WO2009085631A3 - Adhesive tape and method for preparing the same - Google Patents
Adhesive tape and method for preparing the same Download PDFInfo
- Publication number
- WO2009085631A3 WO2009085631A3 PCT/US2008/086363 US2008086363W WO2009085631A3 WO 2009085631 A3 WO2009085631 A3 WO 2009085631A3 US 2008086363 W US2008086363 W US 2008086363W WO 2009085631 A3 WO2009085631 A3 WO 2009085631A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- preparing
- same
- adhesive tape
- conductive filler
- adhesive tapes
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BRPI0821289-9A BRPI0821289A2 (en) | 2007-12-21 | 2008-12-11 | Adhesive tape and method for preparing it |
CN2008801220251A CN101903484A (en) | 2007-12-21 | 2008-12-11 | Adhesive tape and method for preparing the same |
EP08867664A EP2235130A2 (en) | 2007-12-21 | 2008-12-11 | Adhesive tape and method for preparing the same |
CA2709934A CA2709934A1 (en) | 2007-12-21 | 2008-12-11 | Adhesive tape and method for preparing the same |
JP2010539635A JP2011508012A (en) | 2007-12-21 | 2008-12-11 | Adhesive tape and method for producing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0135804 | 2007-12-21 | ||
KR1020070135804A KR20090067964A (en) | 2007-12-21 | 2007-12-21 | Adhesive tape and method for preparing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009085631A2 WO2009085631A2 (en) | 2009-07-09 |
WO2009085631A3 true WO2009085631A3 (en) | 2009-08-27 |
Family
ID=40824985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2008/086363 WO2009085631A2 (en) | 2007-12-21 | 2008-12-11 | Adhesive tape and method for preparing the same |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP2235130A2 (en) |
JP (1) | JP2011508012A (en) |
KR (1) | KR20090067964A (en) |
CN (1) | CN101903484A (en) |
BR (1) | BRPI0821289A2 (en) |
CA (1) | CA2709934A1 (en) |
RU (1) | RU2010125988A (en) |
TW (1) | TW200948927A (en) |
WO (1) | WO2009085631A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100608533B1 (en) | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Polymer resin having excellent electroconductivity and manufacturing method thereof |
CN103201352B (en) * | 2011-10-25 | 2014-07-09 | 3M创新有限公司 | Nonwoven adhesive tapes and articles therefrom |
CN110746901A (en) * | 2019-11-12 | 2020-02-04 | 湖南省和祥润新材料有限公司 | Combined type shading adhesive and manufacturing process thereof |
RU2724650C1 (en) * | 2020-01-22 | 2020-06-25 | ООО "РТ-технологии" | Electroconductive materials dispersed in non-conductive organic material |
KR102271126B1 (en) * | 2020-12-28 | 2021-07-02 | 주식회사 스파이더실크 | High Thermal Conductivity Heat Dissipation Composite Material And Manufacturing Method Thereof |
CN115181505B (en) * | 2022-07-12 | 2024-02-27 | 东莞市兆科电子材料科技有限公司 | Heat conduction gasket and preparation method thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4731282A (en) * | 1983-10-14 | 1988-03-15 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film |
WO2004077621A1 (en) * | 2003-02-28 | 2004-09-10 | J.S.T. Mfg. Co. Ltd. | Anisotropic conductive sheet |
US7034403B2 (en) * | 2003-04-10 | 2006-04-25 | 3M Innovative Properties Company | Durable electronic assembly with conductive adhesive |
US20070001292A1 (en) * | 2005-06-30 | 2007-01-04 | Polymatech Co., Ltd. | Heat radiation member and production method for the same |
US20070068622A1 (en) * | 2004-02-26 | 2007-03-29 | Sony Chemicals Corp. | Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film |
-
2007
- 2007-12-21 KR KR1020070135804A patent/KR20090067964A/en not_active Application Discontinuation
-
2008
- 2008-12-11 WO PCT/US2008/086363 patent/WO2009085631A2/en active Application Filing
- 2008-12-11 RU RU2010125988/05A patent/RU2010125988A/en not_active Application Discontinuation
- 2008-12-11 CN CN2008801220251A patent/CN101903484A/en active Pending
- 2008-12-11 JP JP2010539635A patent/JP2011508012A/en not_active Withdrawn
- 2008-12-11 BR BRPI0821289-9A patent/BRPI0821289A2/en not_active IP Right Cessation
- 2008-12-11 CA CA2709934A patent/CA2709934A1/en not_active Abandoned
- 2008-12-11 EP EP08867664A patent/EP2235130A2/en not_active Withdrawn
- 2008-12-19 TW TW097149842A patent/TW200948927A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4731282A (en) * | 1983-10-14 | 1988-03-15 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film |
WO2004077621A1 (en) * | 2003-02-28 | 2004-09-10 | J.S.T. Mfg. Co. Ltd. | Anisotropic conductive sheet |
US7034403B2 (en) * | 2003-04-10 | 2006-04-25 | 3M Innovative Properties Company | Durable electronic assembly with conductive adhesive |
US20070068622A1 (en) * | 2004-02-26 | 2007-03-29 | Sony Chemicals Corp. | Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film |
US20070001292A1 (en) * | 2005-06-30 | 2007-01-04 | Polymatech Co., Ltd. | Heat radiation member and production method for the same |
Also Published As
Publication number | Publication date |
---|---|
JP2011508012A (en) | 2011-03-10 |
WO2009085631A2 (en) | 2009-07-09 |
EP2235130A2 (en) | 2010-10-06 |
CA2709934A1 (en) | 2009-07-09 |
CN101903484A (en) | 2010-12-01 |
KR20090067964A (en) | 2009-06-25 |
TW200948927A (en) | 2009-12-01 |
BRPI0821289A2 (en) | 2015-06-16 |
RU2010125988A (en) | 2012-01-27 |
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