TW201032931A - Laser patterning method and laser patterning device - Google Patents

Laser patterning method and laser patterning device Download PDF

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Publication number
TW201032931A
TW201032931A TW098145091A TW98145091A TW201032931A TW 201032931 A TW201032931 A TW 201032931A TW 098145091 A TW098145091 A TW 098145091A TW 98145091 A TW98145091 A TW 98145091A TW 201032931 A TW201032931 A TW 201032931A
Authority
TW
Taiwan
Prior art keywords
substrate
laser
pattern
glass substrate
line data
Prior art date
Application number
TW098145091A
Other languages
English (en)
Chinese (zh)
Inventor
Masanori Tao
Tomoo Uchikata
Naoyoshi Hamakawa
Hiromitsu Wada
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW201032931A publication Critical patent/TW201032931A/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/18Sheet panels
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Photovoltaic Devices (AREA)
TW098145091A 2009-01-19 2009-12-25 Laser patterning method and laser patterning device TW201032931A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009008341A JP2010162586A (ja) 2009-01-19 2009-01-19 レーザ加工方法及びレーザ加工装置

Publications (1)

Publication Number Publication Date
TW201032931A true TW201032931A (en) 2010-09-16

Family

ID=42579202

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098145091A TW201032931A (en) 2009-01-19 2009-12-25 Laser patterning method and laser patterning device

Country Status (3)

Country Link
JP (1) JP2010162586A (ja)
KR (1) KR20100084985A (ja)
TW (1) TW201032931A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495531B (zh) * 2010-09-16 2015-08-11 Panasonic Corp Laser processing device and laser processing method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101221093B1 (ko) * 2010-08-17 2013-01-17 (주)엔에스 디스플레이 패널용 박막필름의 재단장치
KR20140000662A (ko) * 2010-10-16 2014-01-03 엘지전자 주식회사 디지털 수신기 및 디지털 수신기에서의 3d 컨텐트 처리방법
DE102011052444A1 (de) * 2011-08-05 2013-02-07 Jenoptik Automatisierungstechnik Gmbh Verfahren zur linearen Strukturierung eines beschichteten Substrats zur Herstellung von Dünnschicht-Solarzellenmodulen
JP6019892B2 (ja) 2012-07-30 2016-11-02 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
KR101221095B1 (ko) * 2012-08-07 2013-01-16 (주)엔에스 디스플레이 패널용 박막필름의 재단방법
JP2014082418A (ja) * 2012-10-18 2014-05-08 Disco Abrasive Syst Ltd レーザー加工装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007048835A (ja) * 2005-08-08 2007-02-22 Shibaura Mechatronics Corp レーザ加工装置及びそれを用いた太陽電池基板のパターニング方法
GB0622232D0 (en) * 2006-11-08 2006-12-20 Rumsby Philip T Method and apparatus for laser beam alignment for solar panel scribing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495531B (zh) * 2010-09-16 2015-08-11 Panasonic Corp Laser processing device and laser processing method

Also Published As

Publication number Publication date
KR20100084985A (ko) 2010-07-28
JP2010162586A (ja) 2010-07-29

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