TW201032931A - Laser patterning method and laser patterning device - Google Patents

Abstract

The subject of this invention is not to cause contact or error in interval dimension for the patterns formed on the substrate by laser light in the front-end process and the patterns formed on the substrate by laser light in the back-end process. The solution means of this invention is a laser patterning method, which forms specified patterns on the substrate (K) by the relative drive of substrate (K) and laser light (b2), and includes: an imitation datum line data acquisition step (S200) using the data of the first pattern (LA1) shape formed on the substrate (K) in a specific front-end process as the acquisition of imitation datum line data (D2); and a second pattern forming step (S300) relative driving substrate (K) and laser light (b2) based on the imitation datum line data (D2) so that the trajectory tracked by the laser light (b2) in the back-end process becomes the shape that imitates the shape of the first pattern (LA1) and forms the second patterns (L1).

Description

201032931, IV. Designated representative map: (1) The representative representative of the case is: (6). (2) A brief description of the component symbols of the representative figure. 9: Control devices 52Y, 74X, 74Y: Linear motor 73: Laser irradiation head 7 7 : Camera 9 1 : Input/output device 9 2 : s 忆 部 (memory Means) ® 93: Calculation processing unit c calculation means) 95: Hard disk device 96: Interface circuit D1: Image data D 2: Meta-line data K: Glass substrate L1: First scribe line LA1: scribe line ❿ 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: 6. Description of the invention: [Technical field of the invention] The invention relates to a laser patterning meth〇d and a laser processing apparatus (laser patterning equipment). 2 201032931 More specifically, it relates to a method and apparatus for forming a predetermined pattern on a substrate by relatively driving a substrate and laser light. [Prior Art] In order to manufacture a laser pattern of a thin film solar cell pane 1 (laser), the process can be generally divided into four processes. That is, the first process is as shown in FIG. (Α), a process of forming a 10 TC0 film (Transparent Conducting Oxide) Kjl formed on the transparent glass Kt (bottom in the figure) by laser light bl is scribed. As shown in FIG. 15(b), the second process is selectively etched only by the laser light b2 to form an amorphous germanium film Kj2 over the TC0 film. The third process is as shown in FIG. 15(c), and only the amorphous germanium film Kj2 is selectively scribed by the laser light b3 and formed into an amorphous germanium film.

The process of the metal film Kj3 above Kj2. As shown in Fig. 15(D), the fourth process is characterized by laser light b4 simultaneously depicting all processes of TC film and amorphous Laichuan and metal film Kj3. Between the first process and the second process, there is another process of forming the amorphous film Kj2, and a process of forming the metal film Kj3 exists between the second process and the third process. In the above-mentioned various materials [circuit shape

The material used in the process is different, and the processing method 昤 & A is substantially the same except for changing the wavelength of the laser light. In other words, a plurality of straight scribes are formed on a target film of a target film by driving a glass substrate K that is broken by a film and a laser irradiation head that emits laser light (for example, Patent Document 1 below) ). According to the paper, the materials of each layer of τ are each defined by the scribe lines LAI, LI, LB1, and LC1, and the green is trimmed into adjacent materials. These characterizations 3 201032931 Lines LAI, L1, LB 1, and LC1 are the areas of the task of carrying on the insulation between adjacent layers and the conduction of the upper and lower heterogeneous layers. A so-called dead zone that does not contribute to power generation.专利 [Patent Document 1] Japanese Laid-Open Patent Publication No. 2001-111078. SUMMARY OF THE INVENTION Generally, in the manufacturing line of a thin film solar panel, the above-described first to fourth processes are each laser scribing device for each process. (laser scribing ❹apparatus), for example, is often performed in stages in a total of four devices. In this case, even if the straight and parallel scribe lines ' can be formed in the respective devices, the following may be unfavorable due to the individual mechanical differences of the respective devices present in each device. For example, in the case where the scribe line L1 formed in the second process is shifted in the direction close to the direction of the interval error direction of the scribe line LA1 formed in the first process, etc., even if the amount of error of each interval size is small, there is a scribe line LAI. The contact between L1 and L1 is narrow to a few lOym due to the distance d between the two scribe lines La 1 and L1 (see Fig. 15(B)). Moreover, even if it is shifted toward the direction away from each other, it does not contact 'the expansion of the dead zone due to the enlargement of the interval d of the scribe line L a 1 and the scribe line L1'. As a result, the power generation efficiency of the thin film solar panel ( Power generation efficiency) (conversion efficiency) will decrease. Therefore, in this laser scribing process, it is also important that each of the laser engraving devices provided in each process can form a straight scribe line, but consider the scribe line L1 formed in the process of the latter stage. It is also important that the shape or positional relationship of the score line 201032931 LA1 formed by the process of the preceding stage does not cause contact with the scribe line LA1 of the preceding stage or the size error of the interval. In this way, the pattern formed by the process in the previous stage does not contact with the pattern formed in the process of the subsequent stage or does not cause the gap size error, and the technique of forming the defect can be formed even in the laser manufacturing process of the solar panel. It is also required in addition to the pattern forming process. For example, a liquid crystal panel or a piasma display panel, a flexible panel, and other sheet material manufacturing U-programs. The present invention has been made in view of such circumstances, and an object thereof is to provide a laser processing method and a laser processing apparatus which can prevent laser light from being formed on a substrate by laser light in a pattern of a front stage and laser light in a process in a subsequent stage. The pattern formed on the substrate causes contact or spacing dimensional errors. The above object is achieved by the present invention described below. In addition, the bracketed symbols attached to the respective constituent elements in the present shed ([Clain Content]) indicate relationships corresponding to specific means (means) described in the embodiments to be described later. The invention of claim 1 is a laser processing method in which a predetermined pattern is formed by processing a substrate (K) with a relative carrier substrate (K) and laser light (b2), and its characteristics include, The process of obtaining the shape of the first pattern (LA1) of the substrate (κ) in the preceding stage is used as the imitation element line (the line of the shape of the reference line to be processed first). (S200); according to the meta-element data (D2), relative to the driving substrate (κ) and the laser light (b2), the track traced by the laser light (b2) in the latter stage becomes the first pattern ( The shape of the shape of LA1) and forming a second pattern forming step (S300) of the second pattern (L1). In the invention of the second aspect of the invention, the circuit forming material (Kj) composed of a plurality of layers is formed on at least one surface of the substrate (κ), and the dummy element data obtaining step (S2 00) is performed. Calculating and memorizing the meta-line data (D2) of the first pattern (LA1) of the circuit-forming material (Kj1) formed in the first layer, and in the second pattern forming step (S300), according to the dummy line data (j) 2) A second pattern (L1) is formed in the circuit forming material (Kj2) of the second layer. In the invention of claim 3, the substrate (g) is formed of a glass substrate on which a circuit forming material (Kj) for use in the production of a thin film solar cell is formed, and the laser light (b2) is The power adjusted to the circuit forming material (Kj) is used in the process of manufacturing a thin film solar panel. The invention of claim 4 is a laser processing apparatus (1) which is formed by processing a predetermined pattern on a substrate (κ) by a relative driving substrate (K) and laser light (b2). The data of the shape of the first pattern (LA1) formed in the substrate (κ) in the preceding stage is used as the data source (77, 9) obtained by the imitation element line data (ρ2); according to the imitation element line data (D2) ), the trajectory tracked by the drive substrate (K) and the laser light (b2), and the laser light (1) 2) in the subsequent stage becomes a shape that follows the shape of the first pattern (LA1) and forms a first pattern. The second pattern forming means (?) of (L1). According to the invention of claim 5, the circuit forming material (Kj) composed of a plurality of layers is formed on at least one surface of the substrate, and the dummy material line obtaining means (77, 9) includes: Photographing means (77) of the first pattern (LA1) of the circuit-forming material formed on the first layer; calculating, memorizing the meta-line data (D2), memorizing means (9), and forming the second pattern 6 201032931 The means (7) forms a second pattern (L1) in the circuit forming material (K j2) of the second layer according to the meta-line data (D2). In the invention of claim 6 of the invention, the substrate ( K) is a laser irradiation head (73) which is formed of a glass substrate for forming a circuit for forming a thin film solar cell, and includes laser light (b) including a material for forming a scribeable circuit (j). It is used in the manufacturing process of thin film solar panels. @ [Effect of the Invention] According to the present invention, the pattern formed by the laser light on the substrate and the pattern formed by the laser light on the substrate in the process of the subsequent stage may cause contact or gap size error.

According to the inventions of the first and fourth aspects of the patent application, the second pattern (L1) is formed as follows. That is, according to the obtained meta-line data, which is formed by relatively driving the substrate (K) and the laser light (b2), the track traced by the process laser light (b2) in the subsequent stage becomes the first pattern (Lai). Shape of the shape. According to this, a second pattern (L1) which is shaped like the first pattern is formed on the surface of the substrate (K). For example, the first pattern (LA1) is a scribe line, and the first pattern (LA1) is slightly f-curved, and the second pattern (L1) which becomes the scribe line of the subsequent stage is not formed straight, but is The same shape of a round case is curved to form ...b' without causing the process in the preceding stage to be formed by the first pattern (LA1) of the substrate (κ) by Ray light (bi) and by the laser light by the process of the latter stage ( B2) A second pattern (Li) lead or spacer size error formed on the substrate (K). 7 201032931 In accordance with the invention of the second and fifth aspects of the patent application, the 俞 秘 i plate (K) is formed on at least one of the faces of the film, and the circuit formation Μ Μ (Kj) is formed over the plurality of layers. The second case (L1) of the circuit-forming material (Kj2) of the first first layer of the circuit-forming material (Kj1) formed in the first material-forming material layer (Kj1) causes contact or interval error. Therefore, it is suitable for use in a state in which the enthalpy barrier formed in the process of the preceding stage is formed in a state in which the pattern of the or is formed close to the pattern formed in the process of the subsequent stage, 彳u) Manufacturing process for panels, liquid crystal panels or plasma display panels, Mwp flexible panels, and other sheet materials. According to the invention of the third box of the patent application, the invention of nn, and the item of item 6, the contact or spacing error of each scribe line in the thin film solar panel may not be caused. As a result, thin-film solar panels with high power generation efficiency can be produced. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. 1 is a perspective view showing the appearance of a laser scribing device 4 relating to the present invention, and FIG. 2 is a plan view showing a main portion of the laser scoring device 1 in a plan view. The circle 3 is a main portion of the laser scribing device 1. In the front view, FIG. 4 is a perspective view showing the laser unit 7. The three axes of the orthogonal coordinate system are X, Y, and Z in the respective figures, and the transfer direction of the glass substrate K is the γ direction to be positive in the horizontal plane. The direction intersecting the Υ direction is the Χ direction, and the vertical direction is the ζ direction, and the direction of rotation around the vertical axis is 0 direction. Further, the paper surface of the drawing is placed near the front side of the eye as the upstream side, and the head side of the paper surface is the downstream side, that is, in the drawing, the upstream side is the upstream side and the right side is the downstream side in Figs. 2 and 3 . Furthermore, it is necessary to further the area 8 201032931. The case where the directions in each direction are left or right or before and after is indicated by adding a symbol of [+] or [-] at the forefront. For example, the transfer direction in the formation operation of the scribe line in the Υ direction of the transfer direction of the glass substrate κ is denoted by [[+ γ direction]', and the transfer direction after the formation of the scribe line is referred to as [-Υ direction ]Wait. Further, Fig. 5 is a connection diagram showing the connection of the control device 9 and various components in the laser scribing device 1, and Fig. 6 is a view for explaining the main part of the present invention. Fig. 7 is a display head driving portion 74 and a clip. FIG. 8 is a three-side view showing a glass substrate 形成 in which a score line is formed by the laser scribing device 1 in a driving direction of the holder group driving unit 52. Further, in Fig. 6, A is an operation state at the time of acquiring the meta-line data, and B is an operation state at the time of forming the scribe line. Further, in Fig. 8, a is a plan view, a side view of B, and a front view of C. The laser scribing device 1 is configured to form a circuit pattern for the purpose of response by scanning a glass substrate K' on which a circuit forming material Kj (see FIG. 8) is formed on one surface by laser light of a predetermined intensity. Pattern) scribe 1 ine. In the present embodiment, the circuit forming material to be scribed is an amorphous ruthenium film Kj2' formed on the TC0 film Kj1 (bottom in the figure). The TC0 film Kjl is formed on the transparent glass j ( Above t (in the figure is • under). It is assumed that the TC 0 film K j 1 has been formed with the scribe lines LA 1 , LA2 ... by other laser scribes in the front-end process. As shown in Fig. 8(A), the scribe lines LA1, LA2, ... are formed by a slight inclination of the longitudinal direction of the glass substrate κ. The laser scribing device 1 is treated as the TC0 film Kj. The amorphous ruthenium film K j 2 above 1 is used to form a device for scribe lines L1, L2, etc. In particular, 993332931, the laser scribe device 1 is a material for forming a circuit in a glass substrate κ. In the state in which the film formation surface of K j is formed in a downward direction, the type of the scribe line is formed, and the glass substrate κ is supported by the air to move in the +γ direction. Specifically, the laser scribing device 1 includes a machine 2, a floating flat σ 3, an elevator unit 4, a transfer unit 5, and the like. The board positioning device 6, the laser unit 7, the dust collecting unit 8, the control device 9, etc., and the moving of the glass substrate κ® to move the floating platform 3 on the outer side of the upstream of the laser scribing device Carrying out the robotic arm (carrying ^n/〇ut rGbGt) 1G. The following describes each component of the laser scribing device 1. The machine 2 is a support ship that supports the main component of the laser scoring device i, and includes a pedestal. Department 21 and door frame platform 1 _ mouth seat # d support floating platform 3 and transfer early 疋 5 etc. 'Door frame 22 support Thunder 铋 丄 丄 得 得 雷 卓 卓 卓 卓 卓 卓 卓 卓 卓 卓In order to ensure the sufficient rigidity of the machine and to minimize the deformation accompanying the temperature change, it is preferable to use a stone such as: =lte), but in order to obtain the device cost in the present embodiment, The lowering is made of a metal such as stainless steel. The floating platform 3 is a member that supports the glass substrate K to be scratched by the air ejected from the surface thereof, and the sentence 〇9 ^ 傅仵 includes the main platform 31 and Sub-platform 2. The main platform 31 is in the laser scoring equipment - self-matching μ △ 】 device 1 There is one for each of the upstream side and the downstream side. This configuration is to maintain a predetermined space with u between the upper α ^ ϋ « and the downstream main platforms 31. The main platform 31 is specifically as shown in Fig. 2, The floating unit 3 329 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 The surface of the surface is provided with a plurality of air ejection holes 3iih. The air ejection holes 311h are connected to a pipe with a compressed air pump, etc. 7((3ΐν6Ι·ιιηί1;) 33' The upward jet is supplied by the blower unit 33 for & Μ la Α «Τ d. In the air of the pressure-receiving air, the pressure of the air which is caused by the air-floating glass substrate is set to a state in which the glass substrate κ which is a floating object is not bent and is maintained in a stable state.

The sub-stage 32 is formed by arranging two long floating units 321 long in the X direction with a predetermined interval therebetween between the upstream and downstream main platforms 31. The space portion formed between the two floating units 321 is a particle (the swarf of the amorphous enamel film Kj2) which is dropped when the laser irradiation head 73 located above is scribed. Recover holes to function. The floating unit 321 is also provided with a plurality of air ejection holes 321h on the surface as in the floating unit 311, and the air ejection holes 321h discharge the air of a predetermined pressure supplied from the blower unit 33 upward. As will be described later, the sub-stage 32 is arranged so that the following operation is smooth and reliable. The glass substrate K is moved in the +Y direction, and the floating support by the upstream main platform 31 is moved to the downstream side. The operation of the floating support at the main platform 31 is reversed, and the glass substrate K is moved in the -Y direction, and the floating support by the main platform 31 on the downstream side is moved to the main platform 31 on the upstream side. The operation of the lifting support 4 is performed. The elevator unit 4 is a device for receiving the glass substrate κ to be scribed and transferring the etched glass substrate K, and includes a pin frame 201032931 (pin frame) 41 and a frame driving portion. 42. The pin frame 41 is a sub-shaped body which is slightly larger than the glass substrate κ which is the object of receiving and transmitting, and includes a sub-shaped peripheral frame which is slightly like the [mouth] in plan view. 41& and the central box 41b of the glyph of [a]. In the peripheral frame 41a, a plurality of lift pins 43 are erected at predetermined intervals adjacent to each other. The ejector pin 43 is a pin member that abuts against the bottom surface of the forehead portion Kf (see Fig. 8) in the glass substrate κ at its tip end portion and can support the glass substrate κ. The front edge portion is a film forming material Kj which is formed without forming a film on the outer side of the glass substrate κ, or a circuit forming material Kj is formed on the outer surface of the glass substrate κ. The area where the tip portion abuts does not affect the area of the final product. The frame driving unit 42 is configured to extend and lower the driving pin frame 41 in the Z direction, and is realized by, for example, a rotating ball screw (plus ball SCreW) mechanism of the center frame 41b. The frame driving unit 42 drives the pin frame 41 to selectively arrange the ejector pin 43 at the upper limit position ^ and the lower limit position upper limit position P1 shown in FIG. 3 to receive the boring process from the loading/unloading robot 1 The position at which the glass substrate K of the target object is transferred or the glass substrate K that has been subjected to the singulation is transferred to the loading/unloading robot 1 () is at a position where the tip end portion of the ejector pin 43 is much higher than the floating platform 3 The location of the surface. When the ejector pin 43 is not used, such as when the glass substrate κ is moved in and out, for example, when the ejector pin 43 is not used, the ejector pin 43 is retracted, and the tip end of the ejector pin 43 is the tip end of the ejector pin 43. The portion is lower than the position of the surface of the floating platform 3. The delivery pin 43 is lowered after receiving the glass substrate κ, and the descending speed at this time is set as follows. That is, the lowering speed at which the ejector pin 43 is moved from the upper limit position to the upper position P3 (described below) of the float 12 201032931 is set to be moved from the upper position P3 to the floating surface position p4 ( Similarly, when the falling speed at the time of the following is U2, there is a relationship of U2CU1. More preferably υ2<υι/2. Further, the floating position upper position P3 is a position at which the tip end portion of the ejector pin 43 is higher than the floating surface position p4 and lower than the upper limit position pl. The floating surface position P4 is a height position at which the glass substrate K is floated by the air ejected from the air ejection ports 3nh and 321h in the floating level σ3. The transfer sheet 7L 5 is a device including a gripper group 51 and a gripper group drive unit 52, which are configured to move the glass substrate Κ in the γ direction while the cantilever supports the glass substrate κ. In the gripper group 51, a total of four grippers 53 are integrally arranged in a line at predetermined intervals in the γ direction, and each gripper 53 grips the fore edge portion of the glass substrate κ. One side of the Kf is configured to support the glass substrate κ by cantilever. Specifically, each of the grippers 53 has a pair of upper and lower movable claws. The movable claw is configured to be driven synchronously by the action of compressed air or the like in accordance with a signal transmitted from the control unit 9, and can be opened and closed. Opening the movable claw is to grasp one side of the fore edge portion of the glass substrate κ. When the movable claw is closed, one side of the forehead portion Kf of the glass substrate κ is grasped, or when each of the grippers 53 is retracted. In order to ensure the safety of the fingers, etc., it is necessary to grasp the glass substrate, and basically the movable claw is used in a closed state. Further, the gripper group 51 is driven in the X direction by a drive device such as a servo motor or the like, and is selectively disposed at the holding position P5 and the avoidance position P6 shown in Fig. 2 . The holding position p5 is the position of the front edge of the front edge portion of the glass substrate κ supported by the ejector pin 43. The avoidance position Ρ6 is a position where the pair, the area, and the von are placed at the position ρ5, and the glass substrate κ is not caught. Moreover, / ° then ' • are independent of each other and can also be driven by a servo motor or the like. 53 The driving device is arbitrarily moved by the box. The driving in the βΖ direction in each direction of θ is mainly in the holder 53: Was carried out. The drive in the Θ direction is mainly performed when the gripper 53_ Θ is mounted at the angle of correction. The gripper group drive unit 52 is a linear motor (linear m〇t〇r) 52Y that is disposed in the side direction of the pedestal portion 21 in order to drive the gripper group 51 toward the ❿. As the main component. The linear motor 52Y is operated, and the detentor group 51 is selectively disposed in the receiving position of the circle and the to-be-avoided position p8. The receiving position is within the range of the glass substrate K6tx in which the loading and unloading robot 1 () is moved in. The position including all the holders 53 is located on the upstream side of the floating flat 3. The 'avoidance position P8 is a position to be avoided for the safety to ensure that the holder 53 is to be avoided, and is located on the floating platform 3 On the downstream side of the glass substrate K, in order to prevent the safety of the insertion of the arm, etc., the four gripper groups 51 are basically disposed at the position to be avoided. The substrate positioning device 6 is disposed on the downstream side. The two sides of the upstream side of the platform 3 in the χ direction include: a pressing roller 61 that can respectively press the end faces of the two short sides of the glass substrate κ; and a cylinder that drives the pressing roller 61 in the χ direction Uir cy 1 inder 62. The substrate positioning device 6 performs the glass substrate κ by simultaneously stretching the two cylinders 62 while positioning, and sandwiching the two short-side end faces of the glass substrate K by the pressing roller 61. Positioning. Then positioning ends 14 201032931 When the two cylinders 62 are simultaneously shortened, the glass substrate κ is separated from the pressing rollers 61. The laser unit 7 is supported by the holder group 51 and the floating platform 3 and is transferred to the +. The glass substrate Υ in the Υ direction is irradiated with the laser light b2, and the circuit forming material K j (amorphous ruthenium film K j 2 ) is formed on the bottom surface of the glass substrate 并 to form a predetermined scribe line. Specifically, as shown in FIG. 1 and FIG. 4, a laser oscillator 71, an illumination optical system 7, a laser irradiation head 73, a head driving unit 704, and the like are included. φ Laser oscillator Π It is a light source device that emits laser light b2 for patterning the circuit forming material K j (amorphous germanium film Kj2) formed on the glass substrate K. For example, an oscillation wavelength of 355 nm to 1064 nm and an output of 20 W can be used. Left and right

Nd-YAG (yttrium aluminum garnet) laser or Nd — YVCh (y 11 ri um orthovanadate : Ifl acid in B) laser illuminating optical system 72 is laser light emitted by laser oscillator 7i B2 is guided to the laser irradiation head 73 to constitute 'including: mirrors 722a to 72 2h, a beam expander 723, an attenuator 724, and the like. The laser light b2 is opened and closed by a mechanical shutter 721 disposed on the optical axis of the laser beam b2 emitted from the laser oscillator 71, and the light guide to the laser head 73 is turned on (〇n) /〇ff) is switched. The opening and closing of the mechanical shutter 721 is performed based on a signal transmitted from the control device 9. Further, in the state in which the mirrors 722f to 72h are housed in the case (b〇x) 76, the mirrors 722f to 72h can be driven in the X direction to form the path length correction unit in synchronization with the laser head 73. By separating a part of the optical system from the laser irradiation head 73 by such a movable case 76 15 201032931, the storage contents in the laser irradiation head 73 are reduced as follows, and the weight is reduced, and the drive source is reduced. The load of the head drive unit 74. At the same time, the tracking and responsiveness of the action are good, and precise fine adjustment is possible. The laser irradiation head 73 is configured such that the laser light b2 from the laser oscillator 71 guided by the illumination optical system 72 is irradiated onto the surface of the glass substrate K by a vertical beam. Specifically, it is constituted by an optical cartridge having a laser irradiation window 735 which is a laser beam b2 and an injection port, and houses a return mirror 731, a focus lens (focus ens) 732, and a condensing mirror = 〇ndenSer 733 therein. . The laser irradiation head 73 can be independently driven in the X direction and the Y direction by the head driving unit 74 described below (walking and stopping), and the camera 77 is attached to the side wall of the laser irradiation head 73. The camera 77 is An imaging element having a CCD (Charge Coupled Device) or the like can be configured to output image data Di obtained by photography to the control device 9. The camera 77 is mounted to be photographed.

The direction of the I direction is downward. According to this, it is possible to perform imaging while walking the scribe line LA1 formed on the glass substrate K© in the X direction. In the control device 9, the calculation of the [imitation element line data D2] and the memory processing are performed based on the image data m. Details thereof will be described later. The head driving portion 74 is mainly composed of a linear motor 74A and a linear motor 74γ. The upper linear motor 74 is mounted on the upper portion of the portal frame 22 along its longitudinal direction (X direction). The linear motor 74A has a movable table (not shown) that is driven to the side 2 . The linear motor 74A is disposed on the movable table in the /Q direction. According to this, the laser irradiation head 73 can be driven simultaneously and independently 201032931 in the X direction and the γ direction. The movable range of the 私 私 私 私 私 -4 -4 -4 m m 73 73 73 73 73 73 73 73 73 73 73 73 73 73 73 73 73 The boundary position 1 of the direction is set between the initial position P9 舆 + the end position P10 of the limit position in the γ direction. Since the laser irradiation head 73 is produced very lightly as described above, the load required for stopping and starting is small. Therefore, the head drive unit 74 does not require a high-output brake that has a strong pull/urine and a strong braking force, and the cost of the device can be reduced by one, and the heat generated from the drive source at the time of stop and start is small. Therefore, due to the influence of the heat, the device details

Expansion, the occurrence of positional accuracy over time, the cause of poor accuracy in the A war is also extremely

As shown in FIG. 1, the sputum dust collecting unit 8 collects particles which are dropped from the bottom surface of the glass substrate κ at the time of scribing by the laser irradiation head 73 located above it (the swarf of the amorphous smectite Kj2) The configuration specifically includes a tray 81 and a vacuum chamber 83. The tray 81 is disposed below the range in which the laser irradiation head 73 moves in the X direction, and is connected to the vacuum chamber 83 through the pipe 82. With this configuration, the particles dropped by the laser scoring to the tray 81 are recovered into the vacuum chamber 83 by vacuum suction. In the scribing operation, the vacuum chamber 8 3 ❿ basically performs the suction operation. As shown in FIG. 5, the control device 9 is capable of inputting various commands and conditions, arithmetic processing in response to the inputs, and outputting an appropriate control signal based on the result of the arithmetic processing to each drive system, etc., and the laser scribing apparatus 1 is possible. It is constructed by performing a series of scribing actions. Specifically, as shown in FIG. 6, the input/output device 91 such as a touch panel; the memory unit 92 mainly composed of a memory device; and the arithmetic processing unit 93 mainly composed of a microprocessor. And an appropriate interface circuit (interface cueu it) 96 for data communication with each drive system and loading and unloading machine 201032931 in the laser scoring device 1; including a computer program for operating the hardware Disc device 95 and the like. The arithmetic processing unit 93 performs the calculation processing of the pseudo-line data D2 based on the video data D1 (see Fig. 6(A)) of the scribe line LA1 taken in by the camera 77. The imitation meta line information! 2 is a material of the shape of the specific score line laI, and is calculated based on the coordinates of X and Y of the score line LA1. Further, means for forming the score line L1 formed in the process of the subsequent stage (i.e., the second process) is formed in the shape of the scribe line L A1 . The imaginary line data D2 calculated by the arithmetic processing unit 93 is stored in the memory unit 92. The details of these are explained in the description of the operation described later. The loading/unloading robot arm 10 is configured to carry out the loading and unloading of the floating substrate 3 by the glass substrate K, and includes an adsorption hand 11, an arm 12, a vacuum pump 13, and a motor as shown in Fig. 1 . 14 and the operation panel 17. The adsorption hand 11 includes a plurality of suction pads 16 arranged in a two-dimensional shape in the frame i 5 . The suction pads 16 are such that the respective adsorption surfaces are on the same plane, whereby the top of the glass substrate K of the planar body can be simultaneously adsorbed at a plurality of places. The surface (the non-film formation surface φ suction pad 16 generates a suction pressure by the operation of the vacuum pump 13. Then, the adsorption hand 11 drives the motor 14 in accordance with an instruction from the operation panel 17, and the transmission arm 12 moves freely in the XYZ 0 direction. Next, the operation of the laser scribing apparatus 1 will be described. Fig. 9 is a flow chart showing the outline of the basic operation of the laser scribing apparatus 1 and the operation of the imitation data acquisition step S200. 1〇 is a flow chart of the process of the glass substrate loading step 1A, the blade operation program, FIG. 11 is a flow chart showing the operation procedure of step 300, and FIG. 12 is a glass base. 201032931 疋Display laser sculpt diagram 14 is a flow chart showing the operation procedure of the squeegee out step 500, and FIG. 13 is a timing chart of the basic operation of the apparatus 1 and a timing chart of the stroke operation. Further, in Fig. 9, A The figure is a summary of the basic actions set. 'B is an operation program for displaying the step of obtaining the meta-line data. Moreover, 'the variable axis (movable part)' that is not aware of the operation speed in FIG. 13 is only the expression of the switch (0n/0f f ), plus The deceleration is not indicated. The ejector pin 43 has a variable speed during the operation. As shown in Fig. 9(A), the basic operation of the laser scribing device 1 is to carry the glass crucible substrate into the step S1 00 and the imitation line. The order of the data acquisition step s2 〇〇, the scribe step S3 0 0 , and the glass substrate carry-out step S 510 is performed. Hereinafter, the operation contents of the respective steps will be described later. Further, the laser scribe apparatus will be described in the following description. The initial state of 1 is set to the following (see the left side of the time axis in each of the tables in Fig. 13). That is, the floating platform 3 is directly blown out of the floating air. The pin 43 is located at the upper limit position pi. The gripper group 51 is located at a shunting position P8. Each of the grippers 53 is closed. The substrate fixing and positioning device 6 is in an introduced state. The glass substrate κ which is the object of scribing is such that The film is placed face down on the trolley or pallet (pall [S1 0 0 Loading Glass Substrate] First, the glass substrate loading step S100 will be described with reference to Figs. 10 and 13 [S110 accepts a glass substrate (tb t2 in Fig. 13)] • Operator operation The robot arm 10 is moved in and out and the glass substrate K is carried into the laser scribing device 1. Specifically, the arm 1 is moved as follows using the operation panel 17. 201032931 First, the suction hand 11 is brought to the glass carried on the trolley or the pallet. Above the substrate κ. Next, the adsorption hand 11 is lowered to a height of the non-composite surface of the glass substrate κ. Next, the plurality of non-film formation faces in the glass substrate crucible are adsorbed by the adsorption crucible 16 in the adsorption hand 11. Next, the moving arm 12 takes the glass substrate sucked and held by the suction hand 11 to the upstream side position of the floating platform 3. Then, the suction holding by the suction hand 1 1 is released, and the bottom surface of the front edge portion Kf of the glass substrate κ is manually carried out by a guide (not shown) attached to the pin frame 41. The tip end portion of the pin 43. ® [S120 moves the gripper group toward the receiving position (t3 of Fig. 13)] The glass substrate K is supported by the tip end portion of the ejector pin 43, and the gripper group 51 is moved from the standby position P8 toward the receiving position P7. Specifically, the linear motor 5/y drives the gripper group 51 in the 4 direction in accordance with the signal transmitted from the control unit 9. According to this, the gripper group 51 to be avoided to the standby position ρ8 for safety assurance is disposed at the receiving position Ρ7. [S130 Opening the Gripper (t4 of Fig. 13)] Once the turtle root gripper group 51 is disposed at the receiving position P7, each gripper 53 opens and closes the movable pawl by a signal transmitted from the control device 9. . [S14〇 Move the gripper group toward the holding position (t5 of Fig. 13)] If each gripper 53 is opened at the receiving position p7, the grip avoidance position P6 is moved to the end of the control position. Specifically, the gripper group 51 is driven in accordance with the movement caused by the brush device 9. The position is driven by the avoidance position Ρ6 to maintain the position D5. At this time, each of the grippers 53 is in a state in which the edge of the 'substrate κ' is broken—the Λ wind is a glass space. 20 201032931 between the upper and lower movable claws of the erectors [2010] The ejector pins are lowered (the t6 of the movable claws of the t6 of Fig. 13 is assigned ψ ^ ^ 保持 to the holding value P5, the ejector pin 43. According to this, the glass substrate κ 盔 迓 迓 迓 孑 孑 平台 平台 平台 平台 平台 盔 盔 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃 玻璃The signal transmitted by the device 9 is lowered by the driving pin frame. The driving is performed as follows. First, the ejector pin 43 is lowered from the upper limit position P1 to the upper position of the floating surface ❹ P3 at the speed Ui in the state of the louver glass (Fig. 13). After t6 to t7)e, the glass substrate κ is lowered to the upper position of the floating surface Ρ3 at the speed κ, and then the speed U2 (<U1) is lowered to the floating surface position ρ4 (t7 to t8h of Fig. 13) When the substrate κ is lowered, a two-stage speed is used. As in the case of U2 < tJ1, the low speed is in the vicinity of the floating surface position Ρ4 in order to prevent the floating platform 3 and the glass substrate from being drastically lowered directly above the floating platform 3. K contact. The ejector pin 43 is lowered at the speed U2 to become the floating surface position P4, if the glass base K is lifted at the net-lifting position P4, and the ejector pin 43 is stopped (t8-t12 of Fig. 13). At this stage, the glass substrate K is ejected by the ejector pin 43 and by the floating platform 3. Air support Q [Locating the S160 glass substrate (t9 of Fig. 13)] The glass substrate K is supported by the ejector pin 43 and the air, and the substrate positioning device 6 elongates the cylinder 62 according to the signal transmitted by the control device 9. The both ends of the glass substrate K are pressed by the roof roller 61. Accordingly, the glass substrate K is placed at a predetermined position. [S170 Closing the holder (t10 of Fig. 13)] The positioning of the glass substrate K is performed as follows. The signals transmitted by the control device 9 are closed by the respective holders 5, and one side of the fore edge portion κ f 201032931 in the glass substrate K is grasped. At this stage, the glass substrate K is held by the holder 53 and the ejection lock 43 Air support [S180 causes the substrate positioning device to retreat (t11 of Fig. 13)] gripper 53 - grips one side of the fore edge portion of the glass substrate K, and the substrate positioning device 6 causes the cylinder according to the signal transmitted by the control device 9. The shortening of 62 causes the pressing roller 61 to retreat. [S190 causes the ejector pin to be lowered further (t12 of Fig. 13). Tl3);| The substrate positioning device 6 is retracted, and the frame driving portion 42 drives the pin frame 41 in accordance with the signal transmitted from the control device 9. At this time, the glass substrate κ is supported by air. The ejection pin 43 leaves the glass. The substrate κ is lowered to the lower limit position Ρ 2. At this stage, the side of the front edge portion Kf of the glass substrate 保持 is held by the holder 53 and the entire film formation surface is supported by air floating. As described above, the glass substrate K is moved. [S200 Meta-Line Data Acquisition Step] Next, the dummy line data acquisition step S200 will be described with reference to FIGS. 6U) and 9(B). Further, it is assumed that the alignment of the camera 77 with the scribe line ίΑ is explained by the line. That is, the camera 77 is disposed on the photographable score line [Μ _ - π & 7 α Α » ^ 马达 马达 Χ Χ Χ Χ according to the head 73 transmitted by the control device 9 in the +X direction (S2l 图 of Fig. 9 (8)). Accordingly, the camera 77 attached to the side portion of the illumination beam 73 moves in the +χ direction. The photographing line LA1 is taken with the movement, and the image data is transmitted to the control device 9. The control device 9 is controlled by the image data m of the 93-valued value. The meta-line data is reported to have been remembered in the memory department 22 201032931 92. The dummy line data D2 is data of a line which becomes a dummy of the scribe line L 2 ... formed in the second process. The calculation method of the meta-line data D2 can be arbitrarily set. E.g

The multiple points (e.g., 2 to 10 points) on the insulting line I1 are calculated by approximating the curve or the approximate straight line approximation. When this calculation method is used, J is released by the wire motor 74 间歇 intermittently driving the laser irradiation 3 in the above-described step S210. That is, 'the camera 77 is stopped at the above 2 to 10 o'clock every time, and the camera is processed/processed. Moreover, another method can also read the scribe line on the scribe line Α1, which is used as the tracking scribe line LA1. Calculated by data. When this calculation method is used, it is performed by continuously driving the X direction at a low speed without stopping the camera 77. The meta-line data D 2, which has been recalled by the memory unit 92, is read out in the scribing step S300 described later in the next paragraph, and is used as the control data for correcting the driving of the laser irradiation head 73 at the time of the scribing operation. . [S300 scribing] Next, referring to FIG. 7, FIG. 11, and FIG. 14, the scribing step S3 will be described. In addition, the laser irradiation window 735 and the first scribing start end in the laser irradiation head 73 are assumed. The alignment of L S1 is performed to explain. [S31〇~S345 Formation of the first scribe line (wbw12 of Fig. 14)] The linear motor 52Y drives the gripper group 51 in the _^ direction at a constant speed of π according to the signal transmitted from the control device 9. 531〇 of 11 and wl, w4 of Fig. 14). According to this, the glass substrate κ travels at a constant speed of n in the +γ direction. On the other hand, the linear motor 74 驱动 drives the laser irradiation head 73 in the + γ direction according to the signal transmitted from the control device 9 at a constant speed of vi 23 201032931

(S3 20 of Fig. 11 and "5" of Fig. 14). Accordingly, the relative speed of the glass substrate K and the laser irradiation head 713 becomes 〇, and the laser irradiation head 713 is stationary to the appearance of the glass substrate 。. The mechanical shutter is opened in accordance with the nickname transmitted by the control device 9 (S325 of Fig. 11). The linear motor 74 驱动 drives the laser irradiation head 73 at a constant speed of ¥2 based on the signal transmitted from the control device 9. In the Χ direction (S330 of Fig. 11, w3, w6 of Fig. η), at the same time, the linear motor 74Y is corrected in a small amount in the γ direction according to the dummy line data D2' stored in the memory unit 92 of the control unit 9. The laser irradiation head 73 is driven, and the trajectory tracked by the laser light b2 is substantially the same shape as the scribe line LA1. The medium is the laser light b2 irradiated by the laser irradiation window 735 from the first scribe start end LSI ( Referring to Fig. 8), moving to the first scribing end lei (S330 of Fig. 11 and w5-w7 of Fig. 14) is performed by the above operation 'the laser light b2 irradiated by the laser irradiation window 735 is the side maintaining glass The substrate K moves in the +γ direction, from the first scribing start end LSI to the first scribing The beam end LE1 moves on the glass substrate κ 俾 in the shape of the scribe line LA1 (Fig. 6 (Β), S33 of the figure 〇, w6 w8 of the figure). The transparent glass Kt transmitted through the glass substrate κ by the laser light b2 (囷8), the material-forming material amorphous film Kj2)' which is formed by filming on the bottom surface is formed into a scribe line parallel to the scribe line U1 [this secant line u is as shown in Fig. 8(A)] When the scribe line of the imitation element is inclined a little, it is: the shape of the scribe line LA1. Similarly, the scribe line ui forms a curve: in the case of a mineral tooth, the formed scribe line u also responds to each. Further, the particles generated at this time fall to the tray 81 and are recovered into the vacuum chamber 83 by vacuum suction. At the time point when the first stripe is formed (4) 24 201032931, the mechanical shutter 721 is based on The control device 9 turns off the signal of the wheel (S345 of 囷11). [S350 returns the laser head to the initial position (w7~wl2 of Fig. 4)] The mechanical shutter 721 is closed, and the linear motor 74Y is controlled by the control device 9 transmitted 彳5#' drives the laser irradiation head 73 in the -γ direction by the following method (w7~w of Fig. 14) L2h, that is, the time from the completion of the formation of the first scribe line L1 to the time t = Q/VI. The laser irradiation head is returned to the original initial position P9. The purpose of this operation is as follows. The glass substrate κ ❹ does not stand still but moves in the + γ direction at a constant speed of VI. Here, the pitch of the scribe lines adjacent to each other in the short-side direction of the glass substrate κ is Q (refer to the figure). 8), the laser irradiation window 735 is located above the second scratch start end LS2 after the formation of the first scribe line l 1 after t = Q/Vl. Up to this point, by returning the laser irradiation head 73 to the original initial position P9' to ensure that when the second scribe line L2 is formed (wl6 - * 18 of Fig. 14), the laser irradiation head 73 is directed toward + Stroke in the γ direction movement ❿ [S360 to S385 formation of the second scribe line (w14 to w21 in Fig. 14)] The glass substrate K is in a state of traveling at a constant speed of VI in the +γ direction. The linear motor 74Y drives the laser irradiation head 73s + Y direction at a certain speed of νι according to the signal transmitted from the control device 9 (s36 of Fig. u, wl3 - wl5 of Fig. 14). Accordingly, as in the formation of the first scribe line u, the relative speed of the glass substrate K and the laser irradiation head 73 becomes 〇, and the laser irradiation-head 73 is a stationary mechanical shutter for the appearance of the glass substrate κ. 721 is turned on according to the signal transmitted by the control device 9 (S365 of Fig. u). The linear motor 201032931 drives the laser irradiation head 73 in the -X direction based on the signal transmitted from the control device 9 at a constant speed of V2 (when the target is wl4-wl6 in Fig. 11). At the same time, the linear motor 74γ corrects the trajectory tracked by the laser irradiation head b' 俾 in the γ direction by a small amount of correction in the γ direction based on the dummy line data D2 stored in the memory unit 92 of the control unit 9. It has substantially the same shape as the score line LA1. This driving is performed by the laser light b2 irradiated by the laser irradiation window moving from the first scribing start end LS2 to the second scribing end LE2 (S37 of Fig. U, η? of Fig. 14). By the above operation, the laser beam b2 irradiated by the laser irradiation window 735 moves from the second scribing start end LS2 to the second scribing end lE2 while maintaining the glass substrate K in the +γ direction. On the glass substrate 俾, the shape of the scribe line LA1 is imitation (S370 of Fig. 14 and wl6, wl8 of Fig. 14). The circuit forming material κ j (amorphous germanium film Kj 2) formed by the transparent glass Kt (see FIG. 8 ) of the laser light transmitted through the glass substrate κ is formed parallel to the first underline. The second scribe line L2 of L1 (parallel to the scribe line LA1). The particles generated at this time are dropped to the tray 81' as in the formation of the first scribe line L1, and are recovered into the vacuum chamber 83 by vacuum suction. At the time point when the second scribe line 12 is formed, the mechanical shutter 721 is turned off in accordance with the signal transmitted from the control device 9 (S385 of Fig.). [S390 returns the laser irradiation head to the initial position (wl7 to w22 of Fig. 14)] the mechanical shutter 721 is closed' and the linear motor 74Y transmits and transmits the first scribe line u according to the signal transmitted from the control device 9. The same method drives the laser irradiation head 73 in the -γ direction (wl7 to w2 2 of Fig. 14). Also, 26 201032931, that is, after the formation of the second scribe line L 2 is completed and the time elapses from t = Q / V1, the laser irradiation head 73 is returned to the original initial position P9. According to this, it is ensured that the stroke of the laser irradiation head 73 is moved in the +Y direction when the third scribe line L3 is formed (w26-w28 of Fig. 14). [Formation of the scribe line after the third line and the subsequent scribe line] After the third line, the scribe line is also maintained by the same method as the first or second strip, while maintaining the glass substrate K toward + γ direction moving state, while not making it stationary, the laser light 1) 2 is moved in the _^ direction or _χ direction, and the driving lightning is corrected in a small amount in the Υ direction according to the imitation element line data D2. The irradiation head 73 is irradiated and a score line is formed. Further, the linear motor 52γ is referred to as a Υ1 axis, and the linear motor 74 Υ is a Υ2 axis, and the positional relationship and operational relationship of each axis when the linear motor 74 χ is the XI axis are as shown in FIG. 7 . Here, when the glass substrate Κ is moved in the +γ direction and the π support of the glass substrate κ is moved from the upstream main stage 31 to the downstream main stage 31, since the air is also blown by the sub-stage 32, the recovery hole is formed. Part (above the tray 81) The glass substrate Κ is greatly bent and prevented. According to this, the end portion of the main substrate 31 that is in contact with the downstream end of the glass substrate is prevented, and the main platform 31 of the glass substrate κ that is transferred from the upstream main platform 31 to the downstream main platform 31 is smoothly and surely get on. Further, the same effect is obtained when the glass substrate κ is moved in the direction in the step S5I described later. As described above, if a predetermined number of scribe lines are formed without stopping the glass substrate Κ while moving in the +γ direction ' (in the figure u @ s4〇〇, the linear motor 52Y is controlled by the control device i) 9 The transmitted signal stops the driving of the gripper group 5丨 in the +Y direction (S4i〇 of Fig. u, m 27 201032931 tl7 of Fig. 13). Thus [in accordance with the laser scoring device 1, when forming the second process When the scribe line L1 is drawn, the linear motor 74Y corrects the driving of the laser irradiation head 73 in a small amount in the γ direction as follows. That is, when the linear motor 74X is driving the laser irradiation head 73 in the X direction at a constant speed, The linear motor 74 4 γ is used to correct the driving of the laser irradiation head 73 in a small amount in the Y direction in accordance with the proud line data D2 of the memory unit 92 stored in the control unit 9. The trajectory tracked by the laser light b2 becomes and The slanting line LA1 of the proud element has substantially the same shape. Accordingly, the shape or positional relationship of the scribe line LA1 formed in the process of the preceding stage can be considered, and the scribe line just in accordance with the shape of the scribe line LA1 can be formed. L1 is adjacent to the adjacent line (narrow pitch position) of the scribe line L A1. The score line L1 formed by the laser scoring device 1 is tilted or curved if the first process in the preceding stage is tilted or bent by the scribe line LA1 formed by another machine. The shape of LA1. Therefore, there is no scribe line lai, L1 is in contact with each other' or because the interval d between the scribe line LA 1 and the scribe line l 1 is enlarged to make the dead zone (the area that does not contribute to the power generation between the scribe lines) As a result, it is possible to prevent the power generation efficiency of the thin film solar panel from being lowered. Further, since the laser irradiation head 73 is made of a light structure by reducing the contents, the tracking property and the responsiveness of the operation are excellent, and the precision is excellent. Further, the scribe line formed by the correction by the dummy line data D2 is not formed, for example, as shown in Fig. 6, and has a shape in which the self-engraving 绛L A1 [interval size error] is enlarged. Next, the glass substrate carrying out step §5〇〇 will be described with reference to Figs. 12 and 13 [S510 returns the glass substrate to the receiving position (t17 in Fig. 13)] 201032931 When the formation of the scribe line is completed, the linear motor 5 2 Y is based on Signal driven by control device 9 The holder group 51 is in the -Υ direction. Accordingly, the downstream glass substrate 移动 moves in the -Υ direction and returns to the receiving position Ρ7. When the glass substrate is moved in the -Υ direction, the downstream side is used. When the floating support by the stage 31 is moved to the floating support by the main platform 31 on the upstream side, the glass substrate Κ is supported by the air ejected from the sub-stage 32, so that even the recovery hole portion moves. It is also smooth and reliable. [S5 20 raises the ejector pin (t8, tl9 of Fig. 13)] Φ grips the gripper group 51 of the glass substrate — - returns to the receiving position ρ7, and the pole drive unit 42 is controlled by the control device The 9 transmitted signal rises in conjunction with the pin frame 41 to the floating surface position Ρ4. Accordingly, the ejector pin 43 is raised from the lower limit position Ρ2, and the tip end portion abuts against the bottom surface of the forehead portion Kf in the glass substrate Κ. At this stage, the glass substrate K is separated from the ejector pin 43 and the air branch by the holder 53. [S5 30 Opening the gripper (t20 of Fig. 13)] If the ejector pin 43 is raised and the tip end portion abuts against the bottom surface of the fore edge portion Kf of the glass substrate κ, each gripper 53 is transmitted by the control device 9. The signal of the wheel © opens the closed movable claw and releases the glass substrate κ. At this stage, the glass substrate is supported by the ejector pin 43 and the air. [S540 gripper group in the avoidance position (t2l of Fig. 13)] Each gripper 53 - releases the glass substrate κ, the signal transmitted by the gripper group 5 ι control device 9 is driven, • Η is moved by the holding position P5 In response to the avoidance position Ρ6β, the clamp 11 group is moved to the avoidance position Ρ6'. The frame drive unit 42 drives the lock frame 4i according to the signal transmitted from the control unit 9 at the root 29 201032931. According to this, the ejector pin 43 is raised from the floating surface position P4 to the upper limit position N in a state where the tip end portion abuts against the bottom surface of the forehead portion Kf in the glass substrate K. At this stage of the glass, the substrate κ is in a state of being completely raised by the floating surface position P4 and supported only by the ejector pin 43. [S560 gripper group is in the position to be avoided (seventh, ^5 in Fig. 13)] glass substrate Κ - becomes the upper limit position p. The linear motor 52 γ drives the gripper group 51 to + γ according to the signal transmitted from the control device 9. direction. According to this, the gripper group 51 is moved from the receiving position Ρ7 to the to-be-avoided position ρ8. Then, each gripper 53 closes the open movable pawl 0 according to the signal transmitted from the control device 9 [S570 transmits the glass substrate (t26, t27 of Fig. 13)] the gripper group 51 - moves to the to-be-avoided position 卩 8, the operator In the operation of moving in and out of the robot arm ίο, the glass substrate K supported only by the ejector pin 43 is transmitted to the bogie or the pallet by the laser scribing device j. Specifically, the arm a is first operated, and the suction hand 11 is disposed above the glass substrate supported by the ejection pin 43. © Next, the adsorption hand 11 is lowered to the height of the non-film formation surface in the glass substrate κ. Next, the adsorption target 1 is used to adsorb the plural portions of the non-composite surface of the glass substrate κ. Next, the arm 12 is operated to take the glass-phosphorus substrate κ adsorbed by the handcuff to the position of the trolley or the pallet. Then, the adsorption holding by the adsorption hand u is released, and the glass substrate K is manually carried out to the carriage or the pallet. The embodiments of the present invention have been described above, but the above-described embodiments are merely illustrative, and the scope of the present invention is not limited to the embodiments. The scope of the present invention is to be construed as being limited by the scope of the appended claims. That is, the structure, shape, size, material, number, and the like of the entire or a part of the laser scribing device 1 can be variously changed in accordance with the gist of the present invention. Further, in the present embodiment, the substrate processing apparatus is a laser scribing apparatus, and can be applied to an apparatus other than the laser scribing apparatus, for example, for exposing a film formed on a glass substrate. A device or the like for marking or cutting a glass substrate. Further, in the above-described embodiment, the position of the laser irradiation head 73 is corrected by the minute drive of the linear motor 74Y, and the operation of the scribe line LA1 is performed. The driving operation of all or a part of each of the medium moving portion 'and the linear motor 52Y in each direction may be driven on the side of the glass substrate K. Alternatively, the glass substrate K may be driven by using a current mirror (gaivan〇_mirr〇r) or the like. Further, although the laser scribing apparatus 1 is a device for forming the scribe lines L1, L2, ..., the amorphous ruthenium film K j 2 over the TC0 film K j ,, that is, the device for the second process ©, The metal film Kj3 formed on the amorphous germanium film Kj2 forms a scribe line, that is, the laser engraving for the third process can also be 0. [Simplified illustration] FIG. 1 is related to the present invention. An oblique view of the appearance of the laser scoring device. Fig. 2 is a plan view showing a main part of the laser scoring apparatus. Figure 3 is a front elevational view showing the main portion of the laser scoring device. 31 201032931 Figure 4 is an oblique view showing the street _ 宁射单疋.

Fig. 5 is a connection diagram of the connection between the control device and the various components in the turtle + $ A touchless scoring device. Fig. 6 is a view for explaining the main part of the present invention. Fig. 7 is a circle showing the relationship between the driving direction of the turtle-_head drive unit and the gripper group drive unit. Figure 8 is a three-sided view of a glass substrate K on which JSs —.. is v" not formed by a laser scoring device.

Fig. 9 is a flow chart showing the basic operation of the + A cautionary laser scoring apparatus and the operational procedure of the imitation element purchase. Fig. 10 is a flow chart showing the operation procedure of the step of carrying out the glass substrate. Figure 11 is a flow chart showing the action procedure of the + t " not scribing step.囷12 is a flow chart of the operation procedure of the turtle's and the glass substrate unloading step. Figure 13 is a timing circle showing the basic operation of the laserless scoring device. Figure 1 shows the timing diagram of the scribing action. 15 ®

G 疋 Describes the process of forming a laser pattern for the fabrication of thin film solar panels.圏16 is a circle showing a state in which the score line formed by the present invention is not used. [Main element symbol description] 1: Laser scribing device 2: Machine table 3: Floating platform 4: Elevator unit 32 201032931 5: Transfer unit 6 : Substrate positioning device 7 : Laser unit 8 : Dust collecting unit 9 : Control device 10 : Loading and unloading robot arm 11 : Adsorption hand 12 : Arm φ 1 3 : Vacuum pump 1 4 : Motor 15 : Frame 1 6 : Suction pad 1 7 : Operation 2 1 : pedestal portion 22 : portal frame 31 : main platform © 32 : sub-stage 33 : blower unit 41 : pin frame 41 a : peripheral frame 41 b : center frame 42 : frame drive portion 43 : ejection Pin 51: gripper group 33 201032931 52: gripper group drive unit 52Y, 74X, 74Y, 76X: linear motor 53: gripper 61: press roller 6 2 : cylinder 71: laser oscillator 72: irradiation Optical system 73: laser irradiation head 10 74: head driving unit 76: box 77: camera 81: tray 8 2: piping 83: vacuum chamber 91: input/output device 92: memory unit (memory means) φ 93 ·· Processing unit (calculation means) 95: hard disk device 9 6 : interface circuit 311 : floating unit 311h, 321h: air ejection hole 321 : floating Element 721: Mechanical shutters 722a-722h: Mirror 34 201032931 723: Beam expander 724: Attenuator 7 31: Return mirror 732: Focus lens 733. Condenser 735: Laser illumination window b2: Laser light D1: Image data φ D 2 : Imitation element line data K: glass substrate

Kf : front edge portion K j of glass substrate K : circuit forming material Kjl : TC0 film K j 2 : amorphous germanium film K j 3 : metal film L1 : first strip line QL Γ : scribe line L2: The second scribe line L3: the third scribe line LAI, LA2: scribe line P1: upper limit position P2: lower limit position P3: position above the floating surface P4: floating surface position 35 201032931 P5: holding position P 6 : Avoidance position P7: Accept position P8: Waiting position P 9 : Initial position P10 : Terminal position

Claims (1)

201032931 VII. Patent application scope: 1. A laser processing method, which forms a prescribed pattern by processing relative to a driving substrate, and its characteristics include: The data formed on the substrate in a specific front-end process is regarded as an Aoyuan line data. The obtained meta-line data is taken according to the imitation 7L line data, and the trajectory tracked by the laser light of the driving substrate and the lightning process becomes a second pattern forming step of patterning the first shape and forming the second pattern. ® 2. The laser processing substrate of the first application of the patent application is formed on a surface of at least one of the plurality of layers, and the first pattern of the memory circuit forming material is calculated in the step of obtaining the dummy line data. The meta-line data is formed into a second pattern in the second layer according to the imitation meta-line data. 3. In the first or second aspect of the patent application, wherein the substrate is composed of a glass substrate for forming a material for forming a thin film solar cell 10, and the power of the material for forming the laser optical circuit is used for Make a thin process. 4, a laser processing device, formed by a relative drive substrate to form a predetermined pattern, the characteristics of which include: the specific data formed on the substrate in the process of the front segment is taken as the material of the ray element line data obtained according to the imitation a line data, a step of driving the substrate and the lightning substrate in a shape of the laser light; and a method of illuminating the shape of the pattern in the rear stage, wherein the circuit forming material is formed on the first layer The second pattern-shaped road is formed by a material-shaped laser processing method, and the electricity of the manufacture of the pool plate is adjusted to a means for marking the substrate of the solar panel and the shape of the laser light in a pattern; and the light is emitted in the latter stage 37 The shape of the shape of the track tracked by the laser light of the process of 201032931 is the segment obtained by the circuit-shaped means for forming the material layer in the road; the memory is formed by the second case forming material to form the second pair and form the second The second pattern...the first pattern - rd, the means of formation. 5. If you apply for the fourth section of the patent garden, the substrate is formed on the surface of at least one of the first surface of the electroforming material composed of a plurality of M equipment materials and the imitation element data acquisition means. In the section, the calculation of the imitation meta-line data is calculated from the image data of 43⁄4. &A: The memory means of the imitation meta-line data calculated by the segment is based on the imitation meta-line data, and the circuit formation in the second layer is pattern. A laser processing apparatus according to the fourth or fifth aspect of the invention, wherein the substrate is formed of a glass substrate on which a circuit forming material for manufacturing a thin film solar cell is formed, comprising irradiation scribeable A laser irradiation head for laser light of a circuit forming material is used in a process for manufacturing a thin film solar panel. 38