TW201100690A - Gas supply unit and gas supply device - Google Patents

Gas supply unit and gas supply device Download PDF

Info

Publication number
TW201100690A
TW201100690A TW099121344A TW99121344A TW201100690A TW 201100690 A TW201100690 A TW 201100690A TW 099121344 A TW099121344 A TW 099121344A TW 99121344 A TW99121344 A TW 99121344A TW 201100690 A TW201100690 A TW 201100690A
Authority
TW
Taiwan
Prior art keywords
flow path
valve
opening
block
mounting surface
Prior art date
Application number
TW099121344A
Other languages
English (en)
Chinese (zh)
Inventor
Takashi Inoue
Keisuke Kato
Nario Nishida
Toshiichi Miwa
Original Assignee
Ckd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Corp filed Critical Ckd Corp
Publication of TW201100690A publication Critical patent/TW201100690A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45565Shower nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Valve Housings (AREA)
  • Details Of Valves (AREA)
TW099121344A 2009-06-30 2010-06-29 Gas supply unit and gas supply device TW201100690A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009155901 2009-06-30

Publications (1)

Publication Number Publication Date
TW201100690A true TW201100690A (en) 2011-01-01

Family

ID=43389895

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099121344A TW201100690A (en) 2009-06-30 2010-06-29 Gas supply unit and gas supply device

Country Status (4)

Country Link
JP (1) JP5274518B2 (ja)
KR (1) KR101737117B1 (ja)
CN (1) CN101936409B (ja)
TW (1) TW201100690A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651486B (zh) * 2013-12-05 2019-02-21 Ckd股份有限公司 流體供給控制裝置
JP6346550B2 (ja) * 2013-12-05 2018-06-20 Ckd株式会社 流体供給制御装置
JP6751552B2 (ja) * 2015-06-04 2020-09-09 サーパス工業株式会社 流体機器
CN110494686A (zh) * 2017-03-28 2019-11-22 株式会社富士金 接头块和使用该接头块的流体控制装置
KR102543187B1 (ko) 2018-11-09 2023-06-15 삼성전자주식회사 밸브 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0332858Y2 (ja) * 1987-01-12 1991-07-11
JP2000035148A (ja) * 1998-07-22 2000-02-02 Hitachi Metals Ltd 集積形流体制御装置
JP4244254B2 (ja) * 1999-04-30 2009-03-25 株式会社キッツエスシーティー 集積化ガス制御装置
JP4487135B2 (ja) * 2001-03-05 2010-06-23 東京エレクトロン株式会社 流体制御装置
JP2004340199A (ja) * 2003-05-14 2004-12-02 Fujikin Inc 加熱装置付き流体制御装置
JP2006009969A (ja) * 2004-06-25 2006-01-12 Kitz Sct:Kk 集積化ガス制御装置用流路ブロックとその製造方法並びに集積化ガス制御装置
JP2008014390A (ja) * 2006-07-05 2008-01-24 Hitachi Metals Ltd 集積形流体制御装置

Also Published As

Publication number Publication date
KR20110001938A (ko) 2011-01-06
CN101936409B (zh) 2014-05-28
JP5274518B2 (ja) 2013-08-28
CN101936409A (zh) 2011-01-05
JP2011027259A (ja) 2011-02-10
KR101737117B1 (ko) 2017-05-17

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