CN110561550A - Novel material die cutting process for heat dissipation paste - Google Patents

Novel material die cutting process for heat dissipation paste Download PDF

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Publication number
CN110561550A
CN110561550A CN201910767014.9A CN201910767014A CN110561550A CN 110561550 A CN110561550 A CN 110561550A CN 201910767014 A CN201910767014 A CN 201910767014A CN 110561550 A CN110561550 A CN 110561550A
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China
Prior art keywords
die cutting
special
product
release film
cutting process
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Application number
CN201910767014.9A
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Chinese (zh)
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CN110561550B (en
Inventor
朱长红
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Shenzhen Linglve CNC Equipment Co Ltd
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Shenzhen Linglve CNC Equipment Co Ltd
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Priority to CN201910767014.9A priority Critical patent/CN110561550B/en
Publication of CN110561550A publication Critical patent/CN110561550A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01Means for holding or positioning work
    • B26D7/02Means for holding or positioning work with clamping means
    • B26D7/025Means for holding or positioning work with clamping means acting upon planar surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out

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  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to the field of material processing, and discloses a novel material die cutting process for a cooling paste. The process comprises the following steps: 1) dividing the heat dissipation paste material into material strips by using a dividing mold; 2) compounding the separated material strips onto a special release film; 3) pulling the material strip and the special release film to a die cutting device by using a special roller, and performing die cutting processing to form a product; 4) removing waste materials on the product; the middle part of the special roller is provided with two pinch rollers, and the two pinch rollers respectively correspond to the two sides of the special release film. The novel material die-cutting process for the cooling paste can stably perform die-cutting processing on a silica gel cooling paste product, does not deform or stick the material on a cutting die, can be suitable for processing special-shaped products, improves the processing efficiency, and ensures the product quality.

Description

novel material die cutting process for heat dissipation paste
Technical Field
The invention relates to the field of material processing, in particular to a novel material die cutting process for a cooling paste.
Background
the heat dissipating paste is also called as a heat conducting paste, is a soft paste-like substance, has good heat conductivity, low thermal resistance and is generally non-conductive, and is often used as a heat dissipating material applied to a core component of electronic equipment, such as a CPU of a mobile phone or a tablet computer, and mainly functions to remove air or gaps at an interface part, so that the heat conduction capacity is maximized. The main component of the heat dissipating paste is silica gel which has strong fluidity and is easy to diffuse and flow to the periphery under the influence of external force.
In the prior art, a heat-dissipating paste is generally laminated on a release film, and the film is cut into a desired size using a cutting blade, i.e., processed using a die cutting technique. The existing die cutting technology is that a material pulling shaft or a material returning shaft is used for pressing materials and then driving a material belt to realize linkage die cutting, the die cutting mode is generally only suitable for film materials with higher hardness, and if soft paste with stronger fluidity such as heat dissipation paste is used as raw materials to be processed in the mode, the raw materials can be directly deformed after being pulled and rolled and can be adhered to a cutting die when the die is punched and cut, so that the die cutting cannot be effectively formed. Therefore, the existing heat-dissipating cream products are directly cut by a manual operation cutting machine, the shapes are limited, the products can be generally only processed into squares, more manpower and material resources are generally consumed by manual operation, the production and processing efficiency is low, and the quality of the products is difficult to ensure.
Disclosure of Invention
In order to solve the problems, the invention provides a novel material die cutting process for a heat-dissipating paste.
According to one aspect of the invention, a novel material die-cutting process of a thermal paste is provided, which comprises the following steps:
1) Dividing the heat dissipation paste material into material strips by using a dividing mold;
2) Compounding the separated material strips onto a special release film;
3) Pulling the material strip and the special release film to a die cutting device by using a special roller, and performing die cutting processing to form a product;
4) Removing waste materials on the product;
the middle part of the special roller is provided with two pinch rollers, and the two pinch rollers respectively correspond to the two sides of the special release film.
The novel material die-cutting process for the cooling paste can stably perform die-cutting processing on a silica gel cooling paste product, does not deform or stick the material on a cutting die, can be suitable for processing special-shaped products, reduces the consumption of manpower and material resources, improves the production and processing efficiency, and ensures the product quality.
In some embodiments, in step 2), the strip of material is compounded in the middle of the dedicated release film. Therefore, the specific situation that the material strips are compounded on the special release film is set, and two sides of the special release film are used for corresponding to the pressing wheels of the special rolling shafts.
In some embodiments, two empty areas are disposed on the dedicated release film, wherein the two empty areas are respectively located at two sides of the material strip and respectively correspond to the two press wheels. From this, drawing the material in-process, two dead zones on the special type membrane contact with two pinch rollers respectively, can draw the material to it under the condition that does not harm the material strip.
In some embodiments, in step 2), the strip of material is compounded onto a dedicated release film using a laminator. Therefore, the equipment for compounding the material strips is provided, and the specific type and model of the equipment can be reasonably selected in the prior art according to needs.
In some embodiments, in step 3), the die cutting apparatus is a flat knife machine. Therefore, the type of the die cutting equipment is set, and the specific type and model of the flat cutter machine can be reasonably selected in the prior art according to needs.
In some embodiments, in step 3), the product is subjected to an automated continuous die-cutting process using a die-cutting apparatus. Therefore, automatic continuous die cutting processing and treatment of the heat dissipation paste material can be achieved according to needs, and production and processing efficiency is improved.
In some embodiments, in step 4), the waste material on the product is removed using a laminator. From this, set up and carried out the equipment of waste material to the product, and the concrete kind and the model of this equipment can rationally be selected as required in prior art.
in some embodiments, further comprising the steps of: 5) and transferring the product to a delivery paster. Therefore, the finished product can be shipped and used through the shipment paster.
Drawings
Fig. 1 is a schematic structural diagram of a material pulling device in a die cutting process of a novel thermal paste material according to an embodiment of the invention.
In the figure: the material strip 1, special type membrane 2, special roller bearing 3, pinch roller 4, dead zone 5, supplementary axle 6.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
In general, a technique for processing a thermal grease material is to cut the material into a processable size by using a cutting machine, etc., and to discontinuously cut out excess waste after drawing and die cutting. On one hand, the material drawing and die cutting process easily deforms the heat dissipation paste material, and on the other hand, the shape of the cut product is limited and cannot be used for processing special-shaped products.
the existing heat-dissipating paste material processing technology is improved on the basis of the original technology, a slitting knife is used for slitting the material into processing specifications and sizes, and a flat knife machine is used for automatic continuous die cutting. However, the method uses a common roller and a release film for pulling, so that the problem of easy deformation of the thermal paste material is still not solved.
Fig. 1 schematically shows a structure of a drawing device for a thermal paste novel material die-cutting process according to an embodiment of the present invention. As shown in fig. 1, the process flow of processing the thermal paste material in this embodiment may be sequentially divided into a plurality of steps. In the first step, a striping mold is used for striping and rolling the thermal paste material to form a material strip 1.
And secondly, compounding the stripped material strip 1 onto a special release film 2, wherein the material strip 1 is compounded and arranged in the middle of the special release film 2, and empty areas 5 without laying the material strip 1 are arranged on two sides of the material strip 1, namely two sides of the special release film 2.
In addition, the compounding equipment used in this step is generally a laminator.
and thirdly, pulling the material strip 1 and the special release film 2 to a die cutting device by using a special roller 3, and carrying out die cutting processing on the material strip 1 by the die cutting device to form a product. Wherein, the middle part of the special roller 3 is provided with two pinch rollers 4 side by side, a distance exists between the two pinch rollers 4, and the bottom of the special roller 3 is also provided with a common auxiliary shaft 6.
When using special roller bearing 3 to draw the material from type membrane 2 to material strip 1 and special, two pinch rollers 4 are corresponding with special dead zone 5 of type membrane 2 both sides respectively, two pinch rollers 4 press respectively on two dead zones 5 promptly, and the cooperation is located special auxiliary shaft 6 from the type membrane 2 back and draws the material from type membrane 2 to material strip 1 and special jointly, wherein, material strip 1 is located the lower part in the middle of two pinch rollers 4, do not contact with special roller bearing 3 and pinch roller 4, consequently the condition such as deformation or pasting can not appear and influence and draw the material work.
the die cutting equipment is generally a flat cutter machine which can carry out automatic continuous die cutting on the product during the material pulling process of the product.
And fourthly, discharging the residual broken waste materials such as the release film and the like on the product. Among them, a laminator is generally used to discharge waste materials from products.
In addition, the fifth step, namely, the product is transferred and pasted on the delivery paster, so that the product can be conveniently transferred and stored, and delivery can be carried out.
The novel material die-cutting process for the cooling paste can stably perform die-cutting processing on a silica gel cooling paste product, does not deform or stick the material on a cutting die, can be suitable for processing special-shaped products, and enriches the diversity of the products. Meanwhile, compared with the conventional die cutting processing method for the heat dissipation paste material, the method has the advantages that the consumption of manpower and material resources is reduced, the productivity can be improved by at least 40%, the precision and the quality of the product are ensured, and the reject ratio is reduced.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.

Claims (8)

1. The novel material die cutting process of the cooling paste is characterized in that: the method comprises the following steps:
1) using a slitting die to slit the heat-dissipating paste material into material strips (1);
2) Compounding the separated material strips (1) to a special release film (2);
3) Pulling the material strip (1) and the special release film (2) to a die cutting device by using a special roller (3), and performing die cutting to form a product;
4) Removing waste materials on the product;
The middle part of the special roller (3) is provided with two pressing wheels (4), and the two pressing wheels (4) correspond to the two sides of the special release film (2) respectively.
2. The novel material die cutting process of the thermal grease as claimed in claim 1, characterized in that: in the step 2), the material strip (1) is compounded in the middle of the special release film (2).
3. the novel material die cutting process of the thermal grease as claimed in claim 2, characterized in that: two empty areas (5) are arranged on the special release film (2), wherein the two empty areas (5) are respectively positioned at two sides of the material strip (1) and respectively correspond to the two press wheels (4).
4. The novel material die cutting process of the thermal grease as claimed in claim 1, characterized in that: in step 2), a laminator is used to compound the material strip (1) onto the special release film (2).
5. The novel material die cutting process of the thermal grease as claimed in claim 1, characterized in that: in step 3), the die cutting equipment is a flat cutter machine.
6. The novel material die cutting process of the thermal grease as claimed in claim 1, characterized in that: in step 3), the product is subjected to automatic continuous die cutting by using die cutting equipment.
7. the novel material die cutting process of the thermal grease as claimed in claim 1, characterized in that: in step 4), the waste material on the product is removed by using a laminating machine.
8. The novel material die cutting process of the thermal grease as claimed in claim 1, characterized in that: further comprising the steps of:
5) And transferring the product to a delivery paster.
CN201910767014.9A 2019-08-20 2019-08-20 Novel material die cutting process for heat dissipation paste Active CN110561550B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN201910767014.9A CN110561550B (en) 2019-08-20 2019-08-20 Novel material die cutting process for heat dissipation paste

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CN110561550A true CN110561550A (en) 2019-12-13
CN110561550B CN110561550B (en) 2021-10-01

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111070322A (en) * 2019-12-20 2020-04-28 无锡积捷光电材料有限公司 Die-cutting non-knife-mark processing technology of adhesive product

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003048652A (en) * 2001-08-01 2003-02-21 Sony Corp Width tension generating device for sheet of base material, and method for generating width tension in sheet of base material
CN102285057A (en) * 2011-05-20 2011-12-21 深圳市安品有机硅材料有限公司 Method for continuously forming organosilicon heat-conducting patch
CN105368051A (en) * 2015-11-13 2016-03-02 深圳德邦界面材料有限公司 High-heat conductivity heat-conduction silica gel pad and preparation method thereof
CN106272694A (en) * 2016-08-25 2017-01-04 强新正品(苏州)环保材料科技有限公司 A kind of dicing method of heat conductive silica gel material
CN208199900U (en) * 2018-03-01 2018-12-07 东莞领益精密制造科技有限公司 A kind of compounding machine gripping roll
CN109531697A (en) * 2018-11-28 2019-03-29 昆山上艺电子有限公司 A kind of technique being die cut glue class anti-sticking die
CN109807989A (en) * 2019-03-12 2019-05-28 苏州达翔新材料有限公司 A kind of die-cutting process and adhesive article of adhesive article

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003048652A (en) * 2001-08-01 2003-02-21 Sony Corp Width tension generating device for sheet of base material, and method for generating width tension in sheet of base material
CN102285057A (en) * 2011-05-20 2011-12-21 深圳市安品有机硅材料有限公司 Method for continuously forming organosilicon heat-conducting patch
CN105368051A (en) * 2015-11-13 2016-03-02 深圳德邦界面材料有限公司 High-heat conductivity heat-conduction silica gel pad and preparation method thereof
CN106272694A (en) * 2016-08-25 2017-01-04 强新正品(苏州)环保材料科技有限公司 A kind of dicing method of heat conductive silica gel material
CN208199900U (en) * 2018-03-01 2018-12-07 东莞领益精密制造科技有限公司 A kind of compounding machine gripping roll
CN109531697A (en) * 2018-11-28 2019-03-29 昆山上艺电子有限公司 A kind of technique being die cut glue class anti-sticking die
CN109807989A (en) * 2019-03-12 2019-05-28 苏州达翔新材料有限公司 A kind of die-cutting process and adhesive article of adhesive article

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111070322A (en) * 2019-12-20 2020-04-28 无锡积捷光电材料有限公司 Die-cutting non-knife-mark processing technology of adhesive product
CN111070322B (en) * 2019-12-20 2021-08-24 无锡积捷光电材料有限公司 Die-cutting non-knife-mark processing technology of adhesive product

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