TW201039957A - Force reaction compensation system - Google Patents

Force reaction compensation system Download PDF

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Publication number
TW201039957A
TW201039957A TW099105848A TW99105848A TW201039957A TW 201039957 A TW201039957 A TW 201039957A TW 099105848 A TW099105848 A TW 099105848A TW 99105848 A TW99105848 A TW 99105848A TW 201039957 A TW201039957 A TW 201039957A
Authority
TW
Taiwan
Prior art keywords
motor
platform
force
laser
motors
Prior art date
Application number
TW099105848A
Other languages
English (en)
Chinese (zh)
Inventor
Mark T Kosmowski
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW201039957A publication Critical patent/TW201039957A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Machine Tool Units (AREA)
  • Control Of Position Or Direction (AREA)
TW099105848A 2009-03-27 2010-03-01 Force reaction compensation system TW201039957A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16438209P 2009-03-27 2009-03-27
US12/510,630 US8735774B2 (en) 2009-03-27 2009-07-28 Force reaction compensation system

Publications (1)

Publication Number Publication Date
TW201039957A true TW201039957A (en) 2010-11-16

Family

ID=42781748

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099105848A TW201039957A (en) 2009-03-27 2010-03-01 Force reaction compensation system

Country Status (6)

Country Link
US (1) US8735774B2 (enExample)
JP (1) JP5718894B2 (enExample)
KR (1) KR20120002603A (enExample)
CN (1) CN102349147A (enExample)
TW (1) TW201039957A (enExample)
WO (1) WO2010110990A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616269B (zh) * 2016-08-01 2018-03-01 Reaction force elimination platform device

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JP2014229787A (ja) * 2013-05-23 2014-12-08 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP6308852B2 (ja) * 2014-04-15 2018-04-11 キヤノン株式会社 駆動装置、リソグラフィ装置、および物品の製造方法
NL2014487A (en) * 2014-04-17 2015-11-02 Asml Netherlands Bv Lithographic Apparatus and Device Manufacturing Method.
US10374530B2 (en) 2017-02-21 2019-08-06 Invetech, Inc. Dual-axis linear motion system
WO2018156663A1 (en) 2017-02-21 2018-08-30 Invetech, Inc. Single-axis linear motion system
KR102449594B1 (ko) 2017-09-04 2022-10-04 에이에스엠엘 네델란즈 비.브이. 전자 빔 검사 장치 스테이지 위치설정
DE102018122717A1 (de) * 2018-09-17 2020-03-19 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zur schneidenden Bearbeitung von Rohren in einer Laserrohrschneidmaschine sowie Laserrohrschneidmaschine
NL2022539B1 (en) * 2019-02-08 2020-08-19 Dutch United Instr B V Positioning system for positioning an object
US11209373B2 (en) 2019-06-21 2021-12-28 Kla Corporation Six degree of freedom workpiece stage
CN110711958B (zh) * 2019-11-15 2021-11-02 安徽同兴科技发展有限责任公司 抗扰度高精密直线电机驱动的激光切割机及其控制方法
KR20230088475A (ko) * 2020-10-19 2023-06-19 어플라이드 머티어리얼스, 인코포레이티드 공급 어레인지먼트, 진공 프로세싱 시스템, 및 진공 프로세싱 시스템에서 이동하는 디바이스를 공급하는 방법
CN118180660B (zh) * 2024-05-16 2024-09-06 江苏盛捷半导体材料有限公司 一种半导体器件加工用激光切割设备

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616269B (zh) * 2016-08-01 2018-03-01 Reaction force elimination platform device

Also Published As

Publication number Publication date
WO2010110990A3 (en) 2011-01-06
US20100243622A1 (en) 2010-09-30
WO2010110990A2 (en) 2010-09-30
JP5718894B2 (ja) 2015-05-13
JP2012522373A (ja) 2012-09-20
US8735774B2 (en) 2014-05-27
CN102349147A (zh) 2012-02-08
KR20120002603A (ko) 2012-01-06

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