KR20120002603A - 반력 보상 시스템 - Google Patents

반력 보상 시스템 Download PDF

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Publication number
KR20120002603A
KR20120002603A KR1020117025375A KR20117025375A KR20120002603A KR 20120002603 A KR20120002603 A KR 20120002603A KR 1020117025375 A KR1020117025375 A KR 1020117025375A KR 20117025375 A KR20117025375 A KR 20117025375A KR 20120002603 A KR20120002603 A KR 20120002603A
Authority
KR
South Korea
Prior art keywords
motor
stage
reaction force
laser beam
laser processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020117025375A
Other languages
English (en)
Korean (ko)
Inventor
마크 티 코스모스키
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20120002603A publication Critical patent/KR20120002603A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Machine Tool Units (AREA)
  • Control Of Position Or Direction (AREA)
KR1020117025375A 2009-03-27 2010-02-26 반력 보상 시스템 Withdrawn KR20120002603A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US16438209P 2009-03-27 2009-03-27
US61/164,382 2009-03-27
US12/510,630 2009-07-28
US12/510,630 US8735774B2 (en) 2009-03-27 2009-07-28 Force reaction compensation system

Publications (1)

Publication Number Publication Date
KR20120002603A true KR20120002603A (ko) 2012-01-06

Family

ID=42781748

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117025375A Withdrawn KR20120002603A (ko) 2009-03-27 2010-02-26 반력 보상 시스템

Country Status (6)

Country Link
US (1) US8735774B2 (enExample)
JP (1) JP5718894B2 (enExample)
KR (1) KR20120002603A (enExample)
CN (1) CN102349147A (enExample)
TW (1) TW201039957A (enExample)
WO (1) WO2010110990A2 (enExample)

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JP2014229787A (ja) * 2013-05-23 2014-12-08 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP6308852B2 (ja) * 2014-04-15 2018-04-11 キヤノン株式会社 駆動装置、リソグラフィ装置、および物品の製造方法
NL2014487A (en) * 2014-04-17 2015-11-02 Asml Netherlands Bv Lithographic Apparatus and Device Manufacturing Method.
TWI616269B (zh) * 2016-08-01 2018-03-01 Reaction force elimination platform device
US10374530B2 (en) 2017-02-21 2019-08-06 Invetech, Inc. Dual-axis linear motion system
WO2018156663A1 (en) 2017-02-21 2018-08-30 Invetech, Inc. Single-axis linear motion system
KR102449594B1 (ko) 2017-09-04 2022-10-04 에이에스엠엘 네델란즈 비.브이. 전자 빔 검사 장치 스테이지 위치설정
DE102018122717A1 (de) * 2018-09-17 2020-03-19 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zur schneidenden Bearbeitung von Rohren in einer Laserrohrschneidmaschine sowie Laserrohrschneidmaschine
NL2022539B1 (en) * 2019-02-08 2020-08-19 Dutch United Instr B V Positioning system for positioning an object
US11209373B2 (en) 2019-06-21 2021-12-28 Kla Corporation Six degree of freedom workpiece stage
CN110711958B (zh) * 2019-11-15 2021-11-02 安徽同兴科技发展有限责任公司 抗扰度高精密直线电机驱动的激光切割机及其控制方法
KR20230088475A (ko) * 2020-10-19 2023-06-19 어플라이드 머티어리얼스, 인코포레이티드 공급 어레인지먼트, 진공 프로세싱 시스템, 및 진공 프로세싱 시스템에서 이동하는 디바이스를 공급하는 방법
CN118180660B (zh) * 2024-05-16 2024-09-06 江苏盛捷半导体材料有限公司 一种半导体器件加工用激光切割设备

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US5363029A (en) * 1993-04-19 1994-11-08 Kabushiki Kaisha Yaskawa Denki Laser-beam machine using two-dimensional stepping motor
JP3548353B2 (ja) * 1996-10-15 2004-07-28 キヤノン株式会社 ステージ装置およびこれを用いた露光装置ならびにデバイス製造方法
JPH10293611A (ja) 1997-04-21 1998-11-04 Canon Inc 位置決め装置
GB2328636A (en) * 1997-08-29 1999-03-03 Rye Machinery Ltd A support for a laser tool
US6408045B1 (en) * 1997-11-11 2002-06-18 Canon Kabushiki Kaisha Stage system and exposure apparatus with the same
JPH11147192A (ja) * 1997-11-12 1999-06-02 Koike Sanso Kogyo Co Ltd レーザー切断装置
US6040553A (en) * 1998-10-29 2000-03-21 Gebo Conveyors Consultants & Systems, Inc. Method of manufacturing air conveyor panels by laser ablation drilling
JP3312297B2 (ja) * 1999-07-02 2002-08-05 住友重機械工業株式会社 ステージ位置制御装置
DE10117460A1 (de) * 2001-04-06 2002-11-07 Siemens Ag Impulsgekoppelter Transmissionsantrieb
JP4223714B2 (ja) * 2001-11-30 2009-02-12 住友重機械工業株式会社 ステージ装置
JP2004304034A (ja) 2003-03-31 2004-10-28 Nikon Corp ステージ装置、露光装置及びデバイスの製造方法
JP2005203567A (ja) * 2004-01-15 2005-07-28 Canon Inc 駆動装置、露光装置及びデバイス製造方法
WO2006006730A1 (ja) * 2004-07-15 2006-01-19 Nikon Corporation 平面モータ装置、ステージ装置、露光装置及びデバイスの製造方法
JP2006032788A (ja) 2004-07-20 2006-02-02 Canon Inc 露光装置及び半導体デバイスの製造方法
JP2006049384A (ja) * 2004-07-30 2006-02-16 Laserfront Technologies Inc ガントリー型ｘｙステージ
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Also Published As

Publication number Publication date
WO2010110990A3 (en) 2011-01-06
US20100243622A1 (en) 2010-09-30
WO2010110990A2 (en) 2010-09-30
TW201039957A (en) 2010-11-16
JP5718894B2 (ja) 2015-05-13
JP2012522373A (ja) 2012-09-20
US8735774B2 (en) 2014-05-27
CN102349147A (zh) 2012-02-08

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20111026

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid