TW201017721A - Insulated pad conditional and method of using same - Google Patents
Insulated pad conditional and method of using same Download PDFInfo
- Publication number
- TW201017721A TW201017721A TW098136555A TW98136555A TW201017721A TW 201017721 A TW201017721 A TW 201017721A TW 098136555 A TW098136555 A TW 098136555A TW 98136555 A TW98136555 A TW 98136555A TW 201017721 A TW201017721 A TW 201017721A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- carrier
- abrasive
- abrasive surface
- disk
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract description 18
- 230000003750 conditioning effect Effects 0.000 claims abstract description 21
- 239000000615 nonconductor Substances 0.000 claims abstract description 12
- 238000005498 polishing Methods 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 22
- 239000002245 particle Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 13
- 239000004033 plastic Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000010935 stainless steel Substances 0.000 claims description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000005060 rubber Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims description 3
- 229910000906 Bronze Inorganic materials 0.000 claims description 2
- 239000010974 bronze Substances 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000007799 cork Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000005121 nitriding Methods 0.000 claims description 2
- 239000000123 paper Substances 0.000 claims description 2
- 239000002023 wood Substances 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims 2
- 239000011651 chromium Substances 0.000 claims 2
- 229910052580 B4C Inorganic materials 0.000 claims 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- XONMHGLIXCOULQ-UHFFFAOYSA-N [O-2].[Ce+3].[O-2].[Al+3] Chemical compound [O-2].[Ce+3].[O-2].[Al+3] XONMHGLIXCOULQ-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052810 boron oxide Inorganic materials 0.000 claims 1
- 238000005034 decoration Methods 0.000 claims 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims 1
- 229910001651 emery Inorganic materials 0.000 claims 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims 1
- 229910001120 nichrome Inorganic materials 0.000 claims 1
- 239000012811 non-conductive material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 229910003468 tantalcarbide Inorganic materials 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 27
- 238000000227 grinding Methods 0.000 description 7
- 238000010292 electrical insulation Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007517 polishing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001257 Nb alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910000419 boron suboxide Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009264 composting Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- -1 for example Chemical class 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/007—Cleaning of grinding wheels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- General Preparation And Processing Of Foods (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/797,890 US7125324B2 (en) | 2004-03-09 | 2004-03-09 | Insulated pad conditioner and method of using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201017721A true TW201017721A (en) | 2010-05-01 |
Family
ID=34920153
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098136555A TW201017721A (en) | 2004-03-09 | 2005-02-16 | Insulated pad conditional and method of using same |
| TW094104498A TW200539255A (en) | 2004-03-09 | 2005-02-16 | Insulated pad conditional and method of using same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094104498A TW200539255A (en) | 2004-03-09 | 2005-02-16 | Insulated pad conditional and method of using same |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US7125324B2 (enExample) |
| EP (1) | EP1722925B1 (enExample) |
| JP (1) | JP2007528299A (enExample) |
| KR (1) | KR20090130084A (enExample) |
| CN (1) | CN1929955B (enExample) |
| AT (1) | ATE480367T1 (enExample) |
| DE (1) | DE602005023419D1 (enExample) |
| MY (1) | MY135125A (enExample) |
| TW (2) | TW201017721A (enExample) |
| WO (1) | WO2005095055A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
| US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
| US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US7427337B2 (en) * | 1998-12-01 | 2008-09-23 | Novellus Systems, Inc. | System for electropolishing and electrochemical mechanical polishing |
| US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
| US8398466B2 (en) | 2006-11-16 | 2013-03-19 | Chien-Min Sung | CMP pad conditioners with mosaic abrasive segments and associated methods |
| US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
| US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
| US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
| US20080061985A1 (en) * | 2006-08-31 | 2008-03-13 | Symbol Technologies, Inc. | Visual display of RFID tag content via laser projection display |
| TWI388402B (en) * | 2007-12-06 | 2013-03-11 | Methods for orienting superabrasive particles on a surface and associated tools | |
| US8496511B2 (en) | 2010-07-15 | 2013-07-30 | 3M Innovative Properties Company | Cathodically-protected pad conditioner and method of use |
| CN102601722A (zh) * | 2011-01-20 | 2012-07-25 | 中芯国际集成电路制造(上海)有限公司 | 一种研磨方法和研磨装置 |
| WO2012162430A2 (en) | 2011-05-23 | 2012-11-29 | Chien-Min Sung | Cmp pad dresser having leveled tips and associated methods |
| KR101311330B1 (ko) * | 2012-06-12 | 2013-09-25 | 주식회사 덕성 | 반도체 씨엠피 가공장치용 템플레이트 어셈블리 |
| US9227294B2 (en) * | 2013-12-31 | 2016-01-05 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and method for chemical mechanical polishing |
| US10967478B2 (en) * | 2017-09-29 | 2021-04-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chemical mechanical polishing apparatus and method |
| WO2019210278A1 (en) | 2018-04-27 | 2019-10-31 | Saint-Gobain Ceramics & Plastics, Inc. | Material including boron suboxide and method of forming same |
| CN111421462B (zh) * | 2019-01-08 | 2022-03-22 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨方法 |
| CN110328607B (zh) * | 2019-08-05 | 2020-05-29 | 衢州学院 | 一种利用电场效应增强加工区域酸碱度的锗平面镜化学抛光方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5196353A (en) * | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| JP3036348B2 (ja) * | 1994-03-23 | 2000-04-24 | 三菱マテリアル株式会社 | ウェーハ研磨パッドのツルーイング装置 |
| US5637031A (en) * | 1996-06-07 | 1997-06-10 | Industrial Technology Research Institute | Electrochemical simulator for chemical-mechanical polishing (CMP) |
| US5911619A (en) * | 1997-03-26 | 1999-06-15 | International Business Machines Corporation | Apparatus for electrochemical mechanical planarization |
| US5807165A (en) * | 1997-03-26 | 1998-09-15 | International Business Machines Corporation | Method of electrochemical mechanical planarization |
| WO1999026758A1 (en) | 1997-11-25 | 1999-06-03 | John Hopkins University | Electrochemical-control of abrasive polishing and machining rates |
| US6123612A (en) * | 1998-04-15 | 2000-09-26 | 3M Innovative Properties Company | Corrosion resistant abrasive article and method of making |
| JP3295888B2 (ja) * | 1998-04-22 | 2002-06-24 | 株式会社藤森技術研究所 | ケミカルマシンポリッシャの研磨盤用研磨ドレッサ |
| US6176992B1 (en) | 1998-11-03 | 2001-01-23 | Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
| US6328872B1 (en) | 1999-04-03 | 2001-12-11 | Nutool, Inc. | Method and apparatus for plating and polishing a semiconductor substrate |
| US6263605B1 (en) * | 1998-12-21 | 2001-07-24 | Motorola, Inc. | Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor |
| US6066030A (en) * | 1999-03-04 | 2000-05-23 | International Business Machines Corporation | Electroetch and chemical mechanical polishing equipment |
| JP2002540972A (ja) * | 1999-04-01 | 2002-12-03 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | ２重ｃｍｐパッド調整装置 |
| US6135863A (en) * | 1999-04-20 | 2000-10-24 | Memc Electronic Materials, Inc. | Method of conditioning wafer polishing pads |
| JP3387858B2 (ja) * | 1999-08-25 | 2003-03-17 | 理化学研究所 | ポリッシングパッドコンディショナー |
| US6379223B1 (en) * | 1999-11-29 | 2002-04-30 | Applied Materials, Inc. | Method and apparatus for electrochemical-mechanical planarization |
| US6666754B1 (en) * | 2000-01-18 | 2003-12-23 | Advanced Micro Devices, Inc. | Method and apparatus for determining CMP pad conditioner effectiveness |
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| US6517424B2 (en) * | 2000-03-10 | 2003-02-11 | Abrasive Technology, Inc. | Protective coatings for CMP conditioning disk |
| KR100360469B1 (ko) * | 2000-05-09 | 2002-11-08 | 삼성전자 주식회사 | 화학기계적 연마장치의 연마패드 컨디셔닝 장치 |
| US6494765B2 (en) * | 2000-09-25 | 2002-12-17 | Center For Tribology, Inc. | Method and apparatus for controlled polishing |
| WO2002028598A1 (en) * | 2000-10-02 | 2002-04-11 | Rodel Holdings, Inc. | Method for conditioning polishing pads |
| US7128825B2 (en) * | 2001-03-14 | 2006-10-31 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US6932896B2 (en) * | 2001-03-30 | 2005-08-23 | Nutool, Inc. | Method and apparatus for avoiding particle accumulation in electrodeposition |
| EP1478708A1 (en) * | 2002-02-26 | 2004-11-24 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US7011566B2 (en) * | 2002-08-26 | 2006-03-14 | Micron Technology, Inc. | Methods and systems for conditioning planarizing pads used in planarizing substrates |
| US6722948B1 (en) * | 2003-04-25 | 2004-04-20 | Lsi Logic Corporation | Pad conditioning monitor |
-
2004
- 2004-03-09 US US10/797,890 patent/US7125324B2/en not_active Expired - Lifetime
-
2005
- 2005-01-25 AT AT05722530T patent/ATE480367T1/de not_active IP Right Cessation
- 2005-01-25 DE DE602005023419T patent/DE602005023419D1/de not_active Expired - Lifetime
- 2005-01-25 CN CN2005800077568A patent/CN1929955B/zh not_active Expired - Fee Related
- 2005-01-25 KR KR1020097022337A patent/KR20090130084A/ko not_active Ceased
- 2005-01-25 EP EP05722530A patent/EP1722925B1/en not_active Expired - Lifetime
- 2005-01-25 WO PCT/US2005/002309 patent/WO2005095055A1/en not_active Ceased
- 2005-01-25 JP JP2007502803A patent/JP2007528299A/ja active Pending
- 2005-02-16 TW TW098136555A patent/TW201017721A/zh unknown
- 2005-02-16 TW TW094104498A patent/TW200539255A/zh unknown
- 2005-02-18 MY MYPI20050643A patent/MY135125A/en unknown
-
2006
- 2006-04-18 US US11/405,862 patent/US7247577B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20050202676A1 (en) | 2005-09-15 |
| WO2005095055A1 (en) | 2005-10-13 |
| US20060189140A1 (en) | 2006-08-24 |
| CN1929955B (zh) | 2010-06-16 |
| ATE480367T1 (de) | 2010-09-15 |
| MY135125A (en) | 2008-02-29 |
| KR20090130084A (ko) | 2009-12-17 |
| CN1929955A (zh) | 2007-03-14 |
| JP2007528299A (ja) | 2007-10-11 |
| EP1722925A1 (en) | 2006-11-22 |
| US7247577B2 (en) | 2007-07-24 |
| TW200539255A (en) | 2005-12-01 |
| US7125324B2 (en) | 2006-10-24 |
| EP1722925B1 (en) | 2010-09-08 |
| DE602005023419D1 (de) | 2010-10-21 |
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