CN101903484A - Adhesive tape and method for preparing the same - Google Patents
Adhesive tape and method for preparing the same Download PDFInfo
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- CN101903484A CN101903484A CN2008801220251A CN200880122025A CN101903484A CN 101903484 A CN101903484 A CN 101903484A CN 2008801220251 A CN2008801220251 A CN 2008801220251A CN 200880122025 A CN200880122025 A CN 200880122025A CN 101903484 A CN101903484 A CN 101903484A
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- adhesive tape
- thin slice
- weighting agent
- fluoropolymer resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Disclosed are adhesive tapes which include a flake conductive filler material. According to the disclosed invention, the adhesive tapes comprising a flake conductive filler that can be changed depending on the light-shielding pattern of the mask, can be have a relatively small thickness of around about 100 [mu]m and different electrical conductivity.
Description
Technical field
The present invention relates to can be used for be used for adhesive tape of electromagnetic interference shield and preparation method thereof in the multiple electronic application.
Background technology
In some cases, the electromagnetic radiation that produces in the circuit of various electronic installations can be disturbed electronic installation or functions of components, reduction device performance, generation neighbourhood noise and interference, damage electronic image and shortening electronic installation life-span on every side.
Up to now, develop multiple material and shielded the hertzian wave that causes these problems.These materials comprise tinsel, metal-coated fabric, conductive coating paint, electroconductibility adhesive tape, conductive elastomer or the like.
Especially, the electroconductibility adhesive tape is mainly used in compact electronic device.By tiny electroconductibility weighting agent (for example carbon black, graphite, silver, copper, nickel, aluminium etc.) is added to bonding with fluoropolymer resin electroconductibility is given described resin, prepare this electroconductibility adhesive tape.In order to make this electroconductibility weighting agent give the bonding fluoropolymer resin of using with electroconductibility, the electroconductibility filler particles must be bonding with forming the successive conductive path in the fluoropolymer resin.For this reason, add excessive relatively electroconductibility weighting agent to the bonding fluoropolymer resin of using in general.Yet when adding excessive electroconductibility weighting agent, the fusion viscoelasticity of adhesive resin reduces, and allows the filler particles cohesion, thereby increases the viscosity of fluoropolymer resin.The increase of this viscosity causes the increase of proportion and the deterioration of physical property (comprising the reduction of shock and vibration absorbent properties) again.In addition, utilize conventional manufacture method to be difficult to control the specific conductivity of electroconductibility adhesive tape.
Summary of the invention
Therefore, the inventor is devoted to prepare the electroconductibility adhesive tape, this electroconductibility adhesive tape maskable hertzian wave and do not cause the problems referred to above.
In addition, the inventor makes great efforts to prepare the adhesive tape of the application that is applicable to become gradually miniaturization and elongated electronic installation.
Therefore, the inventor finds, when electroconductibility weighting agent thin slice is used in the bonding usefulness fluoropolymer resin, can prepare the very little bond property of resin and the adhesive tape of specific conductivity of keeping simultaneously of thickness.
In addition, the inventor also finds, when the mask that is formed with the light shield pattern on it is attached to the both sides of adhesive tape and adhesive tape by rayed, can utilizes the light shield pattern of mask to control moving of electroconductibility weighting agent, thereby can prepare electroconductibility adhesive tape with required specific conductivity.
The present invention is based on such investigation result.
In one aspect, the invention provides adhesive tape, this adhesive tape comprises: the bonding fluoropolymer resin of using; With electroconductibility weighting agent thin slice, this electroconductibility weighting agent thin slice is distributed in bonding with in the fluoropolymer resin, wherein electroconductibility weighting agent thin slice in the horizontal direction (x direction and y direction) and thickness direction (z direction) electrically and continuously be arranged in bondingly with in the fluoropolymer resin, and therefore adhesive tape illustrates various specific conductivity.
On the other hand, the invention provides the method for preparing adhesive tape, this method may further comprise the steps: (i) will be used to form bonding monomer with fluoropolymer resin and mix with electroconductibility weighting agent thin slice; (ii) mixture is formed sheet material; (iii) mask is arranged on the sheet surface; And the one or both sides of (iv) using the rayed sheet material, with photo polymerization monomer, so that form the bonding fluoropolymer resin of using, wherein mask has the light shield pattern that forms on it, and light is radiated on all or part of surface of sheet material according to the light shield pattern.
Description of drawings
Fig. 1 (a) is illustrated in the adhesive tape of preparation in the example 1 of the present invention, and wherein electroconductibility weighting agent thin slice is arranged with the network configuration in general.
Fig. 1 (b) is illustrated in the adhesive tape of preparation in the example 2 of the present invention, and wherein electroconductibility weighting agent thin slice is partly arranged from surface a to bosom of polymer paste with thickness direction in the horizontal direction.
Fig. 1 (c) is illustrated in the adhesive tape of preparation in the example 3 of the present invention, and wherein electroconductibility weighting agent thin slice is arranged in the bosom layer of polymer paste in the horizontal direction.
The arrangement of Fig. 2 and the schematically illustrated weighting agent of Fig. 3 has difference according to the pattern of employed mask in the adhesive tape preparation method's of the present invention rayed step.
Fig. 4 (a) is scanning electron microscope (" the SEM ") photo on the surface of adhesive tape that embodiment according to the present invention 1 preparation is shown.
Fig. 4 (b) and Fig. 4 (c) are scanning electron microscope (" the SEM ") photo of the cross section of adhesive tape that embodiment according to the present invention 1 preparation is shown.
Fig. 5 (a) and Fig. 5 (b) are respectively scanning electron microscope (" the SEM ") photo of the both sides of the adhesive tape that embodiment according to the present invention 2 preparations are shown.
Fig. 6 is schematically illustrated according to adhesive tape preparation method of the present invention.
Embodiment
Have such structure in general according to adhesive tape of the present invention, wherein electroconductibility weighting agent sheeting is distributed in bonding with in the fluoropolymer resin.Electroconductibility weighting agent sheeting in the horizontal direction and/or thickness direction is arranged on the surface of adhesive tape or inner (or both).Because this ordered arrangement of electroconductibility weighting agent sheeting, adhesive tape of the present invention show to have the specific conductivity of improvement.
Employed electroconductibility weighting agent thin slice particle can flatly be arranged in bonding with in the fluoropolymer resin basically among the present invention.Perhaps, because the difference in the polymerization initiating stage between the fluoropolymer resin part due to the existence of the light shield pattern in the photopolymerization step, filler particles can move with differing from one another.
For example, sheet adhesive tape according to an aspect of the present invention can be prepared as follows: electroconductibility weighting agent thin slice is added to not to be had in the completely crued pulp-like polymer materials (hereinafter to be referred as " polymer paste "); Mixture is formed sheet material; Peelable antiadhesion barrier is arranged on the both sides of sheet material; And with the both sides of rayed sheet material, with the photopolymerization polymer paste.(x direction and y direction) flatly (promptly planar is orientated) and arranges electroconductibility weighting agent sheeting by in the horizontal direction, can prepare the adhesive tape of thickness less than about 100 μ m.The step that polymer paste is formed sheet material can be carried out simultaneously with the step on the both sides that antiadhesion barrier are arranged on sheet material.
Particularly, polymer paste is being formed in the technology of sheet material, light shield patterning antiadhesion barrier can be arranged on the both sides of sheet material.If use this light shield pattern, then the light shield pattern according to antiadhesion barrier optionally carries out rayed, and optionally causes the photopolymerization of pulp surface.Therefore what electroconductibility weighting agent thin slice moved to polymer paste does not also have a polymeric part, and this principle can be used for controlling the arrangement of electroconductibility weighting agent sheeting.
Especially, if light transmission is formed with the mask irradiation of light shield pattern on it, then or light can't pass the light shield area of the pattern, or the amount of passing the light in described zone will be significantly few.Therefore, polymer paste with the corresponding part of light shield pattern in, will not cause photopolymerization, if or cause photopolymerization, then polymerization speed will be very low.Otherwise, on its of polymer paste, not being provided with in the part of light shield pattern, photopolymerization will initiatively cause, and polymerization will be carried out towards the bottom of polymer paste via the base that causes gained from photopolymerization.
Like this, the electroconductibility weighting agent sheeting that is present in the part of wherein initiated polymerizationization of polymer paste will move to other parts of wherein also not carrying out polymerization.If photopolymerization is carried out from the both sides of polymer paste, then will be from the surperficial initiated polymerizationization of polymer paste, and the lip-deep electroconductibility weighting agent that is present in polymer paste will be moved to the inside of wherein also not carrying out polymerization of polymer paste.On the other hand, being arranged in the part below the light shield pattern of polymer paste, do not carry out photopolymerization, and the electroconductibility weighting agent that exists in this part does not move or moves to other parts.Utilize the mobile character of electroconductibility weighting agent thin slice, can prepare according to various adhesive tapes of the present invention.
Fig. 2 illustrates such embodiment.Polymer paste 1 is arranged between the mask 3 that does not have the light shield pattern, and is shone by light 4.So just, formed adhesive tape, wherein electroconductibility weighting agent thin slice is arranged in the bosom layer of polymer paste in the horizontal direction.
Fig. 3 illustrates another embodiment, and wherein polymer paste 1 is arranged between the mask 3 with light shield pattern and by light 4 and shines.So just, formed adhesive tape, wherein electroconductibility weighting agent thin slice 2 is arranged in the inside of the slurry that the light shield pattern is not set in the above.Otherwise, on its of slurry, be provided with in the part of light shield pattern, owing to only cause photopolymerization by the low light level, electroconductibility weighting agent thin slice 2 remains on the surface of polymer paste and without any significantly moving, or is present on the whole thickness direction.According to this combination, electroconductibility weighting agent thin slice 2 forms the network structure that a side of adhesive tape is electrically connected to opposite side.
In addition, every light shield pattern mask only is used on the side of polymer paste, also can prepare such adhesive tape: wherein electroconductibility weighting agent thin slice in the horizontal direction with thickness direction from a side of polymer paste to internal arrangement.
Adhesive tape with different electroconductibility weighting agent flake alignment according to the present invention can be used in the various application.For example, wherein electroconductibility weighting agent thin slice is arranged from a side of adhesive tape to opposite side with the adhesive tape that forms the successive network structure (as embodiment as described in Fig. 1 (a)) and be can be used as double sticky tape, to be used for the ground connection connectivity in all directions (x direction, y direction and z direction).Wherein (as embodiment as described in Fig. 1 (b)) can be used as double sticky tape to electroconductibility weighting agent thin slice from a side of adhesive tape to the inner adhesive tape of arranging continuously in thickness direction and horizontal direction, being used in the horizontal direction the ground connection connectivity of (x direction and y direction), and in the insulation of vertical direction or thickness direction (z direction).In addition, wherein electroconductibility weighting agent thin slice is arranged in adhesive tape in the inside of adhesive tape (in embodiment as described in Fig. 1 (c)) in the horizontal direction continuously and can be used as double sticky tape, to be used for insulation.
The dispersive adhesive tape is different brokenly with the electroconductibility weighting agent of prior art wherein, in above-mentioned adhesive tape of the present invention, but the arrangement Be Controlled of electroconductibility weighting agent thin slice.Therefore, adhesive tape of the present invention can prepare the multiple different application that is used for the requirement specific conductivity.Particularly, according to the present invention, because the use of electroconductibility weighting agent sheeting, so can prepare the adhesive tape of thickness relatively little (according to appointment about 100 μ m).Therefore, adhesive tape of the present invention will have about 0.1 Ω/m usually
2Or bigger surface resistivity and about 0.001 Ω or bigger vertical resistor.
In adhesive tape of the present invention, electroconductibility weighting agent thin slice is introduced into to give specific conductivity and the ability that makes adhesive tape thinner is provided.Can select any material as electroconductibility weighting agent thin slice, prerequisite is that this material can be given specific conductivity and be shaped as thin slice.
The example of available electroconductibility weighting agent sheeting comprises among the present invention: sheet metal comprises: precious metal thin slice and base metal thin slice; Be coated with another kind of precious metal or non-noble metal precious metal thin slice or base metal thin slice; Plating precious metal or non-noble metal nonmetallic slices; The electrically conductive, non-metallic thin slice; With two or more the mixture in these materials.
The specific examples of electroconductibility weighting agent sheeting comprises: precious metal, for example gold and silver and platinum; Base metal, for example nickel, copper, tin and aluminium; Be coated with the precious metal and the base metal of precious metal, for example silver plated copper, nickel, aluminium, Xi Hejin; Be coated with non-noble metal precious metal and base metal, for example the copper of nickel plating and silver; Plating precious metal or non-noble metal nonmetal, graphite, glass, pottery, plastics, elastomerics and the mica of for example silver-plated or nickel; Electrically conductive, non-metallic, for example carbon black and carbon fiber; With two or more the mixture among any person in these materials.
The size of electroconductibility weighting agent thin slice can have difference according to the material type of using.The size of electroconductibility weighting agent thin slice is not restricted especially, but in one embodiment of the invention, if the shape of electroconductibility weighting agent thin slice is square or rectangle, then its thickness in general will be at about 100nm to the scope of about 25 μ m, and its side length is about 0.25-25 μ m.
Based on the gross weight of adhesive tape, the content of the electroconductibility weighting agent sheeting in the adhesive tape prepared in accordance with the present invention in general will be in the scope of about 20-60 weight %.In one exemplary embodiment of the present invention, the bonding content with fluoropolymer resin in the adhesive tape is about 40-80 weight %, and the content of electroconductibility weighting agent thin slice is about 20-60 weight %.
In the present invention, acrylic polymer resins can be used as the bonding fluoropolymer resin of using.In one embodiment, can use can be by the acrylic polymer resins of polymerization photopolymerizable monomer preparation.
The photopolymerizable monomer that can be used for preparing this acrylic polymer resins comprises having C
1-14The alkyl acrylate monomer of alkyl.The non-limiting instance of this alkyl acrylate monomer comprises: (methyl) butyl acrylate, (methyl) Ethyl acrylate, (methyl) vinylformic acid n-monooctyl ester, (methyl) Isooctyl acrylate monomer, (methyl) 2-EHA, (methyl) vinylformic acid ester in the different ninth of the ten Heavenly Stems or the like.Other example comprises Isooctyl acrylate monomer, vinylformic acid ester in the different ninth of the ten Heavenly Stems, 2-ethyl-hexyl acrylate, decyl acrylate, dodecylacrylate, n-butyl acrylate, Ethyl acrylate or the like.
Though alkyl acrylate monomer can be used alone forming the bonding fluoropolymer resin of use of vinylformic acid, they also can with other polar copolymerizable monomer copolymerization with the bonding fluoropolymer resin of using of formation vinylformic acid.This resinoid of a kind of available can be by having C
1-14The alkyl acrylate monomer of alkyl and the multipolymer of polar copolymerizable monomer are made.In this case, though the weight ratio of alkyl acrylate monomer and polar copolymerizable monomer is not restricted especially, according to the bonding physical property with fluoropolymer resin of gained, this weight ratio is preferably 99-50: 1-50.
The limiting examples of polar copolymerizable monomer comprises acrylamide, N-vinyl pyrrolidone, N-caprolactam, vinyl cyanide, vinylchlorid and diallyl phthalate of vinylformic acid, methylene-succinic acid, acrylic acid hydroxy alkyl ester, vinylformic acid cyano group alkyl ester, acrylamide, replacement or the like.This polar copolymerizable monomer can be used for adhesivity and cohesion are given fluoropolymer resin and improved adhesive power.
Based on the gross weight of adhesive tape, the bonding content with fluoropolymer resin in the adhesive tape prepared in accordance with the present invention will be about 40-80 weight % in general.
In addition, have required physical property in their applied products in order to make adhesive tape, adhesive tape of the present invention can also comprise the weighting agent that one or more are extra.Can use any this extra weighting agent, prerequisite is character and the validity that they do not damage adhesive tape.The limiting examples of this extra weighting agent comprises heat conduction weighting agent, flame retardant filler, antistatic agent, whipping agent or the like.
Based on the bonding fluoropolymer resin of using of 100 weight parts, the consumption of this extra weighting agent in general will be less than about 100 weight parts, for example about 10-100 weight part.
Adhesive tape of the present invention can also comprise additive, for example polymerization initiator, linking agent, light trigger, pigment, antioxidant, UV stablizer, dispersion agent, defoamer, softening agent and tackifying resin.This additive can add in the preparation process of adhesive tape.
Below detailed description is used to prepare the method for adhesive tape.
Adhesive tape of the present invention can prepare like this: will be used to form bonding monomer or this monomeric prepolymer slurry with fluoropolymer resin and mix with the electroconductibility weighting agent thin slice that is used to give specific conductivity, add extra weighting agent or additive (if you are using), and this mixture of polymerization.
Especially, adhesive tape of the present invention can prepare by carrying out following steps: will be used to form bonding monomer with fluoropolymer resin and mix with electroconductibility weighting agent thin slice; Mixture is formed sheet material; Mask is arranged on the sheet surface; And, be used to form bonding monomer with fluoropolymer resin with photopolymerization with the both sides of rayed sheet material.Can use the mask that is formed with the light shield pattern on it, and all or part of of sheet surface can be according to the light shield pattern of mask and by rayed.In this case, the electroconductibility weighting agent thin slice that exists in the part of the wherein initiated polymerizationization of sheet material will move to other parts of wherein also not carrying out polymerization.
In one embodiment of the invention, be used to form bonding monomer with fluoropolymer resin by prepolymerization with the preparation polymer paste, and electroconductibility weighting agent thin slice and other necessary additives are added in this polymer paste.Present method can be used for equably dispersed electro-conductive weighting agent thin slice and helps causing optionally photopolymerization.More particularly, can may further comprise the steps being used to form bonding monomer and electroconductibility weighting agent thin slice blended step with fluoropolymer resin: partly this monomer composition of polymerization is with the preparation polymer paste, and electroconductibility weighting agent thin slice added in the polymer paste.In one embodiment of the invention, the viscosity of polymer paste can be for about 500 to about 20,000 centipoises.
In preparation method's specific embodiment, at first under oxygen free condition, utilize the polymerization initiator to come partly polymerization to be used to form bonding monomer (for example being used to form the monomer of acrylic polymer resins) with fluoropolymer resin, with preparation viscosity is about 500 slurries to about 20,000 centipoises.Electroconductibility weighting agent thin slice, linking agent, light trigger and any other necessary additive are added in the slurry, and mixture is formed sheet material.Can use the printing opacity antiadhesion barrier, make the polymer syrup tablet be set between the two-layer antiadhesion barrier.By polymer paste is arranged between the antiadhesion barrier, can keep the condition of anaerobic basically.If the light shield pattern is formed on the one or both in the antiadhesion barrier, then antiadhesion barrier can be used as the mask that is formed with the light shield pattern on it.Afterwards, can come polymerization and cross-linked polymer slurry by other mask direct irradiation light (preferred UV light) that under the condition of anaerobic basically, see through antiadhesion barrier or have a light shield pattern.In this step, light can be radiated on surface all or part of of polymer paste according to the light shield pattern, thereby optionally causes photopolymerization.The electroconductibility weighting agent thin slice that exists in the part of the initiated polymerizationization of slurry moves to other parts of wherein also not carrying out polymerization.Therefore, electroconductibility weighting agent thin slice is arranged with three dimensional form, and can prepare the adhesive tape with required specific conductivity.
During with the rayed sheet surface, the minimizing of oxygen content can cause the bonding increase of using the adhesive power of fluoropolymer resin in the sheet material, and this is because avoided the unnecessary oxidizing reaction in the adhesive tape.Form sheet material by above-mentioned polymer paste is arranged between the antiadhesion barrier and with polymer paste, can realize the obstruction of oxygen.In addition, preferably cause photopolymerization in general by in the chamber of anaerobic (for example oxygen concentration is less than the chamber of about 1000ppm) basically, carrying out rayed.Do like this and can more effectively stop oxygen and inhibited oxidation reaction.In some cases, oxygen concentration is more preferably less than about 500ppm.
In the photopolymerization step, for the selection part that only makes sheet surface by rayed, can use mask with light shield pattern, and for all surfaces that makes sheet material by rayed, can use the mask (being transparent mask) that does not have the light shield pattern.Mask with light shield pattern comprises zone that light can pass and the zone that light can not pass or only very a spot of light can pass in general.Therefore, being provided with the part of light shield pattern above its of sheet material will be by rayed or will be shone by the low light level, and the electroconductibility weighting agent thin slice that exists in this part will remain on the sheet surface, and basically without any moving.Otherwise the part that the light shield pattern is not set above its of sheet material will be by rayed causing photopolymerization, and the electroconductibility weighting agent thin slice that exists in this part will move to and wherein also not carry out photopolymerisable other parts.Therefore, electroconductibility weighting agent thin slice can form network structure in sheet material.In addition,, can use the mask that does not have the light shield pattern, make light can be radiated on the whole basically surface of sheet material in order to make electroconductibility weighting agent flake alignment in the inside of sheet material.
The limiting examples of mask comprises printing opacity antiadhesion barrier that is formed with required light shield pattern (for example network structure or trellis) on it and the printing opacity antiadhesion barrier that does not have the light shield pattern.Surface-area transparent plastic film little or that be coated with adherent layer on it can be used as the printing opacity antiadhesion barrier.The example of suitable printing opacity antiadhesion barrier comprises polyethylene film, polypropylene film, polyethylene terephthalate (" PET ") film or the like.
Can use any material of the light of the arrival light shield pattern that can shield about 10-100%, to form the light shield pattern.Preferably, use can shield the material of the light that surpasses about 50% arrival light shield pattern.In some embodiments of the invention, can design the light shield pattern, make its shielding surpass about 70% incident light.If necessary, also can design the light shield pattern, make its fully (100%) shielding incident light.
On the surface of printing opacity antiadhesion barrier, form the light shield method of patterning without limits to being used for.Can use on the surface of printing opacity antiadhesion barrier deposition to reduce or any method of the material of the light shield pattern that shielded from light is passed through to be used to form.For this reason, can use (for example) printing process.This printing process is known in the art, and comprises (for example) screen painting method, the print process of utilizing heat passage paper, woodburytype etc.Can use the good black ink of extinction property to form the light shield pattern.The shape of the light shield pattern that forms on the antiadhesion barrier is not restricted especially, and can be selected as overlapping with required some network structure of electroconductibility filler material.
In an embodiment of the present invention, the thickness of antiadhesion barrier can for about 5 μ m to about 2mm, but the thickness of antiadhesion barrier is not had specific limited.In general, more be difficult to form the light shield pattern on less than the antiadhesion barrier of about 5 μ m and apply polymer paste at thickness.If antiadhesion barrier very thick (as greater than about 2mm) then also can be difficult to carry out the photopolymerization of polymer paste.
In addition, though the thickness of adhesive tape prepared in accordance with the present invention is not restricted especially, the thickness of adhesive tape is preferably about 10-200 μ m.In some embodiments of the invention, according to the thickness of photopolymerization, electroconductibility weighting agent thin slice with move etc., the thickness of adhesive tape is preferably about 20-150 μ m, about 30-100 μ m more preferably.
The photopolymerisable light intensity that is used to carry out polymer paste can be for being applied to photopolymerisable any light intensity in a usual manner.In one embodiment of the invention, be preferred with the corresponding light intensity of UV light.
One or more linking agents can be used for bonding crosslinked with fluoropolymer resin.According to the amount of the linking agent that uses, the bonding character (particularly bond property) of may command with fluoropolymer resin.Based on the bonding fluoropolymer resin of using of 100 weight parts, the consumption of linking agent is about 0.05-2 weight part in general.The specific examples of available linking agent includes, but is not limited to polyfunctional acrylic ester, for example diacrylate 1,6-hexylene glycol ester, Viscoat 295, pentaerythritol triacrylate, 1 diacrylate, 1,12-dodecanediol acrylate or the like.
In addition, one or more light triggers can also be used for the preparation technology of adhesive tape of the present invention.According to the amount of the light trigger that uses, the degree of the polymerization of may command fluoropolymer resin.Based on the bonding fluoropolymer resin of using of 100 weight parts, the consumption of light trigger can be about 0.01-2 weight part.The specific examples of available light trigger includes, but is not limited to 2; 4; 6-Three methyl Benzene formyl diphenyl phosphine oxide, two (2; 4; 6-three Yue base benzoyl) phenyl phosphine oxide, α; α-methoxyl group-Alpha-hydroxy methyl phenyl ketone, 2-benzoyl-2 (dimethylamino)-1-[4-(4-morpholinyl) phenyl]-1-butanone, 2,2-dimethoxy-2-phenyl methyl phenyl ketone etc.
Because the arrangement of electroconductibility weighting agent thin slice can change according to the light shield pattern of mask, so that change specific conductivity, adhesive tape prepared in accordance with the present invention can be applicable to require the various electronic installations of specific conductivity.
Example
Hereinafter with reference to example and comparative example the present invention is described in more detail.To should be appreciated that these examples of providing only in order schematically illustrating, and scope of the present invention should not to be interpreted as it is to be limited to this.
Term in the following example " part " means bonding " weight part " with fluoropolymer resin with respect to 100 weight parts, and this is bonding to form by monomeric polymerization with fluoropolymer resin.
Example 1
To be arranged on as 90 parts of ethyl acrylates of Acrylic Acid Monomer with as 10 parts of vinylformic acid of polar copolymerizable monomer in 1 liter the glass reactor, and to the light trigger Irgacure 651 (α that wherein add 0.1 part, α-methoxyl group-Alpha-hydroxy methyl phenyl ketone) and 0.1 part linking agent diacrylate 1,6-hexylene glycol ester (" HDDA ").Make the polymerization of monomer segment ground by light-initiated, thereby preparation viscosity is the slurry of 3000 centipoises.At this slurry, add 40 parts of thin silver films, and stir the mixture as electroconductibility weighting agent thin slice, thus the polymer paste of preparation homogeneous.
Simultaneously, utilizing black ink patterning width on the antiadhesion barrier of being made by the transplanting polyethylene terephthalate film (" PET ") thicker than 75 μ m is 350 μ m and the trellis that is spaced apart 1mm.
As shown in Figure 6, extruded polymer slurry from glass reactor utilizes roller coating machine that the antiadhesion barrier of patterning is arranged on the both sides of polymer paste simultaneously, makes the thickness of polymer paste reach about 50 μ m.By antiadhesion barrier being arranged on the both sides of polymer paste, can suppressing polymer paste and contact with air (particularly oxygen).
By utilizing metal halide UV lamp with 4.5mW/cm
3Energy dose continue to come the cure polymer slurry in 520 seconds with UV rayed both sides via antiadhesion barrier, thereby the preparation adhesive tape.
Example 2
Prepare adhesive tape in the mode identical with example 1, the antiadhesion barrier of different is patterning is set on the top side of polymer paste, and transparent antiadhesion barrier (but not antiadhesion barrier of patterning) is set on the bottom side.
Example 3
Prepare adhesive tape in the mode identical with example 1, different is that transparent antiadhesion barrier (but not antiadhesion barrier of patterning) is set on the both sides of polymer paste.
Test case 1: measurement of resistance
Utilize Kietheley 580 microhmmeters to measure each surface resistivity and vertical resistor in the adhesive tape of example 1 preparation to the example 3 by the surface-probe method that adapts to Mil-G-83528B.Following table 1 illustrates the mean value of measuring result.
Table 1
From above table 1, can find out to have various specific conductivity according to the light shield pattern of mask at the adhesive tape of example 1 preparation to the example 3.
Test case 2: adhesive power test
According to ASTM D 1000, in the adhesive tape of example 1 preparation to the example 3 each is laminated with aluminium flake, utilize on 180 ° of directions of omnipotent test machine (" UTM ") measurement each adhesive tape to the adhesive power of top side and bottom side then.Following table 2 illustrates measuring result.
Table 2
| Top side (kgf/in.) | Bottom side (kgf/in.) | |
| Example 1 | 1.2 | 1.2 |
| Example 2 | 1.41 | 1.15 |
| Example 3 | 1.32 | 1.42 |
Claims (20)
1. adhesive tape comprises:
The bonding fluoropolymer resin of using; With
Electroconductibility weighting agent thin slice, it is distributed in described bonding with in the fluoropolymer resin
Wherein said electroconductibility weighting agent thin slice (x direction and y direction) and thickness direction (z direction) in the horizontal direction electrically and continuously is arranged in described bonding with in the fluoropolymer resin.
2. adhesive tape according to claim 1, its thickness are 10～200 μ m.
3. adhesive tape according to claim 1, its surface resistivity are 0.1 Ω/m
2Or it is bigger.
4. adhesive tape according to claim 1, its vertical resistor are 0.001 Ω or bigger.
5. adhesive tape according to claim 1, the thickness of wherein said electroconductibility weighting agent thin slice is in the scope of 100nm to 25 μ m.
6. adhesive tape according to claim 1, wherein based on the gross weight of described adhesive tape, the content of described electroconductibility weighting agent thin slice is 20-60 weight %.
7. adhesive tape according to claim 1, wherein said electroconductibility weighting agent thin slice is selected from the group that following material is formed: sheet metal, described metal comprises precious metal and base metal; Be coated with the precious metal thin slice or the base metal thin slice of precious metal; Be coated with nonmetallic precious metal thin slice or base metal thin slice; Be coated with precious metal or non-noble metal nonmetallic slices; The electrically conductive, non-metallic thin slice; And their mixture.
8. adhesive tape according to claim 7, wherein said precious metal comprises gold and silver and platinum; Described base metal comprises nickel, copper, tin and aluminium; Described precious metal thin slice or the nonmetallic slices that is coated with precious metal comprises silver plated copper, nickel, aluminium, Xi Hejin; Describedly be coated with copper and the silver that non-noble metal precious metal thin slice or base metal thin slice comprise nickel plating; Describedly be coated with graphite, glass, pottery, plastics, elastomerics and the mica that precious metal or non-noble metal nonmetallic slices comprise silver-plated or nickel; And described electrically conductive, non-metallic thin slice comprises carbon black and carbon fiber.
9. adhesive tape according to claim 1, wherein based on the gross weight of described adhesive tape, described bonding content with fluoropolymer resin is 40-80 weight %.
10. adhesive tape according to claim 1 wherein saidly bondingly comprises acrylic polymer resins with fluoropolymer resin.
11. adhesive tape according to claim 10, wherein said acrylic polymer resins is to have C
1-14The alkyl acrylate monomer of alkyl and the multipolymer of polar copolymerizable monomer.
12. adhesive tape according to claim 11, the ratio of wherein said alkyl acrylate monomer and described polar copolymerizable monomer are 99-50: 1-50.
13. a method that is used to prepare adhesive tape may further comprise the steps:
(i) will be used to form bonding monomer with fluoropolymer resin mixes with electroconductibility weighting agent thin slice;
(ii) described mixture is formed sheet material;
(iii) mask is arranged on the one or both sides of described sheet material; And
The both sides of (iv) using the described sheet material of rayed are with the described monomer of photopolymerization, so that form the bonding fluoropolymer resin of using,
Wherein said mask forms the light shield pattern thereon, and light according to described light shield patterned illumination on all or part of surface of described sheet material.
14. method according to claim 13, wherein in the photopolymerization step, according to the configuration of described light shield pattern, described electroconductibility weighting agent thin slice is (x direction and y direction) and thickness direction (z direction) arrangement in the horizontal direction.
15. method according to claim 13, wherein said mask is made of the printing opacity antiadhesion barrier that is formed with the light shield pattern on it.
16. method according to claim 13, the described light shield pattern that wherein forms on described mask is network structure or trellis.
17. method according to claim 15, wherein said printing opacity antiadhesion barrier are polyethylene film, polypropylene film or polyethylene terephthalate (PET) films.
18. method according to claim 13 wherein will be used for bonding described monomer and described electroconductibility weighting agent thin slice blended step with fluoropolymer resin and comprise following substep:
Be used in bonding described monomer segment ground polymerization, to form polymer paste with fluoropolymer resin; And
Described electroconductibility weighting agent thin slice is added in the described polymer paste, and stir described mixture.
19. method according to claim 18, the viscosity of wherein said polymer paste are 500-20,000 centipoise.
20. method according to claim 13, wherein the oxygen concentration in the rayed is less than 1000ppm.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070135804A KR20090067964A (en) | 2007-12-21 | 2007-12-21 | Adhesive tape and method for preparing the same |
| KR10-2007-0135804 | 2007-12-21 | ||
| PCT/US2008/086363 WO2009085631A2 (en) | 2007-12-21 | 2008-12-11 | Adhesive tape and method for preparing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101903484A true CN101903484A (en) | 2010-12-01 |
Family
ID=40824985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801220251A Pending CN101903484A (en) | 2007-12-21 | 2008-12-11 | Adhesive tape and method for preparing the same |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP2235130A2 (en) |
| JP (1) | JP2011508012A (en) |
| KR (1) | KR20090067964A (en) |
| CN (1) | CN101903484A (en) |
| BR (1) | BRPI0821289A2 (en) |
| CA (1) | CA2709934A1 (en) |
| RU (1) | RU2010125988A (en) |
| TW (1) | TW200948927A (en) |
| WO (1) | WO2009085631A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103201352A (en) * | 2011-10-25 | 2013-07-10 | 3M创新有限公司 | Nonwoven adhesive tapes and articles therefrom |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100608533B1 (en) | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Polymer resin having excellent electroconductivity and manufacturing method thereof |
| CN110746901A (en) * | 2019-11-12 | 2020-02-04 | 湖南省和祥润新材料有限公司 | Combined type shading adhesive and manufacturing process thereof |
| RU2724650C1 (en) * | 2020-01-22 | 2020-06-25 | ООО "РТ-технологии" | Electroconductive materials dispersed in non-conductive organic material |
| KR102271126B1 (en) * | 2020-12-28 | 2021-07-02 | 주식회사 스파이더실크 | High Thermal Conductivity Heat Dissipation Composite Material And Manufacturing Method Thereof |
| CN115181505B (en) * | 2022-07-12 | 2024-02-27 | 东莞市兆科电子材料科技有限公司 | Heat conduction gasket and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4731282A (en) * | 1983-10-14 | 1988-03-15 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film |
| JP2004265729A (en) * | 2003-02-28 | 2004-09-24 | Jst Mfg Co Ltd | Anisotropic conductive sheet |
| US7034403B2 (en) * | 2003-04-10 | 2006-04-25 | 3M Innovative Properties Company | Durable electronic assembly with conductive adhesive |
| JP4385794B2 (en) * | 2004-02-26 | 2009-12-16 | ソニーケミカル＆インフォメーションデバイス株式会社 | Anisotropic conductive connection method |
| JP4686274B2 (en) * | 2005-06-30 | 2011-05-25 | ポリマテック株式会社 | Heat dissipation component and manufacturing method thereof |
-
2007
- 2007-12-21 KR KR1020070135804A patent/KR20090067964A/en not_active Application Discontinuation
-
2008
- 2008-12-11 CN CN2008801220251A patent/CN101903484A/en active Pending
- 2008-12-11 JP JP2010539635A patent/JP2011508012A/en not_active Withdrawn
- 2008-12-11 BR BRPI0821289-9A patent/BRPI0821289A2/en not_active IP Right Cessation
- 2008-12-11 WO PCT/US2008/086363 patent/WO2009085631A2/en active Application Filing
- 2008-12-11 EP EP08867664A patent/EP2235130A2/en not_active Withdrawn
- 2008-12-11 RU RU2010125988/05A patent/RU2010125988A/en not_active Application Discontinuation
- 2008-12-11 CA CA2709934A patent/CA2709934A1/en not_active Abandoned
- 2008-12-19 TW TW097149842A patent/TW200948927A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103201352A (en) * | 2011-10-25 | 2013-07-10 | 3M创新有限公司 | Nonwoven adhesive tapes and articles therefrom |
| CN103201352B (en) * | 2011-10-25 | 2014-07-09 | 3M创新有限公司 | Nonwoven adhesive tapes and articles therefrom |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2709934A1 (en) | 2009-07-09 |
| BRPI0821289A2 (en) | 2015-06-16 |
| KR20090067964A (en) | 2009-06-25 |
| RU2010125988A (en) | 2012-01-27 |
| WO2009085631A3 (en) | 2009-08-27 |
| JP2011508012A (en) | 2011-03-10 |
| EP2235130A2 (en) | 2010-10-06 |
| TW200948927A (en) | 2009-12-01 |
| WO2009085631A2 (en) | 2009-07-09 |
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