JP2007528299A5 - - Google Patents

Download PDF

Info

Publication number
JP2007528299A5
JP2007528299A5 JP2007502803A JP2007502803A JP2007528299A5 JP 2007528299 A5 JP2007528299 A5 JP 2007528299A5 JP 2007502803 A JP2007502803 A JP 2007502803A JP 2007502803 A JP2007502803 A JP 2007502803A JP 2007528299 A5 JP2007528299 A5 JP 2007528299A5
Authority
JP
Japan
Prior art keywords
electrode
polishing pad
polishing surface
polishing
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007502803A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007528299A (ja
Filing date
Publication date
Priority claimed from US10/797,890 external-priority patent/US7125324B2/en
Application filed filed Critical
Publication of JP2007528299A publication Critical patent/JP2007528299A/ja
Publication of JP2007528299A5 publication Critical patent/JP2007528299A5/ja
Pending legal-status Critical Current

Links

JP2007502803A 2004-03-09 2005-01-25 絶縁パッドコンディショナおよびその使用方法 Pending JP2007528299A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/797,890 US7125324B2 (en) 2004-03-09 2004-03-09 Insulated pad conditioner and method of using same
PCT/US2005/002309 WO2005095055A1 (en) 2004-03-09 2005-01-25 Insulated pad conditioner and method of using same

Publications (2)

Publication Number Publication Date
JP2007528299A JP2007528299A (ja) 2007-10-11
JP2007528299A5 true JP2007528299A5 (enExample) 2008-03-13

Family

ID=34920153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007502803A Pending JP2007528299A (ja) 2004-03-09 2005-01-25 絶縁パッドコンディショナおよびその使用方法

Country Status (10)

Country Link
US (2) US7125324B2 (enExample)
EP (1) EP1722925B1 (enExample)
JP (1) JP2007528299A (enExample)
KR (1) KR20090130084A (enExample)
CN (1) CN1929955B (enExample)
AT (1) ATE480367T1 (enExample)
DE (1) DE602005023419D1 (enExample)
MY (1) MY135125A (enExample)
TW (2) TW201017721A (enExample)
WO (1) WO2005095055A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US7427337B2 (en) * 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US20080061985A1 (en) * 2006-08-31 2008-03-13 Symbol Technologies, Inc. Visual display of RFID tag content via laser projection display
TWI388402B (en) * 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
US8496511B2 (en) 2010-07-15 2013-07-30 3M Innovative Properties Company Cathodically-protected pad conditioner and method of use
CN102601722A (zh) * 2011-01-20 2012-07-25 中芯国际集成电路制造(上海)有限公司 一种研磨方法和研磨装置
WO2012162430A2 (en) 2011-05-23 2012-11-29 Chien-Min Sung Cmp pad dresser having leveled tips and associated methods
KR101311330B1 (ko) * 2012-06-12 2013-09-25 주식회사 덕성 반도체 씨엠피 가공장치용 템플레이트 어셈블리
US9227294B2 (en) * 2013-12-31 2016-01-05 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and method for chemical mechanical polishing
US10967478B2 (en) * 2017-09-29 2021-04-06 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method
WO2019210278A1 (en) 2018-04-27 2019-10-31 Saint-Gobain Ceramics & Plastics, Inc. Material including boron suboxide and method of forming same
CN111421462B (zh) * 2019-01-08 2022-03-22 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法
CN110328607B (zh) * 2019-08-05 2020-05-29 衢州学院 一种利用电场效应增强加工区域酸碱度的锗平面镜化学抛光方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196353A (en) * 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
JP3036348B2 (ja) * 1994-03-23 2000-04-24 三菱マテリアル株式会社 ウェーハ研磨パッドのツルーイング装置
US5637031A (en) * 1996-06-07 1997-06-10 Industrial Technology Research Institute Electrochemical simulator for chemical-mechanical polishing (CMP)
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
US5807165A (en) * 1997-03-26 1998-09-15 International Business Machines Corporation Method of electrochemical mechanical planarization
WO1999026758A1 (en) 1997-11-25 1999-06-03 John Hopkins University Electrochemical-control of abrasive polishing and machining rates
US6123612A (en) * 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
JP3295888B2 (ja) * 1998-04-22 2002-06-24 株式会社藤森技術研究所 ケミカルマシンポリッシャの研磨盤用研磨ドレッサ
US6176992B1 (en) 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6328872B1 (en) 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6263605B1 (en) * 1998-12-21 2001-07-24 Motorola, Inc. Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment
JP2002540972A (ja) * 1999-04-01 2002-12-03 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ２重ｃｍｐパッド調整装置
US6135863A (en) * 1999-04-20 2000-10-24 Memc Electronic Materials, Inc. Method of conditioning wafer polishing pads
JP3387858B2 (ja) * 1999-08-25 2003-03-17 理化学研究所 ポリッシングパッドコンディショナー
US6379223B1 (en) * 1999-11-29 2002-04-30 Applied Materials, Inc. Method and apparatus for electrochemical-mechanical planarization
US6666754B1 (en) * 2000-01-18 2003-12-23 Advanced Micro Devices, Inc. Method and apparatus for determining CMP pad conditioner effectiveness
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US6517424B2 (en) * 2000-03-10 2003-02-11 Abrasive Technology, Inc. Protective coatings for CMP conditioning disk
KR100360469B1 (ko) * 2000-05-09 2002-11-08 삼성전자 주식회사 화학기계적 연마장치의 연마패드 컨디셔닝 장치
US6494765B2 (en) * 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
WO2002028598A1 (en) * 2000-10-02 2002-04-11 Rodel Holdings, Inc. Method for conditioning polishing pads
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US6932896B2 (en) * 2001-03-30 2005-08-23 Nutool, Inc. Method and apparatus for avoiding particle accumulation in electrodeposition
EP1478708A1 (en) * 2002-02-26 2004-11-24 Applied Materials, Inc. Method and composition for polishing a substrate
US7011566B2 (en) * 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
US6722948B1 (en) * 2003-04-25 2004-04-20 Lsi Logic Corporation Pad conditioning monitor

Similar Documents

Publication Publication Date Title
JP2007528299A5 (enExample)
TW366534B (en) Method of electrochemical mechanical planarization
JP2893012B2 (ja) ワークピースを平坦化する方法および装置
JP6006972B2 (ja) 静電チャック
CN2730553Y (zh) 一种用于电化学机械抛光的抛光部件
KR100745102B1 (ko) 반도체장치의 제조방법, 연마장치 및 연마방법
CN100398261C (zh) 用于电化学机械抛光的导电抛光部件
CN1929955B (zh) 绝缘衬垫调整器及其使用方法
US20180361529A1 (en) Chemical mechanical polishing system and method
WO2008035395A1 (en) Feeding structure of electrostatic chuck, method for producing the same, and method for regenerating feeding structure of electrostatic chuck
CN219945748U (zh) 一种用于cmp设备的电化学机械抛光及平坦化系统
CN101022920A (zh) 具有导电部分的固定环
TWI531444B (zh) 陰極保護墊調節器及其使用方法
JP2020116722A (ja) 流体研磨装置および流体研磨方法
JP2013534734A5 (enExample)
TW201531377A (zh) 硏磨物件、調節盤及形成硏磨物件之方法
JP2005219152A (ja) ドレッサおよびその製造方法
WO2008094811A3 (en) Method and system for pad conditioning in an ecmp process
JP4737492B2 (ja) メタルレスボンド砥石とそれによる電解ドレッシング研削方法及び装置
CN200970715Y (zh) 一种用于电化学机械抛光的抛光部件
JP4275682B2 (ja) 静電チャック
EP2383773A3 (en) Method of electrochemical-mechanical polishing of silicon carbide wafers
TWI290754B (en) Retaining ring with conductive portion
JP7730506B2 (ja) チャック装置
TWI659467B (zh) 電解磨粒拋光裝置