JP2013534734A5 - - Google Patents

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Publication number
JP2013534734A5
JP2013534734A5 JP2013519695A JP2013519695A JP2013534734A5 JP 2013534734 A5 JP2013534734 A5 JP 2013534734A5 JP 2013519695 A JP2013519695 A JP 2013519695A JP 2013519695 A JP2013519695 A JP 2013519695A JP 2013534734 A5 JP2013534734 A5 JP 2013534734A5
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JP
Japan
Prior art keywords
cathodic protection
polishing
metal substrate
attached
receiving surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013519695A
Other languages
English (en)
Japanese (ja)
Other versions
JP5972264B2 (ja
JP2013534734A (ja
Filing date
Publication date
Priority claimed from US12/837,055 external-priority patent/US8496511B2/en
Application filed filed Critical
Publication of JP2013534734A publication Critical patent/JP2013534734A/ja
Publication of JP2013534734A5 publication Critical patent/JP2013534734A5/ja
Application granted granted Critical
Publication of JP5972264B2 publication Critical patent/JP5972264B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013519695A 2010-07-15 2011-06-24 陰極防食したパッドコンディショナー及び使用方法 Expired - Fee Related JP5972264B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/837,055 US8496511B2 (en) 2010-07-15 2010-07-15 Cathodically-protected pad conditioner and method of use
US12/837,055 2010-07-15
PCT/US2011/041843 WO2012009139A1 (en) 2010-07-15 2011-06-24 Cathodically-protected pad conditioner and method of use

Publications (3)

Publication Number Publication Date
JP2013534734A JP2013534734A (ja) 2013-09-05
JP2013534734A5 true JP2013534734A5 (enExample) 2014-07-24
JP5972264B2 JP5972264B2 (ja) 2016-08-17

Family

ID=44628604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013519695A Expired - Fee Related JP5972264B2 (ja) 2010-07-15 2011-06-24 陰極防食したパッドコンディショナー及び使用方法

Country Status (7)

Country Link
US (1) US8496511B2 (enExample)
JP (1) JP5972264B2 (enExample)
KR (1) KR20130128370A (enExample)
CN (1) CN103003026B (enExample)
SG (1) SG187009A1 (enExample)
TW (1) TWI531444B (enExample)
WO (1) WO2012009139A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9550247B2 (en) * 2013-07-18 2017-01-24 Aps Materials, Inc. Double coupon reference cell and methods of making same
JP7232763B2 (ja) * 2016-12-21 2023-03-03 スリーエム イノベイティブ プロパティズ カンパニー スペーサ及びウェハ平坦化システムを有するパッドコンディショナ
EP3691830A4 (en) * 2017-10-04 2021-11-17 Saint-Gobain Abrasives, Inc. ABRASIVE ARTICLE AND ITS FORMATION PROCESS
US11490664B2 (en) * 2018-02-23 2022-11-08 Linderton Holdings, Inc. Supporting garments and sizing systems
EP3948702A4 (en) 2019-03-29 2023-07-26 Saint-Gobain Abrasives, Inc. POWER LOOP SOLUTIONS
WO2020206382A1 (en) 2019-04-03 2020-10-08 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2817634A (en) 1953-09-22 1957-12-24 Texas Co Device for preventing corrosion
US3022234A (en) 1958-06-30 1962-02-20 Engelhard Ind Inc Cathodic protection of ships
US5352342A (en) 1993-03-19 1994-10-04 William J. Riffe Method and apparatus for preventing corrosion of metal structures
ZA9410384B (en) 1994-04-08 1996-02-01 Ultimate Abrasive Syst Inc Method for making powder preform and abrasive articles made therefrom
US6123612A (en) 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6176992B1 (en) * 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6203413B1 (en) 1999-01-13 2001-03-20 Micron Technology, Inc. Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
JP3665523B2 (ja) * 1999-12-28 2005-06-29 株式会社東芝 ドレッシング方法
US6264536B1 (en) * 2000-02-01 2001-07-24 Lucent Technologies Inc. Reducing polish platen corrosion during integrated circuit fabrication
US6811680B2 (en) * 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
EP1446514A4 (en) * 2001-11-13 2007-11-28 Acm Res Inc ELECTROPOLIER ASSEMBLY AND METHOD FOR ELECTROPOLISHING CONDUCTIVE LAYERS
US7276454B2 (en) 2002-11-02 2007-10-02 Taiwan Semiconductor Manufacturing Co., Ltd. Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
CA2434986A1 (en) 2003-07-11 2005-01-11 G.I. Russell & Company Ltd. Method and apparatus for instrumental analysis in remote locations
US7125324B2 (en) 2004-03-09 2006-10-24 3M Innovative Properties Company Insulated pad conditioner and method of using same
CN1562566A (zh) * 2004-04-06 2005-01-12 北京工业大学 金属结合剂砂轮在线电解磨削修整法及其装置
US7608173B2 (en) 2004-12-02 2009-10-27 Applied Materials, Inc. Biased retaining ring
JP2007537052A (ja) 2004-05-13 2007-12-20 アプライド　マテリアルズ　インコーポレイテッド 導電部を備えた保持リング
JP2008192749A (ja) * 2007-02-02 2008-08-21 Matsushita Electric Ind Co Ltd 研磨装置および研磨方法

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