CN103113846A - Heat-conducting silica gel sheet and manufacturing method thereof - Google Patents
Heat-conducting silica gel sheet and manufacturing method thereof Download PDFInfo
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- CN103113846A CN103113846A CN2013100783990A CN201310078399A CN103113846A CN 103113846 A CN103113846 A CN 103113846A CN 2013100783990 A CN2013100783990 A CN 2013100783990A CN 201310078399 A CN201310078399 A CN 201310078399A CN 103113846 A CN103113846 A CN 103113846A
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Abstract
The invention discloses a heat-conducting silica gel sheet and a manufacturing method thereof. The heat-conducting silica gel sheet is a sheet shaped body which is formed by mixing and mould-pressing the following components in parts by weight: 10-50 parts of polysiloxane, 20-600 parts of heat-conducting powder, 0.1-5 parts of surface modifier, 0.2-2 parts of cross-linking agent, 0.01-1 part of platinum catalyst and 0.0001-0.01 part of inhibitor. The manufacturing method of the heat-conducting silica gel sheet comprises the following steps: a adding polysiloxane, heat-conducting powder, the surface modifier, the cross-linking agent, the platinum catalyst and the inhibitor to a reaction kettle in proportion in sequence, and stirring the components for 30-50 minutes to obtain mixed materials; b filling the mixed materials to a frame-shaped mould and flatting the upper surface of the frame-shaped mould; and c putting the mould with the mixed materials to an oven, curing for 5-20 minutes at 80-150 DEG C, and forming to obtain the heat-conducting silica gel sheet with a predetermined thickness, wherein one surface of the heat-conducting silica gel sheet has viscosity and the other surface of the heat-conducting sheet does not have viscosity. According to the heat-conducting silica gel sheet and the manufacturing method thereof disclosed by the invention, the single-surface viscosity characteristic of the heat-conducting silica gel sheet is achieved without a secondary process, and the process treatment uniformity is ensured by the one-step forming process.
Description
[technical field]
The present invention relates to heat-conducting interface material, particularly relate to and a kind ofly namely possess single face viscosity through once shaped, can be used as heat conductive silica gel sheet material of the gap filling material between Heating element and heat dissipation element and preparation method thereof.
[background technology]
In daily life, people can be widely applied to various electronic products, large to televisor, little of MP3, and all electronic products all relate to heat dissipation problem because the electronic component in electronic product in use temperature can raise, especially transistor and some semiconductor devices especially easily generate heat, when the use temperature of electronic component is very high, can causes electronic component performance to descend, thereby need to dispel the heat to electronic component.For this reason, usually the larger electronic product Pei Ge of volume has the fan of heat transmission, but for the electronic product of small volume, due to the interiors of products insufficient space, needs the less heat dissipation element of Pei Ge volume to dispel the heat.When heat dissipation element is connected with Heating element, usually need to fill gap between Heating element and heat dissipation element with packing material and thermally conductive material.The heat conductive silica gel sheet material is a kind of heat-conducting interface material commonly used.In actual use, the heat conductive silica gel sheet material is attached on Heating element, then is fixed on heat dissipation element.If the both side surface of heat conductive silica gel sheet material all has viscosity, there are the following problems, the one, and because making, sticking hand mounts the difficult aligning of a Ge; The 2nd, when the assembling Heating element, need very little could the assembling of friction resistance between conducting strip surface and heat dissipation element; Secondly, two-sided adhesive conducting strip is long-time use after, can with bonding very tight of heat dissipation element, make when the serviceman need to carry out detachable maintaining, because of the not quick detachable maintenance efficiency that affects.Thereby developing the adhesive heat conductive silica gel sheet material of a kind of single face just becomes a kind of objective demand.
The main technique of existing making single face viscosity thermally-conductive sheet is the mode by surperficial aftertreatment, realize single face viscosity, this technique is the sticking thermally-conductive sheet of Mr.'s output tables mask, recycle special auxiliary agent or sizing material, be attached to the surface of heat conductive silica gel sheet material by the mode of spraying or blade coating, through hot setting, the conducting strip surface viscosity is disappeared, reach the purpose of single face viscosity.This technique exists to be processed inhomogeneously, makes heat conductive silica gel sheet material viscosity at different position Ge, certain difference be arranged, and even has the dead angle, causes the defectives such as product quality is poor.Simultaneously, owing to coating being arranged and solidifying two procedures, cause the production efficiency of heat conductive silica gel sheet material very low.
[summary of the invention]
The present invention is intended to address the above problem, and namely possesses single face viscosity and provide a kind of through once shaped, and can effectively enhance productivity and the heat conductive silica gel sheet material of ease of use.
The present invention also aims to provide a kind of preparation method of this heat conductive silica gel sheet material.
For achieving the above object, the invention provides a kind of heat conductive silica gel sheet material, this heat conductive silica gel sheet material is to be mixed by the weight ratio of 10～50:20～600:0.1～5:0.2～2:0.01～1:0.0001～0.01 by polysiloxane, heat conduction powder, surface-modifying agent, linking agent, platinum catalyst, inhibitor and mold pressing forms one wears viscosity, the not adhesive plates of another side.
Described surface-modifying agent is the silane coupling agent that contains alkenyl, and described alkenyl is a kind of in vinyl, propenyl, butenyl, pentenyl, hexenyl.
Polysiloxane is that viscosity is the polydimethylsiloxane of 10～5000mPas, and its end of the chain or side chain contain two alkenyls at least.
The heat conduction powder is selected from least a in aluminum oxide, silicon-dioxide, zinc oxide, magnesium oxide, aluminium nitride, silicon nitride, boron nitride, silicon carbide, aluminium powder, copper powder, silver powder, nickel powder, graphite, carbon nanotube and carbon fiber, and the particle diameter of this heat conduction powder is 0.2～100 micron.
Linking agent is that hydrogen content is 0.05～0.7% methyl hydrogen containing siloxane.
Inhibitor is at least a in alkynol compounds, multi-vinyl silicone oil.
The thickness of this heat conductive silica gel sheet material is 0.3～10mm.
The present invention also provides the preparation method of heat conductive silica gel sheet material, and the method comprises the steps:
A, the polysiloxane with described ratio, linking agent, surface-modifying agent, heat conduction powder, platinum catalyst and inhibitor add reactor successively, use high speed power mixer vacuum stirring 30～50 minutes, the mixture that obtains mixing;
B, mixture is filled in the shaped as frame mould of setting thickness, and upper surface is struck off;
C, the mould that mixture is housed is put into baking box, solidified 5～20 minutes at 80～150 ℃ of temperature, obtain pre-determined thickness after moulding, one wears viscosity, the not adhesive heat conductive silica gel sheet material of another side.
In step b, the setting thickness of mould is 0.3～10mm.
Contribution of the present invention is, it efficiently solves defective and the complex procedures of existing single face viscosity conducting strip surface aftertreatment technology, the problem that production efficiency is low.The present invention can once make single face viscosity heat conductive silica gel sheet material, make the heat conductive silica gel sheet material need not the processing of secondary operation and namely have the viscosity of wearing, the not adhesive characteristic of another side, one-shot forming technique has guaranteed heat conductive silica gel sheet material surface-treated homogeneity simultaneously, makes the heat conductive silica gel sheet material have identical viscosity at different position Ge.Heat conductive silica gel sheet material of the present invention has that to mount a Ge accurate, is easy to assembling, is convenient to serviceman's dismounting and maintenance, the maintenance efficiency high.
[embodiment]
The following example is to further explanation of the present invention and replenishes, the present invention is not constituted any limitation.
Embodiment 1
The polysiloxane of getting the 1000mPas ethenyl blocking of 50 weight parts adds in reactor, then add successively the methyl hydrogen containing siloxane of 1.2 weight parts, the vinyltrimethoxy silane of 3 weight parts, the particle diameter of 150 weight parts is the aluminum oxide of 30 microns, the particle diameter of 100 weight parts is the aluminum oxide of 3.5 microns, the platinum catalyst of 0.3 weight part, the butynol inhibitor of 0.005 weight part, above-mentioned material is by high speed power mixer vacuum stirring 30 minutes, the mixture that obtains mixing.Be that in the frame mould of 2mm, this frame mould is open topped formula mould to thickness with the mixture filling after mixing, be convenient to the upper surface curing molding of material.Pack into and with scraper, unnecessary material is scraped after the material levelling of frame mould.The mould that mixture is housed is put into baking box, solidified 15 minutes at 100 ℃ of temperature, namely obtaining thickness after curing molding is the heat conductive silica gel sheet material of 2mm.
Comparative Examples 1
The polysiloxane of getting the 1000mPas ethenyl blocking of 50 weight parts adds in reactor, then add successively the methyl hydrogen containing siloxane of 1.2 weight parts, the particle diameter of 150 weight parts is the aluminum oxide of 30 microns, the particle diameter of 100 weight parts is the aluminum oxide of 3.5 microns, 0.3 the platinum catalyst of weight part, 0.005 the butynol inhibitor of weight part, above-mentioned material is by high speed power mixer vacuum stirring 30 minutes, the mixture that obtains mixing.Be in the frame mould of 2mm, with scraper, unnecessary material to be scraped after the material levelling of the frame mould of packing into to thickness with the mixture filling after mixing.The mould that mixture is housed is put into baking box, solidified 15 minutes at 100 ℃ of temperature, obtaining thickness is the heat conductive silica gel sheet material of heat conductive silica gel sheet material contrast use 2mm and embodiment 1, test performance correlation data such as the table 1 of embodiment 1 and Comparative Examples 1.
Embodiment 2
The polysiloxane of getting the 500mPas ethenyl blocking of 50 weight parts adds in reactor, then add successively the methyl hydrogen containing siloxane of 2 weight parts, γ-the methacryloxypropyl trimethoxy silane of 3 weight parts, the particle diameter of 120 weight parts is the aluminium powder of 15 microns, the particle diameter of 80 weight parts is the aluminium powder of 4 microns, 0.3 the platinum catalyst of weight part, 0.005 the butynol inhibitor of weight part, above-mentioned material is by high speed power mixer vacuum stirring 40 minutes, the mixture that obtains mixing.Be in the frame mould of 2mm to thickness with the mixture filling after mixing.Packing into scrapes unnecessary material with scraper after the material levelling of frame mould, afterwards sizing material and mould is put into baking box together, solidifies 10 minutes at 120 ℃ of temperature, and namely obtaining thickness after curing molding is the heat conductive silica gel sheet material of 2mm.
Comparative Examples 2
The polysiloxane of getting 50 weight part 500mPas side chain vinyl adds in reactor, then add successively 1.8 weight part methyl hydrogen containing siloxanes, 150 weight part particle diameters are the aluminium powder of 15 microns, 100 weight part particle diameters are the aluminium powder of 4 microns, 0.3 the weight part platinum catalyst, 0.005 part of butynol inhibitor.The mixture that obtains mixing.Mixture is put into the dark frame mould of 2mm, with scraper, unnecessary sizing material is scraped after levelling.Afterwards sizing material and mould are put into baking box together, solidified 10 minutes at 120 ℃ of temperature, obtaining thickness is the contrast heat conductive silica gel sheet material sample of 2mm.
Embodiment 3
The polysiloxane of getting the 1000mPas ethenyl blocking of 50 weight parts adds in reactor, then add successively the methyl hydrogen containing siloxane of 1.2 weight parts, the vinyltrimethoxy silane of 3 weight parts, the particle diameter of 300 weight parts is the aluminum oxide powder of 45 microns, the particle diameter of 200 weight parts is the aluminum oxide of 5 microns, the platinum catalyst of 0.6 weight part, the butynol inhibitor of 0.007 weight part, above-mentioned material is by high speed power mixer vacuum stirring 50 minutes, the mixture that obtains mixing.Be in the frame mould of 2mm to thickness with the mixture filling after mixing.Packing into scrapes unnecessary material with scraper after the material levelling of frame mould, afterwards sizing material and mould is put into baking box together, solidifies 5 minutes at 150 ℃ of temperature, and namely obtaining thickness after curing molding is the heat conductive silica gel sheet material of 2mm.
Embodiment 4
The polysiloxane of getting the 500mPas ethenyl blocking of 50 weight parts adds in reactor, then add successively the methyl hydrogen containing siloxane of 1.2 weight parts, the vinyl three of 3 weight parts (2-methoxy ethoxy) TMOS, the particle diameter of 150 weight parts is the aluminium powder of 14 microns, the particle diameter of 100 weight parts is the aluminium nitride of 2 microns, 0.3 the platinum catalyst of weight part, 0.005 the butynol inhibitor of weight part, above-mentioned material is by high speed power mixer vacuum stirring 50 minutes, the mixture that obtains mixing.Be in the frame mould of 2mm to thickness with the mixture filling after mixing.Packing into scrapes unnecessary material with scraper after the material levelling of frame mould, afterwards sizing material and mould is put into baking box together, solidifies 20 minutes at 80 ℃ of temperature, and namely obtaining thickness after curing molding is the heat conductive silica gel sheet material of 2mm.
Embodiment 1～4 and Comparative Examples 1,2 test performance correlation data see Table 1:
Table 1
As can be seen from Table 1, after having added surface-modifying agent, the upper surface viscosity of goods obviously disappears, and hardness and heat conductivility be impact not.Illustrate that the present invention can effectively eliminate heat conductive silica gel sheet material surface viscosity, only need one-step solidification technique, just can obtain the heat conductive silica gel sheet material of single face viscosity.
Although by above embodiment, the present invention is disclosed, protection scope of the present invention is not limited to this, is not departing under the condition of the present invention design, and the distortion that above each member is done, replacement etc. all will fall in claim scope of the present invention.
Claims (10)
1. heat conductive silica gel sheet material, it is characterized in that, this heat conductive silica gel sheet material is to be mixed by the weight ratio of 10～50:20～600:0.1～5:0.2～2:0.01～1:0.0001～0.01 by polysiloxane, heat conduction powder, surface-modifying agent, linking agent, platinum catalyst, inhibitor and mold pressing forms one wears viscosity, the not adhesive plates of another side.
2. heat conductive silica gel sheet material as claimed in claim 1, is characterized in that, described surface-modifying agent is the silane coupling agent that contains alkenyl.
3. heat conductive silica gel sheet material as claimed in claim 2, is characterized in that, described alkenyl is a kind of in vinyl, propenyl, butenyl, pentenyl, hexenyl.
4. heat conductive silica gel sheet material as claimed in claim 1, is characterized in that, described polysiloxane is that viscosity is the polydimethylsiloxane of 10～5000mPas, and its end of the chain or side chain contain two alkenyls at least.
5. heat conductive silica gel sheet material as claimed in claim 1, it is characterized in that, described heat conduction powder is selected from least a in aluminum oxide, silicon-dioxide, zinc oxide, magnesium oxide, aluminium nitride, silicon nitride, boron nitride, silicon carbide, aluminium powder, copper powder, silver powder, nickel powder, graphite, carbon nanotube and carbon fiber, and the particle diameter of this heat conduction powder is 0.2～100 micron.
6. heat conductive silica gel sheet material as claimed in claim 1, is characterized in that, described linking agent is that hydrogen content is 0.05～0.7% methyl hydrogen containing siloxane.
7. heat conductive silica gel sheet material as claimed in claim 1, is characterized in that, described inhibitor is at least a in alkynol compounds, multi-vinyl silicone oil.
8. heat conductive silica gel sheet material as claimed in claim 1, is characterized in that, the thickness of this heat conductive silica gel sheet material is 0.3～10mm.
9. the preparation method of heat conductive silica gel sheet material as claimed in claim 1, is characterized in that, the method comprises the steps:
A, the polysiloxane with described ratio, linking agent, surface-modifying agent, heat conduction powder, platinum catalyst and inhibitor add reactor successively, use high speed power mixer vacuum stirring 30～50 minutes, the mixture that obtains mixing;
B, mixture is filled in the shaped as frame mould of setting thickness, and upper surface is struck off;
C, the mould that mixture is housed is put into baking box, solidified 5～20 minutes at 80～150 ℃ of temperature, obtain pre-determined thickness after moulding, one wears viscosity, the not adhesive heat conductive silica gel sheet material of another side.
10. the manufacture method of heat conductive silica gel sheet material as claimed in claim 9, is characterized in that, in step (b), the setting thickness of mould is 0.3～10mm.
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101654609A (en) * | 2008-09-19 | 2010-02-24 | 镇江东辰新材料有限公司 | Single-component silicone seal gum for solar component and method for manufacturing same |
| CN101928462A (en) * | 2010-09-10 | 2010-12-29 | 烟台德邦科技有限公司 | Acetone-removing silicon rubber and preparation method thereof |
| CN101934623A (en) * | 2009-04-15 | 2011-01-05 | 信越化学工业株式会社 | Silicone rubber sheet for thermocompression bonding |
| CN101942197A (en) * | 2009-07-09 | 2011-01-12 | 昆山伟翰电子有限公司 | Heat-conducting silicon rubber composite material and preparing method thereof |
| CN102002346A (en) * | 2010-10-15 | 2011-04-06 | 深圳市安品有机硅材料有限公司 | Organic silicon heat conduction composition and organic silicon heat conduction patch |
| KR20120001655A (en) * | 2010-06-28 | 2012-01-04 | 아이카고교 가부시키가이샤 | Addition-type silicone resin composition |
| JP2012106409A (en) * | 2010-11-17 | 2012-06-07 | Shin-Etsu Chemical Co Ltd | Silicone rubber sheet for thermocompression bonding |
| CN102533152A (en) * | 2012-01-18 | 2012-07-04 | 苏州领胜电子科技有限公司 | Heat-conducting siliconfilm and manufacturing method thereof |
| CN102899000A (en) * | 2012-11-05 | 2013-01-30 | 江苏天辰硅材料有限公司 | Metal self-adhesive silicone rubber mixture and preparation method thereof |
-
2013
- 2013-03-12 CN CN201310078399.0A patent/CN103113846B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101654609A (en) * | 2008-09-19 | 2010-02-24 | 镇江东辰新材料有限公司 | Single-component silicone seal gum for solar component and method for manufacturing same |
| CN101934623A (en) * | 2009-04-15 | 2011-01-05 | 信越化学工业株式会社 | Silicone rubber sheet for thermocompression bonding |
| CN101942197A (en) * | 2009-07-09 | 2011-01-12 | 昆山伟翰电子有限公司 | Heat-conducting silicon rubber composite material and preparing method thereof |
| KR20120001655A (en) * | 2010-06-28 | 2012-01-04 | 아이카고교 가부시키가이샤 | Addition-type silicone resin composition |
| CN101928462A (en) * | 2010-09-10 | 2010-12-29 | 烟台德邦科技有限公司 | Acetone-removing silicon rubber and preparation method thereof |
| CN102002346A (en) * | 2010-10-15 | 2011-04-06 | 深圳市安品有机硅材料有限公司 | Organic silicon heat conduction composition and organic silicon heat conduction patch |
| JP2012106409A (en) * | 2010-11-17 | 2012-06-07 | Shin-Etsu Chemical Co Ltd | Silicone rubber sheet for thermocompression bonding |
| CN102533152A (en) * | 2012-01-18 | 2012-07-04 | 苏州领胜电子科技有限公司 | Heat-conducting siliconfilm and manufacturing method thereof |
| CN102899000A (en) * | 2012-11-05 | 2013-01-30 | 江苏天辰硅材料有限公司 | Metal self-adhesive silicone rubber mixture and preparation method thereof |
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