TW201110402A - Workpiece handling system and method - Google Patents

Workpiece handling system and method Download PDF

Info

Publication number
TW201110402A
TW201110402A TW099119555A TW99119555A TW201110402A TW 201110402 A TW201110402 A TW 201110402A TW 099119555 A TW099119555 A TW 099119555A TW 99119555 A TW99119555 A TW 99119555A TW 201110402 A TW201110402 A TW 201110402A
Authority
TW
Taiwan
Prior art keywords
mask
workpiece
selective
chamber
rti
Prior art date
Application number
TW099119555A
Other languages
English (en)
Inventor
Benjamin B Riordon
Kevin M Daniels
William T Weaver
Charles T Carlson
Original Assignee
Varian Semiconductor Equipment
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Semiconductor Equipment filed Critical Varian Semiconductor Equipment
Publication of TW201110402A publication Critical patent/TW201110402A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/48Ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/20Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67213Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769Storage means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/022441Electrode arrangements specially adapted for back-contact solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • H01L31/0682Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2001Maintaining constant desired temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007Holding mechanisms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202Movement
    • H01J2237/20292Means for position and/or orientation registration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/204Means for introducing and/or outputting objects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/31701Ion implantation
    • H01J2237/31706Ion implantation characterised by the area treated
    • H01J2237/3171Ion implantation characterised by the area treated patterned
    • H01J2237/31711Ion implantation characterised by the area treated patterned using mask
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Analytical Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Sustainable Energy (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Respiratory Apparatuses And Protective Means (AREA)
  • Photovoltaic Devices (AREA)

Description

六、發明說明: 【發明所屬之技術領域】 本發明是關於工作件(workpiece)處理,且更明破而 言是關於工作件處理系統以及操作方法。 本申請案主張2009年6月16日申請之臨時專利申請 案第61/187,306號的權利,所述臨時專利申請案以引用的 方式併入本文。 【先前技術】 工作件處理系統一般將多個工作件引入至處理工具 之處理腔室(process chamber)中,自所述處理腔室移除 工作件,及在處理之後將所述工作件返回工作件載體 (carrier)。工作件在處理腔室中之處理通常在真空中執 行。處理工具可為離子植入機(i〇n implanter),其產生離 子且將離子引導至工作件之表面㈣於處置。離子植入機 可為射束線(beam line)離子植入機或電漿摻雜(plasma doping)離子植入機。射束線離子植入機包含離子源及萃 取電極(extraction electrode)總成(assembly)以自離子源萃 取良好界定之離子束。此項技術巾已知的—個或多個射束 線組件可控制及修改離子束,以獲得具有所要特性之離子 束,所述離子束朝向工作件的前表面引導。所述離子束可 藉由離子束移動、工作件移動或兩者之組合而跨越工作件 的前表面來分佈著。離子植人機亦可包含腔室中產生電漿 之已知電漿雜離子植人機。來自t漿之離子在特定時間 間隔期間躺工作件的前表面而被吸引。工作件亦定位在 201110402 電漿摻雜料獻狀腔室巾。對於任— 可包含(但不限於)太陽能電池(二: 丰導體基板、聚合物基板以及平坦面板。 由離子植入機處置之工作件可| (photoresistmask)以將工作件之選定部八^ 阻·,、罩 護其他部__響。雖=Γ且保 的,置製造過程添加了多個 本。製造過程(尤其是太陽能電池製 / =肖耗喊本衫要_)料柄任何 統 因此’需要―觀良之I作件處理系 【發明内容】 、根據本發明之第—態樣,提供—種工作 所述工作件處理系統包含:處理腔室支^ 第,,存於所述二 4且處於遮罩台中,以及機器人$統 所遮罩’且將所述第1罩 -選擇性植人。付 件經*所述第-遮罩而接收第 根據本發明之另一態樣,提供一 =:2存於處理腔室外部且處於遮樹:·自 所述遮罩台擷取所述第一谀w 定位在所述處理腔室中之 二 及經由糊H爾帛- s 6 201110402 現將參考如附圖中所示之例示性實施例更詳細猫述 本發明。雖然下文參考例示性實施例來描述本發明’但應 理解本發明不限於此。能夠使用本文之教示的熟習此項技 術者將認識到屬於如本文所述之本發明之範疇内的額外貫 施方案、修改及實施例以及其他使用領域,且本發明4關 於此等額外實施方案、修改及實施例以及其他使用領威而 具有顯著效用。 【實施方式】 為了更好理解本發明,參看隨附圖式,其中用相同數 字來參考相同元件。 圖1為工作件處理系統1〇〇之方塊圖,其具有處理腔 室114、儲存在處理腔室114外部且位於遮罩台(mask station) 170中之一個或多個遮罩172、174、176,以及機 器人系統(robot system) 106,所述機器人系統1〇6包含 一個或多個機器人,諸如第一真空機器人1〇2、第二真空 機器人104以及大氣機器人128。遮罩台no使得多種遮 罩172'174、176能夠儲存在其中且能夠由機器人系統1〇6 之相關聯的機器人來存取(access)。因此,工作件處理系統 1〇〇准許在取決於工作件的類型以及處理腔室114中對其 進行的所要的選擇性處置而選擇不同遮罩用於不同目的/中 的靈活性。儘管遮罩台170經圖解為處於第一承載室(1〇屺 lock) 116中,但遮罩台170可處於機器人系統1〇6之一個 或多個機器人可存取的另-位置。舉例而言,遮罩台17〇 可處於第二承載室117、工作件處理機腔室118、緩衝器腔 201110402 室120、或另一特定設計之腔室(諸如附接至工作件處理 機腔室118之-側的腔室1〇7)中。腔室1〇7可經由隔離 閥(未說明)而與工作件處理機腔室118連通。 —工作件處理系統⑽亦可包含緩衝H腔室120、承載 室116、117’以及工作件處理機腔室118。緩衝器腔室 ^處於或接近錢壓力,且提㈣控之低餘環境。緩衝 器腔室120可經由門(d〇〇r) 131而與工作件載體⑽介 接。工作件載體13G可為取決於工作件之標準化工作件載 體。工作件可包含(但不限於)太陽能電池、半導體基板、 聚合物基板卩及平㈣板。胁將半導 體基板’工作件載趙13〇可為前開口式通二器中= 叩ening unified P〇d ’ F0UP ),其為用於在製造設施中傳送 半導體基板之標準化紐。簡n腔室12G,村包含大氣 著軌道126而傳送工作件,且在晶圓載體 130與承載至116、117之間移動I作件。在另—例子中, _器腔室m可由㈣沿著帶子義卫作件之帶式系統 將工作件傳遞至承載室116、117之兩個掃描臂機 器人替換。 承載室116、in可分別經由隔離閥12卜122而與工 ^牛處理機腔室118連通。工作件處理機腔室ιΐ8可包含 第-真空機器人1G2、第二真空機器人1()4以及件對 準台105或定向器。 真空抽吸系統(未說明)控制不同腔室(其包含但不 限於承載室U6、117)中之壓力,言之,當藉由大氣機
S 8 201110402 器人128將工作件自緩衝器腔室12〇轉移至第一承載室 116時,第一承載室U6通風(vented)成緩衝器腔室12〇之 壓力(通常為大氣),其中隔離閥121關閉。接著,連接第 -承載室116與緩衝器腔室12〇之闕關閉,且所述承載室 腔室經真空抽吸至JL作件處理機腔室118的壓力。接著, 隔離閥121打開,且工作件與一個或多個遮罩172、⑺、 Π6可由第一真空機器人1〇2存取。 控制器112可為或包含通用電腦或通用電腦之網路, 其可經程式化以執行解的輸人/輸ώ功能。控制器亦 包含通信裝置、資料儲存裝置及軟體。控制器112可自使 用者介面系統及/或工作件處理系統刚之一個或多個电 _收信號’且可回應於其而控制工作件處理系統1〇〇之 在操作中’控制器112可控制工作件處理系統刚以 承載室m、in巾之-麵雜賴取I作件,且將盆 定位於處理腔室m之夾钳(damp) 115上。舉_/ 之第一真空機器人102可經由打開的隔離 =而自第-承載室116選擇I作件,且將其定位 以用於離子植入。對於離子之「毯覆式⑽ 無,子朝向工作件行進所界定之方向上將遮罩 牛之上游。對於選擇性植入,可將-個或多個 在172、174、176定位於工作件上游。舉例而言, 2 正在進行時,可能需要隨後選擇性植入,因 此第一真空機器人Κ)2可自此例子^定 201110402 116中之遮罩台no來選擇「遮罩A」172。在藉由工作件 對準台105來適當定向之後,第一機器人1〇2可將「遮罩 A」172定位於已處於夾鉗115上之工作件上游,使得可起 始經由此遮罩之非阻擋部分的選擇性植入。 轉至圖2A及圖2B,其說明與實施例一致的夾鉗總成 200的橫截面圖,其中起模頂桿(lift pin ) 202處於延伸(圖 2A)及完全收縮位置(圖2B)。為了促進工作件2〇6及/ 或遮罩172之插入及移除,起模頂桿2〇2可處於圖2八之 延伸位置。在離子經由遮罩172中之開口而撞擊工作件時 的處理期間’起模頂桿可處於圖2B之完全收縮位置。起 模頂桿202可在箭頭21〇之方向上延伸及收縮。 夾鉗總成2GG促進不同之工作件及遮罩組合被引入至 2 i15及自其移除’以及促進不同之工作件及遮罩組合 狀妹槿對2A所說明’起模頂桿202可具有階梯 二f ’其中母—起模了頁桿202之支架(shelf) 2〇4可將 ==之=分支樓在第—承載平面謂上。起模頂 載平面249刀界定用於諸如遮罩172之遮罩的第二承 使用具右⑹兩^不同承载平面24G、242准許(在需要時) pick)。、固τ端執行器(endeffeCt〇r)之雙拾取器(dual
Pick)或者’可利用 的兩個獨立機器人。在“人上二有早末4執灯器 兩者可在單一末端執行器上L鄰接。172與工作件206 件206之適m亦^含對準機構以確保遮罩172與工作 。遮罩172可具有參考夾鉗總成2〇〇之 201110402 另一部分的對準特徵。在圖2A及圖2B之實施例中,遮罩 172之對準特徵為與柱(PQSt) 214對準之⑽(aperture) L73 °^主214自夾鉗115之夾鉗表面217延伸。如圖2B所 不’當遮罩172適當對準時,柱214與遮罩之相關聯孔隙 17^對準。在與本發明一致之另一對準機構中,圖2B上之 ^影中所展示的在遮罩172之面對工作件綱之下侧上的 突=物(pr〇trusi〇n) 270可促進遮罩172與工作件2〇6之 適當對準。夾鉗總成2⑼亦固定該遮罩172與工作件200 之相對定細胁在處賴室114巾的纽。亦即,遮罩 172與工作件206在處理腔t 114巾-起以相同速率移動 而穿過離子。 在另失鉗總成貫施例中,單一階梯狀起模頂桿2〇2 =兩_立起模稱#代q提供—組越頂桿以將工 206支揮於第一承載平面上,且可提供第二組起模頂 杯以將遮罩172支撐於第二承載平面上。 遮罩台170可儲存有用於不同目的及植入圖案的不同 大士及形狀的一個或多個遮罩172、174、176。轉至圖3, ^疋說明朝向軒行進方向之下游的簡化的遮罩302之-^施例的圖。遮罩302亦可儲存於遮罩台170中且用於工 作件處理系統⑽巾。用陰影說明定位於料302下游之 306。此實例中之工作件3〇6可為選擇性發射極太 池且因而可稍後才再說明。遮罩302可由石墨或充 刀(且擋離子之另一材料製成。僅為了說明清晰性,將遮罩 說明為具有四個孔隙322、324、326、328。現實中, 201110402, 遮罩302可取決於孔隙之間的中心間距(center t〇 eentei> spacing) (XI)以及每一孔隙之寬度(Χ2)而具有更多孔 隙。在一實施例中,遮罩302可具有約2 _ 3毫米之中心 間距(XI)且每一孔隙可具有約150 - 700微米之寬度 (Χ2) ’從而准許對選擇性發射極太陽能電池3〇6進行選擇 性摻雜。 在第一離子植入步驟期間,遮罩302未處於工作件上 游以使得能夠在選擇性發射極太陽能電池工作件3〇6上執 行「毯覆式」植入,從而得到輕度摻雜之發射極區域。在 第二離子植入步驟期間,機器人系統1〇6可經由第一真空 機器人106而自遮罩台no榻取所要遮罩302,且將其定 位於選擇性發射極太陽能電池工作件306上游。可將此等 步驟顛倒,使得首先執行遮蔽式植入,且隨後執行「毯覆 式」植入。與次序無關,遮罩302阻擋離子撞擊輕度摻雜 之發射極區域的特定部分,同時允許離子撞擊具有由孔隙 322 ' 324、326、328界定之長度及寬度的細長部分。此等 重度摻雜區域之細長部分定位在稍後將添加選擇性發射極 太陽能電池之前側電觸點或「指狀物(finger)」之處的下 方。 、更特定地參看圖1及圖3,六個選擇性發射極太陽能 電池可以2 X 3矩陣而裝載至載體上’所述载體經設定大 小以载運所述選擇性發射極太陽能電池。可藉由大氣機器 人128將此载體裝載至第-承載室116中。諸如遮罩302 之遮罩可能已儲存於遮罩台170中。在一個例子中,第一
S 12 201110402 承载室116中之垂直儲存位置可交替儲存載體及遮罩。第 一真空機器人1〇2可自第一承載室116擷取載體,且在將 所述載體針對晶圓對準台1〇5而定向之後將所述载體定位 於處理腔室114中之夾鉗115上。載體上之六個選擇性發 射極太陽能電池可接著接收第一毯覆式離子植入。在毯覆 式植入正在進行時,第一機器人丨〇2可自遮罩台17〇擷取 ,如遮罩3G2之遮罩’絲後在毯覆式植人完成之後將其 定位於載體上游。此外,此等步驟之次序可顛倒。 接著,可經由遮罩302而執行選擇性植入以形成更多 重度掺雜區域。接著可藉由第二真空機ϋ人刚在相同時 間移除,罩302及固持六個選擇性發射極太陽能電池之載 體。接著可將_上經處置之選紐發射極太陽能電池定 位於第二承載室117中,同時可將遮罩3〇2返回至遮罩台 口0。隔離閥122可接著關閉,且第二承載室117通風成^ 緩衝器腔室12G相同之壓力(通f為大氣)。經處置之選擇 性發射極太陽能電池可接著由缝㈣人128練且定位 於工作件載體130中之一者中以用於未來傳送。 轉至圖4,其說明選擇性發射極太陽能電池400之橫 截面圖’所述選擇性發射極太陽能電池働可部分地與圖 1之工作件處理系統以及與圖3之遮罩3〇2 一致之 =製造。選擇性發射極太陽能電池4⑻具有輕度摻雜區域 及更重度摻雜區域47〇。輕度摻贿域43G可為η型區 域’其用以在ρ型基底44〇與輕度摻雜之η型區域之 間形成Ρ_η接面420。熟習此項技術者將認識到ρ型區域 13 201110402 與η型區域可顛倒。輕度摻雜區域43〇可藉由毯覆式植入 而形成,更重度摻雜區域470可藉由經由遮罩3〇2之孔隙 322、324、326、328進行選擇性植入而形成。置放於前側 觸點426之下的重度摻雜區域47〇 ?文良觸點似與太陽能 電池之間的傳導性因此,太陽能電池之效率亦得到改良。 轉至圖5,其說明朝向離子行進方向的下游的另一遮 罩502之一實施例的圖。遮罩5〇2為亦可儲存於遮罩台 甲且用於工作件處理系統卿中之遮罩的另一實例。定位 於此遮罩502下游之工作件可為指又背接觸(―邮⑽ baCkc_ct,IBC)太陽能電池。遮罩5〇2為有用於摻雜 me太陽能電池之不同區域的兩個遮罩中之一者。 b圖6為1BC太陽能電池600之橫截面圖,所述见仁太 陽能電池600可科地翻κι作件處理織以及與圖 5之遮罩5G2 一起製造而顯示。脱太陽能電池在此項技 術中為吾人所熟知,且具有彳嫌基板之底部表面上之金屬 觸點670。底部表面之特定部分可用p型摻雜劑植入以產 生發射極區域_。其他部分可用n型摻雜雜人以產生 更加負偏壓之背表面場(back surface field,BSF)區域 650。在操作中,第一遮罩可儲存於處理腔室ii4外部且在 遮罩σ 170中。機器人系統1〇6之機器人可擷取第一遮罩 將其疋位於IBC太陽能電池600上游。接著可使用η型 =雜劑以經由第-遮罩之雜擋部分喊行選擇性植入。 厶,第一遮罩之此選擇性植入可界定IBC太陽能電池6〇〇 之背表面場區域650。在經由第一遮罩之第一選擇性植入
S 14 201110402 w丨〆矗恳 正在進行時,機器人系統106可自遮罩台170擷取類似於 圖5之遮罩502之第二遮罩。第一遮罩可自處理腔室114 移除且返回至遮罩台170。同時,遮罩502可經擷取且定 位於IBC太陽能電池之上游。接著可執行經由遮罩5〇2而 使用p型摻雜劑之第二選擇性植入以形成發射極區域 640。使用兩種不同遮罩之此植入序列允許產生IBC:太陽 :電池所需之觸點圖案。形成背表面場區域65〇及發射極 區域640之次序亦可藉由首先形成發射極區域64〇且接著 形成背表面場區域650而顛倒。 工作件處理系統1 〇 〇之靈活性亦使得能夠連續或同時 使用兩個或兩個以上遮罩,從而達成原本可能僅使用一個 遮罩時極為困難或不可能達成之所要的植入圖案。舉例而 言,轉至圖7,其說明所要的植入圖案7〇2。若僅一個遮罩 經製造以提供圖7之所要的植入圖案7〇2,則可如圖8所 說明來定形遮罩802。不幸地,圖8之具有細長的窄部分 806之遮罩8〇2之形狀難以(若非不可能)藉由諸如石墨 之典型遮罩材料來製造。即使可能製造,此遮罩8〇2將容 易損壞且難以處理。 有利地’如圖9所說明,可藉由連續或同時使用第一 遮罩902及第二遮罩904來達成圖7之所要的植入圖案 ,從而達成所要的聚集選擇性植入圖案9〇6,其與圖^ 之所要的圖案702相同。與圖8之遮罩802相比,遮罩9〇2 及904不具有細長的窄部分,且更易於製造且較不易於在 處理時損壞。 15 201110402 砂置.人系統1G6可自遮罩台17G擷取第一 遮罩,且將所述第一遮罩902定位於工作件9〇1上游 以使用離子進行處置。第—遮罩9G2中之開口 922 22、923、924形成於工作件9〇1上。
罩搬接著可自其在工作件上游之位置移除,機器U 1〇6可自遮罩台170掏取第二遮罩904且將其定位於^作 件901之相同上游。第二遮罩9〇4中之開口 93〇、州、呢、 933准許另一填充圖案中所說明之摻雜區域94〇、941、 942、943形成於同-工作件9〇1上。以此方式經 遮罩902之第一選擇性植入及經由第二遮罩9〇4之第二選 擇性植入而共同提供所要的聚集選擇性植入圖案9〇6, 與圖7之所要的植入圖案7〇2相同。 八 、 遮罩台170可為儲存於其中之一個或多個遮罩額外提 供熱處置。此類熱處置幫助控制及使歸因於一個或多個遮 罩之熱膨脹而造成的變化最小化,因為所述遮罩在使用中 當離子撞擊遮罩時易於變熱。熱處置可包含冷卻、加熱或 兩者。 可藉由允許遮罩返回至遮罩台170以在再次使用之前 充分冷卻來提供被動冷卻(passive cooling)。舉例而十, 當遮罩台170經受諸如在承载室116、117中或在緩衝器腔 至120中之大氣條件時,僅暴露於大氣條件時易於冷卻遮 軍,因為熱里更谷易藉由周圍空氣而自遮罩傳導出去。主' 動冷卻(active cooling)可包含在遮罩台170中添加—個 16 201110402 或多個冷卻單元(未說明)以主動提供其它額外之冷卻。 額外冷卻單元可為氣體冷卻總成或冷卻台,其中低溫流體 經抽吸而經過冷卻台。可使用冷卻以在使用遮罩之前將所 述遮罩預冷卻至周圍溫度以下,或在其使用後使其自較高 溫度返回至約周圍溫度。 如圖ίο所說明’遮罩台170亦可提供一個或多個遮 罩之加熱。類似於冷卻,可加熱一個或多個遮罩以便使遮 罩之歸因於熱膨脹之變化被最小化。在一個實施例中,加 熱器1004可經定位於接近遮罩174以提供對遮罩之主動加 熱。加熱器1004可經實施為位於遮罩上方之加熱表面。加 熱器1004亦可位於遮罩下方或接近遮罩之任何位置以提 供所要的熱量。加熱器1004可提供額外的熱量至遮罩 !J4’j最小化所述遮罩174之輻射冷卻或將遮罩加熱至預 定的高溫顧。此外,諸如遮罩172之_鮮可定位於 非熱傳導襯墊(n〇n_thermally c〇nductive pad ) 1 上且無 需任何加熱器來加熱該遮罩172。非熱傳導襯墊職^ 化該遮罩172之熱損失。 取』 因此,提供一種工作件處理系統,其提供選 ^不同料以用於不同目的之訪性。可實施具有一^ ir二γιγ工作流程。因此啟用了快速製程的 遮罩之現有離子理系統可容易適用於未裝備有任何 令之任何料。因此’離子植人機之產量並未受到進 17 201110402 行中的遮罩檢查或遮罩更換的不利影響。舉例而言,在一 個實施例中,可將視窗(window)置放於腔室1〇7上以提 供視覺遮罩檢查。亦可進行其他類型之遮罩檢查。 本發明在範缚上並不限於本文所述之特定實施例。實 際上,除了本文所述之實施例以外,熟習此項技術者將根 據以上描述及附圖而顯而易見本發明之其他各種實施例及 =改。因此,此類其他實施例及修改意欲屬於本發明之範 w此外,儘管本文已為特定目的而在特定環境中之特定 實,方案之情況下描述本發明,但熟習此項技術者將認識 至1發明之有用性並不限於此,且本發明可有益地實施於 任何數目之環境中用於任何數目之目的。因此,下文所陳 利範嶋於本文所述之本發明之完整範圍及 【圖式簡單說明】 圖。圖1為根據本發明之實施例之工作件處理系統的方塊 圖2A為根據本發明之實》 圖,其中起模頂桿處於升高位置。夾甜、、息成的松截面 縮位置圖。2B為圖从之夾鉗總成的圖,其中起模頂捍處於收 遮罩=為可用於圖1之工作件處理系統中之一種類型的 能電之遮罩而製造的選擇性發射極太陽 201110402 ^f-ry-ryjuix 圖5為可用於圖1之工作件處理系統中之另一類型的 遮罩的圖。 圖6為可使用圖5之遮罩而製造的指叉背接觸太陽能 電池的橫截面圖。 圖7為所要的植入區域圖案的圖。 圖8為將提供圖7之所要的植入區域圖案但極難以製 造的一種遮罩的圖。 圖9為可一起提供圖7的所要的植入區域圖案之兩個 遮罩的圖。 圖10為具有加熱器之遮罩台的方塊圖。 【主要元件符號說明】 100 :工作件處理系統 102 :第一真空機器人 104 :第二真空機器人 105 :工作件對準台 106 :機器人系統 107 :腔室 112 :控制器 114 :處理腔室 115 :夾钳 116 :第一承載室 117 :第二承載室 118 :工作件處理機腔室 120 :緩衝器腔室 19 201110402 121 :隔離閥 122 :隔離閥 126 :軌道 128 :大氣機器人 130 :工作件載體 131 :門 170 :遮罩台 172 :遮罩 173 :孔隙 174 :遮罩 176 :遮罩 200 :夾鉗總成 202 :起模頂桿 204 :支架 206 :工作件 210 :箭頭 214 :柱 217 :夾鉗表面 240 :第一承載平面 242 :第二承載平面 270 :突出物 302 :遮罩 306 :工作件 322 :孔隙 201110402 324 :孔隙 326 :孔隙 328 :孔隙 400 :選擇性發射極太陽能電池 420 : p-n 接面 426 :觸點 430 :輕度摻雜區域/η型區域 440 : ρ型基底 470 :重度摻雜區域 502 :遮罩 600 :指叉背接觸(IBC)太陽能電池 640 :發射極區域 650 :背表面場(BSF)區域 670 :金屬觸點 702 :所要的植入圖案 802 :遮罩 806 :細長的窄部分 901 :工作件 902 :第一遮罩 904 :第二遮罩 906 :所要的聚集選擇性植入圖案 910 :開口 911 :開口 912 :開口 21 201110402 913 開口 914 開口 920 掺雜區域 921 摻雜區域 922 摻雜區域 923 掺雜區域 924 摻雜區域 930 開口 931 開口 932 開口 933 開口 940 摻雜區域 941 摻雜區域 942 摻雜區域 943 :摻雜區域 1002 :非熱傳導襯墊 1004 :加熱器 22

Claims (1)

  1. 201110402 七、申請專利範園: 1. 一種工作件處理系統,其包括: 於遮罩台 中;以及 ’其經組態"^撐工作件用於離子植入 第遮罩,其館存於所述處理腔室外部且處 、挣蓄機自所述遮罩㈣取所述第一 、:所述帛-料粒㈣駐作件之 所述工作件經由所述第—遮罩而接收第-選擇性植入 =根射請專利範圍第1項所述之I作件處理系 更包料齡腔室,且其帽述鮮台定位於所述 承載室腔室中。 3.根據申請專利範圍第〗項所述之工作件處理系 統,更包括夾鉗總成,其定位於所述處理腔室中以支撐所 述工作件用於離子植入,所述夾鉗總成包括: 夾鉗,其具有夾钳表面以支撐所述工作件;以及 兩個可收縮起模頂桿,其在延伸位置中自所述夾鉗表 面延伸,所述兩個可收縮起模頂桿界定第一平面以支撐所 述工作件以及界定第二平面以在所述延伸位置中支撐所述 第一遮罩。 4.根據申请專利範圍第3項所述之工作件處理系 統’其中所述夾鉗總成更包括自所述夾鉗之所述夾钳表面 延伸之柱’所述柱經設定大小以嚙合所述第一遮罩中之相 關聯孔隙,從而在所述兩個可收縮起模頂桿收縮至收縮位 置時促進所述第一遮罩與所述工作件之對準。 23 201110402 5·根據申請專利範圍第1項所述之工作件處理系 統’更包括儲存於所述處_室外部且處於所述遮罩台中 之第二遮罩’且其中所述機器人系統經進一步組態以操取 所述第二遮罩,騎述第二遮罩定位於所述工作件上游, 使得所述X作件經由所述第二遮罩而接收第二選擇性植 入,其中所述第-選擇性植人以及所述第二選擇性植入— 起提供所要的聚集選擇性植入圖案。 6.根據申請專利㈣第丨項所述之工作件處理 :’其中所述遮罩台包括多個非熱料襯細在所述第二 遮罩儲存於所述遮罩台處時支禮所述第一遮罩。 纪1·㈣中請專利1顧述之j:•作件處理系 二,其中所述遮罩台包括加熱器以在所述第—遮罩儲存於 所述遮罩台處時加熱所述第一遮罩。 ; 8.根據中請專利_第1項所述之工作件處理糸 r其中所述遮罩台包括冷卻單元以在所述第一= 於所述遮罩台處時冷卻所述第一遮罩。 逻罩儲存 9· 一種方法,其包括: 將第一遮罩儲存於處理腔室外部且處於遮罩台中. 自所述遮罩台擷取所述第一遮罩; 工作在所述處理腔室中之 經由所述第-鮮執行第—選擇性植入。 在執二第9項所述之方法,其更包括 所这第選擇性植入之後將所述第-遮罩返回至所 €\ 24 述遮罩台。 u·根據申請專利範圍第9項所述之方法,更包括: 將第一遮罩儲存於所述遮罩台中; 自所述遮罩台擷取所述第二遮罩; 將所述第二遮罩定位於已定位在所述處理腔室中之 所述工作件上游以用於離子植入;以及 經由所述第二遮罩而執行第二選擇性植入,其中所述 第一選擇性植入以及所述第二選擇性植入一起提供所要的 聚集選擇性植入圖案。 12. 根據申清專利範圍第11項所述之方法,其中所述 第一遮罩以及所述第二遮罩兩者同時定位於所述工作件之 上游。 13. 根據申請專利範圍第n項所述之方法,其中所述 第一遮罩以及所述第二遮罩連續定位於所述工作件之上 游0 M.根據申請專利範圍第9項所述之方法,其中所述 工作件包括選雜發射極太陽㈣池,且所述第—選擇性 植入將離子植人至所述選擇性發射極太陽能電池之細長部 分中’以形歧位於所騎雜魏極太陽能電池之前側 觸點下方的具有長如及寬度之重度掺雜區域。 15.根據申請專利範圍第14項所述之方法,其 藉由不受所述第-鮮畴之毯覆式植人來植人所述 性發射極太陽能電池,所述毯覆式植人在 發^ 極太陽能電池中提供p_n接面。 發射 201110402 16.根據申請專利範圍第9項所述之方法,其中所述 工作件包括指又背接觸(IBC)太陽能電池,且所述第一 選擇性植人將離子植人至所述IBC太陽能電池之部分中以 形成η型摻雜劑之背表面場區域。 17·根據中請專利範圍第16項所述之方法,更包括: 自所述遮罩台擷取第二遮罩; 將所述第二遮罩定位於已定位在 所述工作件上游以用於離子植入;以及 至中之 始姑 弟一%早㈣行第二選擇性植入以將離子 入入至所述IBC太陽能電池之其他部分巾,以 型摻雜劑之發射極區域。 ^ ί 18.根據申請專利範圍第9項所述之方法, I所述第—遮#位於所述遮罩台中之多個非熱傳導^ 在所述遮罩台中冷所述之方法,其更包括 26
TW099119555A 2009-06-16 2010-06-15 Workpiece handling system and method TW201110402A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US18730609P 2009-06-16 2009-06-16
US12/814,748 US20110027463A1 (en) 2009-06-16 2010-06-14 Workpiece handling system

Publications (1)

Publication Number Publication Date
TW201110402A true TW201110402A (en) 2011-03-16

Family

ID=43357011

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099119555A TW201110402A (en) 2009-06-16 2010-06-15 Workpiece handling system and method

Country Status (7)

Country Link
US (1) US20110027463A1 (zh)
EP (1) EP2443646A2 (zh)
JP (1) JP2012530381A (zh)
KR (1) KR20120031171A (zh)
CN (1) CN102439693B (zh)
TW (1) TW201110402A (zh)
WO (1) WO2010147997A2 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8101927B2 (en) * 2009-06-08 2012-01-24 Varian Semiconductor Equipment Associates, Inc. Masking apparatus for an ion implanter
US8749053B2 (en) 2009-06-23 2014-06-10 Intevac, Inc. Plasma grid implant system for use in solar cell fabrications
EP2534674B1 (en) * 2010-02-09 2016-04-06 Intevac, Inc. An adjustable shadow mask assembly for use in solar cell fabrications
KR101539153B1 (ko) * 2010-12-14 2015-07-23 가부시키가이샤 니콘 노광 방법 및 노광 장치, 그리고 디바이스 제조 방법
US8242005B1 (en) 2011-01-24 2012-08-14 Varian Semiconductor Equipment Associates, Inc. Using multiple masks to form independent features on a workpiece
US8658458B2 (en) * 2011-06-15 2014-02-25 Varian Semiconductor Equipment Associates, Inc. Patterned doping for polysilicon emitter solar cells
US9437392B2 (en) * 2011-11-02 2016-09-06 Varian Semiconductor Equipment Associates, Inc. High-throughput ion implanter
JP6068491B2 (ja) 2011-11-08 2017-01-25 インテヴァック インコーポレイテッド 基板処理システムおよび基板処理方法
JP5892802B2 (ja) * 2012-02-09 2016-03-23 住友重機械工業株式会社 イオン注入方法、搬送容器及びイオン注入装置
KR101948206B1 (ko) * 2012-03-02 2019-02-14 인텔렉츄얼 키스톤 테크놀로지 엘엘씨 태양 전지와, 이의 제조 방법
US20140037858A1 (en) * 2012-07-31 2014-02-06 Varian Semiconductor Equipment Associates, Inc. Anisotropic surface energy modulation by ion implantation
US10446710B2 (en) * 2012-12-13 2019-10-15 Varian Semiconductor Equipment Associates, Inc. Transfer chamber and method of using a transfer chamber
WO2014100506A1 (en) 2012-12-19 2014-06-26 Intevac, Inc. Grid for plasma ion implant
KR101613843B1 (ko) * 2013-04-23 2016-04-20 엘지전자 주식회사 태양 전지 및 이의 제조 방법
CN103605366A (zh) * 2013-11-21 2014-02-26 福州大学 移动机器人的图形化控制组态方法
FR3013971B1 (fr) * 2013-12-04 2015-11-20 Oreal Compositions de vernis photoreticulables a titre de revetement de base et procedes d'application
CN107710423B (zh) * 2015-07-15 2021-01-12 瓦里安半导体设备公司 处理工件的方法
JP7129888B2 (ja) * 2018-11-07 2022-09-02 東京エレクトロン株式会社 成膜方法及び半導体製造装置
US20200411342A1 (en) * 2019-06-27 2020-12-31 Applied Materials, Inc. Beamline architecture with integrated plasma processing

Family Cites Families (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2770049A (en) * 1954-01-28 1956-11-13 Harry E Wimpfheimer Apparatus for pre-positioning printing plates
US5696402A (en) * 1965-09-28 1997-12-09 Li; Chou H. Integrated circuit device
US3661759A (en) * 1970-02-19 1972-05-09 Varian Associates Vacuum coating apparatus having means for positioning one of a plurality of members at a selected location between the substrate and the coating material source
US3790412A (en) * 1972-04-07 1974-02-05 Bell Telephone Labor Inc Method of reducing the effects of particle impingement on shadow masks
USRE31151E (en) * 1980-04-07 1983-02-15 Inexpensive solar cell and method therefor
US4372248A (en) * 1981-09-21 1983-02-08 Applied Magnetics-Magnetic Head Division Corporation Apparatus for accurately registering a member and a substrate in an interdependent relationship
US4478879A (en) * 1983-02-10 1984-10-23 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Screen printed interdigitated back contact solar cell
US4549843A (en) * 1983-03-15 1985-10-29 Micronix Partners Mask loading apparatus, method and cassette
JPS6215864A (ja) * 1985-07-15 1987-01-24 Hitachi Ltd 太陽電池の製造方法
DE3623891A1 (de) * 1986-07-15 1988-01-28 Siemens Ag Anordnung zur genauen gegenseitigen ausrichtung einer maske und einer halbleiterscheibe in einem lithographiegeraet und verfahren zu ihrem betrieb
JPH025353A (ja) * 1988-06-15 1990-01-10 Teru Barian Kk イオン注入装置
US5087486A (en) * 1989-04-19 1992-02-11 Progressive Blasting Systems, Inc. Method and apparatus for blasting parts
JP3159583B2 (ja) * 1993-11-10 2001-04-23 シャープ株式会社 太陽電池およびその製造方法
US5707485A (en) * 1995-12-20 1998-01-13 Micron Technology, Inc. Method and apparatus for facilitating removal of material from the backside of wafers via a plasma etch
US6628391B2 (en) * 1996-02-26 2003-09-30 Rex Hoover Method for aligning two objects
JPH1060624A (ja) * 1996-08-20 1998-03-03 Matsushita Electric Ind Co Ltd スパッタリング装置
JP4363694B2 (ja) * 1998-04-17 2009-11-11 株式会社東芝 イオン注入装置および半導体装置の製造方法
US6110278A (en) * 1998-08-10 2000-08-29 Saxena; Arjun N. Methods for and products of growth of single-crystal on arrayed nucleation sites (SCANS) defined in nucleation unfriendly substrates
US6168668B1 (en) * 1998-11-25 2001-01-02 Applied Materials, Inc. Shadow ring and guide for supporting the shadow ring in a chamber
JP3947374B2 (ja) * 2000-08-25 2007-07-18 エーエスエムエル ネザーランズ ビー.ブイ. 平板投影装置および素子製造方法
JP2002164556A (ja) * 2000-11-27 2002-06-07 Kyocera Corp 裏面電極型太陽電池素子
JP4252237B2 (ja) * 2000-12-06 2009-04-08 株式会社アルバック イオン注入装置およびイオン注入方法
JP2003173958A (ja) * 2001-12-06 2003-06-20 Nikon Corp 露光方法及び露光装置
US6610123B2 (en) * 2001-12-17 2003-08-26 Intel Corporation Filtered mask enclosure
US6806006B2 (en) * 2002-07-15 2004-10-19 International Business Machines Corporation Integrated cooling substrate for extreme ultraviolet reticle
JP2004207571A (ja) * 2002-12-26 2004-07-22 Toshiba Corp 半導体装置の製造方法、半導体製造装置及びステンシルマスク
CN100382246C (zh) * 2003-04-25 2008-04-16 住友电气工业株式会社 半导体装置的制造方法
JP4447872B2 (ja) * 2003-09-17 2010-04-07 キヤノン株式会社 ステージ装置、該ステージ装置を用いた露光装置および該露光装置を用いたデバイス製造方法
JP2006100706A (ja) * 2004-09-30 2006-04-13 Tokyo Seimitsu Co Ltd 電子線露光装置
JP4609756B2 (ja) * 2005-02-23 2011-01-12 三井造船株式会社 成膜装置のマスク位置合わせ機構および成膜装置
US20060258128A1 (en) * 2005-03-09 2006-11-16 Peter Nunan Methods and apparatus for enabling multiple process steps on a single substrate
JP2006302528A (ja) * 2005-04-15 2006-11-02 Ulvac Japan Ltd イオン注入装置及びイオン注入方法
TWI312029B (en) * 2005-06-23 2009-07-11 Honda Motor Co Ltd Fuel feed system of engine
JP4667140B2 (ja) * 2005-06-30 2011-04-06 キヤノン株式会社 露光装置およびデバイス製造方法
US20080075563A1 (en) * 2006-09-27 2008-03-27 Mclane James R Substrate handling system and method
US7820460B2 (en) * 2007-09-07 2010-10-26 Varian Semiconductor Equipment Associates, Inc. Patterned assembly for manufacturing a solar cell and a method thereof
US7727866B2 (en) * 2008-03-05 2010-06-01 Varian Semiconductor Equipment Associates, Inc. Use of chained implants in solar cells
KR20110042051A (ko) * 2008-06-11 2011-04-22 솔라 임플란트 테크놀로지스 아이엔씨. 주입을 사용하여 솔라 셀의 제작
US8202789B2 (en) * 2008-09-10 2012-06-19 Varian Semiconductor Equipment Associates, Inc. Implanting a solar cell substrate using a mask
US7816239B2 (en) * 2008-11-20 2010-10-19 Varian Semiconductor Equipment Associates, Inc. Technique for manufacturing a solar cell
JP2010126748A (ja) * 2008-11-26 2010-06-10 Canon Anelva Corp マスク位置合わせ装置及び基板処理装置
US9076914B2 (en) * 2009-04-08 2015-07-07 Varian Semiconductor Equipment Associates, Inc. Techniques for processing a substrate
US8900982B2 (en) * 2009-04-08 2014-12-02 Varian Semiconductor Equipment Associates, Inc. Techniques for processing a substrate
US9006688B2 (en) * 2009-04-08 2015-04-14 Varian Semiconductor Equipment Associates, Inc. Techniques for processing a substrate using a mask
US8330128B2 (en) * 2009-04-17 2012-12-11 Varian Semiconductor Equipment Associates, Inc. Implant mask with moveable hinged mask segments
US9000446B2 (en) * 2009-05-22 2015-04-07 Varian Semiconductor Equipment Associates, Inc. Techniques for processing a substrate
US8008176B2 (en) * 2009-08-11 2011-08-30 Varian Semiconductor Equipment Associates, Inc. Masked ion implant with fast-slow scan
US8173527B2 (en) * 2009-10-19 2012-05-08 Varian Semiconductor Equipment Associates, Inc. Stepped masking for patterned implantation
US8461030B2 (en) * 2009-11-17 2013-06-11 Varian Semiconductor Equipment Associates, Inc. Apparatus and method for controllably implanting workpieces
US8912082B2 (en) * 2010-03-25 2014-12-16 Varian Semiconductor Equipment Associates, Inc. Implant alignment through a mask
US20110320030A1 (en) * 2010-06-25 2011-12-29 Varian Semiconductor Equipment Associates, Inc. Thermal Control of a Proximity Mask and Wafer During Ion Implantation
US8242005B1 (en) * 2011-01-24 2012-08-14 Varian Semiconductor Equipment Associates, Inc. Using multiple masks to form independent features on a workpiece
US8658458B2 (en) * 2011-06-15 2014-02-25 Varian Semiconductor Equipment Associates, Inc. Patterned doping for polysilicon emitter solar cells
US8372737B1 (en) * 2011-06-28 2013-02-12 Varian Semiconductor Equipment Associates, Inc. Use of a shadow mask and a soft mask for aligned implants in solar cells
US8697559B2 (en) * 2011-07-07 2014-04-15 Varian Semiconductor Equipment Associates, Inc. Use of ion beam tails to manufacture a workpiece
US9333733B2 (en) * 2013-07-26 2016-05-10 Varian Semiconductor Equipment Associates, Inc. Multi-part mask for implanting workpieces
US9490153B2 (en) * 2013-07-26 2016-11-08 Varian Semiconductor Equipment Associates, Inc. Mechanical alignment of substrates to a mask

Also Published As

Publication number Publication date
JP2012530381A (ja) 2012-11-29
US20110027463A1 (en) 2011-02-03
CN102439693B (zh) 2015-01-21
CN102439693A (zh) 2012-05-02
KR20120031171A (ko) 2012-03-30
WO2010147997A3 (en) 2011-07-28
WO2010147997A2 (en) 2010-12-23
EP2443646A2 (en) 2012-04-25

Similar Documents

Publication Publication Date Title
TW201110402A (en) Workpiece handling system and method
JP6599374B2 (ja) 高処理能力の加熱イオン注入システムおよび方法
US8328494B2 (en) In vacuum optical wafer heater for cryogenic processing
KR101817185B1 (ko) 피가공재 상의 응축을 방지하기 위한 능동형 이슬점 감지 및 로드록 배기
KR102055681B1 (ko) 불활성 대기 압력 예냉 및 후열처리
US20080044257A1 (en) Techniques for temperature-controlled ion implantation
US20080042078A1 (en) Techniques for temperature-controlled ion implantation
WO2010120765A2 (en) Implant mask with moveable mask segments
CN104364890A (zh) 工件承载件
TW201212156A (en) Heated annulus chuck
TW201042712A (en) Shorten temperature recovery time of low temperature ion implantation
CN105981152A (zh) 用于大温度范围夹盘的多流体冷却系统
JP2012057211A (ja) 金属リングの移動機構及びその移動方法
US7977652B2 (en) Optical heater for cryogenic ion implanter surface regeneration
US20090226283A1 (en) Method For Separating Wafers From A Stack Of Wafers
CN108604619A (zh) 用于处理太阳能电池基板的设备、用于处理太阳能电池基板的系统和用于处理太阳能电池基板的方法
CN104011826A (zh) 高产率离子植入机
TWI633570B (zh) 離子植入系統以及將離子植入工件的方法
CN102169816B (zh) 一种超浅结深紫外激光退火设备中的屏蔽电极装置
CN105977123A (zh) 一种SiC注入机传片系统及其传片方法
CN103123905A (zh) 快速热处理设备及方法