CN105368051A - High-heat conductivity heat-conduction silica gel pad and preparation method thereof - Google Patents
High-heat conductivity heat-conduction silica gel pad and preparation method thereof Download PDFInfo
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- CN105368051A CN105368051A CN201510773602.5A CN201510773602A CN105368051A CN 105368051 A CN105368051 A CN 105368051A CN 201510773602 A CN201510773602 A CN 201510773602A CN 105368051 A CN105368051 A CN 105368051A
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- silica gel
- gel pad
- silicone oil
- heat conductive
- conductive silica
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Abstract
The invention relates to the technical field of heat conduction materials and concretely relates to a high-heat conductivity heat-conduction silica gel pad and a preparation method thereof. The high-heat conductivity heat-conduction silica gel pad is prepared from 10 parts by weight of methyl silicone oil, 10-20 parts by weight of vinyl silicone oil, 1-3 parts by weight of polyhydrosiloxane, 0.1-0.3 parts by weight of a catalyst, 1-3 parts by weight of a silane coupling agent, 0.02-0.05 parts by weight of an inhibitor, 500-800 parts by weight of spherical alumina and 100-200 parts by weight of mesocarbon microbeads (MCMB). Compared with the prior art, the preparation method utilizes MCMB and a corresponding technology so that a heat conduction coefficient is improved to 5w/m-k or more.
Description
Technical field
The present invention relates to thermally conductive material technical field, be specifically related to a kind of high thermal conductivity heat conductive silica gel pad and preparation method thereof.For filling the scatterer gap of electronic industry, improve life-span and the stability of heat dissipation element.Can at-54-200 DEG C of life-time service.
Background technology
Heat conductive silica gel pad cooling application, in heater members and radiating element, can improve the work-ing life of product greatly.The diversification of electronic devices and components design function, more and more higher to the requirement of thermally conductive material, thermal conductivity requires more than 5w/m-k, also requires that product has good kindliness.Common heat conductive silica gel pad generally improves thermal conductivity with spherical alumina Al filler, but filler coefficient more high product kindliness is poorer, performance is difficult to take into account.
Summary of the invention
The object of this invention is to provide a kind of heat conductive silica gel pad, designed and preparation method by optimization of C/C composites, obtain high-efficiency heat conduction performance, thermal conductivity reaches 7w/m-k, meets product design needs.
The object of the invention is to be achieved by following technical solution:
Heat conductive silica gel pad formula of the present invention is made by described weight part primarily of following component:
Methyl-silicone oil 10 parts, vinyl silicone oil 10 ~ 20 parts, containing hydrogen silicone oil 1 ~ 3 part, catalyzer 0.1 ~ 0.3 part, silane coupling agent 1 ~ 3 part, inhibitor 0.02-0.05 part, ball-aluminium oxide 500 ~ 800 parts, MCMB100 ~ 200 part.MCMB (MCMB) is the sphere structure that lamella is piled up, and has and the capacity of heat transmission like graphite-phase, although applicant not yet understands concrete mechanism, adds a certain amount of MCMB, can be used for greatly improving thermal conductivity.
Described vinyl silicone oil contents of ethylene is 0.05-0.3%, viscosity 200mPas.
Described containing hydrogen silicone oil reactive hydrogen content is 0.2-0.5%.
Catalyzer is platinum catalyst.
Silane coupling agent is γ-amine propyl-triethoxysilicane.
Inhibitor is acetylenic alcohol inhibitor.
Described ball-aluminium oxide particle diameter is the aluminum oxide of 0.5 ~ 10 micron.
MCMB is the MCMB of particle diameter 5 ~ 20 microns.
Methyl-silicone oil, vinyl silicone oil, containing hydrogen silicone oil, catalyzer, inhibitor, coupling agent are joined in stirring tank and stirred 1 hour, and rotating speed is 120r ~ 160rpm, then adds ball-aluminium oxide and stirs 0.5 hour, and rotating speed is 60r ~ 80rpm; Add MCMB after stirring, rotating speed is 20r ~ 40rpm; Vacuumize and slough bubble, obtain paste material.Be the sheet of 0.2 ~ 5 mm of thickness at the middle calendering formation of PET release film by paste material, solidify 0.5 hour at 120 ~ 150 DEG C, cut into the sheet of 200mm × 200mm, namely make described heat conductive silica gel pad.
Embodiment
Several embodiment is provided the following detailed description of the present invention:
Embodiment 1
Methyl-silicone oil 10 parts, vinyl silicone oil 10 parts, containing hydrogen silicone oil 1 part, catalyzer 0.1 part, 0.02 part, inhibitor, coupling agent 1 part are joined in stirring tank and stir 1 hour, rotating speed is 120r ~ 160rpm, then add ball-aluminium oxide 500 parts to stir 0.5 hour, rotating speed is 60r ~ 80rpm; Add MCMB100 part after stirring, rotating speed is 20r ~ 40rpm; Vacuumize and slough bubble, obtain paste material.Be the sheet of 0.2 ~ 5 mm of thickness at the middle calendering formation of PET release film by paste material, solidify 0.5 hour at 120 ~ 150 DEG C, cut into the sheet of 200mm × 200mm, namely make described heat conductive silica gel pad.
Embodiment 2
Methyl-silicone oil 10 parts, vinyl silicone oil 20 parts, containing hydrogen silicone oil 3 parts, catalyzer 0.3 part, 0.05 part, inhibitor, coupling agent 3 parts are joined in stirring tank and stir 1 hour, rotating speed is 120r ~ 160rpm, then add ball-aluminium oxide 800 parts to stir 0.5 hour, rotating speed is 60r ~ 80rpm; Add MCMB200 part after stirring, rotating speed is 20r ~ 40rpm; Vacuumize and slough bubble, obtain paste material.Be the sheet of 0.2 ~ 5 mm of thickness at the middle calendering formation of PET release film by paste material, solidify 0.5 hour at 120 ~ 150 DEG C, cut into the sheet of 200mm × 200mm, namely make described heat conductive silica gel pad.
Embodiment 3
Methyl-silicone oil 10 parts, vinyl silicone oil 15 parts, containing hydrogen silicone oil 2 parts, catalyzer 0.2 part, 0.04 part, inhibitor, coupling agent 2 parts are joined in stirring tank and stir 1 hour, rotating speed is 120r ~ 160rpm, then add ball-aluminium oxide 700 parts to stir 0.5 hour, rotating speed is 60r ~ 80rpm; Add MCMB160 part after stirring, rotating speed is 20r ~ 40rpm; Vacuumize and slough bubble, obtain paste material.Be the sheet of 0.2 ~ 5 mm of thickness at the middle calendering formation of PET release film by paste material, solidify 0.5 hour at 120 ~ 150 DEG C, cut into the sheet of 200mm × 200mm, namely make described heat conductive silica gel pad.
Claims (9)
1. a high thermal conductivity heat conductive silica gel pad, is characterized in that: be made up of following component and weight part:
Methyl-silicone oil 10
Vinyl silicone oil 10-20
Containing hydrogen silicone oil 1-3
Catalyzer 0.1-0.3
Silane coupling agent 1-3
Inhibitor 0.02-0.05
Ball-aluminium oxide 500-800
MCMB100-200。
2. a kind of high thermal conductivity heat conductive silica gel pad according to claim 1, is characterized in that: described vinyl silicone oil contents of ethylene is 0.05-0.3%, viscosity 200mPas.
3. a kind of high thermal conductivity heat conductive silica gel pad according to claim 1, is characterized in that: the reactive hydrogen content of described containing hydrogen silicone oil is 0.2 ~ 0.5%.
4. a kind of high thermal conductivity heat conductive silica gel pad according to claim 1, is characterized in that: described catalyzer is platinum catalyst.
5. a kind of high thermal conductivity heat conductive silica gel pad according to claim 1, is characterized in that: described silane coupling agent is γ-amine propyl-triethoxysilicane.
6. a kind of high thermal conductivity heat conductive silica gel pad according to claim 1, is characterized in that: described inhibitor is acetylenic alcohol inhibitor.
7. a kind of high thermal conductivity heat conductive silica gel pad according to claim 1, is characterized in that: the aluminum oxide of described ball-aluminium oxide to be particle diameter be 0.5-10 micron.
8. a kind of high thermal conductivity heat conductive silica gel pad according to claim 1, is characterized in that: described MCMB is the MCMB of particle diameter 5-20 micron.
9. prepare the method for a kind of high thermal conductivity heat conductive silica gel pad according to claim 1, it is characterized in that: comprise following steps:
By methyl-silicone oil, vinyl silicone oil, containing hydrogen silicone oil, catalyzer, silane coupling agent, inhibitor, join in stirring tank and stir 1 hour, rotating speed is 120r ~ 160rpm, then adds ball-aluminium oxide, and stir 0.5 hour, rotating speed is 60r ~ 80rpm; Add MCMB after stirring, rotating speed is 20r ~ 40rpm; Vacuumize and slough bubble, obtain paste material; Be the sheet of 0.2 ~ 5 mm of thickness at the middle calendering formation of PET release film by paste material, solidify 0.5 hour at 120 ~ 150 DEG C, cut into the sheet of 200mm × 200mm, namely make described heat conductive silica gel pad.
Priority Applications (1)
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| CN201510773602.5A CN105368051A (en) | 2015-11-13 | 2015-11-13 | High-heat conductivity heat-conduction silica gel pad and preparation method thereof |
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| CN201510773602.5A CN105368051A (en) | 2015-11-13 | 2015-11-13 | High-heat conductivity heat-conduction silica gel pad and preparation method thereof |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105754350A (en) * | 2016-04-06 | 2016-07-13 | 深圳市欧普特工业材料有限公司 | High-heat-conductivity gel sheet and preparation method thereof |
| CN106084797A (en) * | 2016-07-14 | 2016-11-09 | 强新正品（苏州）环保材料科技有限公司 | Silica gel pad for electronic product |
| CN106272694A (en) * | 2016-08-25 | 2017-01-04 | 强新正品（苏州）环保材料科技有限公司 | A kind of dicing method of heat conductive silica gel material |
| CN106634863A (en) * | 2016-12-30 | 2017-05-10 | 深圳市大族元亨光电股份有限公司 | Graphene based silica gel heat-conductive gasket and preparation method thereof |
| CN107973553A (en) * | 2017-11-13 | 2018-05-01 | 国网山东省电力公司莱州市供电公司 | A kind of computer room anti-vibration noise reducing cabinet |
| CN108276777A (en) * | 2018-01-23 | 2018-07-13 | 苏州矽美科导热科技有限公司 | A kind of high-tension heat-conducting silica gel sheet and preparation method thereof |
| CN109467937A (en) * | 2018-09-30 | 2019-03-15 | 东莞市臻邦新材料科技有限公司 | A kind of low-density high thermal conductive silicon glue gasket and preparation method thereof |
| CN109553984A (en) * | 2018-12-12 | 2019-04-02 | 深圳德邦界面材料有限公司 | A kind of heat-conducting pad of low-density and high-strength and preparation method thereof |
| CN110294935A (en) * | 2018-11-19 | 2019-10-01 | 浙江天易新材料有限公司 | A kind of forming method of high thermal conductivity foamed silica gel material |
| CN110561550A (en) * | 2019-08-20 | 2019-12-13 | 深圳市领略数控设备有限公司 | Novel material die cutting process for heat dissipation paste |
| CN111234784A (en) * | 2020-01-21 | 2020-06-05 | 深圳德邦界面材料有限公司 | Heat-conducting gel with good reworkability and preparation method thereof |
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| CN102585757A (en) * | 2011-12-28 | 2012-07-18 | 烟台德邦科技有限公司 | Silica gel fin and preparation method thereof |
| CN103522685A (en) * | 2013-10-10 | 2014-01-22 | 烟台德邦科技有限公司 | Composite type heat radiation silica gel pad and preparation method thereof |
| CN104448829A (en) * | 2014-11-24 | 2015-03-25 | 深圳德邦界面材料有限公司 | Low-hardness and high-strength radiating silicone pad and preparation method thereof |
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2015
- 2015-11-13 CN CN201510773602.5A patent/CN105368051A/en active Pending
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| CN102585757A (en) * | 2011-12-28 | 2012-07-18 | 烟台德邦科技有限公司 | Silica gel fin and preparation method thereof |
| CN103522685A (en) * | 2013-10-10 | 2014-01-22 | 烟台德邦科技有限公司 | Composite type heat radiation silica gel pad and preparation method thereof |
| CN104448829A (en) * | 2014-11-24 | 2015-03-25 | 深圳德邦界面材料有限公司 | Low-hardness and high-strength radiating silicone pad and preparation method thereof |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105754350A (en) * | 2016-04-06 | 2016-07-13 | 深圳市欧普特工业材料有限公司 | High-heat-conductivity gel sheet and preparation method thereof |
| CN106084797A (en) * | 2016-07-14 | 2016-11-09 | 强新正品（苏州）环保材料科技有限公司 | Silica gel pad for electronic product |
| CN106272694A (en) * | 2016-08-25 | 2017-01-04 | 强新正品（苏州）环保材料科技有限公司 | A kind of dicing method of heat conductive silica gel material |
| CN106634863A (en) * | 2016-12-30 | 2017-05-10 | 深圳市大族元亨光电股份有限公司 | Graphene based silica gel heat-conductive gasket and preparation method thereof |
| CN107973553A (en) * | 2017-11-13 | 2018-05-01 | 国网山东省电力公司莱州市供电公司 | A kind of computer room anti-vibration noise reducing cabinet |
| CN108276777A (en) * | 2018-01-23 | 2018-07-13 | 苏州矽美科导热科技有限公司 | A kind of high-tension heat-conducting silica gel sheet and preparation method thereof |
| CN109467937A (en) * | 2018-09-30 | 2019-03-15 | 东莞市臻邦新材料科技有限公司 | A kind of low-density high thermal conductive silicon glue gasket and preparation method thereof |
| CN110294935A (en) * | 2018-11-19 | 2019-10-01 | 浙江天易新材料有限公司 | A kind of forming method of high thermal conductivity foamed silica gel material |
| CN109553984A (en) * | 2018-12-12 | 2019-04-02 | 深圳德邦界面材料有限公司 | A kind of heat-conducting pad of low-density and high-strength and preparation method thereof |
| CN110561550A (en) * | 2019-08-20 | 2019-12-13 | 深圳市领略数控设备有限公司 | Novel material die cutting process for heat dissipation paste |
| CN110561550B (en) * | 2019-08-20 | 2021-10-01 | 深圳市领略数控设备有限公司 | Novel material die cutting process for heat dissipation paste |
| CN111234784A (en) * | 2020-01-21 | 2020-06-05 | 深圳德邦界面材料有限公司 | Heat-conducting gel with good reworkability and preparation method thereof |
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Application publication date: 20160302 |
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