TW201005037A - Room-temperature-curable organopolysiloxane composition - Google Patents

Room-temperature-curable organopolysiloxane composition Download PDF

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Publication number
TW201005037A
TW201005037A TW98121672A TW98121672A TW201005037A TW 201005037 A TW201005037 A TW 201005037A TW 98121672 A TW98121672 A TW 98121672A TW 98121672 A TW98121672 A TW 98121672A TW 201005037 A TW201005037 A TW 201005037A
Authority
TW
Taiwan
Prior art keywords
group
mass
component
composition
groups
Prior art date
Application number
TW98121672A
Other languages
English (en)
Chinese (zh)
Inventor
Akiko Nabeta
Harumi Kodama
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of TW201005037A publication Critical patent/TW201005037A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
TW98121672A 2008-07-17 2009-06-26 Room-temperature-curable organopolysiloxane composition TW201005037A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008186403A JP5534656B2 (ja) 2008-07-17 2008-07-17 室温硬化性オルガノポリシロキサン組成物

Publications (1)

Publication Number Publication Date
TW201005037A true TW201005037A (en) 2010-02-01

Family

ID=41057274

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98121672A TW201005037A (en) 2008-07-17 2009-06-26 Room-temperature-curable organopolysiloxane composition

Country Status (5)

Country Link
JP (1) JP5534656B2 (ja)
KR (1) KR20110036908A (ja)
CN (1) CN102056991A (ja)
TW (1) TW201005037A (ja)
WO (1) WO2010008036A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102276889B1 (ko) * 2013-12-24 2021-07-12 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 실온 경화성 폴리오르가노실록산 조성물 및 전기·전자기기

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0784560B2 (ja) * 1986-12-19 1995-09-13 東芝シリコ−ン株式会社 シリコ−ンゴム組成物
JPS6451465A (en) * 1987-08-21 1989-02-27 Asahi Glass Co Ltd Room temperature curing composition
JPH04359058A (ja) * 1991-06-03 1992-12-11 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物の製造方法
US6132664A (en) * 1997-12-23 2000-10-17 Dow Corning Corporation Method of forming a seal in a confined configuration with an alkoxy-functional RTV composition
US7307134B2 (en) * 2002-02-22 2007-12-11 Henkel Corporation Mixed alkoxysilyl functional polymers
JP4799835B2 (ja) * 2004-07-09 2011-10-26 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器

Also Published As

Publication number Publication date
JP5534656B2 (ja) 2014-07-02
KR20110036908A (ko) 2011-04-12
WO2010008036A1 (en) 2010-01-21
CN102056991A (zh) 2011-05-11
JP2010024327A (ja) 2010-02-04

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