TW201100690A - Gas supply unit and gas supply device - Google Patents
Gas supply unit and gas supply device Download PDFInfo
- Publication number
- TW201100690A TW201100690A TW099121344A TW99121344A TW201100690A TW 201100690 A TW201100690 A TW 201100690A TW 099121344 A TW099121344 A TW 099121344A TW 99121344 A TW99121344 A TW 99121344A TW 201100690 A TW201100690 A TW 201100690A
- Authority
- TW
- Taiwan
- Prior art keywords
- flow path
- valve
- opening
- block
- mounting surface
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Valve Housings (AREA)
- Details Of Valves (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009155901 | 2009-06-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201100690A true TW201100690A (en) | 2011-01-01 |
Family
ID=43389895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099121344A TW201100690A (en) | 2009-06-30 | 2010-06-29 | Gas supply unit and gas supply device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5274518B2 (ja) |
KR (1) | KR101737117B1 (ja) |
CN (1) | CN101936409B (ja) |
TW (1) | TW201100690A (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI651486B (zh) * | 2013-12-05 | 2019-02-21 | Ckd股份有限公司 | 流體供給控制裝置 |
JP6346550B2 (ja) * | 2013-12-05 | 2018-06-20 | Ckd株式会社 | 流体供給制御装置 |
JP6751552B2 (ja) * | 2015-06-04 | 2020-09-09 | サーパス工業株式会社 | 流体機器 |
CN110494686A (zh) * | 2017-03-28 | 2019-11-22 | 株式会社富士金 | 接头块和使用该接头块的流体控制装置 |
KR102543187B1 (ko) | 2018-11-09 | 2023-06-15 | 삼성전자주식회사 | 밸브 장치 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0332858Y2 (ja) * | 1987-01-12 | 1991-07-11 | ||
JP2000035148A (ja) * | 1998-07-22 | 2000-02-02 | Hitachi Metals Ltd | 集積形流体制御装置 |
JP4244254B2 (ja) * | 1999-04-30 | 2009-03-25 | 株式会社キッツエスシーティー | 集積化ガス制御装置 |
JP4487135B2 (ja) * | 2001-03-05 | 2010-06-23 | 東京エレクトロン株式会社 | 流体制御装置 |
JP2004340199A (ja) * | 2003-05-14 | 2004-12-02 | Fujikin Inc | 加熱装置付き流体制御装置 |
JP2006009969A (ja) * | 2004-06-25 | 2006-01-12 | Kitz Sct:Kk | 集積化ガス制御装置用流路ブロックとその製造方法並びに集積化ガス制御装置 |
JP2008014390A (ja) * | 2006-07-05 | 2008-01-24 | Hitachi Metals Ltd | 集積形流体制御装置 |
-
2010
- 2010-06-25 JP JP2010144480A patent/JP5274518B2/ja active Active
- 2010-06-28 CN CN201010216247.9A patent/CN101936409B/zh not_active Expired - Fee Related
- 2010-06-29 TW TW099121344A patent/TW201100690A/zh unknown
- 2010-06-29 KR KR1020100061606A patent/KR101737117B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20110001938A (ko) | 2011-01-06 |
CN101936409B (zh) | 2014-05-28 |
JP5274518B2 (ja) | 2013-08-28 |
CN101936409A (zh) | 2011-01-05 |
JP2011027259A (ja) | 2011-02-10 |
KR101737117B1 (ko) | 2017-05-17 |
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