CN102349147A - 反作用力补偿系统 - Google Patents

反作用力补偿系统 Download PDF

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Publication number
CN102349147A
CN102349147A CN201080011565XA CN201080011565A CN102349147A CN 102349147 A CN102349147 A CN 102349147A CN 201080011565X A CN201080011565X A CN 201080011565XA CN 201080011565 A CN201080011565 A CN 201080011565A CN 102349147 A CN102349147 A CN 102349147A
Authority
CN
China
Prior art keywords
objective table
reaction force
laser processing
motor
processing system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201080011565XA
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English (en)
Chinese (zh)
Inventor
马克·T·科斯莫夫斯基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of CN102349147A publication Critical patent/CN102349147A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Machine Tool Units (AREA)
  • Control Of Position Or Direction (AREA)
CN201080011565XA 2009-03-27 2010-02-26 反作用力补偿系统 Pending CN102349147A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US16438209P 2009-03-27 2009-03-27
US61/164,382 2009-03-27
US12/510,630 2009-07-28
US12/510,630 US8735774B2 (en) 2009-03-27 2009-07-28 Force reaction compensation system
PCT/US2010/025591 WO2010110990A2 (en) 2009-03-27 2010-02-26 Force reaction compensation system

Publications (1)

Publication Number Publication Date
CN102349147A true CN102349147A (zh) 2012-02-08

Family

ID=42781748

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080011565XA Pending CN102349147A (zh) 2009-03-27 2010-02-26 反作用力补偿系统

Country Status (6)

Country Link
US (1) US8735774B2 (enExample)
JP (1) JP5718894B2 (enExample)
KR (1) KR20120002603A (enExample)
CN (1) CN102349147A (enExample)
TW (1) TW201039957A (enExample)
WO (1) WO2010110990A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110711958A (zh) * 2019-11-15 2020-01-21 安徽同兴科技发展有限责任公司 抗扰度高精密直线电机驱动的激光切割机及其控制方法
CN111052296A (zh) * 2017-09-04 2020-04-21 Asml荷兰有限公司 电子束检查设备的台架定位
CN113195147A (zh) * 2018-09-17 2021-07-30 通快机床两合公司 用于在激光切管机中通过切割来对管进行加工的方法以及激光切管机
CN113424018A (zh) * 2019-02-08 2021-09-21 荷兰联合仪器有限公司 用于定位物体的定位系统

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014229787A (ja) * 2013-05-23 2014-12-08 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP6308852B2 (ja) * 2014-04-15 2018-04-11 キヤノン株式会社 駆動装置、リソグラフィ装置、および物品の製造方法
NL2014487A (en) * 2014-04-17 2015-11-02 Asml Netherlands Bv Lithographic Apparatus and Device Manufacturing Method.
TWI616269B (zh) * 2016-08-01 2018-03-01 Reaction force elimination platform device
US10374530B2 (en) 2017-02-21 2019-08-06 Invetech, Inc. Dual-axis linear motion system
WO2018156663A1 (en) 2017-02-21 2018-08-30 Invetech, Inc. Single-axis linear motion system
US11209373B2 (en) 2019-06-21 2021-12-28 Kla Corporation Six degree of freedom workpiece stage
KR20230088475A (ko) * 2020-10-19 2023-06-19 어플라이드 머티어리얼스, 인코포레이티드 공급 어레인지먼트, 진공 프로세싱 시스템, 및 진공 프로세싱 시스템에서 이동하는 디바이스를 공급하는 방법
CN118180660B (zh) * 2024-05-16 2024-09-06 江苏盛捷半导体材料有限公司 一种半导体器件加工用激光切割设备

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KR19980081542A (ko) * 1997-04-21 1998-11-25 미타라이후지오 위치결정장치 및 이 위치결정장치를 구비한 노광장치
KR19990045193A (ko) * 1997-11-11 1999-06-25 미따라이 하지메 스테이지장치와 이것을 이용한 노광장치
JP2004304034A (ja) * 2003-03-31 2004-10-28 Nikon Corp ステージ装置、露光装置及びデバイスの製造方法
KR20060053939A (ko) * 2004-07-20 2006-05-22 캐논 가부시끼가이샤 노광장치 및 반도체 디바이스의 제조방법
US20060170382A1 (en) * 2005-01-28 2006-08-03 Nikon Corporation Linear motor force ripple identification and compensation with iterative learning control
US7215095B2 (en) * 2004-01-15 2007-05-08 Canon Kabushiki Kaisha Driving apparatus, exposure apparatus, and device manufacturing method
US20080012511A1 (en) * 2004-07-15 2008-01-17 Nikon Corporation Planar Motor Device, Stage Device, Exposure Device and Device Manufacturing Method
WO2008103610A1 (en) * 2007-02-20 2008-08-28 Electro Scientific Industries, Inc. Specimen inspection stage implemented with processing stage coupling mechanism
US20080246348A1 (en) * 2005-08-29 2008-10-09 Koninklijke Philips Electronics, N.V. Ironless Magnetic Linear Motors Having Levitating and Transversal Force Capacacities
JP2009053210A (ja) * 2008-12-02 2009-03-12 Sumitomo Heavy Ind Ltd ステージ装置及び半導体検査装置

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GB2328636A (en) * 1997-08-29 1999-03-03 Rye Machinery Ltd A support for a laser tool
JPH11147192A (ja) * 1997-11-12 1999-06-02 Koike Sanso Kogyo Co Ltd レーザー切断装置
US6040553A (en) * 1998-10-29 2000-03-21 Gebo Conveyors Consultants & Systems, Inc. Method of manufacturing air conveyor panels by laser ablation drilling
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US7603785B2 (en) * 2007-02-20 2009-10-20 Electro Scientific Industries, Inc. Air bearing assembly for guiding motion of optical components of a laser processing system
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KR19980081542A (ko) * 1997-04-21 1998-11-25 미타라이후지오 위치결정장치 및 이 위치결정장치를 구비한 노광장치
KR19990045193A (ko) * 1997-11-11 1999-06-25 미따라이 하지메 스테이지장치와 이것을 이용한 노광장치
JP2004304034A (ja) * 2003-03-31 2004-10-28 Nikon Corp ステージ装置、露光装置及びデバイスの製造方法
US7215095B2 (en) * 2004-01-15 2007-05-08 Canon Kabushiki Kaisha Driving apparatus, exposure apparatus, and device manufacturing method
US20080012511A1 (en) * 2004-07-15 2008-01-17 Nikon Corporation Planar Motor Device, Stage Device, Exposure Device and Device Manufacturing Method
KR20060053939A (ko) * 2004-07-20 2006-05-22 캐논 가부시끼가이샤 노광장치 및 반도체 디바이스의 제조방법
US20060170382A1 (en) * 2005-01-28 2006-08-03 Nikon Corporation Linear motor force ripple identification and compensation with iterative learning control
US20080246348A1 (en) * 2005-08-29 2008-10-09 Koninklijke Philips Electronics, N.V. Ironless Magnetic Linear Motors Having Levitating and Transversal Force Capacacities
WO2008103610A1 (en) * 2007-02-20 2008-08-28 Electro Scientific Industries, Inc. Specimen inspection stage implemented with processing stage coupling mechanism
JP2009053210A (ja) * 2008-12-02 2009-03-12 Sumitomo Heavy Ind Ltd ステージ装置及び半導体検査装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111052296A (zh) * 2017-09-04 2020-04-21 Asml荷兰有限公司 电子束检查设备的台架定位
US11302512B2 (en) 2017-09-04 2022-04-12 Asml Netherlands B.V. Electron beam inspection apparatus stage positioning
CN111052296B (zh) * 2017-09-04 2022-10-14 Asml荷兰有限公司 电子束检查设备的台架定位
CN113195147A (zh) * 2018-09-17 2021-07-30 通快机床两合公司 用于在激光切管机中通过切割来对管进行加工的方法以及激光切管机
CN113195147B (zh) * 2018-09-17 2023-03-10 通快机床两合公司 用于在激光切管机中通过切割来对管进行加工的方法以及激光切管机
US12151304B2 (en) 2018-09-17 2024-11-26 TRUMPF Werkzeugmaschinen SE + Co. KG Method for processing of tubes by cutting in a laser tube cutting machine and laser tube cutting machine
CN113424018A (zh) * 2019-02-08 2021-09-21 荷兰联合仪器有限公司 用于定位物体的定位系统
CN110711958A (zh) * 2019-11-15 2020-01-21 安徽同兴科技发展有限责任公司 抗扰度高精密直线电机驱动的激光切割机及其控制方法

Also Published As

Publication number Publication date
WO2010110990A3 (en) 2011-01-06
US20100243622A1 (en) 2010-09-30
WO2010110990A2 (en) 2010-09-30
TW201039957A (en) 2010-11-16
JP5718894B2 (ja) 2015-05-13
JP2012522373A (ja) 2012-09-20
US8735774B2 (en) 2014-05-27
KR20120002603A (ko) 2012-01-06

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
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Application publication date: 20120208