CN115181505B - Heat conduction gasket and preparation method thereof - Google Patents
Heat conduction gasket and preparation method thereof Download PDFInfo
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- CN115181505B CN115181505B CN202210819516.3A CN202210819516A CN115181505B CN 115181505 B CN115181505 B CN 115181505B CN 202210819516 A CN202210819516 A CN 202210819516A CN 115181505 B CN115181505 B CN 115181505B
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- gasket
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- gasket body
- layer
- heat
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- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 37
- 239000000853 adhesive Substances 0.000 claims abstract description 37
- 239000004917 carbon fiber Substances 0.000 claims abstract description 37
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 239000003292 glue Substances 0.000 claims description 25
- 239000004809 Teflon Substances 0.000 claims description 21
- 229920006362 Teflon® Polymers 0.000 claims description 21
- 229920002545 silicone oil Polymers 0.000 claims description 20
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims description 13
- 239000001257 hydrogen Substances 0.000 claims description 13
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 11
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000003112 inhibitor Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000003085 diluting agent Substances 0.000 claims description 6
- 239000012744 reinforcing agent Substances 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000011049 filling Methods 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229920000715 Mucilage Polymers 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 11
- 239000000741 silica gel Substances 0.000 abstract description 10
- 229910002027 silica gel Inorganic materials 0.000 abstract description 10
- 238000007639 printing Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 120
- 230000000052 comparative effect Effects 0.000 description 9
- 229920000297 Rayon Polymers 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229920013822 aminosilicone Polymers 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- KWKXNDCHNDYVRT-UHFFFAOYSA-N dodecylbenzene Chemical compound CCCCCCCCCCCCC1=CC=CC=C1 KWKXNDCHNDYVRT-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010147 laser engraving Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000007655 standard test method Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/006—Presence of polysiloxane in the substrate
Abstract
The invention discloses a heat-conducting gasket and a preparation method thereof, wherein the heat-conducting gasket comprises a gasket body, a pattern layer and a non-adhesive water layer, the pattern layer is arranged protruding out of the surface of the gasket body, the gasket body and the pattern layer are different in color, a plurality of carbon fibers are vertically arranged on the surface of the gasket body to form the pattern layer, and the area of the pattern layer is at least 40% of the area of the gasket body. The heat-conducting gasket can enable the color of the pattern layer and the color of the gasket body to have high-contrast color difference, so that a high-contrast color difference pattern is formed on the surface of the gasket body to serve as an identification mark, and the identification mark is manufactured in a printing mode. Therefore, the heat-conducting silica gel gasket has the advantages of low surface viscosity and high contrast color difference forming identification marks, and the heat-conducting effect of the gasket is not affected.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat conduction gasket and a preparation method thereof.
Background
As the heating power of electronic products is continuously increased, the market demand for high-heat-conductivity heat-conducting silica gel gaskets is larger, and especially, the high-compression low-hardness heat-conducting silica gel gaskets are more and more popular in the market. However, gaskets with high compression and low hardness often cannot be crosslinked with great strength, so the surfaces of the gaskets are often very sticky, and the gasket is too sticky, which causes inconvenience in assembly and application. Typical ways to reduce the tackiness are: the surface of the gasket is partially or completely brushed with a silica gel layer, but the process can lead to the great increase of the thermal resistance of the gasket and influence the heat conduction effect of the gasket.
In addition, the conventional heat-conducting gasket is usually mainly a silica gel system, often cannot directly present an identification mark with identification meaning such as LOGO on the gasket, but the identification mark with identification meaning needs to be printed on the surface layer of the gasket in a printing (including ink printing or transfer printing) mode so as to achieve the effect of identification mark, and most of printing ink on the market is incompatible with the heat-conducting silica gel gasket at present, so that the gasket is easy to strip off under long-term use or high temperature.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide the heat-conducting silica gel gasket with low surface viscosity and high-contrast color difference forming identification marks, which is used for solving the problem of heat increment caused by viscosity reduction treatment of the surface of the heat-conducting gasket, and can form high-contrast color difference patterns on the surface of the gasket without forming identification marks in a printing mode.
In order to achieve the above purpose, the invention discloses a heat conduction gasket, which comprises a gasket body, a pattern layer and a non-viscose water layer, wherein the pattern layer protrudes out of the surface of the gasket body, the gasket body and the pattern layer are different in color, a plurality of carbon fibers are vertically arranged on the surface of the gasket body to form the pattern layer, the area of the pattern layer is at least 40% of the area of the gasket body,
the surface of the pattern layer is provided with the non-adhesive water layer, or the gasket body and the surface of the pattern layer are both provided with the non-adhesive water layer.
Preferably, the thickness of the pattern layer is 0.01-0.03mm.
Preferably, a heat-conducting glue layer is arranged between the gasket body and the pattern layer.
Preferably, the thickness of the heat-conducting glue layer is 0.008-0.01mm.
Preferably, the raw materials for preparing the mucilage-free water layer comprise, by mass, 20-30% of silicone oil, 50-60% of heat conducting filler, 2% of reinforcing agent, 2% of hydrogen-containing silicone oil, 0.5-0.8% of surface treating agent, 1% of platinum catalyst, 0.2% of inhibitor and the balance of diluent.
Correspondingly, the invention also provides a preparation method of the heat conduction gasket, which comprises the following steps:
(1) Providing a gasket body;
(2) Providing a teflon release film, hollowing out the teflon release film according to a required pattern, and covering the teflon release film with hollows on a gasket body;
(3) Vertically filling a plurality of carbon fibers in a hollowed-out area, and stripping the teflon release film to expose a pattern layer formed by the plurality of carbon fibers, wherein the area of the pattern layer at least accounts for 40% of the area of the gasket body;
(4) And coating the non-adhesive water layer on the surface of the pattern layer, or coating the non-adhesive water layer on the surfaces of the gasket body and the pattern layer.
Preferably, the carbon fibers are chopped carbon fibers with a length of 0.01-0.03mm.
Preferably, step (1.1) is further included between steps (1) and (2):
and coating a heat-conducting glue layer on the surface of the gasket body.
Preferably, the thickness of the heat-conducting glue layer is 0.008-0.01mm.
Preferably, the non-adhesive water layer is prepared by thermally curing non-adhesive water, and the non-adhesive water comprises, by mass, 20-30% of silicone oil, 50-60% of heat conducting filler, 2% of reinforcing agent, 2% of hydrogen-containing silicone oil, 0.5-0.8% of surface treating agent, 1% of platinum catalyst, 0.2% of inhibitor and the balance of diluent.
Compared with the prior art, the heat conduction gasket of this application is through setting up the pattern layer on gasket body surface, the area on pattern layer is at least accounting for 40% of gasket body area, and carbon fiber sets up perpendicularly the gasket body surface forms the pattern layer can make the pattern layer have high contrast colour difference with the colour of gasket body to this forms high contrast colour difference pattern as identification mark on gasket body surface, and need not to adopt the mode of printing to make identification mark. Therefore, the heat-conducting silica gel gasket has the advantages of low surface viscosity and high contrast color difference forming identification marks, and the heat-conducting effect of the gasket is not affected.
Drawings
Fig. 1 shows a schematic structural diagram of the heat-conducting pad of the present invention, and shows that the surface of the pattern layer is provided with a non-adhesive water layer.
Fig. 2 shows a schematic structural diagram of another embodiment of the heat-conducting gasket of the present invention, in which the gasket body and the pattern layer are both provided with the non-adhesive water layer.
Fig. 3 shows a schematic structural diagram of the heat-conducting gasket shown in fig. 1, in which a heat-conducting glue layer is added between the gasket body and the pattern layer.
Fig. 4 shows a schematic structural diagram of the heat-conducting gasket shown in fig. 2, in which a heat-conducting glue layer is added between the gasket body and the pattern layer.
Fig. 5 shows a schematic view of a process for preparing the heat conductive gasket of the present invention.
Fig. 6 shows a perspective view of the thermally conductive gasket manufactured by the process of fig. 5, showing that both the gasket body and the pattern layer surfaces are provided with a glue-free water layer.
Detailed Description
In order to describe the technical content, the constructional features, the achieved objects and effects of the present invention in detail, the following description is made in connection with the embodiments and the accompanying drawings.
Referring to fig. 1, the heat-conducting pad of the present invention includes a pad body 10, a pattern layer 30 and a non-adhesive water layer 50.
The gasket body 10 is a heat-conducting silica gel gasket commonly used in the art, and is mainly prepared by filling vinyl silicone oil and heat-conducting powder, stirring uniformly, preparing a sheet gasket through calendaring equipment, and curing at high temperature to obtain the heat-conducting silica gel gasket with self-adhesive effect. Such as a thermally conductive silicone gasket of the mega TIF100 series.
The pattern layer 30 is disposed protruding from the surface of the gasket body 10, and the pattern layer 30 may include, but is not limited to, a pattern structure or a text structure. By vertically disposing a plurality of carbon fibers on the surface of the gasket body 10 to form the pattern layer 30, since the heat conductive capacity of the carbon fibers can be at least 1200W, an excellent heat conductive effect can be provided in the vertical direction. In addition, the area of the pattern layer 30 is at least 40% of the area of the gasket body 10, such as 40%, 42%, 44%, 46%, 48%, 50% of the area of the gasket body 10, but not limited thereto. When the area of the pattern layer 30 is small, the heat conduction effect of the product is significantly affected. Because the colors of the pattern layer 30 and the gasket body 10 are different (if the colors of the pattern layer 30 and the gasket body 10 are the same, the bottom layer can be coated on the surface of the gasket body 10 to distinguish the two colors, so that the color comparison is improved), and the carbon fiber is black, the colors of the pattern layer 30 and the gasket body 10 have high contrast color difference, so that a high contrast color difference pattern is formed on the surface of the gasket body 10 as a recognition mark, and the recognition mark is manufactured without adopting a printing mode. Further, the thickness of the pattern layer 30 is 0.01 to 0.03mm, preferably 0.02 to 0.03mm, and the pattern layer 30 is made of carbon fiber, so that chopped carbon fiber of 0.02 to 0.03mm can be preferably used.
In a preferred embodiment, referring to fig. 1, a non-adhesive water layer 50 formed after non-adhesive water thermal curing is arranged on the surface of the pattern layer 30, and the raw materials for preparing the non-adhesive water layer 50 comprise, by mass, 20-30% of silicone oil, 50% -60% of heat conducting filler, 2% of reinforcing agent, 2% of hydrogen-containing silicone oil, 0.5-0.8% of surface treating agent, 1% of platinum catalyst, 0.2% of inhibitor and the balance of diluent. The silicone oil ensures certain fluidity, and comprises one or more of vinyl silicone oil, amino silicone oil and vinyl silicone resin; the thermally conductive filler provides thermal conductivity and may be, but is not limited to, aluminum oxide, aluminum nitride, zinc oxide; the reinforcing agent may be, but is not limited to, white carbon black and carbon black; the hydrogen-containing silicone oil is double-end hydrogen-containing silicone oil and side-end hydrogen-containing silicone oil; the surface treatment agent may be a silane coupling agent; the inhibitor is alkynol inhibitor; the diluent is environment-friendly alkane solvent, such as dodecane extracted from Japan. Preferably, this embodiment also provides a preparation method of the non-adhesive glue, but is not limited thereto, and the preparation method of the heat-conductive glue includes: (1) Selecting 50 nm spherical alumina, submicron a-spherical alumina, superfine aluminum nitride and silane coupling agent to carry out wet surface treatment according to the proportion of 3:1:2:0.05, thus obtaining modified white bottom heat conduction filler; (2) Uniformly stirring and dispersing 25% of vinyl silicone oil, 3% of amino silicone oil, 2% of white carbon black, 1% of Perkin water and 50% of treated heat conducting filler, and cooling for later use; (3) Adding the mixed materials obtained in the steps into a three-roller grinder, controlling the temperature, gradually adding dodecyl benzene oil, repeatedly grinding to thick slurry, sequentially adding 0.2% of inhibitor and 2% of mixed hydrogen-containing silicone oil, wherein the ratio of the hydrogen-containing silicone oil at the end with the hydrogen content of 0.2% to the hydrogen-containing silicone oil at the side chain with the hydrogen content of 0.5% is preferably 1:3, grinding for 30min, finally adding the rest dodecyl benzene oil, grinding for 10min, charging and sealing for preservation, and obtaining the non-sticky glue, wherein the non-sticky glue can be cured by heating at 80-100 ℃ when in use, and has good curing film forming, high strength, no viscosity and low hardness. Because the pattern layer 30 is formed by carbon fiber vertically, the non-viscose water is coated on the surface of the pattern layer 30, so that the non-viscose water can partially permeate into gaps between the carbon fiber, and the non-viscose water layer 50 is formed on the surface, thereby facilitating subsequent use of the product. Referring to fig. 2, in another preferred embodiment, the gasket body 10 and the pattern layer 30 are provided with a non-adhesive water layer 50. That is, the non-adhesive water layer 50 is coated on the surface of the carbon fiber and the surface of the gasket body 10, thereby further reducing the viscosity.
It should be appreciated that the gasket body 10 is generally self-adhesive, and thus, the carbon fibers may be directly bonded to the gasket body 10. When the gasket body 10 lacks self-adhesion or it is desired to have stronger adhesion, a heat-conductive glue layer 20 may be disposed between the gasket body 10 and the pattern layer 30 (see fig. 3-4) for the purpose of enhancing the stability of the adhesion of the carbon fibers, but for appropriately increasing the thermal resistance, so that the thickness of the heat-conductive glue layer 20 is not too thick, and in a preferred embodiment, the thickness of the heat-conductive glue layer 20 is 0.005-0.015mm, and more preferably 0.008-0.01mm, which would affect the heat-conductive effect. The heat-conducting glue layer 20 is generally made of an organic silicon pressure-sensitive adhesive and a heat-conducting filler, wherein the organic silicon pressure-sensitive adhesive comprises but is not limited to MQ resin, and the heat-conducting filler comprises but is not limited to aluminum oxide, aluminum nitride and zinc oxide. Preferably, the thermally conductive glue layer 20 is preferably white or other light colored to highlight the color contrast with the pattern layer 30.
Referring to fig. 5, the present invention further provides a method for preparing a heat conductive pad, which includes the steps of:
(1) Providing a gasket body 10;
(2) Providing a teflon release film 70, hollowing out the teflon release film 70 according to a required pattern, and covering the hollowed-out teflon release film 70 on the gasket body 10;
(3) A plurality of carbon fibers are vertically filled in the hollowed-out area, the teflon release film 70 is peeled off to expose a pattern layer 30 formed by the carbon fibers, and the area of the pattern layer 30 at least accounts for 40% of the area of the gasket body 10;
(4) The surface of the pattern layer 30 is coated with the non-adhesive water layer 50, or the surfaces of the gasket body 10 and the pattern layer 30 are coated with the non-adhesive water layer 50.
In step (2-3), a required pattern can be hollowed out on the teflon release film 70 by means of a laser carving technique, and then carbon fibers are filled in the hollowed-out area to form a required pattern layer 30, as shown in fig. 5, a ZIIETK pattern is hollowed out on the teflon release film 70 by means of a laser carving technique to be used as a mark, and then the ZIIETK pattern area is vertically filled (i.e. carbon fiber jet) with carbon fibers by means of a flocking machine nozzle, but the ZIIETK pattern is not limited thereto, and as a result, referring to fig. 6, the surfaces of the gasket body 10 and the pattern layer 30 are both provided with non-adhesive water layers 50, but not limited thereto, only the surface of the pattern layer 30 is provided with the non-adhesive water layers 50.
In a preferred embodiment, step (1.1) is further included between steps (1) and (2):
and (3) coating a layer of heat-conducting glue layer 20 on the surface of the gasket body 10, then correspondingly covering the heat-conducting glue layer 20 with the hollowed-out teflon release film 70, vertically filling the hollowed-out areas with a plurality of carbon fibers, and bonding and fixing the carbon fibers through the heat-conducting glue layer 20, wherein the rest steps can refer to the steps (3) and (4).
The method for preparing the heat conductive pad according to the present invention is further described below by way of several specific examples and comparative examples, but not limited thereto.
Example 1
A preparation method of a heat conduction gasket comprises the following steps:
(1) Providing a gasket body 10;
(2) Providing a teflon release film 70, engraving a required pattern by laser engraving, wherein the pattern area accounts for 40% of the area of the gasket body 10, and then covering the surface of the gasket body 10 with the teflon release film 70 containing the hollows;
(3) A plurality of chopped carbon fibers with the length of 0.02mm are vertically filled in a hollowed-out area through an electrostatic flocking technology, the chopped carbon fibers are adhered and fixed with the surface of the gasket body 10, the teflon release film 70 is peeled off to expose a pattern layer 30 formed by the carbon fibers, and the area of the pattern layer 30 accounts for 40% of the area of the gasket body 10;
(4) A non-adhesive water layer 50 is provided on the surface of the pattern layer 30.
Example 2
Example 2 is substantially the same as example 1 except that the area of the pattern layer 30 in example 2 is 50% of the area of the gasket body 10, while the area of the pattern layer 30 in example 1 is 40% of the area of the gasket body 10, and the remainder is the same as example 1, and will not be described.
Example 3
Example 3 is substantially the same as example 1 except that the area of the pattern layer 30 in example 3 is 70% of the area of the gasket body 10, while the area of the pattern layer 30 in example 1 is 40% of the area of the gasket body 10, and the remainder is the same as example 1, and will not be described.
Example 4
A preparation method of a heat conduction gasket comprises the following steps:
(1) Providing a gasket body 10;
(2) Coating a heat-conducting glue layer 20 on the surface of the gasket body 10, wherein the thickness is 0.008mm;
(3) Providing a teflon release film 70, engraving a required pattern by laser engraving, wherein the pattern area accounts for 40% of the area of the gasket body 10, and then covering the surface of the gasket body 10 with the teflon release film 70 containing the hollows;
(4) A plurality of chopped carbon fibers with the length of 0.02mm are vertically filled in a hollowed-out area through an electrostatic flocking technology, the chopped carbon fibers are adhered and fixed with the heat-conducting glue layer 20, the teflon release film 70 is peeled off to expose a pattern layer 30 formed by the carbon fibers, and the area of the pattern layer 30 accounts for 40% of the area of the gasket body 10;
(5) A non-adhesive water layer 50 is provided on the surface of the pattern layer 30.
Example 5
Example 5 is substantially the same as example 4 except that the area of the pattern layer 30 in example 5 is 50% of the area of the gasket body 10, while the area of the pattern layer 30 in example 4 is 40% of the area of the gasket body 10, and the remainder is the same as example 4, and will not be described.
Example 6
Example 6 is substantially the same as example 4 except that the area of the pattern layer 30 in example 6 is 70% of the area of the gasket body 10, while the area of the pattern layer 30 in example 4 is 40% of the area of the gasket body 10, and the remainder is the same as example 4, and will not be described.
Example 7
Example 7 is substantially the same as example 1 except that: in the step (4) of the embodiment 7, the non-adhesive water layer 50 is coated on the surfaces of the gasket body 10 and the pattern layer 30, but in the embodiment 1, the non-adhesive water layer 50 is coated on the surface of the pattern layer 30, and the rest is the same as the embodiment 1, and will not be described.
Example 8
Example 8 is substantially the same as example 4, except that: in the step (4) of the embodiment 8, the non-adhesive water layer 50 is coated on the surfaces of the gasket body 10 and the pattern layer 30, but in the embodiment 4, the non-adhesive water layer 50 is coated on the surface of the pattern layer 30, and the rest is the same as the embodiment 4, and will not be described.
Comparative example 1
Comparative example 1 is substantially the same as example 1 except that the area of the pattern layer 30 in comparative example 1 is 30% of the area of the gasket body 10, while the area of the pattern layer 30 in example 1 is 40% of the area of the gasket body 10, and the remainder is the same as example 1, and will not be described.
Comparative example 2
Comparative example 2 is substantially the same as example 7 except that the area of the pattern layer 30 in comparative example 2 is 30% of the area of the gasket body 10, while the area of the pattern layer 30 in example 7 is 40% of the area of the gasket body 10, and the remainder is the same as example 1, which will not be described.
The products prepared in examples and comparative examples were subjected to performance testing while blank tests (corresponding performance tests were performed on the gasket body) were provided, and the results are shown in table 1.
Adhesive properties: the test was carried out according to GB/T31125-2014, with 1-10 grades, 1 being totally tack-free and 10 being initial tack.
Hardness: according to ASTM-D2240 standard test method.
Thermal resistance: according to ASTM-D5470 standard test method.
TABLE 1 Performance test results
As can be seen from the data in table 1, according to the technical scheme of the invention, a plurality of carbon fibers are vertically arranged on the surface of the gasket body 10 to form the pattern layer 30, the area of the pattern layer 30 at least accounts for 40% of the area of the gasket body 10, the mark formed by high-contrast chromatic aberration can be obtained, and the viscosity and the thermal conductivity are good.
As is clear from the data of comparative example 1 and examples 1 to 3, the areas of the pattern layer 30 were 30%, 40%, 50% and 70% of the area of the gasket body 10, respectively, and when the area of the pattern layer 30 was 30%, the heat conduction effect was greatly reduced, but the hardness was increased when the area of the pattern layer 30 was 70%, and the softer gasket compressed under the same pressure, the lower the heat resistance was, while the higher the filling cost was increased, and the reduction in the heat resistance was not particularly remarkable, so that the best when the area of the pattern layer 30 was 50% was comprehensively considered.
As is clear from comparison between example 1 and example 4, the heat conductive glue layer 20 was added, but the adhesion between the carbon fiber and the gasket body 10 was improved without significantly reducing the heat conductive effect.
The foregoing description of the preferred embodiments of the present invention is not intended to limit the scope of the claims, which follow, as defined in the claims.
Claims (8)
1. The heat-conducting gasket is characterized by comprising a gasket body, a pattern layer and a non-adhesive water layer, wherein the pattern layer protrudes out of the surface of the gasket body, the gasket body is different from the pattern layer in color, a plurality of carbon fibers are vertically arranged on the surface of the gasket body to form the pattern layer, the area of the pattern layer at least accounts for 40% of the area of the gasket body,
the surface of the pattern layer is provided with the non-adhesive water layer, or the gasket body and the surface of the pattern layer are both provided with the non-adhesive water layer;
the preparation raw materials of the mucilage glue-free water layer comprise, by mass, 20-30% of silicone oil, 50-60% of heat conducting filler, 2% of reinforcing agent, 2% of hydrogen-containing silicone oil, 0.5-0.8% of surface treating agent, 1% of platinum catalyst, 0.2% of inhibitor and the balance of diluent.
2. The thermally conductive gasket of claim 1, wherein the patterned layer has a thickness of 0.01-0.03mm.
3. The thermally conductive gasket of claim 1, wherein a thermally conductive glue layer is disposed between said gasket body and said pattern layer.
4. The thermally conductive gasket of claim 3, wherein the thermally conductive glue layer has a thickness of 0.008-0.01mm.
5. The preparation method of the heat conduction gasket is characterized by comprising the following steps:
(1) Providing a gasket body;
(2) Providing a teflon release film, hollowing out the teflon release film according to a required pattern, and covering the teflon release film with hollows on the gasket body;
(3) Vertically filling a plurality of carbon fibers in a hollowed-out area, and stripping the teflon release film to expose a pattern layer formed by the plurality of carbon fibers, wherein the area of the pattern layer at least accounts for 40% of the area of the gasket body;
(4) Coating a non-adhesive water layer on the surface of the pattern layer, or coating non-adhesive water layers on the surfaces of the gasket body and the pattern layer;
the non-adhesive water layer is prepared by thermally curing non-adhesive water, and comprises, by mass, 20-30% of silicone oil, 50-60% of heat conducting filler, 2% of reinforcing agent, 2% of hydrogen-containing silicone oil, 0.5-0.8% of surface treating agent, 1% of platinum catalyst, 0.2% of inhibitor and the balance of diluent.
6. The method of manufacturing a thermal pad according to claim 5, wherein the carbon fiber is a chopped carbon fiber having a length of 0.01-0.03mm.
7. The method of manufacturing a thermally conductive gasket of claim 5 further comprising, between steps (1) and (2), step (1.1):
and coating a heat-conducting glue layer on the surface of the gasket body.
8. The method of claim 7, wherein the thickness of the heat conductive glue layer is 0.008-0.01mm.
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