies and method of grinding plate-like bodies | |
JPH1199458A (ja) | 板状部材角縁面取装置 | |
JP2000218482A (ja) | 枚葉式端面研磨機 | |
TW201829122A (zh) | 研磨裝置、及按壓研磨具之按壓墊 | |
JP2014213419A (ja) | ガラス板端面加工方法、および、ガラス板端面加工装置 | |
TW200830003A (en) | Apparatus for rubbing the alignment layer on a substrate | |
KR101040811B1 (ko) | 연마패드 압착장치 | |
JP2001198781A (ja) | 基板エッジ部の研磨方法およびその装置 | |
JP2007098542A (ja) | 両面研磨装置 | |
JPH09123050A (ja) | 半導体ウェ−ハの面取り面の鏡面研磨方法およびその装置 | |
JP2002210640A (ja) | ディスク基板の研磨方法 | |
JP5614723B2 (ja) | 研磨装置及び被研磨物の研磨方法 | |
TWM297810U (en) | Apparatus for precision linear polishing and grinding | |
JP2013151064A (ja) | 板状体の研磨装置及び板状体の研磨方法 |