CN103333502A - Ultrathin heat conductive silicon sheet and preparation method thereof - Google Patents
Ultrathin heat conductive silicon sheet and preparation method thereof Download PDFInfo
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- CN103333502A CN103333502A CN2013102602237A CN201310260223A CN103333502A CN 103333502 A CN103333502 A CN 103333502A CN 2013102602237 A CN2013102602237 A CN 2013102602237A CN 201310260223 A CN201310260223 A CN 201310260223A CN 103333502 A CN103333502 A CN 103333502A
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Abstract
The invention discloses an ultrathin heat conductive silicon sheet and a preparation method thereof. The ultrathin heat conductive silicon sheet comprises the following components in parts by weight: 100 parts of ethenyl terminated dimethyl silicon oil, 0.5-2.0 parts of hydrogen-based silicon oil, 200-500 parts of heat conductive powder, 0.1-0.3 part of inhibitor and 0.2-0.6 part of catalyst. The preparation method comprises the following steps of: mixing the components, then, dispersing the mixture at high speed by using a high-speed disperser or a method for additionally providing a high-speed dispersing plate in a planetary stirrer, wherein the dispersing linear speed is not smaller than 10m/s; calendaring the uniformly-dispersed materials by using a precise calendar, wherein the calendaring thickness can be as small as below 0.1mm, and the precision can be at least +/-0.02; and then, baking to obtain the heat conductive silicon sheet with the required thickness. The thickness of the heat conductive silicon sheet provided by the invention is 0.1-0.2mm which is far lower than that of the heat conductive silicon sheet sold on the current market, so that the requirement for light and think electronic products and particularly light and thin mobile phones can be met.
Description
Technical field
The present invention relates to a kind of ultra-thin thermal conductive silicon film and preparation method thereof, particularly the thermal conductive silicon film that uses in a kind of smart mobile phone.
Background technology
Along with electronic product develops towards lightening direction, its requirement to heat-conducting interface material is also more and more thinner, especially in the smart mobile phone, and its employed thermal conductive silicon film, the thickness of requirement is usually at 0.2mm even 0.1mm.
And at present both at home and abroad the thickness that can declare of thermal conductive silicon film producer is usually more than 0.5mm, and part producer can accomplish more than the 0.3mm.Such thickness can not satisfy the especially lightening requirement of mobile phone of electronic product.
Summary of the invention
Purpose of the present invention just provides a kind of ultra-thin thermal conductive silicon film.
The invention provides a kind of ultra-thin thermal conductive silicon film, its component ratio is as follows:
The dimethyl silicone oil of ethenyl blocking: 100
Hydrogen base silicone oil: 0.5～2.0
Heat conduction powder: 200～500
Inhibitor: 0.1～0.3
Catalyzer: 0.2～0.6
The dimethyl silicone oil of ethenyl blocking of the present invention requires its viscosity below 500～1500ps, between preferred 500～1000cps.Low viscosity is conducive to sizing material and is adding the levelling in man-hour, and low excessively viscosity then is easy to generate the sedimentation of sizing material, and for to reach thinner, softer requirement, low excessively viscosity can make final product hardness uprise.
Hydrogen base silicone oil of the present invention comprises the hydrogeneous hydrogen base silicone oil of at least a side chain.The hydrogeneous hydrogen base silicone oil of side chain can provide dimethyl silicone oil crosslinked of ethenyl blocking; and the hydrogeneous hydrogen base silicone oil of single side chain is unfavorable for the adjusting of thermal conductive silicon film hardness and intensity, hardness and intensity that the hydrogen base silicone oil of common meeting and hydrogen base end-blocking shares to regulate the silica gel sheet.
Heat conduction powder of the present invention require wherein particle diameter below 40 microns and maximum particle diameter must not be above 100 microns.Particle diameter is below 20 microns in preferred, and maximum particle diameter is no more than 50 microns heat conduction powder.Excessive particle diameter causes the cavity on conducting strip surface easily, reduces the yield of product.
Heat conduction powder of the present invention can be a kind of in aluminum oxide, aluminium nitride, magnesium oxide, the zinc oxide or their combination.
Catalyzer of the present invention is the complex compound of platinum.
Inhibitor of the present invention is commercial the platinum complex compound to be had inhibiting inhibitor.
The present invention also provides the preparation method of this ultra-thin thermal conductive silicon film:
Said components is mixed the method for using high speed dispersor or install the high speed dispersion dish additional in planetary mixer in the back carry out high speed dispersion, the linear velocity of dispersion is not less than 10m/s; Because the particle diameter of heat conduction powder is more little, more trend reunion between its particle and the particle, this dispersing method can be avoided there is not divided particles and cause product surface that pore is arranged because of the air in its intermediate gap when moulding.
For being the particle good dispersion, also can add a spot of coupling agent or dispersion agent.The used coupling agent of the present invention can be any one in the commercial coupling agent that can share with the platinum vulcanizer, the siloxanes that dispersion agent is normally fluorine-containing.
Finely dispersed reinforced, through accurate rolling press calendering, baking can become the thermal conductive silicon film of required thickness.Accurate rolling press of the present invention requires the thickness of its calendering can be low to moderate below the 0.1mm, precision at least ± 0.02mm.
The invention beneficial effect:
Thermal conductive silicon film thickness provided by the invention far below thermal conductive silicon film in the market, can satisfy the especially lightening requirement of mobile phone of electronic product at 0.1～0.2mm.
The modest viscosity of the dimethyl silicone oil of ethenyl blocking in the thermal conductive silicon film batching provided by the invention, low viscosity is conducive to sizing material and is adding the levelling in man-hour, cross low viscosity and then be easy to generate the sedimentation of sizing material, and for to reach thinner, softer requirement, low excessively viscosity can make final product hardness uprise.
Dispersion process in the heat conductive silica gel piece preparation method provided by the invention can be avoided there is not divided particles and cause product surface that pore is arranged because of the air in its intermediate gap when moulding.
Specific embodiment
Embodiment 1
Be 500 parts of the aluminum oxide powders of 30 microns, 50 microns of maximum particle diameters and 3 microns of middle particle diameters, 33 microns of maximum particle diameters with particle diameter in adding in the dimethyl silicone oil of the ethenyl blocking of 100 parts viscosity 500cps, linear velocity with 15m/s in high speed dispersor was disperseed 40 minutes, the hydrogeneous hydrogen base silicone oil of side chain that then adds 0.5 part, disperse to add successively after 20 minutes 0.3 part catalyzer and 0.1 part inhibitor, and begin to vacuumize, after 15 minutes, stop to disperse.With scattered material, be adjusted to the accurate rolling press calendering of 0.15mm through thickness, 120 ℃ of bakings got final product in 15～20 minutes thermal conductivity 1.3w/m.k, the ultra-thin thermal conductive silicon film of thickness 0.15mm ± 0.02mm.
Embodiment 2
It is 2 microns with particle diameter in adding in the dimethyl silicone oil of the ethenyl blocking of 100 parts viscosity 1000cps, 350 parts in the zinc oxide that maximum particle diameter is 25 microns, linear velocity with 15m/s in high speed dispersor was disperseed 1 hour, the hydrogeneous hydrogen base silicone oil of side chain that then adds 0.3 part, disperse to add successively after 20 minutes 0.3 part catalyzer and 0.1 part inhibitor, and begin to vacuumize, after 15 minutes, stop to disperse, with scattered material, be adjusted to the accurate rolling press calendering of 0.1mm through thickness, 90 ℃ of bakings got final product in 30 minutes thermal conductivity 1.1w/m.k, the ultra-thin thermal conductive silicon film of thickness 0.1mm ± 0.02mm.
Above-mentioned example only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the people who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All equivalent transformations that spirit is done according to the present invention or modification all should be encompassed within protection scope of the present invention.
Claims (10)
1. ultra-thin thermal conductive silicon film and preparation method thereof is characterized in that component ratio is as follows: 100 parts of the dimethyl silicone oils of ethenyl blocking, 0.5～2.0 part of hydrogen base silicone oil, heat conduction powder: 200～500 parts, inhibitor: 0.1～0.3 part, catalyzer: 0.2～0.6 part.
2. thermal conductive silicon film according to claim 1 is characterized in that the dimethyl-silicon oil viscosity of described ethenyl blocking is at 500～1500cps.
3. thermal conductive silicon film according to claim 1 is characterized in that the dimethyl-silicon oil viscosity of described ethenyl blocking is at 500～1000cps.
4. thermal conductive silicon film according to claim 1 is characterized in that described hydrogen base silicone oil comprises the hydrogeneous hydrogen base silicone oil of at least a side chain.
5. thermal conductive silicon film according to claim 1 is characterized in that described heat conduction powder median size must not be above 100 microns less than 40 microns and maximum particle diameter.
6. thermal conductive silicon film according to claim 1 is characterized in that described heat conduction powder median size must not be above 50 microns less than 20 microns and maximum particle diameter.
7. thermal conductive silicon film according to claim 1 is characterized in that described heat conduction powder can be a kind of in aluminum oxide, aluminium nitride, magnesium oxide, the zinc oxide or their combination.
8. thermal conductive silicon film according to claim 1 is characterized in that described catalyzer is the complex compound of platinum, and described inhibitor is commercial the platinum complex compound to be had inhibiting inhibitor.
9. the preparation method of the described thermal conductive silicon film of claim 1, it is characterized in that comprising following steps: said components is mixed the method for using high speed dispersor or install the high speed dispersion dish additional in planetary mixer in the back carry out high speed dispersion, it is finely dispersed reinforced that the linear velocity of disperseing is not less than 10m/s, thickness through calendering can be low to moderate below the 0.1mm, precision at least ± the accurate rolling press calendering of 0.02mm; Reheat sulfuration subsequently can become the thermal conductive silicon film of required thickness.
10. the preparation method of thermal conductive silicon film according to claim 9, it is characterized in that in dispersion process, also can add coupling agent or dispersion agent, coupling agent can be any one in the commercial coupling agent that can share with the platinum vulcanizer, and dispersion agent is fluorine-containing siloxanes.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105504830A (en) * | 2015-12-29 | 2016-04-20 | 江苏创景科技有限公司 | Single-component addition type heat conduction organic silicon rubber and preparation method thereof |
| CN105949791A (en) * | 2016-07-14 | 2016-09-21 | 东莞市兆科电子材料科技有限公司 | Thermal-conductive silica gel sheet material and preparation method thereof |
| CN107418504A (en) * | 2017-08-30 | 2017-12-01 | 强新正品（苏州）环保材料科技有限公司 | Alternative graphite flake heat conductive silica gel and preparation technology |
| CN108800079A (en) * | 2017-04-27 | 2018-11-13 | 神华集团有限责任公司 | A kind of radiator |
| CN110294935A (en) * | 2018-11-19 | 2019-10-01 | 浙江天易新材料有限公司 | A kind of forming method of high thermal conductivity foamed silica gel material |
| CN110364648A (en) * | 2018-04-11 | 2019-10-22 | 苏州矽美科导热科技有限公司 | A kind of new energy heat dissipation of lithium battery gasket and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103113846A (en) * | 2013-03-12 | 2013-05-22 | 深圳市博恩实业有限公司 | Heat-conducting silica gel sheet and manufacturing method thereof |
-
2013
- 2013-06-26 CN CN2013102602237A patent/CN103333502A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103113846A (en) * | 2013-03-12 | 2013-05-22 | 深圳市博恩实业有限公司 | Heat-conducting silica gel sheet and manufacturing method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105504830A (en) * | 2015-12-29 | 2016-04-20 | 江苏创景科技有限公司 | Single-component addition type heat conduction organic silicon rubber and preparation method thereof |
| CN105949791A (en) * | 2016-07-14 | 2016-09-21 | 东莞市兆科电子材料科技有限公司 | Thermal-conductive silica gel sheet material and preparation method thereof |
| CN108800079A (en) * | 2017-04-27 | 2018-11-13 | 神华集团有限责任公司 | A kind of radiator |
| CN108800079B (en) * | 2017-04-27 | 2024-04-02 | 国家能源投资集团有限责任公司 | Radiator |
| CN107418504A (en) * | 2017-08-30 | 2017-12-01 | 强新正品（苏州）环保材料科技有限公司 | Alternative graphite flake heat conductive silica gel and preparation technology |
| CN110364648A (en) * | 2018-04-11 | 2019-10-22 | 苏州矽美科导热科技有限公司 | A kind of new energy heat dissipation of lithium battery gasket and preparation method thereof |
| CN110364648B (en) * | 2018-04-11 | 2022-04-01 | 苏州矽美科导热科技有限公司 | New energy lithium battery radiating gasket and preparation method thereof |
| CN110294935A (en) * | 2018-11-19 | 2019-10-01 | 浙江天易新材料有限公司 | A kind of forming method of high thermal conductivity foamed silica gel material |
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Application publication date: 20131002 |