TW201023307A - Ceramic substrate having thermal via - Google Patents

Ceramic substrate having thermal via Download PDF

Info

Publication number
TW201023307A
TW201023307A TW097148703A TW97148703A TW201023307A TW 201023307 A TW201023307 A TW 201023307A TW 097148703 A TW097148703 A TW 097148703A TW 97148703 A TW97148703 A TW 97148703A TW 201023307 A TW201023307 A TW 201023307A
Authority
TW
Taiwan
Prior art keywords
thermal via
ceramic substrate
reinforcing structure
quot
height
Prior art date
Application number
TW097148703A
Other languages
English (en)
Chinese (zh)
Inventor
Hidefumi Narita
Akira Inaba
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW201023307A publication Critical patent/TW201023307A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW097148703A 2007-12-11 2008-12-12 Ceramic substrate having thermal via TW201023307A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/001,267 US20090146295A1 (en) 2007-12-11 2007-12-11 Ceramic substrate having thermal via

Publications (1)

Publication Number Publication Date
TW201023307A true TW201023307A (en) 2010-06-16

Family

ID=40637680

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097148703A TW201023307A (en) 2007-12-11 2008-12-12 Ceramic substrate having thermal via

Country Status (5)

Country Link
US (1) US20090146295A1 (https=)
JP (1) JP2011507276A (https=)
CN (1) CN101874299B (https=)
TW (1) TW201023307A (https=)
WO (1) WO2009076494A2 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101491138B1 (ko) * 2007-12-12 2015-02-09 엘지이노텍 주식회사 다층 기판 및 이를 구비한 발광 다이오드 모듈
US20100140790A1 (en) * 2008-12-05 2010-06-10 Seagate Technology Llc Chip having thermal vias and spreaders of cvd diamond
US8757874B2 (en) 2010-05-03 2014-06-24 National Instruments Corporation Temperature sensing system and method
WO2012055206A1 (zh) * 2010-10-26 2012-05-03 Yu Jianping 氧化铝/石墨复合陶瓷材料和采用该材料为基板的led光源
KR101289186B1 (ko) * 2011-04-15 2013-07-26 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US9006770B2 (en) * 2011-05-18 2015-04-14 Tsmc Solid State Lighting Ltd. Light emitting diode carrier
US8908383B1 (en) * 2012-05-21 2014-12-09 Triquint Semiconductor, Inc. Thermal via structures with surface features
US9318466B2 (en) * 2014-08-28 2016-04-19 Globalfoundries Inc. Method for electronic circuit assembly on a paper substrate
US11378465B2 (en) * 2018-11-09 2022-07-05 Siemens Aktiengesellschaft Assembly for determining the temperature of a surface
CN117769163B (zh) * 2023-12-26 2024-05-31 江苏富乐华半导体科技股份有限公司 一种铝薄膜电路基板制备方法

Family Cites Families (23)

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JPS59230741A (ja) * 1983-06-15 1984-12-25 株式会社日立製作所 形状記憶複合材料
US4894115A (en) * 1989-02-14 1990-01-16 General Electric Company Laser beam scanning method for forming via holes in polymer materials
JPH07221218A (ja) * 1994-02-03 1995-08-18 Toshiba Corp 半導体装置
US5802699A (en) * 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5558267A (en) * 1995-03-31 1996-09-24 Texas Instruments Incorporated Moat for die pad cavity in bond station heater block
JPH0955459A (ja) * 1995-06-06 1997-02-25 Seiko Epson Corp 半導体装置
US6247228B1 (en) * 1996-08-12 2001-06-19 Tessera, Inc. Electrical connection with inwardly deformable contacts
JP3650689B2 (ja) * 1997-05-28 2005-05-25 三菱電機株式会社 半導体装置
US6395998B1 (en) * 2000-09-13 2002-05-28 International Business Machines Corporation Electronic package having an adhesive retaining cavity
DE10051547A1 (de) * 2000-10-18 2002-04-25 Bosch Gmbh Robert Baugruppenträger für elektrische/elektronische Bauelemente
US6750516B2 (en) * 2001-10-18 2004-06-15 Hewlett-Packard Development Company, L.P. Systems and methods for electrically isolating portions of wafers
US6541712B1 (en) * 2001-12-04 2003-04-01 Teradyhe, Inc. High speed multi-layer printed circuit board via
US7152312B2 (en) * 2002-02-11 2006-12-26 Adc Dsl Systems, Inc. Method for transmitting current through a substrate
JP2003338577A (ja) * 2002-05-21 2003-11-28 Murata Mfg Co Ltd 回路基板装置
US6977346B2 (en) * 2002-06-10 2005-12-20 Visteon Global Technologies, Inc. Vented circuit board for cooling power components
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JP2004165291A (ja) * 2002-11-11 2004-06-10 Tokuyama Corp ビアホール付きセラミック基板及びその製造方法
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Also Published As

Publication number Publication date
WO2009076494A2 (en) 2009-06-18
US20090146295A1 (en) 2009-06-11
CN101874299A (zh) 2010-10-27
WO2009076494A3 (en) 2009-07-30
CN101874299B (zh) 2012-04-04
JP2011507276A (ja) 2011-03-03

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