CN110330946A - A kind of low viscosity high heat conduction organosilicon gel and preparation method thereof - Google Patents

Abstract

A kind of low viscosity high heat conduction organosilicon gel and preparation method thereof, belongs to heat-conducting interface material technical field.The low viscosity high heat conduction organosilicon gel is made of component A and B component, wherein component A includes following component: vinyl silicone oil, multi-vinyl silicone oil, alkyl modified silicon oil, reactive diluent, the inorganic filler of high thermal conductivity compounding, catalyst and pigment, B component include following component in parts by mass: vinyl silicone oil, multi-vinyl silicone oil, alkyl modified silicon oil, reactive diluent, high thermal conductivity compound inorganic filler, containing hydrogen silicone oil, inhibitor, tackifier.Product of the invention has low viscosity, and high extrudability and high thixotropic easily mixes, and stress is compressible at different-thickness and filled layer of different shapes；Can room temperature and heating rapid curing at soft Silica hydrogel, the effects of being suitble to irregular gap between the various electronic devices of filling and radiator, play thermally conductive, insulation, buffering, damping.

Description

A kind of low viscosity high heat conduction organosilicon gel and preparation method thereof

Technical field

The invention belongs to heat-conducting interface material technical fields, and in particular to a kind of low viscosity high heat conduction organosilicon gel and its Preparation method.

Background technique

Heat conduction organosilicon gel is one kind with organosiloxane and heat filling, is prepared using certain processing technology A kind of heat-conducting interface material.Can be achieved automation dispensing, the gap of filling shape complexity, solve heat generating components and radiator it Between hot problem of transmission, while can play insulation, damping, buffering the effects of.With the arrival in 5G epoch, the Gao Gong of electronic device Rate, miniaturization, densification requirement are higher, and the heat dissipation problem of device highlights further, and good heat dissipation is that electronic equipment works normally Important guarantee.

There are heat-conducting silicone grease, heat-conducting pad, phase-change material, thermally conductive bonded adhesives and close using wider heat-conducting interface material at present Sealing, thermally conductive gel etc..But in practical application, different heat-conducting interface materials constantly highlights such or such problem, limit The application of heat-conducting interface material has been made, while having also counteracted the progress of electronic technology.It is a kind of cream of undefined structure such as silicone grease Shape Heat Conduction Material, although easily realizing that automation is coated with, is easy for construction, has dusting, fuel-displaced, device easy to pollute etc. in application Disadvantage；Heat-conducting pad is a kind of sheet heat-conducting interface material for having excellent operability, insulating properties, compressibility, and its in applying The micro gap being unable between filling interface, interface resistance is larger, and practical heat transfer effect is poor, and is not applied for needing multiple The occasion of miscellaneous shape filling, application range are restricted；Phase-change material strong operability passes through the phase transformation of material during temperature rise Reaction forms semi liquid state shape substance, realizes moment, efficient endothermic effect, material from solidifying after cooling, is recycled and plays function Effect, but the decaying of oxidizable, physical property is big, the cost is relatively high；Thermally conductive bonded adhesives and sealant have good bonding to substrate Property, while the function of heat dissipation and insulation is played, but its general thermal coefficient is lower, heat dissipation effect is poor.

And thermally conductive Silica hydrogel can solve the easy dusting of heat-conducting silicone grease be hardened, heat-conducting pad interface resistance it is big, poor for applicability, phase Become the problems such as material aging performance is poor, conduction heat sealable glue thermal coefficient is low.Before solidification, thermally conductive Silica hydrogel is a kind of as silicone grease one The paste of sample has good extrudability and thixotropy, can be compressed into different shapes under external force, and tool can be filled There is the electronic equipment of micro gap and labyrinth；Can be soft as gasket after solidification, compression resilience is good and has excellent Different ground adhesion.Even so, as electronic device tends to the design requirement of high power, densification, ultrathin, height is led The demand of hot material is increasing.However, high thermal conductivity does not only result in the increased costs of thermally conductive gel material, and viscosity is also got over Come higher.High viscosity causes thermally conductive gel mixing uneven, it is difficult to the disadvantages of filling micro gap, can not achieve automation dispensing. Therefore low viscosity, the exploitation of high thermal conductivity boundary material are more and more urgent.

Summary of the invention

The technical issues of solution: in view of the above technical problems, the present invention provides a kind of low viscosity high heat conduction organosilicon gel And preparation method thereof, it is with the paste compared with low viscosity, extrudability good, two components easily mix before the product solidification of preparation It is even, the electronic equipment with micro gap and labyrinth can be filled；Can room temperature or heating rapid curing, solidify after image gasket one Sample is soft, and compression resilience is good and excellent cold-and-heat resistent impact.

Technical solution: a kind of low viscosity high heat conduction organosilicon gel, the low viscosity high heat conduction organosilicon gel is by component A It is constituted with B component, wherein component A includes following component in parts by mass: 100 parts of vinyl silicone oils, vinyl silicon more than 5~20 parts Oil, 5~20 parts of alkyl modified silicon oils, 5~25 portions of reactive diluents, 500~2500 parts of high thermal conductivities compound inorganic filler, 1~10 Part catalyst and 2~10 parts of pigment, B component include following component in parts by mass: 100 parts of vinyl silicone oils, second more than 5~20 parts Alkenyl silicone oil, 5~20 parts of alkyl modified silicon oils, 5~25 portions of reactive diluents, the inorganic fillers of 500~2500 parts of high thermal conductivities compounding, 1~20 part of containing hydrogen silicone oil, 0.5~10 part of inhibitor, 0.5~10 part of tackifier.

Preferably, the vinyl silicone oil is dimethyl silicone polymer, the poly dimethyl-ethylene methacrylic of ethenyl blocking At least one of radical siloxane and polymethyl-benzene base-methyl vinyl silicone, viscosity 30-1000mPas.

Preferably, the multi-vinyl silicone oil is methyl blocking, side chain containing vinyl polysiloxane, viscosity 100- 2000mPas, the alkyl modified silicon oil are that Long carbon chain alkyl is grafted dimethyl silicone polymer, and viscosity is 50~350mPa S, the reactive diluent are single-ended vinyl polysiloxane, and structural formula is as follows:

Preferably, high thermal conductivity compounding inorganic filler be aluminium oxide, magnesia, zinc oxide, beryllium oxide, aluminium nitride, At least two in boron nitride, silicon nitride, silicon carbide, aluminium hydroxide, silica, calcium carbonate and silicates inorganic powder.

Preferably, it is that 0.3-100 μm spherical or spherical is led that high thermal conductivity compounding inorganic filler, which is particle size, Hot particle, wherein the 1-5% for accounting for total amount that partial size is 0.3-1 μm, the 60-80% for accounting for total amount that partial size is 3-30 μm, partial size are 50-100 μm of the 1-10% for accounting for total amount.

Preferably, the high thermal conductivity compounding inorganic filler is modified by long chain alkyl silane coupling agent surface, oil factor exists Between 3-10%, the long chain alkyl silane coupling agent is the methoxyl group class siloxanes that chain alkyl carbon atom number is 12-20.

Preferably, the containing hydrogen silicone oil is end hydrogen containing siloxane and side chain hydrogen containing siloxane mixture, middle-end The mass ratio of hydrogen containing siloxane and side chain hydrogen containing siloxane is (1-30): 1.

Preferably, the containing hydrogen silicone oil is low viscosity hydrogen containing siloxane, viscosity 10-150mPas.

Preferably, the catalyst is add-on type liquid silicon rubber custom catalysts, such as chloroplatinic acid and its chelate or Other solubility platinum compounds.

Preferably, the inhibitor and tackifier are respectively conventionally known inhibitor and tackifier.

Preferably, the pigment is iron oxide red, cobalt blue, cadmium yellow or carbon black.

The preparation method of above-mentioned low viscosity high heat conduction organosilicon gel, the described method comprises the following steps:

Step 1 semi-finished product premix takes off low, and vinyl silicone oil, multi-vinyl silicone oil, filler are weighed be added to according to the ratio In planetary mixer, at 120 DEG C, -0.1MPa, which is vacuumized, to be uniformly mixed for use；

Step 2 finished product is prepared, and is cooled to room temperature to semi-finished product, is weighed other objects of component A and B component respectively according to the ratio Material is put into planetary mixer, and -0.1MPa is vacuumized, and 40rpm stirs 45min；

Step 3 packing, the component A mixed, B component are fitted into 1:1 two-component pipe or bucket.

The utility model has the advantages that

The present invention is blended using low viscosity vinyl silicone oil with thermally conductive powder, the different spherical oxidation of particle size slope Aluminium carries out optimal compounding, keeps system accumulation closely knit, optimizes thermal conducting path, reduce thermally conductive powder additive amount, greatly reduce component Viscosity；There is lower oil factor using the coupling agent modified filler of the long chain alkyl silane filler more modified than common process agent, Powder is set to be easier to filling and dispersion；Low viscosity alkyl modified silicon oil is added, system viscosity on the one hand can be reduced, improves squeezing for colloid Property out；On the other hand due to its branched structure steric effect, it is made to be not easy to ooze out during storage and high temperature ageing.Addition is lived Property diluent, on the one hand can reduce system viscosity；On the other hand since reactive diluent has reactivity, high temperature ageing will not seep Out and it can significantly reduce colloid hardness.It can to sum up make product of the present invention relative market existing product that there is lower viscosity, higher The advantages such as thermally conductive, more soft, ageing stability is more preferable.

Specific embodiment

Embodiment 1

A kind of low viscosity high heat conduction organosilicon gel, the low viscosity high heat conduction organosilicon gel is by component A and B component structure At wherein component A includes following component in parts by mass: 100 parts of vinyl silicone oils, 5 parts of multi-vinyl silicone oils, 5 parts of alkyl change Property silicone oil, 5 portions of reactive diluents, the inorganic fillers of 500 parts of high thermal conductivities compounding, 1 part of catalyst and 2 parts of pigment, B component presses mass parts Counting includes following component: 100 parts of vinyl silicone oils, 5 parts of multi-vinyl silicone oils, 5 parts of alkyl modified silicon oils, 5 portions of reactive diluents, 500 parts of high thermal conductivities compound inorganic filler, 1 part of containing hydrogen silicone oil, 0.5 part of inhibitor, 0.5 part of tackifier.The vinyl silicone oil is The dimethyl silicone polymer of ethenyl blocking, vinyl mass content are viscosity 30mPas between 0.2%.More second Alkenyl silicone oil is methyl blocking, side chain containing vinyl polysiloxane, and vinyl mass content is 0.5%, viscosity 100mPa s.The alkyl modified silicon oil is that Long carbon chain alkyl is grafted dimethyl silicone polymer.The reactive diluent is single-ended ethylene Based polysiloxane.The high thermal conductivity compounding inorganic filler is aluminium oxide and calcium carbonate.The high thermal conductivity compounding inorganic filler is grain Diameter is having a size of 0.3-100 μm of spherical or spherical conductive particle, wherein account for total amount 1% that partial size is 0.3-1 μm, partial size For 3-30 μm of account for total amount 60%, account for total amount 1% that partial size is 50-100 μm, remaining partial size be 1-3 μm and 30-50 μm it Between.The high thermal conductivity compounding inorganic filler is modified by long chain alkyl silane coupling agent surface, and oil factor is between 3-10%.It is described Containing hydrogen silicone oil is that end hydrogen containing siloxane and side chain hydrogen containing siloxane mixture, middle-end hydrogen containing siloxane and side chain are hydrogeneous The mass ratio of polysiloxanes is 1:1.The containing hydrogen silicone oil is low viscosity hydrogen containing siloxane, viscosity 10mPas.It is described to urge Agent is add-on type liquid silicon rubber custom catalysts chloroplatinic acid and its chelate.The inhibitor and tackifier are respectively existing Well known inhibitor and tackifier.The pigment is iron oxide red.

The preparation method of above-mentioned low viscosity high heat conduction organosilicon gel, the described method comprises the following steps:

Step 1 semi-finished product premix, take off it is low, by vinyl silicone oil, multi-vinyl silicone oil, high thermal conductivity compounding inorganic filler press Proportion, which weighs, to be added in planetary mixer, and at 120 DEG C, -0.1MPa, which is vacuumized, to be uniformly mixed for use；

Step 2 finished product is prepared, and is cooled to room temperature to semi-finished product, is weighed other objects of component A and B component respectively according to the ratio Material is put into planetary mixer, and -0.1MPa is vacuumized, and 40rpm stirs 45min；

Step 3 packing, the component A mixed, B component are fitted into 1:1 two-component pipe or bucket.

Embodiment 2

A kind of low viscosity high heat conduction organosilicon gel, the low viscosity high heat conduction organosilicon gel is by component A and B component structure At wherein component A includes following component in parts by mass: 100 parts of vinyl silicone oils, 20 parts of multi-vinyl silicone oils, 20 parts of alkyl Modified silicon oil, 25 portions of reactive diluents, 2500 parts of high thermal conductivity compounding inorganic fillers, 10 parts of catalyst and 10 parts of pigment, B component are pressed Mass parts meter includes following component: 100 parts of vinyl silicone oils, 20 parts of multi-vinyl silicone oils, 20 parts of alkyl modified silicon oils, 25 parts of work Property diluent, 2500 parts of high thermal conductivities compound inorganic fillers, 20 parts of containing hydrogen silicone oils, 10 parts of inhibitor, 10 parts of tackifier.The ethylene Base silicone oil is dimethyl silicone polymer, poly dimethyl-methyl vinyl silicone and the polymethyl-benzene base-methyl of ethenyl blocking Vinylsiloxane, vinyl mass content is 0.8%, viscosity 1000mPas.The multi-vinyl silicone oil is methyl envelope End, side chain contain vinyl polysiloxane, and vinyl mass content is 5%, viscosity 2000mPas.The alkyl modified silicon oil Dimethyl silicone polymer is grafted for Long carbon chain alkyl.The reactive diluent is single-ended vinyl polysiloxane.The high thermal conductivity Compounding inorganic filler is aluminium oxide, magnesia, zinc oxide, beryllium oxide, aluminium nitride, boron nitride, silicon nitride, silicon carbide, hydroxide Aluminium, silica, calcium carbonate and silicates inorganic powder.It is 0.3- that the high thermal conductivity compounding inorganic filler, which is particle size, 100 μm of spherical or spherical conductive particle, wherein partial size is 0.3-1 μm of account for total amount 5%, and partial size is 3-30 μm and accounts for The 80% of total amount, account for total amount 10% that partial size is 50-100 μm, remaining partial size is between 1-3 μm and 30-50 μm.The height is led Heat compounding inorganic filler is modified by long chain alkyl silane coupling agent surface, and oil factor is between 3-10%.The containing hydrogen silicone oil is End hydrogen containing siloxane and side chain hydrogen containing siloxane mixture, middle-end hydrogen containing siloxane and side chain hydrogen containing siloxane Mass ratio is 30:1.The containing hydrogen silicone oil is low viscosity hydrogen containing siloxane, viscosity 150mPas.The catalyst is to add Molding liquid silicon rubber custom catalysts are soluble platinum compounds.The inhibitor and tackifier are respectively conventionally known suppression Preparation and tackifier.The pigment is cobalt blue.

The preparation method of above-mentioned low viscosity high heat conduction organosilicon gel, the described method comprises the following steps:

Step 1 semi-finished product premix, take off it is low, by vinyl silicone oil, multi-vinyl silicone oil, high thermal conductivity compounding inorganic filler press Proportion, which weighs, to be added in planetary mixer, and at 120 DEG C, -0.1MPa, which is vacuumized, to be uniformly mixed for use；

Step 2 finished product is prepared, and is cooled to room temperature to semi-finished product, is weighed other objects of component A and B component respectively according to the ratio Material is put into planetary mixer, and -0.1MPa is vacuumized, and 40rpm stirs 45min；

Step 3 packing, the component A mixed, B component are fitted into 1:1 two-component pipe or bucket.

Embodiment 3

A kind of low viscosity high heat conduction organosilicon gel, the low viscosity high heat conduction organosilicon gel is by component A and B component structure At wherein component A includes: the dimethyl silicone polymer for the ethenyl blocking that 70g viscosity is 50mPas, and 30g viscosity is Poly dimethyl-methyl vinyl silicone of 250mPas ethenyl blocking, 5g viscosity are 500mPas multi-vinyl silicone oil, The multi-vinyl silicone oil is methyl blocking, side chain containing vinyl polysiloxane, and 20g alkyl modified silicon oil is described alkyl-modified Silicone oil is that Long carbon chain alkyl is grafted dimethyl silicone polymer, 20g reactive diluent, and the reactive diluent gathers for single-ended vinyl Siloxanes, 2300g compound inorganic filler, oil factor 4% by the high thermal conductivity that long chain alkyl silane is handled, wherein including 1900g Ball-aluminium oxide (wherein partial size is 100 μm and accounts for 5%, and 70 μm account for 10%, and 30 μm account for 80%, 1 μm account for 5%), 200g partial size be 20 μ Spherical aluminium hydroxide, the 100g partial size of m be 40 μm of boron nitride, the spherical aluminum nitride that 100g partial size is 30 μm, 20g chloroplatinic acid and 6g Cobalt blue.B component includes: the dimethyl silicone polymer for the ethenyl blocking that 70g viscosity is 50mPas, and 30g viscosity is Poly dimethyl-methyl vinyl silicone of 250mPas ethenyl blocking, 5g viscosity are 500mPas multi-vinyl silicone oil, The multi-vinyl silicone oil is methyl blocking, side chain containing vinyl polysiloxane, and 20g alkyl modified silicon oil is described alkyl-modified Silicone oil is that Long carbon chain alkyl is grafted dimethyl silicone polymer, 20g reactive diluent, and the reactive diluent gathers for single-ended vinyl Siloxanes, 2300g compound inorganic filler, oil factor 4% by the high thermal conductivity that long chain alkyl silane is handled, wherein including 1900g Ball-aluminium oxide (wherein partial size is 100 μm and accounts for 5%, and 70 μm account for 10%, and 30 μm account for 80%, 1 μm account for 5%), 200g partial size be 20 μ Spherical aluminium hydroxide, the 100g partial size of m be 40 μm of boron nitride, the spherical aluminum nitride that 100g partial size is 30 μm, 20g containing hydrogen silicone oil (its middle-end containing hydrogen silicone oil and side containing hydrogen silicone oil mass ratio 20:1), the containing hydrogen silicone oil are low viscosity hydrogen containing siloxane, 3g inhibitor and 3g tackifier, the inhibitor and tackifier are respectively conventionally known inhibitor and tackifier.

The preparation method of above-mentioned low viscosity high heat conduction organosilicon gel, the described method comprises the following steps:

Step 1 semi-finished product premix, take off it is low, by vinyl silicone oil, multi-vinyl silicone oil, high thermal conductivity compounding inorganic filler press Proportion, which weighs, to be added in planetary mixer, and at 120 DEG C, -0.1MPa, which is vacuumized, to be uniformly mixed for use；

Step 2 finished product is prepared, and is cooled to room temperature to semi-finished product, is weighed other objects of component A and B component respectively according to the ratio Material is put into planetary mixer, and -0.1MPa is vacuumized, and 40rpm stirs 45min；

Step 3 packing, the component A mixed, B component are fitted into 1:1 two-component pipe or bucket.

Embodiment 4

With embodiment 3, difference is, component A includes: the poly dimethyl for the ethenyl blocking that 80g viscosity is 50mPas Siloxanes, 20g viscosity are polymethyl-benzene base-methyl vinyl silicone of 250mPas ethenyl blocking, and 5g viscosity is 500mPas multi-vinyl silicone oil, the multi-vinyl silicone oil are methyl blocking, side chain containing vinyl polysiloxane, 20g alkyl Modified silicon oil, the alkyl modified silicon oil are that Long carbon chain alkyl is grafted dimethyl silicone polymer, 15g reactive diluent, the work Property diluent be single-ended vinyl polysiloxane, 1700g high thermal conductivity compound inorganic filler, oil factor 4%, wherein including 1400g ball-aluminium oxide (wherein partial size is 100 μm and accounts for 5%, and 70 μm account for 10%, and 30 μm account for 80%, 1 μm account for 5%), 100g partial size For the spherical aluminum nitride that 20 μm of spherical aluminium hydroxides, 100g partial size are 30 μm of boron nitride, 100g partial size is 30 μm, 20g chlorine platinum Acid and 5g cobalt blue.B component includes: the dimethyl silicone polymer for the ethenyl blocking that 80g viscosity is 50mPas, and 20g viscosity is Polymethyl-benzene base-methyl vinyl silicone of 250mPas ethenyl blocking, 5g viscosity are the more vinyl silicon of 500mPas Oil, the multi-vinyl silicone oil is methyl blocking, side chain contains vinyl polysiloxane, 20g alkyl modified silicon oil, and the alkyl changes Property silicone oil be Long carbon chain alkyl be grafted dimethyl silicone polymer, 15g reactive diluent, the reactive diluent be single-ended vinyl Polysiloxanes, 1700g high thermal conductivity compound inorganic filler, oil factor 4%, wherein including 1400g ball-aluminium oxide (wherein partial size Account for 5% for 100 μm, 70 μm account for 10%, and 30 μm account for 80%, 1 μm account for 5%), the spherical aluminium hydroxide that 100g partial size is 20 μm, (containing hydrogen silicone oil is low for 100g partial size is 30 μm of boron nitride, 100g partial size is 30 μm spherical aluminum nitride, 20g containing hydrogen silicone oil Viscosity hydrogen containing siloxane, middle-end containing hydrogen silicone oil and side containing hydrogen silicone oil mass ratio 15:1), 2g inhibitor and 3g tackifier (inhibitor and tackifier be respectively conventionally known inhibitor and tackifier).

Embodiment 5

With embodiment 3, difference is, component A includes: the poly dimethyl for the ethenyl blocking that 50g viscosity is 250mPas Siloxanes, 50g viscosity are the dimethyl silicone polymer of 1000mPas ethenyl blocking, 10g multi-vinyl silicone oil, more second Alkenyl silicone oil is methyl blocking, side chain containing vinyl polysiloxane, and 10g alkyl modified silicon oil, the alkyl modified silicon oil is length Alkyl chain length is grafted dimethyl silicone polymer, 10g reactive diluent, and the reactive diluent is single-ended vinyl polysiloxane, 1300g high thermal conductivity compounds inorganic filler, oil factor 5%, wherein (wherein partial size accounts for for 100 μm comprising 1100g ball-aluminium oxide 5%, 70 μm account for 10%, and 30 μm account for 80%, 1 μm account for 5%), the boron nitride that 100g partial size is 40 μm, 100g partial size be 30 μm of spherical shapes Aluminium nitride, 10g chloroplatinic acid and 5g cobalt blue.B component includes: the poly dimethyl for the ethenyl blocking that 50g viscosity is 250mPas Siloxanes, 50g viscosity are the dimethyl silicone polymer of 1000mPas ethenyl blocking, 10g multi-vinyl silicone oil, more second Alkenyl silicone oil is methyl blocking, side chain containing vinyl polysiloxane, and 10g alkyl modified silicon oil, the alkyl modified silicon oil is length Alkyl chain length is grafted dimethyl silicone polymer, 10g reactive diluent, and the reactive diluent is single-ended vinyl polysiloxane, 1300g high thermal conductivity compounds inorganic filler, oil factor 5%, wherein (wherein partial size accounts for for 100 μm comprising 1100g ball-aluminium oxide 5%, 70 μm account for 10%, and 30 μm account for 80%, 1 μm account for 5%), the boron nitride that 100g partial size is 40 μm, 100g partial size be 30 μm of spherical shapes Aluminium nitride, 10g containing hydrogen silicone oil (containing hydrogen silicone oil is end hydrogen containing siloxane and side chain hydrogen containing siloxane mixture, Middle-end containing hydrogen silicone oil and side containing hydrogen silicone oil mass ratio 10:1), 2g inhibitor and 3g tackifier (inhibitor and tackifier point It Wei conventionally known inhibitor and tackifier).

After component A in embodiment 3,4 and 5 and B component 1:1 in mass ratio are mixed, carried out after 100 DEG C of solidification 30min Performance test, test result is referring to the following table 1:

1 thermally conductive gel performance test results of table

As can be seen from the table, the existing similar product in market is compared, product of the present invention all has lower viscosity ﹤ 200Pas is lower than existing products in markets 250Pas, is more suitable and automates dispensing, while having better stable storing Property, hypotonic oil；Higher thermal conductivity is more able to satisfy demand of the market to high thermal conductivity product, more soft, elastic, preferably mechanical Performance, electrical property.

Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff is complete Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention Property range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.

Claims (10)

1. a kind of low viscosity high heat conduction organosilicon gel, which is characterized in that the low viscosity high heat conduction organosilicon gel is by component A It is constituted with B component, wherein component A includes following component in parts by mass: 100 parts of vinyl silicone oils, vinyl more than 5 ~ 20 parts Silicone oil, 5 ~ 20 parts of alkyl modified silicon oils, 5 ~ 25 portions of reactive diluents, 500 ~ 2500 parts of high thermal conductivities compound inorganic filler, 1 ~ 10 parts of catalyst and 2 ~ 10 parts of pigment, B component include following component in parts by mass: 100 parts of vinyl silicone oils, 5 ~ 20 Part multi-vinyl silicone oil, 5 ~ 20 parts of alkyl modified silicon oils, 5 ~ 25 portions of reactive diluents, 500 ~ 2500 parts of high thermal conductivities compoundings Inorganic filler, 1 ~ 20 part of containing hydrogen silicone oil, 0.5 ~ 10 part of inhibitor, 0.5 ~ 10 part of tackifier.

2. a kind of low viscosity high heat conduction organosilicon gel according to claim 1, which is characterized in that the vinyl silicone oil For the dimethyl silicone polymer of ethenyl blocking, poly dimethyl-methyl vinyl silicone and polymethyl-benzene base-methyl ethylene At least one of siloxanes, viscosity are 30-1000 mPas.

3. a kind of low viscosity high heat conduction organosilicon gel according to claim 1, which is characterized in that more vinyl silicon Oil is methyl blocking, side chain containing vinyl polysiloxane, and viscosity is 100-2000 mPas, and the alkyl modified silicon oil is length Alkyl chain length is grafted dimethyl silicone polymer, and the reactive diluent is single-ended vinyl polysiloxane.

4. a kind of low viscosity high heat conduction organosilicon gel according to claim 1, which is characterized in that the high thermal conductivity compounding Inorganic filler is aluminium oxide, magnesia, zinc oxide, beryllium oxide, aluminium nitride, boron nitride, silicon nitride, silicon carbide, aluminium hydroxide, two At least two in silica, calcium carbonate and silicates inorganic powder.

5. a kind of low viscosity high heat conduction organosilicon gel according to claim 1, which is characterized in that the high thermal conductivity compounding Inorganic filler is the spherical or spherical conductive particle that particle size is 0.3-100 μm, wherein partial size is 0.3-1 μm and accounts for The 1-5% of total amount, the 60-80% for accounting for total amount that partial size is 3-30 μm, the 1-10% for accounting for total amount that partial size is 50-100 μm.

6. a kind of low viscosity high heat conduction organosilicon gel according to claim 1, which is characterized in that the high thermal conductivity compounding Inorganic filler is modified by long chain alkyl silane coupling agent surface, and oil factor is between 3-10%.

7. a kind of low viscosity high heat conduction organosilicon gel according to claim 1, which is characterized in that the containing hydrogen silicone oil For end hydrogen containing siloxane and side chain hydrogen containing siloxane mixture, middle-end hydrogen containing siloxane and side chain hydrogen containing siloxane Mass ratio be (1-30): 1.

8. a kind of low viscosity high heat conduction organosilicon gel according to claim 1, which is characterized in that the containing hydrogen silicone oil For low viscosity hydrogen containing siloxane, viscosity is 10-150 mPas.

9. a kind of low viscosity high heat conduction organosilicon gel according to claim 1, which is characterized in that the pigment is iron Red, cobalt blue, cadmium yellow or carbon black.

10. based on a kind of preparation method of low viscosity high heat conduction organosilicon gel described in claim 1, which is characterized in that institute State method the following steps are included:

Step 1 semi-finished product premix takes off low, and vinyl silicone oil, multi-vinyl silicone oil, filler are weighed according to the ratio and are added to planet In mixing machine, under the conditions of 120 DEG C of temperature, vacuumizes and be uniformly mixed for use；

Step 2 finished product is prepared, and is cooled to room temperature to semi-finished product, and the unclassified stores for weighing component A and B component respectively according to the ratio is thrown Enter into planetary mixer, vacuumize, stirs；

Step 3 packing, the component A mixed, B component are fitted into 1:1 two-component pipe or bucket.