KR20090130084A - 절연된 패드 컨디셔너 및 이를 이용하는 방법 - Google Patents

절연된 패드 컨디셔너 및 이를 이용하는 방법 Download PDF

Info

Publication number
KR20090130084A
KR20090130084A KR1020097022337A KR20097022337A KR20090130084A KR 20090130084 A KR20090130084 A KR 20090130084A KR 1020097022337 A KR1020097022337 A KR 1020097022337A KR 20097022337 A KR20097022337 A KR 20097022337A KR 20090130084 A KR20090130084 A KR 20090130084A
Authority
KR
South Korea
Prior art keywords
abrasive
substrate
carrier
stainless steel
abrasive surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097022337A
Other languages
English (en)
Korean (ko)
Inventor
개리 엠. 팜그렌
브라이언 디. 고어스
더글라스 제이. 피셔
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20090130084A publication Critical patent/KR20090130084A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007—Cleaning of grinding wheels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • General Preparation And Processing Of Foods (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
KR1020097022337A 2004-03-09 2005-01-25 절연된 패드 컨디셔너 및 이를 이용하는 방법 Ceased KR20090130084A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/797,890 US7125324B2 (en) 2004-03-09 2004-03-09 Insulated pad conditioner and method of using same
US10/797,890 2004-03-09

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020067018320A Division KR20070015919A (ko) 2004-03-09 2005-01-25 절연된 패드 컨디셔너 및 이를 이용하는 방법

Publications (1)

Publication Number Publication Date
KR20090130084A true KR20090130084A (ko) 2009-12-17

Family

ID=34920153

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097022337A Ceased KR20090130084A (ko) 2004-03-09 2005-01-25 절연된 패드 컨디셔너 및 이를 이용하는 방법

Country Status (10)

Country Link
US (2) US7125324B2 (enExample)
EP (1) EP1722925B1 (enExample)
JP (1) JP2007528299A (enExample)
KR (1) KR20090130084A (enExample)
CN (1) CN1929955B (enExample)
AT (1) ATE480367T1 (enExample)
DE (1) DE602005023419D1 (enExample)
MY (1) MY135125A (enExample)
TW (2) TW201017721A (enExample)
WO (1) WO2005095055A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101311330B1 (ko) * 2012-06-12 2013-09-25 주식회사 덕성 반도체 씨엠피 가공장치용 템플레이트 어셈블리

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US7427337B2 (en) * 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US20080061985A1 (en) * 2006-08-31 2008-03-13 Symbol Technologies, Inc. Visual display of RFID tag content via laser projection display
TWI388402B (en) * 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
US8496511B2 (en) 2010-07-15 2013-07-30 3M Innovative Properties Company Cathodically-protected pad conditioner and method of use
CN102601722A (zh) * 2011-01-20 2012-07-25 中芯国际集成电路制造(上海)有限公司 一种研磨方法和研磨装置
WO2012162430A2 (en) 2011-05-23 2012-11-29 Chien-Min Sung Cmp pad dresser having leveled tips and associated methods
US9227294B2 (en) * 2013-12-31 2016-01-05 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and method for chemical mechanical polishing
US10967478B2 (en) * 2017-09-29 2021-04-06 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method
WO2019210278A1 (en) 2018-04-27 2019-10-31 Saint-Gobain Ceramics & Plastics, Inc. Material including boron suboxide and method of forming same
CN111421462B (zh) * 2019-01-08 2022-03-22 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法
CN110328607B (zh) * 2019-08-05 2020-05-29 衢州学院 一种利用电场效应增强加工区域酸碱度的锗平面镜化学抛光方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196353A (en) * 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
JP3036348B2 (ja) * 1994-03-23 2000-04-24 三菱マテリアル株式会社 ウェーハ研磨パッドのツルーイング装置
US5637031A (en) * 1996-06-07 1997-06-10 Industrial Technology Research Institute Electrochemical simulator for chemical-mechanical polishing (CMP)
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
US5807165A (en) * 1997-03-26 1998-09-15 International Business Machines Corporation Method of electrochemical mechanical planarization
WO1999026758A1 (en) 1997-11-25 1999-06-03 John Hopkins University Electrochemical-control of abrasive polishing and machining rates
US6123612A (en) * 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
JP3295888B2 (ja) * 1998-04-22 2002-06-24 株式会社藤森技術研究所 ケミカルマシンポリッシャの研磨盤用研磨ドレッサ
US6176992B1 (en) 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6328872B1 (en) 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6263605B1 (en) * 1998-12-21 2001-07-24 Motorola, Inc. Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment
JP2002540972A (ja) * 1999-04-01 2002-12-03 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ２重ｃｍｐパッド調整装置
US6135863A (en) * 1999-04-20 2000-10-24 Memc Electronic Materials, Inc. Method of conditioning wafer polishing pads
JP3387858B2 (ja) * 1999-08-25 2003-03-17 理化学研究所 ポリッシングパッドコンディショナー
US6379223B1 (en) * 1999-11-29 2002-04-30 Applied Materials, Inc. Method and apparatus for electrochemical-mechanical planarization
US6666754B1 (en) * 2000-01-18 2003-12-23 Advanced Micro Devices, Inc. Method and apparatus for determining CMP pad conditioner effectiveness
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US6517424B2 (en) * 2000-03-10 2003-02-11 Abrasive Technology, Inc. Protective coatings for CMP conditioning disk
KR100360469B1 (ko) * 2000-05-09 2002-11-08 삼성전자 주식회사 화학기계적 연마장치의 연마패드 컨디셔닝 장치
US6494765B2 (en) * 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
WO2002028598A1 (en) * 2000-10-02 2002-04-11 Rodel Holdings, Inc. Method for conditioning polishing pads
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US6932896B2 (en) * 2001-03-30 2005-08-23 Nutool, Inc. Method and apparatus for avoiding particle accumulation in electrodeposition
EP1478708A1 (en) * 2002-02-26 2004-11-24 Applied Materials, Inc. Method and composition for polishing a substrate
US7011566B2 (en) * 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
US6722948B1 (en) * 2003-04-25 2004-04-20 Lsi Logic Corporation Pad conditioning monitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101311330B1 (ko) * 2012-06-12 2013-09-25 주식회사 덕성 반도체 씨엠피 가공장치용 템플레이트 어셈블리

Also Published As

Publication number Publication date
US20050202676A1 (en) 2005-09-15
WO2005095055A1 (en) 2005-10-13
US20060189140A1 (en) 2006-08-24
CN1929955B (zh) 2010-06-16
ATE480367T1 (de) 2010-09-15
MY135125A (en) 2008-02-29
CN1929955A (zh) 2007-03-14
JP2007528299A (ja) 2007-10-11
EP1722925A1 (en) 2006-11-22
US7247577B2 (en) 2007-07-24
TW200539255A (en) 2005-12-01
US7125324B2 (en) 2006-10-24
EP1722925B1 (en) 2010-09-08
DE602005023419D1 (de) 2010-10-21
TW201017721A (en) 2010-05-01

Similar Documents

Publication Publication Date Title
US7247577B2 (en) Insulated pad conditioner and method of using same
US6540597B1 (en) Polishing pad conditioner
US5639363A (en) Apparatus and method for mirror surface grinding and grinding wheel therefore
US20060030156A1 (en) Abrasive conductive polishing article for electrochemical mechanical polishing
US6117001A (en) Electrolytic in-process dressing method, electrolytic in-process dressing apparatus and grindstone
US8496511B2 (en) Cathodically-protected pad conditioner and method of use
CN115194564A (zh) 一种半导体晶片磁控研磨和抛光一体盘及其使用方法
KR20070015919A (ko) 절연된 패드 컨디셔너 및 이를 이용하는 방법
JP2014083678A (ja) 電気泳動式カッティングシステム及び電気泳動式カッティングキャリアの製造方法
JP3802884B2 (ja) Ｃｍｐコンディショナ
US20250353136A1 (en) Polishing Pad Assembly for Electrochemical Mechanical Polishing
CN117047564B (zh) 一种用于平面工件电化学研磨/电化学机械抛光中抑制边缘杂散电流腐蚀的方法及装置
Ilhan et al. A study of wheel wear in electrochemical surface grinding
CA2038753C (en) Electrolytic cleaning and refurbishing of grinding wheel
JP4508355B2 (ja) 研削方法
JP2000246646A (ja) 電着砥石
JP7730506B2 (ja) チャック装置
JP2003260642A (ja) 鏡面研削方法およびその装置
Prabhu et al. Nano-surface generation using electrolytic in-process dressing (ELID) technique in grinding process
JP3839297B2 (ja) 研削方法
TWI244962B (en) Method and apparatus for combining composite electroplating and surface abrasive machining
Bandyopadhyay et al. Highly Efficient and Ultraprecision Fabrication of Structural Ceramic Parts with the Application of Electrolytic In-Process Dressing Grinding
JPH09254146A (ja) 硬質脆性材料の切断ないし溝入れ加工方法
WO2004083494A1 (ja) 複合加工装置及び方法
Doi Polishing technology

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20091026

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20100122

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20111107

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20120118

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20111107

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I