CN110294935A - A kind of forming method of high thermal conductivity foamed silica gel material - Google Patents
A kind of forming method of high thermal conductivity foamed silica gel material Download PDFInfo
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- CN110294935A CN110294935A CN201811375884.3A CN201811375884A CN110294935A CN 110294935 A CN110294935 A CN 110294935A CN 201811375884 A CN201811375884 A CN 201811375884A CN 110294935 A CN110294935 A CN 110294935A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0014—Use of organic additives
- C08J9/0033—Use of organic additives containing sulfur
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0066—Use of inorganic compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0095—Mixtures of at least two compounding ingredients belonging to different one-dot groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
- C08J9/102—Azo-compounds
- C08J9/103—Azodicarbonamide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/04—N2 releasing, ex azodicarbonamide or nitroso compound
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/05—Polysiloxanes containing silicon bound to hydrogen
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Abstract
The present invention relates to foamed silica gel fields, that there are thermal conductivitys is not high, need to be sulfided into methyl vinyl silicon oil, aluminium oxide, boron nitride, graphene, dimethicone, containing hydrogen silicone oil, dispersing agent, foaming agent, inhibitor, platinum catalyst twice to solve thermally conductive foamed silica gel material at present be dispersed with stirring uniformly after, it is put into liquid calender and carries out rolling out film, then sheet stock is laid flat and is toasted into drying tunnel, baking temperature is 80~150 DEG C, baking time is 10~15min, obtains new energy high thermal conductivity foamed silica gel.The mass production time about 30% of high thermal conductivity foamed silica gel can be effectively shortened by a sulfidization molding, and energy saving up to 20%, gained foamed silica gel thermal conductivity is high, has a wide range of application.
Description
Technical field
The present invention relates to foamed silica gel fields, and in particular to a kind of forming method of high thermal conductivity foamed silica gel material.
Background technique
Thermally conductive foamed silica gel is a kind of chemically inert elastic material, and there is fabulous high-low temperature resistant and temperature variation resistant to rush
Hit performance.The thermally conductive foamed silica gel set dual physicochemical property of foamed silica gel and heat conductive silica gel gasket has buffering and thermally conductive
Dual function.It has broad prospect of application in scenes such as OLED screen curtain, cameras;And in new-energy automobile, accurate instrument
The encapsulation filling of lithium battery interior in the products such as device, consumer electronics, so that fixed battery block, reduction battery operating temperature, mitigate
Battery weight;It can be reduced the operating process of assembling simultaneously, reduce labor cost.But current thermally conductive foamed silica gel material
There are some technical deficiencies: 1. thermal conductivity is not high (≤0.8W/k.m), and prolonged high temperature can not be resistant to after molding, thus generates
Deformation;2. needing to need first through 100 ~ 150 DEG C of low-temp foamings, then be thoroughly solidified into through 150 ~ 180 DEG C of high temperature through sulfidization molding twice
Type, cumbersome, vulcanisation step is more, and the operating time is long, is unfavorable for producing in enormous quantities；3. curing temperature height (150-180 DEG C), energy
Source consumption is excessive.
Summary of the invention
To solve thermally conductive foamed silica gel material at present, that there are thermal conductivitys is not high, need to be high through sulfidization molding twice, curing temperature
The problem of, the invention proposes a kind of forming methods of high thermal conductivity foamed silica gel material, can effectively be contracted by a sulfidization molding
The mass production time about 30% of short high thermal conductivity foamed silica gel, energy saving up to 20%, gained foamed silica gel thermal conductivity is high, application range
Extensively.
The present invention is achieved by the following technical solutions: a kind of forming method of high thermal conductivity foamed silica gel material is following
Step:
(1) in parts by weight, by 70~85 parts of methyl vinyl silicon oils, 10~20 parts of aluminium oxide, 5~10 parts of boron nitride, 0.1~
10 parts of graphenes, 10~20 parts of dimethicones, 15~30 parts of containing hydrogen silicone oils, 3~5 parts of dispersing agents, 5~10 parts of foaming agents, 5~
10 parts of inhibitor, 5~10 parts of platinum catalysts are stirred；
Preferably, the inhibitor in acetylene cyclohexanol ,-3 alkynes-2- alcohol of 2- methyl, 3- methyl-1-alkynes-3- alcohol one
Kind is several.Inhibitor controls foamed time and rate, realizes primary vulcanization.
Preferably, the platinum catalyst is selected from Karst platinum catalyst.More preferably, platinum contains in platinum catalyst
Amount is 1000-3000ppm.Catalyst realizes 80~150 DEG C of high temperature 10-15min short vulcanizations.
Preferably, the dimethyl-silicon oil viscosity is 500-10000cPs (25 DEG C).Dimethicone realizes high thermal conductivity
The hardness of foamed silica gel is adjusted.
Specific mixed method is that methyl vinyl silicon oil, dimethicone, containing hydrogen silicone oil are first heated to 100~150
DEG C, be stirred to obtain silica-gel mixture in dispersator, silica-gel mixture be placed again into dispersator and according to
Secondary addition aluminium oxide, boron nitride, graphene, foaming agent, dispersing agent, inhibitor carry out dispersion stirring, add after stirring 5-10 minutes
Enter platinum catalyst to be stirred again, is taken out after 15~30 min and obtain high thermal conductivity foamed silica gel mixture.
(2) mixture is put into liquid calender and carries out rolling out film, then sheet stock is laid flat and is toasted into drying tunnel, dried
Roasting temperature is 80~150 DEG C, and baking time is 10~15min, obtains high thermal conductivity foamed silica gel material.
Preferably, liquid calender carries out rolling out film with the speed of production of 1~2m per minute.
The thermal conductivity of the high thermal conductivity foamed silica gel material be 0.8 ~ 1.5 W/k.m, can be applied to electric car, subway,
The product scopes such as motor-car, mobile phone, precision instrument, consumer electronics.
Compared with prior art, the beneficial effects of the present invention are: the present invention can effectively shorten height by a sulfidization molding
The mass production time about 30% of thermally conductive foamed silica gel, energy saving up to 20%, gained foamed silica gel thermal conductivity is high, has a wide range of application.
Specific embodiment
Below by embodiment, invention is further described in detail, raw materials used commercially available in embodiment or use
Conventional method preparation.
Reactant is in parts by weight in embodiment, and dimethyl-silicon oil viscosity is 500-10000cPs at 25 DEG C.Dispersing agent
Commercially available any dispersing agent is selected, selects lauryl sodium sulfate in the present embodiment.Foaming agent selects commercially available any foaming agent,
The present embodiment selects azodicarbonamide.
Embodiment 1
A kind of forming method of high thermal conductivity foamed silica gel material 1, including 70 parts of methyl vinyl silicon oils, 10 parts of aluminium oxide, 5 parts of nitrogen
Change boron, 5 parts of graphenes, 10 parts of dimethicones, 15 parts of containing hydrogen silicone oils, 3 parts of dispersing agents, 5 parts of foaming agents, 5 parts of inhibitor (acetylene
Cyclohexanol), 5 parts of Karst platinum catalysts.Methyl vinyl silicon oil, dimethicone, containing hydrogen silicone oil be heated to 100 DEG C
It is stirred to obtain silica-gel mixture in dispersator, silica-gel mixture is placed again into dispersator and sequentially adds
Aluminium oxide, boron nitride, graphene, foaming agent, dispersing agent, inhibitor, carry out dispersion stirring, and platinum is added after five minutes and urges for stirring
Agent is stirred again, is taken out after 20min and is obtained high thermal conductivity foamed silica gel mixture.High thermal conductivity foamed silica gel mixture is put
Enter liquid calender, rolling out film is carried out with the speed of production of 1m per minute, obtains uncured thermally conductive foamed silica gel sheet material, then
By sheet stock lay flat into drying tunnel carry out baking foaming, 100 DEG C of blowing temperature, foamed time 15min, a sulfidization molding.
Comparative example 1
Forming method has lacked boron nitride, graphene in reacted constituent, has obtained foamed silica gel material 1 with embodiment 1.
Test case 1
Through overtesting, for the high thermal conductivity foamed silica gel material 1 of embodiment 1 under 250 DEG C of high temperature, 3h does not generate deformation;Thermal conductivity reaches
To 0.9W/k.m.The product of comparative example 1 generates deformation under 250 DEG C of high temperature after 1.5h;Thermal conductivity only has 0.4W/k.m.
Embodiment 2
A kind of forming method of high thermal conductivity foamed silica gel material 2, including 85 parts of methyl vinyl silicon oils, 18 parts of aluminium oxide, 5 parts of nitrogen
Change boron, 10 parts of graphenes, 20 parts of dimethicones, 30 parts of containing hydrogen silicone oils, 5 parts of dispersing agents, 10 parts of foaming agents, 10 parts of inhibitor
(- 3 alkynes -2- alcohol of 2- methyl), 10 parts of Karst platinum catalysts.Methyl vinyl silicon oil, dimethicone, containing hydrogen silicone oil are added
Heat is stirred to obtain silica-gel mixture in dispersator to 150 DEG C, and silica-gel mixture is placed again into dispersator
It is interior and sequentially add aluminium oxide, boron nitride, graphene, foaming agent, dispersing agent, inhibitor, dispersion stirring is carried out, is stirred 10 minutes
Platinum catalyst is added afterwards to be stirred again, is taken out after 30 min and obtains high thermal conductivity foamed silica gel mixture.High thermal conductivity is sent out
Bubble silica gel mixture is put into liquid calender, carries out rolling out film with the speed of production of 2m per minute, obtains uncured thermally conductive hair
Steep silica gel sheet material, then by sheet stock lay flat into drying tunnel carry out baking foaming, 110 DEG C of blowing temperature, foamed time be 10 min, one
Secondary sulfidization molding.
Comparative example 2
Forming method has lacked boron nitride, graphene in reacted constituent, has obtained foamed silica gel material 2 with embodiment 2.
Test case 2
Through overtesting, for the product of embodiment 2 under 250 DEG C of high temperature, 3h does not generate deformation;Thermal conductivity reaches 1.4W/k.m.Comparison
The product of example 2 generates deformation under 250 DEG C of high temperature after 1.5h;Thermal conductivity only has 0.6W/k.m.
Embodiment 3
A kind of forming method of high thermal conductivity foamed silica gel material 3, including 75 parts of methyl vinyl silicon oils, 15 parts of aluminium oxide, 10 parts
Boron nitride, 5 parts of graphenes, 15 parts of dimethicones, 20 parts of containing hydrogen silicone oils, 4 parts of dispersing agents, 8 parts of foaming agents, 8 parts of inhibitor (3-
Methyl-1-alkynes-3- alcohol), 8 parts of Karst platinum catalysts.Methyl vinyl silicon oil, dimethicone, containing hydrogen silicone oil heating
It is stirred to obtain silica-gel mixture in dispersator to 130 DEG C, silica-gel mixture is placed again into dispersator
And aluminium oxide, boron nitride, graphene, foaming agent, dispersing agent, inhibitor are sequentially added, dispersion stirring is carried out, after stirring 7 minutes
Platinum catalyst is added to be stirred again, is taken out after 25min and obtains high thermal conductivity foamed silica gel mixture.High thermal conductivity is foamed silicon
Glue mixture is put into liquid calender, carries out rolling out film with the speed of production of 1.5 m per minute, obtains uncured thermally conductive foaming
Sheet stock is then laid flat and carries out baking foaming into drying tunnel by silica gel sheet material, and 105 DEG C of blowing temperature, foamed time is 12 min, once
Sulfidization molding.
Comparative example 3
Forming method has lacked boron nitride, graphene in reacted constituent, has obtained foamed silica gel material 3 with embodiment 3.
Test case 3
Through overtesting, for the product of embodiment 3 under 250 DEG C of high temperature, 3h does not generate deformation;Thermal conductivity reaches 1.2W/k.m.Comparison
The product of example 3 generates deformation under 250 DEG C of high temperature after 1.5h, thermal conductivity only has 0.5W/k.m.
Embodiment 4
A kind of forming method of high thermal conductivity foamed silica gel material 4, including 80 parts of methyl vinyl silicon oils, 18 parts of aluminium oxide, 6 parts of nitrogen
Change boron, 6 parts of graphenes, 18 parts of dimethicones, 25 parts of containing hydrogen silicone oils, 4.5 parts of dispersing agents, 6 parts of foaming agents, 6 parts of inhibitor (4
Part acetylene cyclohexanol, 2 parts of -3 alkynes -2- alcohol of 2- methyl), 6 parts of Karst platinum catalysts.Methyl vinyl silicon oil, dimethyl
Silicone oil, containing hydrogen silicone oil are heated to 110 DEG C and are stirred to obtain silica-gel mixture in dispersator, and silica-gel mixture is again
It is put into dispersator and sequentially adds aluminium oxide, boron nitride, graphene, foaming agent, dispersing agent, inhibitor, divided
Stirring is dissipated, platinum catalyst is added after stirring 8 minutes and is stirred again, it is mixed to obtain high thermal conductivity foamed silica gel for taking-up after 18 min
It is fit.High thermal conductivity foamed silica gel mixture is put into liquid calender, rolling out film is carried out with the speed of production of 1.8m per minute,
Uncured thermally conductive foamed silica gel sheet material is obtained, then sheet stock is laid flat and carries out baking foaming into drying tunnel, 108 DEG C of blowing temperature, is sent out
The bubble time is 15 min, a sulfidization molding.
Comparative example 4
Forming method has lacked boron nitride, graphene in reacted constituent, has obtained foamed silica gel material 4 with embodiment 4.
Test case 4
Through overtesting, for the product of embodiment 4 under 250 DEG C of high temperature, 3h does not generate deformation;Thermal conductivity reaches 1.0W/k.m.Comparison
The product of example 4 generates deformation under 250 DEG C of high temperature after 1.5h;Thermal conductivity only has 0.6W/k.m.
In a word, the foregoing is merely presently preferred embodiments of the present invention, all to become according to equalization made by patent application the scope of the patents
Change and modify, all should belong to the covering scope of the invention patent.
Claims (5)
1. a kind of forming method of high thermal conductivity foamed silica gel material, which is characterized in that the forming method is following steps:
(1) in parts by weight, by 70~85 parts of methyl vinyl silicon oils, 10~20 parts of aluminium oxide, 5~10 parts of boron nitride, 0.1~
10 parts of graphenes, 10~20 parts of dimethicones, 15~30 parts of containing hydrogen silicone oils, 3~5 parts of dispersing agents, 5~10 parts of foaming agents, 5~
10 parts of inhibitor, 5~10 parts of platinum catalysts are stirred；
(2) by mixture rolling out film, then sheet stock is toasted, baking temperature be 80~150 DEG C, baking time be 10~
15min obtains high thermal conductivity foamed silica gel material.
2. a kind of forming method of high thermal conductivity foamed silica gel material according to claim 1, which is characterized in that the inhibition
Agent is selected from one or more of acetylene cyclohexanol ,-3 alkynes-2- alcohol of 2- methyl, 3- methyl-1-alkynes-3- alcohol.
3. a kind of forming method of high thermal conductivity foamed silica gel material according to claim 1, which is characterized in that the platinum
Catalyst is selected from Karst platinum catalyst.
4. a kind of forming method of high thermal conductivity foamed silica gel material according to claim 1, which is characterized in that the diformazan
Base silicon oil viscosity is 500-10000cPs.
5. a kind of forming method of high thermal conductivity foamed silica gel material according to claim 1, which is characterized in that the height is led
The thermal conductivity of heat foamable silica gel material is 0.8 ~ 1.5 W/k.m.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110951258A (en) * | 2019-12-27 | 2020-04-03 | 福建安达福新材料科技有限公司 | non-Newtonian fluid material for shoe material and preparation method thereof |
| CN115139579A (en) * | 2022-06-15 | 2022-10-04 | 苏州泰吉诺新材料科技有限公司 | High-thermal-conductivity graphene/silica gel foam multilayer composite material and preparation method and application thereof |
| CN115725186A (en) * | 2022-12-21 | 2023-03-03 | 深圳联腾达科技有限公司 | Preparation process of high-thermal-conductivity low-density low-dielectric-constant organic silicon material |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110951258A (en) * | 2019-12-27 | 2020-04-03 | 福建安达福新材料科技有限公司 | non-Newtonian fluid material for shoe material and preparation method thereof |
| CN115139579A (en) * | 2022-06-15 | 2022-10-04 | 苏州泰吉诺新材料科技有限公司 | High-thermal-conductivity graphene/silica gel foam multilayer composite material and preparation method and application thereof |
| CN115725186A (en) * | 2022-12-21 | 2023-03-03 | 深圳联腾达科技有限公司 | Preparation process of high-thermal-conductivity low-density low-dielectric-constant organic silicon material |
| CN115725186B (en) * | 2022-12-21 | 2023-07-25 | 深圳联腾达科技有限公司 | Preparation process of high-heat-conductivity low-density low-dielectric-constant organic silicon material |
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