JP2007528299A - 絶縁パッドコンディショナおよびその使用方法 - Google Patents

絶縁パッドコンディショナおよびその使用方法 Download PDF

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Publication number
JP2007528299A
JP2007528299A JP2007502803A JP2007502803A JP2007528299A JP 2007528299 A JP2007528299 A JP 2007528299A JP 2007502803 A JP2007502803 A JP 2007502803A JP 2007502803 A JP2007502803 A JP 2007502803A JP 2007528299 A JP2007528299 A JP 2007528299A
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JP
Japan
Prior art keywords
carrier
polishing surface
polishing
electrode
conditioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007502803A
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English (en)
Japanese (ja)
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JP2007528299A5 (enExample
Inventor
エム． パルムグレン，ゲーリー
ディー． ゴーアーズ，ブライアン
ジェイ． フィシャー，ダグラス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2007528299A publication Critical patent/JP2007528299A/ja
Publication of JP2007528299A5 publication Critical patent/JP2007528299A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007—Cleaning of grinding wheels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • General Preparation And Processing Of Foods (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
JP2007502803A 2004-03-09 2005-01-25 絶縁パッドコンディショナおよびその使用方法 Pending JP2007528299A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/797,890 US7125324B2 (en) 2004-03-09 2004-03-09 Insulated pad conditioner and method of using same
PCT/US2005/002309 WO2005095055A1 (en) 2004-03-09 2005-01-25 Insulated pad conditioner and method of using same

Publications (2)

Publication Number Publication Date
JP2007528299A true JP2007528299A (ja) 2007-10-11
JP2007528299A5 JP2007528299A5 (enExample) 2008-03-13

Family

ID=34920153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007502803A Pending JP2007528299A (ja) 2004-03-09 2005-01-25 絶縁パッドコンディショナおよびその使用方法

Country Status (10)

Country Link
US (2) US7125324B2 (enExample)
EP (1) EP1722925B1 (enExample)
JP (1) JP2007528299A (enExample)
KR (1) KR20090130084A (enExample)
CN (1) CN1929955B (enExample)
AT (1) ATE480367T1 (enExample)
DE (1) DE602005023419D1 (enExample)
MY (1) MY135125A (enExample)
TW (2) TW201017721A (enExample)
WO (1) WO2005095055A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013534734A (ja) * 2010-07-15 2013-09-05 スリーエム イノベイティブ プロパティズ カンパニー 陰極防食したパッドコンディショナー及び使用方法

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US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US7427337B2 (en) * 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US20080061985A1 (en) * 2006-08-31 2008-03-13 Symbol Technologies, Inc. Visual display of RFID tag content via laser projection display
TWI388402B (en) * 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
CN102601722A (zh) * 2011-01-20 2012-07-25 中芯国际集成电路制造(上海)有限公司 一种研磨方法和研磨装置
WO2012162430A2 (en) 2011-05-23 2012-11-29 Chien-Min Sung Cmp pad dresser having leveled tips and associated methods
KR101311330B1 (ko) * 2012-06-12 2013-09-25 주식회사 덕성 반도체 씨엠피 가공장치용 템플레이트 어셈블리
US9227294B2 (en) * 2013-12-31 2016-01-05 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and method for chemical mechanical polishing
US10967478B2 (en) * 2017-09-29 2021-04-06 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method
WO2019210278A1 (en) 2018-04-27 2019-10-31 Saint-Gobain Ceramics & Plastics, Inc. Material including boron suboxide and method of forming same
CN111421462B (zh) * 2019-01-08 2022-03-22 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法
CN110328607B (zh) * 2019-08-05 2020-05-29 衢州学院 一种利用电场效应增强加工区域酸碱度的锗平面镜化学抛光方法

Citations (1)

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WO2003072672A1 (en) * 2002-02-26 2003-09-04 Applied Materials, Inc. Method and composition for polishing a substrate

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US5196353A (en) * 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
JP3036348B2 (ja) * 1994-03-23 2000-04-24 三菱マテリアル株式会社 ウェーハ研磨パッドのツルーイング装置
US5637031A (en) * 1996-06-07 1997-06-10 Industrial Technology Research Institute Electrochemical simulator for chemical-mechanical polishing (CMP)
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
US5807165A (en) * 1997-03-26 1998-09-15 International Business Machines Corporation Method of electrochemical mechanical planarization
WO1999026758A1 (en) 1997-11-25 1999-06-03 John Hopkins University Electrochemical-control of abrasive polishing and machining rates
US6123612A (en) * 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
JP3295888B2 (ja) * 1998-04-22 2002-06-24 株式会社藤森技術研究所 ケミカルマシンポリッシャの研磨盤用研磨ドレッサ
US6176992B1 (en) 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6328872B1 (en) 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6263605B1 (en) * 1998-12-21 2001-07-24 Motorola, Inc. Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment
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US6135863A (en) * 1999-04-20 2000-10-24 Memc Electronic Materials, Inc. Method of conditioning wafer polishing pads
JP3387858B2 (ja) * 1999-08-25 2003-03-17 理化学研究所 ポリッシングパッドコンディショナー
US6379223B1 (en) * 1999-11-29 2002-04-30 Applied Materials, Inc. Method and apparatus for electrochemical-mechanical planarization
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US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
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US6494765B2 (en) * 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
WO2002028598A1 (en) * 2000-10-02 2002-04-11 Rodel Holdings, Inc. Method for conditioning polishing pads
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US6932896B2 (en) * 2001-03-30 2005-08-23 Nutool, Inc. Method and apparatus for avoiding particle accumulation in electrodeposition
US7011566B2 (en) * 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
US6722948B1 (en) * 2003-04-25 2004-04-20 Lsi Logic Corporation Pad conditioning monitor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003072672A1 (en) * 2002-02-26 2003-09-04 Applied Materials, Inc. Method and composition for polishing a substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013534734A (ja) * 2010-07-15 2013-09-05 スリーエム イノベイティブ プロパティズ カンパニー 陰極防食したパッドコンディショナー及び使用方法

Also Published As

Publication number Publication date
US20050202676A1 (en) 2005-09-15
WO2005095055A1 (en) 2005-10-13
US20060189140A1 (en) 2006-08-24
CN1929955B (zh) 2010-06-16
ATE480367T1 (de) 2010-09-15
MY135125A (en) 2008-02-29
KR20090130084A (ko) 2009-12-17
CN1929955A (zh) 2007-03-14
EP1722925A1 (en) 2006-11-22
US7247577B2 (en) 2007-07-24
TW200539255A (en) 2005-12-01
US7125324B2 (en) 2006-10-24
EP1722925B1 (en) 2010-09-08
DE602005023419D1 (de) 2010-10-21
TW201017721A (en) 2010-05-01

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