CN105368332A - Low-peel strength heat conduction silica gel pad and preparation method thereof - Google Patents
Low-peel strength heat conduction silica gel pad and preparation method thereof Download PDFInfo
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- CN105368332A CN105368332A CN201510773583.6A CN201510773583A CN105368332A CN 105368332 A CN105368332 A CN 105368332A CN 201510773583 A CN201510773583 A CN 201510773583A CN 105368332 A CN105368332 A CN 105368332A
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Abstract
The invention relates to the technical field of heat conduction materials and especially relates to a low-peel strength heat conduction silica gel pad and a preparation method thereof. The low-peel strength heat conduction silica gel pad is prepared from 100 parts by weight of methylsilicone oil, 1-3 parts by weight of volatile silicone oil, 10-20 parts by weight of vinyl silicone oil, 0.5-2 parts by weight of hydrogen-containing silicone oil, 0.1-0.3 parts by weight of a catalyst, 0.02-0.05 parts by weight of an inhibitor and 200-400 parts by weight of alumina. Compared with the prior art, the preparation method utilizes a small amount of volatile silicone oil and utilizes a temperature-gradient method to reduce peel strength. The low-peel strength heat conduction silica gel pad has very small thickness and volatile silicone oil can be removed in follow-up treatment processes so that product peel strength is successfully reduced and operation is simple.
Description
Technical field
The present invention relates to thermally conductive material technical field, be specifically related to a kind of low stripping force heat conductive silica gel pad and preparation method thereof, for filling the scatterer gap of electronic industry, improving life-span and the stability of heat dissipation element.Can at-54-200 DEG C of life-time service.
Background technology
Heat conductive silica gel pad cooling application, in heater members and radiating element, can improve the work-ing life of product greatly.The diversification of electronic devices and components design function, more and more higher to the requirement of thermally conductive material.Some electronic element radiating areas are comparatively large, out-of-shape, and heat radiation gap is very little.
If the thickness of common heat conductive silica gel pad is at more than 0.5mm, peeling force is generally greater than 10g/25cm, and product operation is not difficult, and thin product has a great difference, release film is difficult to tear, and causes the bad operation of product, not only waste time and energy, also can wrinkling breakage, breaking deformation, even cannot peel off.
Summary of the invention
The object of this invention is to provide a kind of heat conductive silica gel pad of thin size, designed and preparation method by optimization of C/C composites, product peeling force is very little, easy to operate.
Object of the present invention is achieved by following technical solution:
A kind of low stripping force heat conductive silica gel pad, be made up by described weight part of following component:
Methyl-silicone oil 100 parts, volatile silicone oils part 1 ~ 3 part, vinyl silicone oil 10 ~ 20 parts, containing hydrogen silicone oil 0.5 ~ 2 part, catalyzer 0.1 ~ 0.3 part, 0.02 ~ 0.05 part, inhibitor, 200 ~ 400 parts, aluminum oxide
Described volatile silicone oils viscosity 10 ~ 50mPas.
Described vinyl silicone oil contents of ethylene is 0.1 ~ 0.3%, viscosity 3000 ~ 5000mPas.
Described containing hydrogen silicone oil reactive hydrogen content is 0.2 ~ 0.5%.
Catalyzer is platinum catalyst.
Inhibitor is acetylenic alcohol inhibitor.
Described alumina particle is the aluminum oxide of 5 microns.
Methyl-silicone oil, volatile silicone oils, vinyl silicone oil, containing hydrogen silicone oil, catalyzer, inhibitor are joined in stirring tank and stirred 1 hour, and rotating speed is 80r ~ 100rpm, then adds aluminum oxide and stirs 0.5 hour, and rotating speed is 20r ~ 50rpm; Vacuumize after stirring and slough bubble, obtain paste material; Be the sheet of 0.1 ~ 0.3mm by paste material molding thickness between PET release film, first at 120 DEG C of sulfuration 20min, tear one deck release film gently, at 150 DEG C, then toast 30min remove volatile silicone oils, obtain described low stripping force heat conductive silica gel pad.
Compared with prior art, the present invention introduces a small amount of volatile silicone oils, and reduce peeling force by the method for temperature-gradient method, because product thickness is very thin, aftertreatment technology can remove volatile silicon oil component, successfully reduces the peeling force of product, simple to operation.
Embodiment
Several embodiment is provided the following detailed description of the present invention:
Embodiment 1: methyl-silicone oil 100 parts, volatile silicone oils 1 part, vinyl silicone oil 10 parts, containing hydrogen silicone oil 0.5 part, catalyzer 0.1 part, 0.02 part, inhibitor are joined in stirring tank and stir 1 hour, rotating speed is 80r ~ 100rpm, then add 200 parts, aluminum oxide to stir 0.5 hour, rotating speed is 20r ~ 50rpm; Vacuumize after stirring and slough bubble, obtain paste material; Be the sheet of 0.1 ~ 0.3mm by paste material molding thickness between PET release film, first at 120 DEG C of sulfuration 20min, tear one deck release film gently, at 150 DEG C, then toast 30min remove volatile silicone oils, obtain described low stripping force heat conductive silica gel pad.
Embodiment 2: methyl-silicone oil 100 parts, volatile silicone oils 3 parts, vinyl silicone oil 20 parts, containing hydrogen silicone oil 2 parts, catalyzer 0.3 part, 0.05 part, inhibitor are joined in stirring tank and stir 1 hour, rotating speed is 80r ~ 100rpm, then add 400 parts, aluminum oxide to stir 0.5 hour, rotating speed is 20r ~ 50rpm; Vacuumize after stirring and slough bubble, obtain paste material; Be the sheet of 0.1 ~ 0.3mm by paste material molding thickness between PET release film, first at 120 DEG C of sulfuration 20min, tear one deck release film gently, at 150 DEG C, then toast 30min remove volatile silicone oils, obtain described low stripping force heat conductive silica gel pad.
Embodiment 3: methyl-silicone oil 100 parts, volatile silicone oils 2 parts, vinyl silicone oil 16 parts, containing hydrogen silicone oil 1 part, catalyzer 0.2 part, 0.04 part, inhibitor are joined in stirring tank and stir 1 hour, rotating speed is 80r ~ 100rpm, then add 300 parts, aluminum oxide to stir 0.5 hour, rotating speed is 20r ~ 50rpm; Vacuumize after stirring and slough bubble, obtain paste material; Be the sheet of 0.1 ~ 0.3mm by paste material molding thickness between PET release film, first at 120 DEG C of sulfuration 20min, tear one deck release film gently, at 150 DEG C, then toast 30min remove volatile silicone oils, obtain described low stripping force heat conductive silica gel pad.
Claims (3)
1. a low stripping force heat conductive silica gel pad, be made up by described weight part of following component:
Methyl-silicone oil 100 parts
Volatile silicone oils 1 ~ 3 part
Vinyl silicone oil 10 ~ 20 parts
Containing hydrogen silicone oil 0.5 ~ 2 part
Catalyzer 0.1 ~ 0.3 part
0.02 ~ 0.05 part, inhibitor
200 ~ 400 parts, aluminum oxide.
2. a kind of low stripping force heat conductive silica gel pad according to claim 1, it is characterized in that: the viscosity of described volatile silicone oils is 10 ~ 50mPas, described vinyl silicone oil contents of ethylene is 0.1 ~ 0.3%, viscosity 3000 ~ 5000mPas, described containing hydrogen silicone oil reactive hydrogen content is 0.2 ~ 0.5%, described catalyzer is platinum catalyst, and described inhibitor is acetylenic alcohol inhibitor, and described alumina particle is the aluminum oxide of 5 microns.
3. the method for a kind of low stripping force heat conductive silica gel pad of preparation described in claim 1 or 2, it is characterized in that following steps of guaranteeing replacement: methyl-silicone oil, volatile silicone oils, vinyl silicone oil, containing hydrogen silicone oil, catalyzer, inhibitor are joined in stirring tank and stirred 1 hour, rotating speed is 80r ~ 100rpm, then add aluminum oxide and stir 0.5 hour, rotating speed is 20r ~ 50rpm; Vacuumize after stirring and slough bubble, obtain paste material; Be the sheet of 0.1 ~ 0.3mm by paste material molding thickness between PET release film, first at 120 DEG C of sulfuration 20min, tear one deck release film gently, at 150 DEG C, then toast 30min remove volatile silicone oils, obtain described low stripping force heat conductive silica gel pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510773583.6A CN105368332A (en) | 2015-11-13 | 2015-11-13 | Low-peel strength heat conduction silica gel pad and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510773583.6A CN105368332A (en) | 2015-11-13 | 2015-11-13 | Low-peel strength heat conduction silica gel pad and preparation method thereof |
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| CN105368332A true CN105368332A (en) | 2016-03-02 |
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| CN201510773583.6A Pending CN105368332A (en) | 2015-11-13 | 2015-11-13 | Low-peel strength heat conduction silica gel pad and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105368052A (en) * | 2015-11-13 | 2016-03-02 | 深圳德邦界面材料有限公司 | Compound heat conduction silica gel pad and preparation method thereof |
| CN107964245A (en) * | 2017-12-18 | 2018-04-27 | 深圳德邦界面材料有限公司 | A kind of dispensing formula gel heat-conducting pad and preparation method thereof |
| CN110128830A (en) * | 2019-03-22 | 2019-08-16 | 中国科学院工程热物理研究所 | A kind of high heat conductance heat conductive silica gel gasket and preparation method thereof |
| CN115181505A (en) * | 2022-07-12 | 2022-10-14 | 东莞市兆科电子材料科技有限公司 | Heat-conducting gasket and preparation method thereof |
Citations (1)
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| CN104448829A (en) * | 2014-11-24 | 2015-03-25 | 深圳德邦界面材料有限公司 | Low-hardness and high-strength radiating silicone pad and preparation method thereof |
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2015
- 2015-11-13 CN CN201510773583.6A patent/CN105368332A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104448829A (en) * | 2014-11-24 | 2015-03-25 | 深圳德邦界面材料有限公司 | Low-hardness and high-strength radiating silicone pad and preparation method thereof |
Non-Patent Citations (1)
| Title |
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| 晨光化工研究院有机硅编写组: "《有机硅单体及聚合物》", 31 December 1986 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105368052A (en) * | 2015-11-13 | 2016-03-02 | 深圳德邦界面材料有限公司 | Compound heat conduction silica gel pad and preparation method thereof |
| CN107964245A (en) * | 2017-12-18 | 2018-04-27 | 深圳德邦界面材料有限公司 | A kind of dispensing formula gel heat-conducting pad and preparation method thereof |
| CN110128830A (en) * | 2019-03-22 | 2019-08-16 | 中国科学院工程热物理研究所 | A kind of high heat conductance heat conductive silica gel gasket and preparation method thereof |
| CN115181505A (en) * | 2022-07-12 | 2022-10-14 | 东莞市兆科电子材料科技有限公司 | Heat-conducting gasket and preparation method thereof |
| CN115181505B (en) * | 2022-07-12 | 2024-02-27 | 东莞市兆科电子材料科技有限公司 | Heat conduction gasket and preparation method thereof |
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Application publication date: 20160302 |
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