200948927 九、發明說明： 【發明所屬之技術領域】 本發明係關於有用於多種電子應用之用於 的膠帶’並關於其製備方法。 【先前技術】 在各種電子I置電路中產生之電磁輕射在—些情況下會 =擾周圍電子裝置或零件的功能、降低裝置性能、產生環 兄雜訊及干擾、損害電子影像並減少電子裝置壽命。 別為止已發展出多種材料來屏蔽引起該等問題的 電磁波。這些材料包含金屬板、鑛金屬織物、傳導塗料、 傳導帶、傳導彈性體及其類似物。 特定5之，傳導膠帶主要用於小型化電子裝置中。此等 傳導帶係藉由將精細的傳導填充物，諸如碳黑、石墨、 銀銅、錄、銘或其類似物，添加至一黏著劑聚合物樹脂 中^賦予a樹脂傳導性而製備得。為使此等傳導填充物賦 予著㈣合物樹脂料性，料填充物微粒必須在該 黏著劑聚合物樹脂中形成__連續傳導路徑。為此，通常添 力=對過量之傳導填充物至該黏著劑聚合物樹脂。然 田添加過量之傳導填充物時，黏著劑樹脂的熔融黏彈 I·生降低，其使得填充物微粒凝聚藉此增加聚合物樹脂的黏 此黏之增加繼而導致比重增加及物理性質的退化， 包含衝擊及振動吸收性質的減少。另夕卜利用習知之製造 方法彳艮難控制傳導帶的導電性。 【發明内容】 137023.doc 200948927 因此，本發明者盡力製備一種可屏蔽電磁波而不會引起 上述問題的傳導膠帶。 另外，本發明者盡力製備一種適合應用於逐漸變得小型 化及纖薄之電子裝置的膠帶。 結果，本發明者發現’當將薄片傳導填充物使用於黏著 ， 劑聚合物樹脂中時，可製備得一種具有極小厚度而同時仍 ·· 維持該樹脂的黏著性質與導電性的膠帶。 Φ 此外，本發明者發現’當將其上形成有一光屏蔽圖案的 遮罩附著至膠帶的兩側，且用光照射該膠帶時，可利用遮 罩的光屏蔽圖案控制傳導填充物的移動，因此可製備得具 有期望導電性的傳導膠帶。 本發明係基於該等發現。 在一態樣中，本發明提供一種膠帶，其包括：一黏著劑 聚合物樹脂；及分佈在黏著劑聚合物樹脂中的薄片傳導填 充物，其中該薄片傳導填充物係於膠帶的水平方向&及y • 方向）及厚度方向（z方向）中電連續地配置在黏著劑聚合物 樹脂中’因此該膠帶顯示多種導電性。 在另一態樣中，本發明提供一種製備一膠帶的方法，其 。括以下步驟.⑴將用於形成黏著劑聚合物樹脂的單體與 薄片傳導填充物混合；(ii)將混合物形成為一薄片；⑽將 遮罩放置在該薄片的表面上；及（iv)用光照射該薄片的 -側或兩侧以光聚合該單體而形成黏著劑聚合物樹脂，其 中該遮罩具有一形成於其上的光屏蔽圖案，且光視該光屏 蔽圖案而照射在該薄片的整個或部分表面上。 137023.doc 200948927 【實施方式】 八根據本發明的膠帶通常具有-其中薄片傳導填充物材料 佈在霉έ著劑聚合物樹脂中的結構。言亥薄片冑導填充物 。;斗係於水平方向及/或厚t方向+配置在膠帶的表面上 或内部（或兩者）。由於薄片傳導填充物材料的此種規則配 置，本發明的膠帶展示改良的導電性。 使用於本發明的薄片傳導填充物微粒可實質上平坦地配 置^黏著㈣合物樹脂中。或者，填充物微粒可由於在光 聚。步驟中存在—光屏蔽圖案所產生之在聚合物樹脂各部 刀之間之聚合引發作用的差異而彼此不同地移動。 根據本發明之一態樣的薄片狀膠帶可例如藉由以下 步驟而製備：m傳導填充物添加至—未完全固化的裝 狀聚合物材料（下文中稱作「聚合物漿液」）；將該混合物 形成為一薄片’·將一可剝離的離型薄膜放置在該薄片的兩 侧上；及用光照射該薄片的兩側以光聚合該聚合物漿液。 藉由將該薄片傳導填充物材料平坦地（即定向於一平面中） 配置在水平方向（X及y方向）上，可製備得具有小於約1〇〇 μιη之厚度的膠帶。將聚合物漿液形成為一薄片的步驟可 與將離型薄膜放置在薄片的兩側上的步驟同時實施。 特定言之’可在將聚合物漿液形成為一薄片的過程中， 將光屏蔽圖案化離型薄膜放置在該薄片的兩側上。若使用 該光屏蔽圖案，則光照射係取決於離型薄膜的光屏蔽圖案 而選擇性地進行’且漿液表面的光聚合作用係經選擇性地 引發。薄片傳導填充物因此移動至聚合物浆液之尚未聚人 137023.doc 200948927 的部分，且可使用此原理來控制薄片傳導填充物材料的配 置。 明確S之，若光照射通過其上形成有一光屏蔽圖案的遮 罩，則光無法通過該光屏蔽圖案區域，或者通過該區域的 光篁將非常少。因此，在聚合物漿液之對應於光屏蔽圖案 的部分中，將不會引發光聚合作用，或若其經引發，光聚 合速率將非常缓慢。相反地，在聚合物漿液之其上未放置 ❹ 光屏蔽圖案的部分中，將主動地引發光聚合作用’且聚合 反應將經由源自光聚合作用之引發的自由基而朝向聚合物 浆液的下部進行。 以此方式，存在於聚合物漿液中經引發聚合反應的部分 中的薄片傳導填充物材料將移動至尚未發生聚合反應的其 他部分。若光聚合作用自聚合物漿液的兩側進行，則聚合 反應將自聚合物毁液的表面引發，且存在於聚合物浆液表 面上的傳導填充物將移往聚合物漿液之其中尚未發生聚合 ❹ &應的内部。另—方面，在位於光屏蔽圖案下方的聚合物 聚液的部分中，未發生光聚合反應，且存在於該部分中的 傳導填充物不移往或移動至其他部分。利用薄片傳導填充 物的移動性質，可製得多種根據本發明的膠帶。 圖2中說明一此種實施例。將聚合物漿液丨放置在無光屏 蔽圖案的遮罩3之間並用光4照射。以此方式，形成一其中 薄片傳導填充物於水平方向中配置在聚合物漿液的内部中 間層中的膠帶。 另一實施例說明於圖3，其中將聚合物漿液丨安置在具有 137023.doc 200948927 一光屏蔽圖案的遮罩3之間並用光4照射。以此方式，形成 一其中薄片傳導填充物2經配置在漿液之其上未放置光屏 蔽圖案之内部的膠帶。相反地，在漿液之其上放置有光屏 蔽圖案的該部分中’由於光聚合反應僅藉由微弱光引發， 因而薄片傳導填充物2仍留在聚合物漿液的表面上而沒有 任何顯著移動或存在遍及整個厚度方向。藉由此組合，薄 片傳導填充物2形成將膠帶的一側電連接至另一側的網狀 結構。 另外，在僅於聚合物漿液的一側上使用光屏蔽圖案化遮 罩之情況下，可製得其中薄片傳導填充物係同時在水平方 向和厚度方向中自聚合物衆液的一側配置至内部的膠帶。 根據本發明之具有薄片傳導填充物之不同配置的膠帶可 用於多種應用中。例如，其中薄片傳導填充物自膠帶的一 側配置至相對側而彬杰一诖嬙姐I处# k ^ I . . . _200948927 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to tapes for use in a variety of electronic applications and to methods for their preparation. [Prior Art] Electromagnetic light generated in various electronic I-position circuits may, in some cases, disturb the function of surrounding electronic devices or parts, degrade device performance, generate ring-shaped noise and interference, damage electronic images, and reduce electrons. Device life. A variety of materials have been developed to shield electromagnetic waves that cause such problems. These materials include metal sheets, mineral metal fabrics, conductive coatings, conductive tapes, conductive elastomers, and the like. In particular, the conductive tape is mainly used in miniaturized electronic devices. These conductive strips are prepared by adding a fine conductive filler such as carbon black, graphite, silver copper, ruthenium, or the like to an adhesive polymer resin to impart a conductivity to the resin. In order for these conductive fillers to impart a (4) resin property, the filler particles must form a continuous conduction path in the adhesive polymer resin. To this end, it is usually added to the excess conductive filler to the adhesive polymer resin. When an excessive amount of conductive filler is added, the viscous viscoelasticity of the adhesive resin is lowered, which causes the filler particles to aggregate, thereby increasing the viscosity of the polymer resin, thereby increasing the specific gravity and degrading the physical properties. Contains a reduction in impact and vibration absorption properties. In addition, it is difficult to control the conductivity of the conduction band by using a conventional manufacturing method. SUMMARY OF THE INVENTION 137023.doc 200948927 Accordingly, the inventors of the present invention have endeavored to prepare a conductive tape that can shield electromagnetic waves without causing the above problems. Further, the inventors of the present invention have endeavored to prepare an adhesive tape suitable for use in an electronic device which is gradually becoming compact and slim. As a result, the inventors have found that when a sheet-conductive filler is used in an adhesive polymer resin, an adhesive tape having an extremely small thickness while maintaining the adhesive property and conductivity of the resin can be prepared. Φ Furthermore, the inventors have found that 'when a mask having a light-shielding pattern formed thereon is attached to both sides of the tape, and the tape is irradiated with light, the light-shielding pattern of the mask can be used to control the movement of the conductive filler, Thus, a conductive tape having a desired electrical conductivity can be prepared. The present invention is based on these findings. In one aspect, the present invention provides an adhesive tape comprising: an adhesive polymer resin; and a sheet conductive filler distributed in the adhesive polymer resin, wherein the foil conductive filler is attached to the horizontal direction of the tape & And y • direction) and the thickness direction (z direction) are continuously arranged in the adhesive polymer resin. Therefore, the tape exhibits various conductivity. In another aspect, the invention provides a method of making a tape. The following steps are included: (1) mixing the monomer for forming the adhesive polymer resin with the sheet conductive filler; (ii) forming the mixture into a sheet; (10) placing the mask on the surface of the sheet; and (iv) The adhesive polymer resin is formed by photopolymerizing the monomer on the side or both sides of the sheet, wherein the mask has a light shielding pattern formed thereon, and the light shielding pattern is irradiated thereon On the entire or partial surface of the sheet. 137023.doc 200948927 [Embodiment] Eight tapes according to the present invention generally have a structure in which a sheet-conductive filler material is disposed in a mold-carrying polymer resin. Yanhai sheet 胄 guide filler. The bucket is placed in the horizontal direction and/or the thick t direction + on the surface of the tape or inside (or both). Due to this regular configuration of the sheet-conducting filler material, the tape of the present invention exhibits improved electrical conductivity. The sheet-conductive filler particles used in the present invention can be disposed substantially uniformly in the adhesive (tetra) resin. Alternatively, the filler particles may be due to photopolymerization. In the step, there is a difference in polymerization initiation effect between the respective knives of the polymer resin due to the light-shielding pattern, and it moves differently from each other. A flaky adhesive tape according to an aspect of the present invention can be produced, for example, by adding an m conductive filler to an incompletely cured shaped polymer material (hereinafter referred to as "polymer slurry"); The mixture is formed into a sheet '. A peelable release film is placed on both sides of the sheet; and both sides of the sheet are irradiated with light to photopolymerize the polymer slurry. By arranging the sheet-conducting filler material flat (i.e., oriented in a plane) in the horizontal direction (X and y directions), an adhesive tape having a thickness of less than about 1 μm can be prepared. The step of forming the polymer slurry into a sheet can be carried out simultaneously with the step of placing the release film on both sides of the sheet. Specifically, a light-shielding patterned release film can be placed on both sides of the sheet during the formation of the polymer slurry into a sheet. If the light-shielding pattern is used, the light irradiation is selectively performed depending on the light-shielding pattern of the release film, and the photopolymerization of the slurry surface is selectively initiated. The sheet-conducting filler thus moves to the portion of the polymer slurry that has not yet been concentrated 137023.doc 200948927, and this principle can be used to control the configuration of the sheet-conducting filler material. It is clear that if the light is irradiated through the mask on which the light shielding pattern is formed, the light cannot pass through the light shielding pattern region, or the aperture passing through the region will be very small. Therefore, in the portion of the polymer slurry corresponding to the light-shielding pattern, photopolymerization will not be initiated, or if it is initiated, the photopolymerization rate will be very slow. Conversely, in the portion of the polymer slurry on which the luminescent mask pattern is not placed, photopolymerization will be actively initiated' and the polymerization will proceed to the lower portion of the polymer slurry via free radicals initiated by photopolymerization. get on. In this manner, the sheet-conducting filler material present in the portion of the polymer slurry that is initiated by the polymerization will move to other portions where polymerization has not yet occurred. If photopolymerization is carried out from both sides of the polymer slurry, the polymerization will be initiated from the surface of the polymer effluent and the conductive filler present on the surface of the polymer slurry will migrate to the polymer slurry where polymerization has not yet occurred. & should be internal. On the other hand, in the portion of the polymer liquid located under the light-shielding pattern, photopolymerization does not occur, and the conductive filler present in the portion does not move or move to other portions. A variety of tapes in accordance with the present invention can be made using the moving nature of the flake-conducting filler. One such embodiment is illustrated in FIG. The polymer slurry was placed between the masks 3 of the matte-free pattern and illuminated with light 4. In this manner, an adhesive tape in which the sheet-conductive filler is disposed in the inner middle layer of the polymer slurry in the horizontal direction is formed. Another embodiment is illustrated in Figure 3, in which a polymer slurry is placed between a mask 3 having a light shielding pattern of 137023.doc 200948927 and illuminated with light 4. In this manner, an adhesive tape in which the sheet-conductive filler 2 is disposed inside the slurry on which the light-shielding pattern is not placed is formed. Conversely, in this portion of the slurry on which the light-shielding pattern is placed, 'because photopolymerization is only initiated by weak light, the sheet-conducting filler 2 remains on the surface of the polymer slurry without any significant movement or It exists throughout the entire thickness direction. By this combination, the sheet conductive filler 2 forms a mesh structure that electrically connects one side of the tape to the other side. In addition, in the case where a light-shielding patterned mask is used on only one side of the polymer slurry, it can be obtained in which the sheet-conducting filler is simultaneously disposed from the side of the polymer liquid to the horizontal direction and the thickness direction to Internal tape. Tapes having different configurations of sheet-conductive fillers in accordance with the present invention can be used in a variety of applications. For example, where the sheet-conducting filler is disposed from one side of the tape to the opposite side and Binjie Yijie I is at #k ^ I . . . _
則地散佈的先前膠帶， ，不同於其中傳導填充物係不規 薄片傳導填充物的配置可經控制。 137023.doc 200948927 因此’可製備得使用於多種需要導電性的不同應用中的本 發明朦帶。特定言之，根據本發明，由於使用一薄片傳導 填充物，因而可製備具有—相對小厚度（例如，大約1〇〇 μΓη)的膠帶。因此，本發明的膠帶典型上將具有約〇1 或以上之表面電阻及約〇.〇〇1 Ω或以上之垂直電阻。 在本發明的膠帶中，引入薄片傳導填充物以賦予導電性 並提供將膠帶製造地更薄的能力。可選擇任何材料用作薄 _ 片傳導填充物，只要其可賦予導電性並且形狀為薄片即 響 可。 本發明中有用的薄片傳導填充物材料的實例包含：薄片 金屬，包含：薄片貴金屬及非貴金屬；鍍上另一貴或非貴 金屬的薄片貴及非貴金屬；鍍上貴金屬或非貴金屬的薄片 非金屬；薄片傳導非金屬；及此等材料之兩種或多種的混 合物。 薄片傳導填充物材料的明確實例包含：貴金屬諸如金、 參 銀及鉑，非貴金屬諸如鎳、銅、錫及鋁；鑛上貴金屬的貴 及非貴金屬，諸如鍍銀的銅、鎳、鋁、錫及金；鍍上非貴 金属的貴及非貴金屬’諸如鍍鎳的銅及銀；鍍上責或非貴 金層的非金屬，諸如鍍銀或鎳的石墨、玻璃、陶竟、塑 膠、彈性體及雲母；傳導非金屬諸如碳黑及碳化纖維；及 任何此等材料之兩種或多種的混合物。 薄片傳導填充物的尺寸可視所使用材料的類型而改變。 薄片傳導填充物的尺寸並無明確限制，但在本發明的—實 施例中，若該薄片傳導填充物的形狀為正方形或矩形，則 137023.doc 200948927 其通常將具有在約100 nm至約25㈣範圍内的厚度及約 0·25-25 μιη的邊長。 基於膠帶的總重量，在根據本發明製成之膠帶中薄片傳 導填充物材料的含量範圍通常為約20-60 wt%(重量百分 比）。在本發明的一說明性實施例中，膠帶中黏著劑聚1 物樹脂的含量為約40_80 wt%，i薄片傳導填充物的含量 為約 20-60 wt%。 在本發日月+，可使用丙稀酸系$合物樹脂作為黏著劑聚 合物樹脂。在一實施例中，可使用可藉由聚合可光聚合之 單體而製備得的丙烯酸系聚合物樹脂。 對製造該等丙烯酸系聚合物樹脂有用的可光聚合單體包 含具有C^4烷基的烷基丙烯酸酯單體。此等烷基丙烯酸酯 單體的非限制實例包含：（甲基）丙烯酸丁酯、（甲基）丙烯 酸己酯、（曱基）丙烯酸正辛酯、（曱基）丙烯酸異辛酯、（甲 基）丙烯酸2-乙基己酯、（甲基）丙烯酸異壬酯及其類似物。 其他實例包含丙烯酸異辛酯、丙烯酸異壬酯、丙烯酸2•乙 基己酯、丙烯酸癸酯、丙烯酸十二烷酯、丙烯酸正丁酯、 丙烯酸己酯及其類似物。 雖然可單獨使用烷基丙烯酸酯單體於形成丙烯酸系黏著 劑聚合物樹脂，但其亦可與其他極性可共聚單體共聚合形 成丙嫦酸系黏著劑聚合物樹脂。一有用的此種樹脂可由具 有Ci-M烷基的烷基丙烯酸酯單體與極性可共聚合單體的共 聚物製成。在此情況，雖然烷基丙烯酸酯單體對極性可共 聚合單體的重量比並無明確限制，但鑑於所形成之黏著劑 137023.doc •12· 200948927 聚合物樹脂的物理性質，其較佳為99-50: 1-50。 極性可共聚合單體的非限制實例包含丙烯酸、衣康酸、 丙烯酸羥烷基酯、丙烯酸氰烧基酯、丙烯醯胺、經取代的 丙烯醯胺、N-乙烯基吡咯啶酮、N-乙烯基己内醯胺、丙稀 腈、氣乙烯、酞酸二烯丙酯及其類似物。該等極性可共聚 合早體可賦予聚合物樹脂膠黏性及内聚性並改良黏著性。 基於膠帶的總重量，根據本發明製成的膠帶中黏著劑聚 合物樹脂的含量通常將約為40-80 wt%。 又，為使膠帶擁有所應用之產品所需的物理性質，本發 明的膠帶可進一步包括一或多種額外填充物。只要不會削 弱膠帶的性質及有效性’則可使用任何此等額外的填充 物。此等額外填充物的非限制實例包含導熱性填充物、阻 燃性填充物、抗靜電劑、發泡劑及其類似物。 以100份重量的黏著劑聚合物樹脂為基礎，該等額外填 充物通常將以小於約100份重量的量使用，例如，約10_ φ 100份重量。 本發明的膠帶可進一步包括添加劑，例如，聚合引發 劑、交聯劑、光引發劑、顏料、抗氧化劑、11¥穩定劑、 分散劑、消泡劑、增塑劑及增黏樹脂。該等添加劑可在膠 _ 帶的製備過程期間添加》 下文中將詳細描述製備膠帶的方法。 本發明的膠帶可藉*將用於形成黏著劑聚合物樹脂的單 體或該單體的預聚物漿液與用於賦予導電性的薄片傳導填 充物混合’添加額外填充物或添加劑（若有使用）及聚合該 137023.doc -13· 200948927 混合物而製備得。 明確言之，本發明的膠帶可藉由實施下列步驟而製備： 此合用於形成黏著劑聚合物樹脂的單體與薄片傳導填充 物；將混合物形成為一薄片；將一遮罩放置在該薄片的表 面上，及用光照射該薄片的兩侧以光聚合該用於形成黏著 劑聚合物樹脂的單體。可使用其上形成有一光屏蔽圖案的 遮罩，且可視遮罩的光屏蔽圖案而用光照射該薄片表面的 全部或部分。在此情況，存在於薄片之經引發聚合之部分 中的薄片傳導填充物將移動至尚未發生聚合的其他部分。 在本發明的—實施例中，用於形成黏著劑聚合物樹脂的 單體經預聚合以製備—聚合物漿液，且將薄片傳導填充物 及其他必需的添加劑添加至聚合物漿液。Λ方法可用以均 勻地分散薄片傳導填充物並促進選擇性光聚合作用的引 “更月確。之’混合用於形成黏著劑聚合物樹脂的單體 與缚片傳導填充物的步驟可包括以下步驟：部分聚合單體 組合物以製備-聚合物漿液及添加薄片傳導填充物至聚合 物漿液。在本發明的一實施例中’該聚合物漿液可具有： 500至約20,〇〇〇 cP之黏度。 在该製備方法的一特定實施例中，首先使用聚合引發劑 在無氧條件下將用於形成黏著劑聚合物樹脂的單體（例 如，用於形成丙烯酸系聚合物樹脂的單體)部分聚合，以 製備具有約500至約20,〇〇〇 cp黏声的她蔣 Μ黏度的糖漿。將薄片傳導填 充物、交聯劑、光引發劑及任何其 ^ ^ U六他必窝添加劑添加至該The previously spread the previously tape, unlike the configuration in which the conductive filler is irregular, the sheet-conductive filler can be controlled. 137023.doc 200948927 Thus, the present invention can be prepared for use in a variety of different applications requiring electrical conductivity. In particular, according to the present invention, since a sheet-conductive filler is used, an adhesive tape having a relatively small thickness (e.g., about 1 〇〇 μΓη) can be prepared. Accordingly, the tape of the present invention will typically have a surface resistance of about 〇1 or more and a vertical resistance of about 〇〇1 Ω 1 Ω or more. In the tape of the present invention, a sheet-conductive filler is introduced to impart electrical conductivity and provide the ability to make the tape thinner. Any material may be selected for use as a thin-sheet conductive filler as long as it imparts conductivity and is shaped as a sheet. Examples of sheet-conducting filler materials useful in the present invention include: sheet metal comprising: sheet precious metals and non-precious metals; sheets of precious or non-precious metals plated with another noble or non-precious metal; sheets of non-metallic coated with precious or non-precious metals The flakes conduct non-metal; and a mixture of two or more of these materials. Clear examples of sheet-conductive filler materials include: noble metals such as gold, silver and platinum, non-precious metals such as nickel, copper, tin and aluminum; precious and non-precious metals of precious metals such as silver, copper, nickel, aluminum, tin And gold; precious and non-precious metals plated with non-precious metals 'such as nickel-plated copper and silver; non-metallic coated with non-precious gold layers, such as graphite or glass coated with silver or nickel, glass, ceramics, plastics, elastomers And mica; conducting non-metals such as carbon black and carbonized fibers; and mixtures of two or more of any of these materials. The size of the sheet-conductive filler can vary depending on the type of material used. The size of the sheet-conducting filler is not specifically limited, but in the embodiment of the present invention, if the shape of the sheet-conducting filler is square or rectangular, then 137023.doc 200948927 will typically have from about 100 nm to about 25 (four) The thickness in the range and the side length of about 0·25-25 μηη. The content of the sheet-conducting filler material in the tape made in accordance with the present invention is typically in the range of from about 20% to about 60% by weight, based on the total weight of the tape. In an illustrative embodiment of the invention, the amount of adhesive polymer in the tape is about 40-80 wt% and the amount of i-sheet conductive filler is about 20-60 wt%. In the present day and month +, an acrylic acid compound resin can be used as the adhesive polymer resin. In one embodiment, an acrylic polymer resin which can be prepared by polymerizing a photopolymerizable monomer can be used. The photopolymerizable monomer useful for the production of the acrylic polymer resins contains an alkyl acrylate monomer having a C 4 alkyl group. Non-limiting examples of such alkyl acrylate monomers include: butyl (meth) acrylate, hexyl (meth) acrylate, n-octyl (decyl) acrylate, isooctyl (decyl) acrylate, (A) 2-ethylhexyl acrylate, isodecyl (meth)acrylate and the like. Other examples include isooctyl acrylate, isodecyl acrylate, 2·ethylhexyl acrylate, decyl acrylate, dodecyl acrylate, n-butyl acrylate, hexyl acrylate, and the like. Although the alkyl acrylate monomer can be used alone to form the acrylic adhesive polymer resin, it can also be copolymerized with other polar copolymerizable monomers to form a propionic acid based adhesive polymer resin. A useful such resin can be made from a copolymer of an alkyl acrylate monomer having a Ci-M alkyl group and a polar copolymerizable monomer. In this case, although the weight ratio of the alkyl acrylate monomer to the polar copolymerizable monomer is not specifically limited, it is preferred in view of the physical properties of the formed polymer 137023.doc • 12· 200948927 polymer resin. For 99-50: 1-50. Non-limiting examples of polar copolymerizable monomers include acrylic acid, itaconic acid, hydroxyalkyl acrylate, cyanamide acrylate, acrylamide, substituted acrylamide, N-vinyl pyrrolidone, N- Vinyl caprolactam, acrylonitrile, ethylene ethylene, diallyl citrate and the like. The polar copolymerizable early precursors impart adhesiveness and cohesiveness to the polymer resin and improve adhesion. The adhesive polymer resin in the tape made in accordance with the present invention will typically comprise from about 40% to about 80% by weight, based on the total weight of the tape. Again, the tape of the present invention may further comprise one or more additional fillers in order for the tape to possess the physical properties required for the product being applied. Any such additional filler may be used as long as the properties and effectiveness of the tape are not compromised. Non-limiting examples of such additional fillers include thermally conductive fillers, flame retardant fillers, antistatic agents, blowing agents, and the like. Based on 100 parts by weight of the adhesive polymer resin, the additional fillers will generally be used in an amount of less than about 100 parts by weight, for example, about 10 _ φ 100 parts by weight. The tape of the present invention may further include additives such as a polymerization initiator, a crosslinking agent, a photoinitiator, a pigment, an antioxidant, a stabilizer, a dispersant, an antifoaming agent, a plasticizer, and a tackifying resin. These additives may be added during the preparation process of the glue tape. The method of preparing the tape will be described in detail below. The adhesive tape of the present invention can be mixed with a monomer for forming an adhesive polymer resin or a prepolymer slurry of the monomer with a conductive filler for imparting conductivity. Prepared by using) and polymerizing the mixture of 137023.doc -13· 200948927. Specifically, the tape of the present invention can be prepared by performing the following steps: the monomer and the sheet conductive filler used to form the adhesive polymer resin; forming the mixture into a sheet; placing a mask on the sheet The surface of the sheet is irradiated with light to photopolymerize the monomer for forming the adhesive polymer resin. A mask having a light shielding pattern formed thereon may be used, and all or a portion of the surface of the sheet may be illuminated with light by the light shielding pattern of the mask. In this case, the sheet-conducting filler present in the initiated polymerization portion of the sheet will move to other portions where polymerization has not yet occurred. In the embodiment of the present invention, the monomer for forming the adhesive polymer resin is prepolymerized to prepare a polymer slurry, and a sheet conductive filler and other necessary additives are added to the polymer slurry. The crucible method can be used to uniformly disperse the sheet-conducting filler and promote selective photopolymerization. The step of mixing the monomer and the tab conductive filler for forming the adhesive polymer resin can include the following steps. Step: partially polymerizing the monomer composition to prepare a polymer slurry and adding a sheet conductive filler to the polymer slurry. In one embodiment of the invention 'the polymer slurry may have: 500 to about 20, 〇〇〇cP In a specific embodiment of the preparation method, a monomer for forming an adhesive polymer resin (for example, a monomer for forming an acrylic polymer resin) is first used under anaerobic conditions using a polymerization initiator. Partially polymerized to prepare a syrup of her Jiangyue viscosity having a viscosity of about 500 to about 20, 〇〇〇cp. The flake conductive filler, crosslinker, photoinitiator and any of its Adding additives to the
漿液，且將該混合物形成為一笼H 風马潯片。可使用透光離型薄 137023.doc 200948927 膜，以致將聚合物漿液薄片安置 置於兩離型薄膜層之間。藉 由將聚合物漿液安置於離型薄膜 潯膜之間，可維持實質上無氧 條件。若將光屏蔽圖案形成在一或兩個離型薄膜上，㈣ 離型薄膜可充作-其上形成光屏蔽圖案的遮罩。其後，聚 合物渡液可在實質上益β 負無氧的條件下’藉由引導照射光(較 佳係υν光）穿過離型薄膜或盆他呈古土 e ^. x丹他具有光屏蔽圖案的遮罩而 聚合及交聯。在此步驟中，朵可通止 τ九了視光屏蔽圖案而照射在聚The slurry was formed and the mixture was formed into a cage of H. A light-transmissive thin film 137023.doc 200948927 can be used so that the polymer slurry sheet is placed between the two release film layers. Substantially anaerobic conditions can be maintained by placing the polymer slurry between the release film and the ruthenium film. If the light-shielding pattern is formed on one or two release films, the (iv) release film can be used as a mask on which the light-shielding pattern is formed. Thereafter, the polymer liquid can be passed through the release film or the potted earth through the release film (preferably υν light) under the conditions of substantially β-negative anaerobic e ^. x dan he has The mask of the light shielding pattern is polymerized and crosslinked. In this step, the flower can pass through the illuminating shield pattern and illuminate the poly
合物漿液表面的全部或部分上，以致選擇性地引發光聚合 反應。存在於漿液之經引發聚合之部分中的薄片傳導填充 物移動至其中尚未發生聚合的其他部分。結果，薄片傳導 填充物經三維配置，且可製備得具有期望導電性的膠帶。 在用光照射薄片纟面期Μ，薄#巾氧含量的減少可導致 黏著劑聚合物樹脂的黏著力增加，因為膠帶中不必要的氧 化反應經避免。氧阻隔可藉由如上所述在離型薄膜之間安 置聚合物漿液並將聚合物漿液形成為一薄片而達成。在一 實質上無氧的腔室，例如，一具有小於約1〇〇〇 之氧濃 度的腔室中經由光照射引發光聚合反應通常亦較佳。如此 可更有效地阻隔氧並防止氧化反應。在一些情況中，氧濃 度更佳為小於約500 ppm。 在光聚合步驟中’為僅使薄片表面的經選擇部分照射 光’可利用具有光屏蔽圖案的遮罩，且為使薄片的整個表 面照射光’可利用沒有光屏蔽圖案的遮罩（即透明遮罩 具有光屏蔽圖案的遮罩通常包括光可通過的區域、及光無 法通過或僅極少量光可通過的區域。因此，薄片之其上經 137023.doc 200948927 放置光屏蔽圖案的部分將不會被光照射或將被微弱光照 射，且存在於該部分中的薄片傳導填充物將保留在薄片表 面上而沒有任何實質的移動。相反地，薄片之其上未放置 光屏蔽圖案的部分將被光照射而w發光聚合反應，且存在 於該部分中的薄片傳導填充物將移動至其中尚未發生光聚 合反應的其他部分。結果，薄片傳導填充物可在薄片中形 成一網狀結構。另外，為使薄片傳導填充物配置在薄片的 内部，可利用沒有光屏蔽圖案的遮罩，以致光可照射在薄 片之實質上整個表面上。 遮罩的非限制實例包含其上形成期望之光屏蔽圖案（諸 如一網狀結構或一格栅結構）的透光離型薄膜及沒有光屏 蔽圖案的透光離型薄膜。可使用具有低表面積或其上經塗 佈釋離層的透明塑膠膜作為透光離型薄膜。適當的透光離 型薄媒的實例包含聚乙稀棋、聚丙烤膜、聚對苯二甲酸乙 二醋（「PET」）膜及其類似物。 可使用任何可屏蔽到達光屏蔽圖案之光之約丨〇_丨〇〇%的 材料來形成光屏蔽圖案。較佳利用可屏蔽到達光屏蔽圖案 之光之多於約50%的材料。在本發明的一些實施例中，可 設計光屏蔽圖案以使其屏蔽多於約7〇%的入射光。若需 要亦可5又计光屏蔽圖案以使其完全地（1 〇〇%)屏蔽入射 光。 對於在透光離型薄膜的表面上形成光屏蔽圖案的方法並 無限制。可利用任何方法將一材料沉積在透光離型薄膜的 表面上，以形成減少或屏蔽光通過的光屏蔽圖案。例如， 137023.doc 200948927 Π:!可t於此目"等印刷方法係此項技術，所 n網版印刷方法、利用熱轉 二成::Γ等等。可利用具咖 形狀並Α特殊：Α形成在離型*膜上的㈣明索的 望的特定：::：:經選擇為與傳導填充物材料所期All or part of the surface of the slurry is such that photopolymerization is selectively initiated. The sheet-conducting filler present in the initiated polymerization portion of the slurry moves to other portions in which polymerization has not yet occurred. As a result, the sheet-conductive filler is three-dimensionally configured, and an adhesive tape having desired conductivity can be prepared. The reduction in the oxygen content of the thinner can cause an increase in the adhesive strength of the adhesive polymer resin because the unnecessary oxidation reaction in the adhesive tape is avoided. Oxygen barrier can be achieved by placing a polymer slurry between the release films as described above and forming the polymer slurry into a sheet. It is also generally preferred to initiate photopolymerization via light irradiation in a substantially oxygen-free chamber, for example, a chamber having an oxygen concentration of less than about 1 Torr. This can block oxygen more effectively and prevent oxidation. In some cases, the oxygen concentration is more preferably less than about 500 ppm. In the photopolymerization step, 'only a portion of the surface of the sheet is irradiated with light' may utilize a mask having a light-shielding pattern, and in order to illuminate the entire surface of the sheet, a mask having no light-shielding pattern may be utilized (ie, transparent) A mask having a light-shielding pattern generally includes a region through which light can pass, and a region through which light cannot pass or only a very small amount of light can pass. Therefore, the portion of the sheet on which the light-shielding pattern is placed by 137023.doc 200948927 will not Will be illuminated by light or will be illuminated by weak light, and the sheet-conducting filler present in the portion will remain on the surface of the sheet without any substantial movement. Conversely, the portion of the sheet on which the light-shielding pattern is not placed will The light is irradiated while the light is luminescent, and the sheet-conducting filler present in the portion is moved to other portions in which photopolymerization has not occurred. As a result, the sheet-conductive filler can form a network in the sheet. In order to arrange the sheet conductive filler inside the sheet, a mask having no light shielding pattern may be utilized, so that the light may be irradiated on the sheet Substantially on the entire surface. Non-limiting examples of masks include a light-transmissive release film having a desired light-shielding pattern (such as a mesh structure or a grid structure) and a light-transmissive release film having no light-shielding pattern thereon. A transparent plastic film having a low surface area or a coated release layer thereon can be used as the light-transmissive release film. Examples of suitable light-transmissive release media include polyethylene chess, polypropylene film, and polyethylene terephthalate. Ethylene glycol oxalate ("PET") film and the like. The light shielding pattern can be formed using any material that can shield the light reaching the light shielding pattern by about 丨〇 丨〇〇 %. Shielding the light of the pattern by more than about 50% of the material. In some embodiments of the invention, the light shielding pattern can be designed to shield more than about 7% of the incident light. The pattern is such that it completely shields the incident light. The method for forming the light-shielding pattern on the surface of the light-transmitting release film is not limited. Any method may be used to deposit a material on the light-transmissive release film. On the surface to form Reduce or shield the light shielding pattern through which light passes. For example, 137023.doc 200948927 Π:! This can be used in this method. The printing method is based on this technology, the n-page printing method, the use of heat transfer 20%::Γ, etc. Etc. Can be used in the shape of a coffee and Α special: Α formed on the release film * (4) the specific look of the cable::::: selected as the material with the conductive filler
9在本發明的實施例中，離型薄膜的厚度可為約5㈣至約 仁對離型薄膜的厚度並無特殊限制。在厚度小於 約5,的離型薄膜上形成光屏蔽圖案及施用聚合物漿液通 常是更困難的。若離型薄膜非常厚（例如，多於約2 mm)， 則實施聚合物漿液的光聚合亦可能困難。 此外，雖然根據本發明製備之膠帶的厚度並無明確限 制，但該膠帶較佳具有約10-200 μηι之厚度。在本發明的 二實施例中，有鑑於光聚合作用、厚度及薄片傳導填充 物的移動等等’膠帶的厚度較佳為約2〇_15〇㈣，並更佳 為約 30-100 。 用於實施聚合物漿液之光聚合反應的光強度可為習知應 用於光聚合的任何光強度。在本發明的一實施例中，相當 於UV光強度之光強度是較佳的。 可使用一或多種交聯劑來交聯黏著劑聚合物樹脂。取決 於交聯劑的使用量，可控制黏著劑聚合物樹脂的性質（尤 其是黏著性質）。以100份重量的黏著劑聚合物樹脂為基 礎’交聯劑通常將以約0.05_2份重量的量使用。有用交聯 劑的明確實例包含（但不限於）多官能丙烯酸酯諸如丨，6_己 137023.doc -17- 200948927 二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、新戊四醇三 丙烯酸酯、1，2-乙二醇二丙烯酸酯、M2_十二烷二醇丙烯 酸酯、及其類似物。 另外’於本發明的膠帶製備過程中可使用一或多種光引 發劑。取決於光引發劑的使用量’可控制聚合物樹脂的聚 合度。以100份重量的黏著劑聚合物樹脂為基礎，光引發 劑可以約0.01-2份重量的量使用。有用光引發劑的明確實 例包含（但不限於）2,4,6-三甲基苯甲醯基_二苯基氧化膦、 雙（2,4,6-三甲基笨甲醯基）苯基氧化膦、α，α_曱氧基羥基 乙醯苯、2-苯甲醯基·2(二甲胺基）嗎啉基）笨基]+ 丁酮、2,2-二甲氧基_2_苯基苯乙酮等等。 由於薄片傳導填充物的配置可取決於遮罩的光屏蔽圖案 而改變以便改變導電性，因而根據本發明製成的膠帶可應 用於需要導電性的多種電子裝置中。 實例 在下文中將參考實例及比較實例更詳細地描述本發明。 應瞭解此等實例僅為說明目的而提供，不應將本發明的範 疇解釋為受其所限制。 下列實例中之術語「份」係指相對於i 〇〇份重量之藉由 聚合單體而形成之黏著劑聚合物樹脂的「重量份數」聚合 物。 實例1 將90份作為丙烯酸系單體的丙烯酸2_乙基己酯及丨〇份作 為極性可共聚合單體的丙烯酸放置於1公升玻璃反應器 137023.doc 200948927 中，且於其中加入0.1份光引發劑Irgacure 651(α，α-甲氧基_ α-經基乙酿苯）及0.1份交聯劑ι，6-己二醇二丙稀酸醋 (「HDDA」）。藉由光引發使該等單體部分聚合，因此製 備得具有3000 cP黏度的漿液。於該漿液中添加4〇份作為 薄片傳導填充物的薄片銀，且攪動混合物，因此製備得均 勻的聚合物漿_液。 同時，利用黑墨水在由75 μηι厚的透明聚對苯二曱酸乙 應 二酯膜（「PET」）製成的離型薄膜上圖案化出一具有35〇 寬度及1 mm間隔的格柵結構，因此製備得具有一光屏 蔽圖案的遮罩。 如圖6中所顯示’聚合物漿液自玻璃反應器中被擠出， 同時利用輥塗機器將圖案化離型薄膜放置在聚合物漿液的 兩側上’以使聚合物漿液的厚度達到約50 μιη。藉由將離 型薄膜放置在聚合物浆液的兩側上，可防止聚合物漿液接 觸到空氣，尤其是氧。 φ 聚合物漿液藉由利用一金屬鹵化物UV燈用UV光透過離 型薄膜以4.5 mW/cm3之能量劑量照射兩側歷時520秒而固 化，因而製備得一膠帶。 實例2 •以如實例1中之相同方式製備一膠帶，僅除了將一圖案 化離型薄膜放置在聚合物漿液之頂側上，及在底側上放置 一透明離型薄膜而非圖案化離型薄膜。 實例3 以如實例1中之相同方式製備一膠帶，僅除了在聚合物 137023.doc •19- 200948927 漿液的兩側上放置一透明離型薄膜而非圖案化離型薄膜。 測試實例1 :電阻測定 藉由改自MU-G-83528B的表面電極（surface pr〇be)方法 利用Kietheley 5 80微歐姆計測定在實例【至3中製備的每個 膠帶的表面電阻及垂直電阻。測定結果的平均值顯示在下 表1。 表1 垂直電阻(Ω) __是面電阻(Q/m2) 頂側 底側 實例1 0.004 10.5 11.4 實例2 - Ϊ0~~~~ 實例3 - 如上表1中可見，實例〗至3中製備的膠帶具有取決於遮 罩之光屏蔽圖案的多種導電性。 測試實例2 :黏著測試 依照ASTM D 1000，將在實例&中製備的每個膠帶與 銘薄片層S ’然後使用通用測試機器（「UTM咖幫…In the embodiment of the present invention, the thickness of the release film may be from about 5 (four) to about 6 Å. The thickness of the release film is not particularly limited. It is generally more difficult to form a light-shielding pattern on a release film having a thickness of less than about 5 and to apply a polymer slurry. If the release film is very thick (e.g., more than about 2 mm), photopolymerization of the polymer slurry may also be difficult. Further, although the thickness of the tape prepared according to the present invention is not specifically limited, the tape preferably has a thickness of about 10 to 200 μη. In the second embodiment of the present invention, the thickness of the tape is preferably about 2 Å to 15 Å (four), and more preferably about 30 to 100, in view of photopolymerization, thickness, and movement of the sheet-conducting filler. The light intensity used to effect photopolymerization of the polymer slurry can be any light intensity conventionally applied to photopolymerization. In an embodiment of the invention, light intensity equivalent to the intensity of the UV light is preferred. One or more crosslinking agents can be used to crosslink the adhesive polymer resin. The nature of the adhesive polymer resin (especially the adhesive property) can be controlled depending on the amount of the crosslinking agent used. The crosslinking agent will usually be used in an amount of about 0.05 to 2 parts by weight based on 100 parts by weight of the adhesive polymer resin. Clear examples of useful crosslinking agents include, but are not limited to, multifunctional acrylates such as hydrazine, 6-hexa 137023.doc -17- 200948927 diol diacrylate, trimethylolpropane triacrylate, neopentyl alcohol Acrylate, 1,2-ethylene glycol diacrylate, M2_dodecanediol acrylate, and the like. Further, one or more photoinitiators can be used in the tape preparation process of the present invention. The degree of polymerization of the polymer resin can be controlled depending on the amount of use of the photoinitiator. The photoinitiator can be used in an amount of from about 0.01 to 2 parts by weight based on 100 parts by weight of the adhesive polymer resin. Clear examples of useful photoinitiators include, but are not limited to, 2,4,6-trimethylbenzimidyl-diphenylphosphine oxide, bis(2,4,6-trimethylabendyryl)benzene Phosphine oxide, α,α-methoxy hydroxyethyl benzene, 2-benzylidene 2 (dimethylamino) morpholinyl) phenyl], butanone, 2,2-dimethoxy _ 2_Phenylacetophenone and the like. Since the configuration of the sheet-conductive filler can be changed depending on the light-shielding pattern of the mask to change the conductivity, the tape made according to the present invention can be applied to various electronic devices requiring conductivity. EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples. It is to be understood that the examples are provided for illustrative purposes only and that the scope of the invention should not be construed as limited. The term "parts" in the following examples refers to "parts by weight" of the polymer of the adhesive polymer resin formed by polymerizing the monomer relative to the weight of the i. Example 1 90 parts of acrylic acid as an acrylic monomer, 2-ethylhexyl acrylate and hydrazine as a polar copolymerizable monomer were placed in a 1 liter glass reactor 137023.doc 200948927, and 0.1 parts were added thereto. The photoinitiator Irgacure 651 (α,α-methoxy_α-pyridylbenzene) and 0.1 part of a crosslinking agent i,6-hexanediol dipropylene vinegar ("HDDA"). The monomers were partially polymerized by photoinitiation, thereby preparing a slurry having a viscosity of 3000 cP. To the slurry was added 4 parts of flake silver as a sheet-conducting filler, and the mixture was agitated, thereby preparing a uniform polymer slurry. At the same time, a black ink was used to pattern a grid having a width of 35 Å and a spacing of 1 mm on a release film made of 75 μη thick transparent polyethylene terephthalate film ("PET"). Structure, thus preparing a mask having a light shielding pattern. As shown in Figure 6, 'the polymer slurry was extruded from the glass reactor while the patterned release film was placed on both sides of the polymer slurry using a roll coater' to bring the polymer slurry to a thickness of about 50 Ιιη. By placing the release film on both sides of the polymer slurry, the polymer slurry is prevented from coming into contact with air, especially oxygen. The φ polymer slurry was cured by irradiating the release film with UV light through a release film at an energy dose of 4.5 mW/cm3 for 520 seconds using a metal halide UV lamp. Example 2 • A tape was prepared in the same manner as in Example 1 except that a patterned release film was placed on the top side of the polymer slurry and a transparent release film was placed on the bottom side instead of patterning. Type film. Example 3 A tape was prepared in the same manner as in Example 1 except that a transparent release film was placed on both sides of the slurry of the polymer 137023.doc • 19-200948927 instead of the patterned release film. Test Example 1: Resistance Measurement Surface resistance and vertical resistance of each of the tapes prepared in Examples [3] were measured by a surface electrode pr〇be method modified from MU-G-83528B using a Kietheley 5 80 micro ohmmeter. . The average value of the measurement results is shown in Table 1 below. Table 1 Vertical resistance (Ω) __ is the sheet resistance (Q/m2) Top side bottom side Example 1 0.004 10.5 11.4 Example 2 - Ϊ0~~~~ Example 3 - As seen in Table 1 above, examples 〖 to 3 The tape has a variety of electrical properties that depend on the light shielding pattern of the mask. Test Example 2: Adhesion Test Each tape prepared in Example & and the sheet layer S' was used in accordance with ASTM D 1000 and then a universal test machine ("UTM Coffee Help...
Test Machine)」）測定每個膠帶在〗8〇。方向中對頂側及底側 的黏著。測定結果顯示在下表2。 ❹ 表2Test Machine)") Determine each tape at 〖8〇. Adhesion to the top and bottom sides in the direction. The results of the measurements are shown in Table 2 below. ❹ Table 2
【圖式簡單說明】 其中薄片傳 圖1⑷顯示在本發明的實例j中冑備的膠帶 導填充物大致係以一網狀組態配置； 137023.doc •20· 200948927 圖1(b)顯示在本發明的實例2中製備的膠帶，其中薄片 傳導填充物係在水平方向與厚度方向中自聚合物衆液的— 表面配置至内部中間部分； 圖1⑷顯示在本發明的實例3中製備的膠帶，其中薄片傳 導填充物係於水平方向中配置於聚合物浆液的内部中 ‘ 中； '· 圖2及3示意性地顯示填充物視在用於製備膠帶之本發明 φ 方法的光照射步驟中所使用之遮罩圖案而變化的配置； 圖4⑷係顯示依照本發明之實例1製備的膠帶之表面的掃 指電子顯微鏡（「SEM」）照片； 圖4(b)及4(c)係顯不依照本發明之實例丨製備的膠帶之橫 截面的掃描電子顯微鏡（「SEM」）照片； 圖5(a)及5(b)係分別顯示依照本發明之實例2製備的膠帶 之兩側的掃描電子顯微鏡（「SEM」）照片；及 圖6不意性地顯示依照本發明製備一膠帶的過程。 φ 【主要元件符號說明】 1 聚合物衆液 2 薄片傳導填充物 3 遮罩 137023.doc -21·BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1 (4) shows that the tape-guided filler prepared in the example j of the present invention is roughly configured in a mesh configuration; 137023.doc • 20· 200948927 Figure 1(b) shows The tape prepared in Example 2 of the present invention, wherein the sheet-conductive filler is disposed from the surface of the polymer liquid to the inner intermediate portion in the horizontal direction and the thickness direction; Fig. 1 (4) shows the tape prepared in Example 3 of the present invention. Wherein the flake-conducting filler is disposed in the interior of the polymer slurry in the horizontal direction; '· Figures 2 and 3 schematically show that the filler is in the light irradiation step of the φ method of the present invention for preparing a tape Fig. 4(4) shows a scanning electron microscope ("SEM") photograph of the surface of the tape prepared in accordance with Example 1 of the present invention; Figs. 4(b) and 4(c) show Scanning electron microscope ("SEM") photographs of cross-sections of tapes not prepared in accordance with examples of the present invention; Figures 5(a) and 5(b) show the sides of the tape prepared in accordance with Example 2 of the present invention, respectively. Scanning electronic display Microscopy ( "SEM") photograph; and FIG. 6 shows exemplary processes intended a tape prepared in accordance with the present invention. Φ [Description of main component symbols] 1 Polymer liquid 2 Thin film conductive filler 3 Mask 137023.doc -21·