201005037 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種室溫可固化之有機聚矽氧烷組合物及 更具體係關於一種在無水分條件下顯示極佳穩定性且易於 控制固化速率之室溫可固化之有機聚矽氧烷組合物。、 【先前技術】 已知某些在空氣中水分的作用及室溫下可固化的特定有 機聚矽氧烷組合物（參見日本未審查專利申請公開案 252456) ’在無水分條件下顯示極佳的儲存穩定性且適合 形成在濕空氣中表現極佳膠粘性的固化製品經去醇作用 及縮合反應固化時提供易蒸發的甲醇、乙醇、或類似醇， 且不引起氣味或腐钱問題。由於該等性質，該室温可固化 有機聚石夕氧烧組合物發現在電氣及電子裝置製造中作為密 封劑及塗層劑使用。 現代電氣及電子裝置製造中利用的密封及 使用特徵在於最佳固化速率的室溫可固化之有機^ = 組合物。但疋’調整上述固化速率同時維持所需儲存穩定 性並不容易。 本發明之目的係提供—種在無水分環境中具有極佳儲存 穩疋性且提供易控制的固化速率的室溫可固化之有機聚矽 氧烧組合物。 【發明内容】 本發明之室溫可固化之有機聚梦氧1 组合物包含： (A)l〇〇 質量份在 25°c~it B 士 i卜具有100至1，〇〇〇,〇〇〇 mpa.s黏度且 141153.doc 201005037 为子端基係選自由烷氧基矽烷基、氫原子、羥基、及經 取代或未經取代的單價烴基組成之群的二有機聚矽氧 烷，但其中至少50莫耳。/〇端基係該等由以下通式表示的 烷氧基矽烷基： •X-SiRUORVa) (其中R1代表經取代或未經取代的單價烴基，R2代表烷 基，X代表氧原子或伸烷基，且“a”為0或1); (B) 0.1至20質量份具有以下通式之有機三甲氧基矽烷或該 i 有機三甲氧基矽烷部分水解及縮合的產物： R3Si(OCH3)3 (其中R3代表經取代或未經取代的單價烴基）； (C) 0.1至20質量份具有以下通式之有機三烷氧基矽烷或該 有機三烷氧基矽烷部分水解及縮合的產物： R4Si(OR5)3 (其中R4代表經取代或未經取代的單價烴基，且R5代表具 有兩個或更多碳原子的烷基及 > (D)〇.i至1〇質量份鈦螯合物觸媒。 在上述組合物中，組分（B)含量對組分（c)含量以質量單 位表示之比可在（1 : 20)至（5 : 1)之範圍。 該組合物可進一步包含以每1〇〇質量份組分（A)為1至5〇 質量份之含量使用的（E)矽石為主之填料。 該組合物可進一步包含以每1〇〇質量份組分（A)為〇 〇1至 W質量份之含量使用的（F)黏著力促進劑。 發明效果 141153.doc 201005037 本發明之室溫可固化之有機聚矽氧烷組合物在無水分環境 中具有極佳儲存穩定性且有效地提供易控制的固化速率。 【實施方式】 現將更詳細描述本發明之室溫可固化之有機聚矽氧院組 合物。 二有機聚梦氧烧（Α)係具有選自由烧氧基石夕院基、氫原 子、羥基、及經取代或未經取代的單價烴基組成之群之分 子端基的組分，其中該烷氧基矽烷基係由以下通式表示： -X-SiR1a(〇R2)(3.a) 在上述烧氧基碎烧基之通式中’ R1代表經取代或未經取 代的單價烴基’其可具體舉例為甲基、乙基、丙基、丁 基、己基、辛基、癸基、十八院基、或類似烧基；環戊 基、環己基、或類似環烷基；乙烯基、烯丙基、丁稀基、 己烯基、或類似烯基；苯基、甲苯基、萘基、或類似芳 基；苯曱基、苯乙基、或類似芳烷基；氣曱基、3_氣丙 基、3,3,3-三氟丙基、或類似處代烷基；氣苯基、氣曱苯 基、或類似函代芳基。最佳係院基、芳基，且尤其係甲基 及苯基。R2代表烷基，例如甲基、乙基、丙基、及丁基。 最佳係甲基及乙基。在上述通式中，Χ代表氧原子或伸燒 基。該等伸烷基可舉例為伸乙基、伸丙基、甲基伸乙基、 及伸丁基。最佳係伸乙基及伸丙基。X較佳代表氧原子。 在該通式中’「a」為0或1，較佳為〇。 上述烷氧基矽烷基可具體舉例為三甲氧基矽氧基、三乙 氧基矽氧基、二f氧基乙氧基矽氧基、甲氧基二乙氧基矽 14I153.doc 201005037 氧基、三異丙氧基矽氧基、三（甲氧基乙氧基）矽氧基、或 類似二烷氧基矽氧基；三甲氧基矽烷基乙基、三甲氧基矽 烷基丙基、三乙氧基矽烷基乙基、或類似三烷氧基矽烷基烷 基，其中較佳係三甲氧基矽氧基及三甲氧基矽烷基乙基。 上述端基的單價烴基可具體舉例為該等上述定義Rl的相 同單償烴基《最佳係烷基、烯基、及芳基，尤其係甲基、 k 乙烯基、烯丙基、及苯基。 組分（A)的分子端基係選自由烷氧基矽烷基、氫原子、 • 羥基、及經取代或未經取代的單價烴基組成之群，其中端 基的至V、50莫耳％，較佳6〇莫耳％，及最佳至少莫耳％ 係上述由以下通式代表的烷氧基矽烷基： _X-SiR 丨 a(〇R2)(3.a) 倘若烷氧基矽烷基含量對分子端基總量之比低於建議的 下限’則所得組合物將顯示不完全固化的傾向。 組分（A)分子中所含之以矽為主之基可舉例為上述定義r丨 的相同單價烴基。最佳係烷基及芳基，尤其係曱基及笨基。 組分（A)具有基本上為直鏈的分子結構，但是，其可具 有某程度分支。在25〇C下組分（A)的黏度係在1〇〇至 !，000,000 mpa.s之間’且較佳係1〇〇至1〇〇 〇〇〇 mPa.s。如 果組分（A)的黏度低於建議的下限，將損及組合物固化製 °°的機械性質。另一方面，如果黏度超過建議的上限，將損 及組合物的可操作性及使組合物不適合作為密封或塗層劑。 組分（Β)係具有以下通式之有機三曱氧基矽烷或上述有 機三曱氧基矽烷部分水解及縮合的產物： 141153.doc 201005037 R3Si(〇CH3)3 在此通式中，R3代表經取代或未經取代的單價烴基，其 等可舉例為上述定義Ri的㈣基圏。最佳係絲、稀基、、 及芳基，尤其係甲基、乙烯基、烯丙基、及苯基。 以有機三甲氧基矽烷形式組分（B)可表示為甲基三甲氧 基妙烧、乙基三甲氧基錢、丙基三甲氧基钱、乙稀基 三甲氧基矽烷、苯基三甲氧基矽烷、或上述化合物中兩種 或更多種的組合。 添加至組合物中的組分（B)的含量係每1 00質量份組分 (A) 為0.1至20質量份’較佳為〇」至15質量份。如果組分 (B) 的含量低於建議的下限，組合物將不完全固化或在儲 存中具有低穩定性。另一方面，如果組分（B)的含量超過 建議的上限，將延遲固化，或將損及組合物固化製品的機 械性質。 組分（C)係具有以下通式之有機三烷氧基矽烷或上述有 機二烧氧基矽烷部分水解及縮合的產物： R4Si(〇R5)3 在上述通式中，R4代表經取代或未經取代的單價烴基， 其可舉例為上述定義R1的相同單價烴基。較佳係烷基、烯 基、及烯丙基，尤其係甲基、乙烯基、烯丙基、或苯基。 在上述通式中，R5代表具有兩個至更多碳原子的烷基。具 體實例係乙基、丙基、丁基、己基、或類似具有2至6個破 原子烧基。最佳係乙基及丙基。 組分（C)作為有機三烷氧基矽烷可具體舉例為甲基三乙 141153.doc 201005037 . 氧基石夕烧、乙基三乙氧基錢、丙基三乙氧基石夕烧乙稀 基三乙氧基矽烷、苯基三乙氧基矽烷、或上述化合物中兩 種或更多種的組合。 組分（c)以每100質量份組分（A)為〇丨至⑽質量份，較佳 0.1至15質量份之含量加人組合物中。如果組分（c)加入的 量低於建議的下限，組合物將不完全固化或在儲存中具有 低穩定性。另-方面，如果組分（c)的含量超過建議的上 限’將延遲11]彳匕’或將損及組合物固化製品的機械性質。 關於組合物中使用的組分（B)與組分（C)的比無特定限 制。但，為維持組合物的儲存穩定性同時便於調整固化速 率，建議組分（B)含量對組分（c)含量的質量單位比於 (1:20)至（5:1)之間，及較佳於（1:1〇)至（2:1)之間。 組分（D)係用於加快組合物固化之鈦螯合物。組分（d)的 具體實例如下：二曱氧基雙（甲基乙酿乙酸）欽、二異丙氧 基雙（乙醯基丙酮酸）鈦、二異丙氧基雙（乙基乙醯乙酸） 鈦、二異丙氧基雙（甲基乙醯乙酸）鈦、及二丁氧基雙（乙基 乙醯乙酸）鈦。 組分（D)可以每100質量份組分（A)為〇丨至1〇質量份較 佳0.3至6質量份之含量加入組合物中。如果組分⑴）以小於 建議的下限之含量添加，其將無法充分加快組合物的固 化。另一方面，如果組分（D)係以超過建議上限之含量添 加，則此將損及組合物的儲存穩定性。 為改善組合物的流動性或固化製品的機械性質，該組合 物可進一步與矽石為主的填料（E)組合。該矽石為主的填 141153.doc 201005037 料可舉例為發煙矽石、熔融矽石、沉澱矽石、石英、或上 述以矽烷化合物、矽氮烷化合物、或低度聚合的矽氧烷進 行表面處理的物質。作為組分最佳係發煙矽石，尤其 係具有等於或大於50 m2/g BET比表面積的發煙矽石。儘 管關於組分（E)之添加量無特定限制，但建議以每1〇〇質量 份組分（A)為1至50質量份，較佳1至30質量份之含量添加 組分（E)。 為改善固化時組合物之固化體對各種基質的膠粘性，該 組合物可與黏著力促進劑（F)組合。該組分（F)可舉例為3 _ 胺基丙基三甲氧基矽烷、3_(2_胺基乙基）胺基丙基三甲氧 基矽烷、或類似含胺基的有機烷氧基矽烷；3_縮水甘油氧 基丙基三曱氧基矽烷、或類似含環氧基的有機烷氧基矽 烷’· 3-疏丙基三甲氧基矽烷、或類似含毓基的有機烷氧基 發烧；或含胺基的有機烷氧基矽烷與含環氧基的有機垸氧 基矽烷的反應性混合物。最佳係含胺基的有機烷氧基矽烷 及含胺基的有機烷氧基矽烷與含環氧基的有機烷氧基矽烷 的反應性混合物。儘管關於組分（F)之添加量無特定限 制’但建議以每1 〇〇質量份組分（A)為〇 ·〇丨至丨〇質量份，較 佳0.05至1〇〇質量份之量添加組分（F)。 在不違背本發明目的之範圍内，該組合物可進一步與其 它添加劑組合’例如碳酸鈣、二氧化鈦、矽藻土氧化 鋁、氧化鎂、氧化鋅、膠質碳酸鈣、碳黑、或類似填料； 上述以矽烷組合物、矽氮烷組合物、或低度聚合的矽氧烷 進行表面處理的填料；及有機溶劑、防蝕劑、阻燃劑、对 141153.doc -10· 201005037 熱劑、增塑劑、觸變劑、顏料等。 關於製備組合物的方法無特定限制，且該組合物可藉由 混合組分（A)至（D)及若需要之其它所需的組分而製備。但 是，如果組合物作為單組（one-part) RTV儲存，與組分（D) 混合及與組分（D)混合後的儲存需要在無水分條件下實 施。如果組合物作為二組（two part) RTV儲存，組分（A)及 (D)應個別儲存。 實例 參 本發明之室溫可固化之有機聚矽氧烷組合物將參照實施 例與比較例更詳細描述。以下方法用於測量室溫可固化之 有機聚矽氧烷組合物的固化速率及儲存穩定性。 [固化速率] 製備後，室溫可固化之有機聚矽氧烷組合物在25°C、無 水分條件下儲存7天。之後，該組合物以2 mm厚的塗層施 加至玻璃板上，保持在25°C及50%相對濕度下，用指尖輕 輕觸碰該塗層表面且測量不黏手時間（TFT)。 ® [儲存穩定性] 製備後，室溫可固化之有機聚矽氧烷組合物在50°C、無 水分條件下在烘箱中儲存28天。然後冷卻該組合物至室 溫，如上述測量TFT，及，基於此判斷固化速率之變化。 [實施例1至5，比較例1至4] 為提供具有20至30 min TFT的室溫可固化之有機聚矽氧 烷組合物，表1所示的組合物藉由在無水分條件下混合下 列組分而製備。 141153.doc -11 - 201005037 組分（a):二甲基聚矽氧烷，其在25〇c下具有2,〇〇〇 mPa.s黏度，且85莫耳％分子端基係具有下列通式之三甲氧 基^夕氧基： -0-Si(0CH3)3， 其餘基團係甲基； 組分（b) : CH3Si(OCH3)3 ; 組分（c) : CH3Si(OC2H5)3 ; 組分（d):二異丙氧基-雙（乙基乙醯乙酸）鈦； 組分（e):具有200 m2/g BET比表面積且以六甲基二石夕氮 烷進行疏水性表面處理的發煙矽石；及 組分（f):以1:2莫耳比混合3-胺基丙基-三甲氧基矽烷與 3 -縮水甘油氧基丙基-三甲氧基石夕院且使混合的組分在 25。(：下反應4周後得到的反應性混合物。 測量關於得到的室溫可固化之有機聚矽氧烷組合物的固 化速率及儲存穩定性。結果如表1所示。 [表1] 組分 實例 實施例 比較例 1 2 3 4 5 1 2 3 4 (a) 100 100 100 100 100 100 100 100 100 (b) 2 1 1 0.5 0.75 2 - - - 組合物 (c) 3 3 2 2 4 - 2 3 4 f晳詈份Ί (d) 2 4 2 2 3 2 2 2 2 (e) 4 4 4 4 4 4 4 4 4 (f) 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 TFT 25 7 °c， 21 21 21 27 23 7 22 35 43 (min.) 25〇C ' 28天後 29 24 28 29 28 9 39 49 58 從表1中可見，如果該組合物不含組分（c)，其難以提供 141153.doc -12- 201005037 所需的20至30 min之内的TFT。（見比較例丨）。如果該祖合 物不含組分（Β)，將損及儲存穩定性（見比較例2至4)〇實施 例1及2與比較例3的此較，實施例3及4與比較似的比較及 實施例5與比較例4的比較顯示：包含組分（Β)及（c)使其有 可能提供20至30 min之間的TFT且同時賦予該組合物良好 > 的儲存穩定性。 產業利用性 由於本發明之室溫可固化之有機聚矽氧烷組合物在無水 • 分條件下具有極佳儲存穩定性且提供易於控制的固化速 率’其適合作為電氣及電子裝置製造中的密封及塗層劑。 141153.doc 13·201005037 VI. Description of the Invention: [Technical Field] The present invention relates to a room temperature curable organopolyoxane composition and a more system for exhibiting excellent stability under moisture-free conditions and easy to control curing A room temperature curable organopolyoxane composition at a rate. [Prior Art] Certain specific organic polyoxoxane compositions which are effective in the presence of moisture in the air and which are curable at room temperature (see Japanese Unexamined Patent Application Publication No. 252456) are shown to be excellent in the absence of moisture. The storage stability is suitable for forming a cured article which exhibits excellent adhesion in moist air to provide easily vaporized methanol, ethanol, or the like when subjected to de-alcoholization and condensation reaction, without causing odor or money loss. Due to these properties, the room temperature curable organic polyoxo composition is found to be used as a sealant and a coating agent in the manufacture of electrical and electronic devices. The sealing and use utilized in the manufacture of modern electrical and electronic devices is characterized by a room temperature curable organic compound at the optimum cure rate. However, it is not easy to adjust the above curing rate while maintaining the desired storage stability. SUMMARY OF THE INVENTION It is an object of the present invention to provide a room temperature curable organopolyoxylate composition which has excellent storage stability in a moisture free environment and which provides an easily controlled cure rate. SUMMARY OF THE INVENTION The room temperature curable organic polyoxyl 1 composition of the present invention comprises: (A) 10 parts by mass at 25 ° c ~ it B 士 i 卜 with 100 to 1, 〇〇〇, 〇〇 〇mpa.s viscosity and 141153.doc 201005037 is a diorganopolyoxyalkylene group selected from the group consisting of an alkoxyalkyl group, a hydrogen atom, a hydroxyl group, and a substituted or unsubstituted monovalent hydrocarbon group, but At least 50 moles. The terminal group is an alkoxyalkyl group represented by the following formula: • X-SiRUORVa) (wherein R1 represents a substituted or unsubstituted monovalent hydrocarbon group, R2 represents an alkyl group, and X represents an oxygen atom or an alkylene group. a group, and "a" is 0 or 1); (B) 0.1 to 20 parts by mass of an organic trimethoxydecane having the following formula or a product of partial hydrolysis and condensation of the i-organic trimethoxydecane: R3Si(OCH3)3 (wherein R3 represents a substituted or unsubstituted monovalent hydrocarbon group); (C) 0.1 to 20 parts by mass of an organotrialkoxydecane having the following formula or a partially hydrolyzed and condensed product of the organotrialkoxydecane: R4Si (OR5)3 (wherein R4 represents a substituted or unsubstituted monovalent hydrocarbon group, and R5 represents an alkyl group having two or more carbon atoms and > (D) 〇.i to 1 part by mass of a titanium chelate compound Catalyst. In the above composition, the ratio of the component (B) content to the component (c) content expressed in mass units may range from (1: 20) to (5: 1). The composition may further comprise (E) vermiculite-based filler used in an amount of 1 to 5 parts by mass per 1 part by mass of the component (A). The step includes (F) an adhesion promoter which is used in an amount of from 1 to W parts by mass per part by mass of the component (A). Effect of the invention 141153.doc 201005037 The room temperature curable organic polymerization of the present invention The oxoxane composition has excellent storage stability in a moisture-free environment and effectively provides an easily controlled cure rate. [Embodiment] The room temperature curable organopolyxide composition of the present invention will now be described in more detail. The second organic polyoxymethane (Α) is a component having a molecular end group selected from the group consisting of an alkoxy group, a hydrogen atom, a hydroxyl group, and a substituted or unsubstituted monovalent hydrocarbon group, wherein the alkane The oxonium alkyl group is represented by the following formula: -X-SiR1a(〇R2)(3.a) In the above formula of the alkoxyalkyl group, 'R1 represents a substituted or unsubstituted monovalent hydrocarbon group' Specific examples thereof are a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, an octyl group, a decyl group, an 18-yard group, or a similar alkyl group; a cyclopentyl group, a cyclohexyl group, or a cycloalkyl group; a vinyl group; Allyl, butyryl, hexenyl, or similar alkenyl; phenyl, tolyl, naphthalene Or an aryl group; a phenylhydrazine group, a phenethyl group, or an analogous aralkyl group; a gas group, a 3-methoxypropyl group, a 3,3,3-trifluoropropyl group, or a similar alkyl group; Phenyl, anthraquinone phenyl, or a similar functional aryl group. Most preferably a ketone group, an aryl group, and especially a methyl group and a phenyl group. R2 represents an alkyl group such as a methyl group, an ethyl group, a propyl group, and a butyl group. The methyl group and the ethyl group are preferred. In the above formula, hydrazine represents an oxygen atom or a stretching group. The alkyl group may be exemplified by an exoethyl group, a propyl group, a methyl group ethyl group, and a stretching group. Butyl group. Preferably, the ethyl group and the propyl group are extended. X preferably represents an oxygen atom. In the formula, 'a' is 0 or 1, preferably hydrazine. The above alkoxyalkylene group may specifically be exemplified by a trimethoxymethoxy group, a triethoxymethoxy group, a bis-ethoxyethoxymethoxy group, a methoxydiethoxy fluorene 14I153.doc 201005037 oxy group. , triisopropoxy decyloxy, tris(methoxyethoxy)decyloxy, or a similar dialkoxymethoxy group; trimethoxydecylethyl, trimethoxydecylpropyl, three Ethoxy methoxyalkylethyl, or a trialkoxyalkylalkylalkyl group, of which trimethoxymethoxyl and trimethoxydecylethyl are preferred. The monovalent hydrocarbon group of the above terminal group may specifically be exemplified by the same monovalent hydrocarbon group of the above definition R1, "the most preferred alkyl group, alkenyl group, and aryl group, especially methyl group, k vinyl group, allyl group, and phenyl group. . The molecular end group of component (A) is selected from the group consisting of an alkoxyalkyl group, a hydrogen atom, a hydroxyl group, and a substituted or unsubstituted monovalent hydrocarbon group, wherein the terminal group is up to V, 50 mol%, Preferably, 6 mol%, and most preferably at least mol%, of the above alkoxyalkylalkyl group represented by the following formula: _X-SiR 丨a(〇R2)(3.a), if alkoxyalkylene group content The ratio of the total amount of molecular end groups to the lower than the recommended lower limit will result in a tendency for the resulting composition to exhibit incomplete cure. The ruthenium-based group contained in the molecule of the component (A) can be exemplified by the same monovalent hydrocarbon group defined above as r丨. The most preferred are alkyl and aryl groups, especially sulfhydryl groups and stupid groups. Component (A) has a substantially linear molecular structure, but it may have a certain degree of branching. The viscosity of component (A) at 25 ° C is between 1 Å and !,000,000 mpa.s and is preferably 1 〇〇 to 1 〇〇 Pa mPa.s. If the viscosity of component (A) is below the recommended lower limit, the mechanical properties of the composition will be compromised. On the other hand, if the viscosity exceeds the recommended upper limit, the operability of the composition is impaired and the composition is unsuitable as a seal or coating agent. The component (Β) is a product of partial hydrolysis and condensation of an organic trimethoxy decane of the following formula or the above organic trimethoxy decane: 141153.doc 201005037 R3Si(〇CH3)3 In this formula, R3 represents The substituted or unsubstituted monovalent hydrocarbon group, which may be exemplified by the above-mentioned definition of the (iv) hydrazine of Ri. Preferred filaments, dilute groups, and aryl groups, especially methyl, vinyl, allyl, and phenyl. In the form of organic trimethoxydecane, component (B) can be represented as methyltrimethoxy, ethyltrimethoxy, propyltrimethoxy, ethylenetrimethoxydecane, phenyltrimethoxy. Decane, or a combination of two or more of the above compounds. The content of the component (B) to be added to the composition is from 0.1 to 20 parts by mass, preferably from 〇 to 15 parts by mass, per 100 parts by mass of the component (A). If the content of component (B) is below the recommended lower limit, the composition will not fully cure or have low stability in storage. On the other hand, if the content of the component (B) exceeds the recommended upper limit, the curing will be delayed or the mechanical properties of the cured article of the composition will be impaired. Component (C) is a product of partial hydrolysis and condensation of an organotrialkoxydecane of the general formula or the above organic di-oxooxydecane: R4Si(〇R5)3 In the above formula, R4 represents substituted or not The substituted monovalent hydrocarbon group may, for example, be the same monovalent hydrocarbon group as defined above for R1. Preferred are alkyl, alkenyl, and allyl groups, especially methyl, vinyl, allyl, or phenyl. In the above formula, R5 represents an alkyl group having two or more carbon atoms. A specific example is an ethyl group, a propyl group, a butyl group, a hexyl group, or the like having 2 to 6 broken atomic groups. The most preferred are ethyl and propyl. The component (C) as the organotrialkoxydecane may be specifically exemplified by methyltriethyl 141153.doc 201005037. Oxygen sulphur, ethyltriethoxy hydroxy, propyltriethoxy sulphuric acid Ethoxy decane, phenyl triethoxy decane, or a combination of two or more of the above compounds. Component (c) is added to the composition in an amount of from 〇丨 to (10) parts by mass, preferably from 0.1 to 15 parts by mass, per 100 parts by mass of the component (A). If component (c) is added in an amount below the recommended lower limit, the composition will not cure completely or have low stability during storage. On the other hand, if the content of component (c) exceeds the recommended upper limit, the retardation will be 11] 彳匕 or the mechanical properties of the cured article of the composition will be impaired. There is no particular limitation on the ratio of component (B) to component (C) used in the composition. However, in order to maintain the storage stability of the composition while facilitating adjustment of the curing rate, it is recommended that the mass ratio of the component (B) content to the component (c) content is between (1:20) and (5:1), and It is preferably between (1:1〇) and (2:1). Component (D) is a titanium chelate compound used to accelerate the curing of the composition. Specific examples of the component (d) are as follows: dimethoxy bis (methyl ethyl styrene acetate), diisopropoxy bis(ethyl thiopyruvate) titanium, diisopropoxy bis (ethyl acetamidine) Acetic acid) Titanium, diisopropoxy bis(methylacetamidineacetic acid) titanium, and dibutoxy bis(ethylacetamidineacetic acid) titanium. The component (D) may be added to the composition in an amount of from 〇丨 to 1 part by mass, preferably from 0.3 to 6 parts by mass, per 100 parts by mass of the component (A). If component (1)) is added at a level less than the recommended lower limit, it will not sufficiently accelerate the curing of the composition. On the other hand, if component (D) is added at a level exceeding the recommended upper limit, this will impair the storage stability of the composition. In order to improve the fluidity of the composition or the mechanical properties of the cured article, the composition may be further combined with a vermiculite-based filler (E). The vermiculite-based filling 141153.doc 201005037 can be exemplified by fumed vermiculite, molten vermiculite, precipitated vermiculite, quartz, or the above-mentioned decane compound, decazane compound, or low-polymerized decane. Surface treated substance. Preferably, the component is a fumed vermiculite, especially a fumed vermiculite having a BET specific surface area equal to or greater than 50 m2/g. Although the amount of the component (E) to be added is not particularly limited, it is recommended to add the component (E) in an amount of 1 to 50 parts by mass, preferably 1 to 30 parts by mass per 1 part by mass of the component (A). . In order to improve the adhesion of the cured body of the composition to various substrates upon curing, the composition may be combined with an adhesion promoter (F). The component (F) can be exemplified by 3-aminopropyltrimethoxydecane, 3-(2-aminoethyl)aminopropyltrimethoxydecane, or an amine group-containing organoalkoxydecane; 3_ glycidoxypropyl trimethoxy decane, or an epoxy group-containing organoalkoxy decane '· 3- propyl trimethoxy decane, or a similar thiol-containing organic alkoxy group Or a reactive mixture of an amine-containing organoalkoxydecane and an epoxy-containing organic decyloxydecane. A reactive mixture of an amine group-containing organoalkoxydecane and an amine group-containing organoalkoxydecane with an epoxy group-containing organoalkoxydecane is preferred. Although there is no particular limitation on the amount of the component (F) to be added, it is recommended to use the component (A) in an amount of from 〇·〇丨 to 丨〇 by mass, preferably from 0.05 to 1 part by mass per 1 part by mass. Add component (F). The composition may be further combined with other additives, such as calcium carbonate, titanium dioxide, diatomaceous earth alumina, magnesia, zinc oxide, colloidal calcium carbonate, carbon black, or the like, within the scope not departing from the object of the present invention; a filler surface-treated with a decane composition, a decazane composition, or a low-polymerized decane; and an organic solvent, an anticorrosive, a flame retardant, a 141153.doc -10· 201005037 a thermal agent, a plasticizer , thixotropic agents, pigments, etc. The method for preparing the composition is not particularly limited, and the composition can be prepared by mixing the components (A) to (D) and, if necessary, other desired components. However, if the composition is stored as a one-part RTV, the storage after mixing with component (D) and mixing with component (D) needs to be carried out without moisture. If the composition is stored as a two part RTV, components (A) and (D) should be stored separately. EXAMPLES The room temperature curable organopolyoxane composition of the present invention will be described in more detail with reference to the examples and comparative examples. The following method was used to measure the cure rate and storage stability of a room temperature curable organopolyoxane composition. [Curing rate] After the preparation, the room temperature curable organopolyoxane composition was stored at 25 ° C for 7 days under moisture-free conditions. Thereafter, the composition was applied to the glass plate with a 2 mm thick coating, kept at 25 ° C and 50% relative humidity, and gently touched the surface of the coating with a fingertip and measured the time of non-sticking (TFT) . ® [Storage Stability] After preparation, the room temperature curable organopolyoxane composition was stored in an oven at 50 ° C for 28 days without moisture. The composition was then cooled to room temperature, the TFT was measured as described above, and, based on this, the change in the curing rate was judged. [Examples 1 to 5, Comparative Examples 1 to 4] To provide a room temperature curable organopolyoxane composition having a TFT of 20 to 30 min, the composition shown in Table 1 was mixed by being free from moisture. Prepared by the following components. 141153.doc -11 - 201005037 Component (a): dimethyl polyoxane having a viscosity of 2, 〇〇〇mPa.s at 25 ° C, and 85 mol% of molecular end groups having the following a trimethoxy methoxy group: -0-Si(0CH3)3, the remaining group is a methyl group; a component (b): CH3Si(OCH3)3; a component (c): CH3Si(OC2H5)3; Component (d): diisopropoxy-bis(ethylacetamidineacetic acid) titanium; component (e): having a BET specific surface area of 200 m 2 /g and a hydrophobic surface with hexamethyldiazepine Treated smoky vermiculite; and component (f): mixing 3-aminopropyl-trimethoxydecane with 3-glycidoxypropyl-trimethoxy sulphate at a molar ratio of 1:2 The mixed components are at 25. (Reactive mixture obtained after 4 weeks of reaction. The curing rate and storage stability of the obtained room temperature curable organopolyoxane composition were measured. The results are shown in Table 1. [Table 1] Components EXAMPLES Example Comparative Example 1 2 3 4 5 1 2 3 4 (a) 100 100 100 100 100 100 100 100 100 (b) 2 1 1 0.5 0.75 2 - - - Composition (c) 3 3 2 2 4 - 2 3 4 f 詈 詈 Ί (d) 2 4 2 2 3 2 2 2 2 (e) 4 4 4 4 4 4 4 4 4 (f) 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 TFT 25 7 °c, 21 21 21 27 23 7 22 35 43 (min.) 25〇C '28 days later 29 24 28 29 28 9 39 49 58 It can be seen from Table 1 that if the composition does not contain component (c), it is difficult to provide 141153 .doc -12- 201005037 Required TFT within 20 to 30 minutes (see Comparative Example). If the auxin contains no component (Β), it will impair storage stability (see Comparative Example 2 to 4) Comparison of Examples 1 and 2 with Comparative Example 3, Comparison of Comparative Examples 3 and 4 with Comparative Example and Example 5 and Comparative Example 4: inclusion of components (Β) and (c) It is possible to provide a TFT between 20 and 30 min while giving the The composition is good > storage stability. Industrial Applicability The room temperature curable organopolyoxane composition of the present invention has excellent storage stability under anhydrous conditions and provides an easily controlled curing rate. Suitable for sealing and coating agents in the manufacture of electrical and electronic devices. 141153.doc 13·