CN105176092B - A kind of preparation method of epoxy resin composite organic insulation material - Google Patents
A kind of preparation method of epoxy resin composite organic insulation material Download PDFInfo
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- CN105176092B CN105176092B CN201510704834.5A CN201510704834A CN105176092B CN 105176092 B CN105176092 B CN 105176092B CN 201510704834 A CN201510704834 A CN 201510704834A CN 105176092 B CN105176092 B CN 105176092B
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 45
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 44
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 239000002131 composite material Substances 0.000 title claims abstract description 14
- 239000012774 insulation material Substances 0.000 title claims abstract description 10
- 229920002545 silicone oil Polymers 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 239000004088 foaming agent Substances 0.000 claims abstract description 14
- 239000005543 nano-size silicon particle Substances 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- 239000003063 flame retardant Substances 0.000 claims abstract description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 7
- -1 polytetrafluoroethylene Polymers 0.000 claims abstract description 7
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 3
- 238000004364 calculation method Methods 0.000 claims abstract description 3
- 238000009413 insulation Methods 0.000 claims abstract description 3
- 239000010959 steel Substances 0.000 claims abstract description 3
- 238000002156 mixing Methods 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 239000003921 oil Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical group [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 4
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 4
- 235000019399 azodicarbonamide Nutrition 0.000 claims description 4
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical group C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910000077 silane Inorganic materials 0.000 claims description 4
- 239000012745 toughening agent Substances 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000005416 organic matter Substances 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 2
- 238000013019 agitation Methods 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- XLXGCFTYXICXJF-UHFFFAOYSA-N ethylsilicon Chemical compound CC[Si] XLXGCFTYXICXJF-UHFFFAOYSA-N 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 claims description 2
- 229920002521 macromolecule Polymers 0.000 claims description 2
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical class NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000004156 Azodicarbonamide Substances 0.000 claims 1
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical group NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 claims 1
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000004321 preservation Methods 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000010426 asphalt Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 210000004243 sweat Anatomy 0.000 description 2
- 244000187801 Carpobrotus edulis Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of preparation method of epoxy resin composite organic insulation material, including（1）The epoxy resin and organic silicone oil of amount of calculation are weighed, then heats and is uniformly mixed in thermostat；（2）In step（1）Fire retardant, foaming agent, nano silicon and modifying agent are added in the resin system of gained and is uniformly mixed；（3）By step（2）Middle gained hybrid resin system turns to be injected into polytetrafluoroethylene PTFE mould or steel mold, is then transferred into thermostatic expansion in high temperature furnace, then obtain a kind of insulation of epoxy resin composite organic with heat-insulating property and the material of fire resistance by the demoulding.This method can prepare a kind of controllable heat-insulating fireproof material, simple with preparation technology, and can easily be generalized in industrial heat preservation application.
Description
Technical field
The invention belongs to the preparing technical field of epoxy resin composite material, specifically, is related to a kind of epoxy resin and answers
Close the preparation method of organosilicon insulation material.
Background technology
Insulation material has in the production and life of people to play a very important role, and can be used as various instrument, valuables
And the protection materials of precision instrument etc..Foaming thermal-insulating is typically the mixed foaming agent in one or several kinds of basic substances
Prepared after heating expands.Epoxy resin is a kind of basic material being often selected in actual applications, and it is that have height
The extensive use in many fields such as heat resistance, excellent adhesive property and mechanical property.Epoxy resin is by foaming
It can prepare the low expanded material of apparent density, form lightweight and structure is hard, and with more preferable electrical property, insulating properties, resistance to
The performance, Zhang Chun et al. such as corrosion and high temperature resistant（CN 201010242589.8）By filling inorganic nano-particle in the epoxy
Son（Silica and montmorillonite）It is prepared for a kind of epoxy resin composite foam material with preferable expansion character；Yu Yi etc.
People（CN 20101217986.X）Report a kind of method in the foamable epoxy resin composite of room temperature, the sample tool of preparation
The mechanical performance having had.The but intrinsic fragility because of epoxide resin material in itself, it usually needs be added different types of
Material is modified, and the material that this research is considered to prepare can be incubated use in about 200 DEG C and following environment, have selected not
Organic silicone oil with viscosity is modified.Organic silicone oil is a kind of polysiloxane of different polymerization degree chain structure, and it has
There are high heat resistance, high viscosity stability, excellent chemical stability and the excellent corrosive effects to material small
It is generally used for the neck such as electronic apparatus, construction material, petrochemical industry and medical and health, Aeronautical R＆D and military technology etc. performance
Domain.Epoxy resin and organic silicone oil are mixed by way of stirring in preparation process, in order to prevent by sweat layer phenomenon
Generation, with the addition of nano silicon be adjusted enable prepare epoxy resin and organic silicone oil mixing resin system
It is stabilized, and there is good dilatancy and demolding performace.
The content of the invention
The purpose of the present invention is overcome the deficiencies in the prior art, with nano-silicon dioxide modified epoxy resin and organic silicone oil
A kind of stable high temperature system of System forming, there is provided preparation method of epoxy resin organosilicon expansion insulation material.
The technical solution adopted by the present invention is to mix epoxy resin and organic silicone oil, adds nano silicon tree
Resin system is modified, and then adds swelling agent and fire retardant and other types of performance modifier, obtaining one kind can be on 200 DEG C of left side
The method for the epoxy resin composite organic insulation material that right environment uses, specific preparation process are as follows：
（1）Prepare uniform resin system：The epoxy resin and organic silicone oil of amount of calculation are weighed, then in thermostat
Heat and be uniformly mixed；
（2）Prepare well mixed epoxy resin organosilicon material：In above-mentioned steps（1）Added in the resin system of gained
Fire retardant, foaming agent, nano silicon and modifying agent are simultaneously uniformly mixed；
（3）Prepare the epoxy resin silicone body based material of high-temperature molding：By above-mentioned steps（2）Middle gained hybrid resin body
System turns to be injected into polytetrafluoroethylene PTFE mould or steel mold, is then transferred into thermostatic expansion in high temperature furnace, then by de-
Mould obtains a kind of insulation of epoxy resin composite organic with heat-insulating property and the material of fire resistance.
The present invention, the weight of raw and auxiliary material used are：High temperature resistant single component epoxy 10 ~ 40；Organic silicone oil
20 ~ 55 parts；5 ~ 20 parts of fire retardant；0.5 ~ 10 part of foaming agent；0.1 ~ 2 part of nano silicon；Modifying agent is silane coupler 0.1
~ 2 parts and 1 ~ 10 part of toughener.
The present invention, the epoxy resin can use high temperature resistant single component epoxy, can also use the bisphenol-A of general type
Type epoxy resin, glycidyl ether type epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, line
One or several kinds of mixing in type aliphatic category epoxy resin and alicyclic based epoxy resin.When from high temperature resistant one-component
During epoxy resin, the bi-component epoxide-resin curing agent in formula is 0.
The present invention, the organic silicone oil include methyl-silicone oil, ethyl silicon oil, phenyl silicone oil, methyl phenyl silicone oil, methyl second
One or more of mixing in alkenyl silicone oil, ethyl containing hydrogen silicone oil and hydroxyl hydrogen silicone oil, one may be selected in specifically used
Kind or viscosity not of the same race be used in mixed way.
The present invention, the fire retardant are aluminium hydroxide, magnesium hydroxide, non-halogen organic matter NP-300, melamine cyanurate
One or more of mixing in salt MCA and silicon-series five-retardant.
The present invention, the foaming agent are azodicarbonamides（AC foaming agents）, macromolecule tiny balloon（Microballoon foaming agent）
And carbonate foaming agent（Such as calcium carbonate, magnesium carbonate, sodium acid carbonate）In one or more of mixing.
The present invention, the nano silicon are that the granularity that laboratory is prepared by Stober methods is the two of 80 ~ 200 nm
Silicon oxide powder, or the nano grade silica particles of commercialized oleophylic type.
The present invention, the silane coupler are one kind or several in KH-550, KH560, KH-570, KH-580 and KH-620
The mixing of kind；Described toughener is butadiene-styrene rubber, polyamide and Nano-meter CaCO33In one or more of mixing.
The present invention, step（1）Described in thermostat be constant temperature water bath apparatus or oil bath device, control temperature is 75
~ 110 DEG C, constant temperature time is 30 ~ 40 min, and hybrid mode is that mechanical agitation or three-roller stir, wherein churned mechanically speed
It is the rpm of constant speed 200 to spend for 150 ~ 1000 rpm, three-roller.
The present invention, step（3）The temperature of middle constant temperature is 130 ~ 200 DEG C, and constant temperature time is 60 ~ 240 min.
The present invention, due to being modified using the organic silicone oil of different viscosities to epoxy resin, by stirring in preparation process
The mode mixed is mixed epoxy resin and organic silicone oil, in order to prevent by sweat layer phenomenon, with the addition of nanometer two
Silica, which is adjusted, enables the epoxy resin prepared and the resin system of organic silicone oil mixing to be stabilized, and with good
Dilatancy and demolding performace, material prepared therefrom use can be incubated in 200 DEG C and following environment.Its preparation technology letter
It is single, can easily it be generalized in industrial heat preservation application.
Brief description of the drawings
Silica SEM figures prepared by Fig. 1 laboratories；
Fig. 2 prepares the photo of epoxy resin composite organic material；
Fig. 3 prepares the SEM figures of epoxy resin composite organic material；
Fig. 4 prepares the insulating tube photo of epoxy resin composite organic material.
Embodiment
The present invention is explained further below in conjunction with specific embodiment, but embodiment does not limit in any form to invention
Embodiment 1：The g of silicone oil 50 and one-component that weigh 1000 the cst g of High temperature epoxy resinses 80 are placed in container, Gu
It is 80 DEG C to be scheduled in constent temperature heater and adjust temperature, and the speed for adjusting mixer is 300 rpm, and it is equal that 30 min of stirring obtain mixing
Even resin system.Then 10 g azodicarbonamides are weighed（AC foaming agents）, the nanometer that is prepared by Stober methods of laboratory
The g of silica 0.5, the g of aluminium hydroxide 15, non-halogen organic matter（NP-300）15 g, the g of butadiene-styrene rubber 10 and 1 g KH-550
It is separately added into well mixed resin system, after 100 rpm speed stirs, then the high speed by 800 rpm
Mixing, well mixed resin system is transferred in PTFE mould, then mould is placed in the baking oven of temperature controllable, controlled
Expansion temperature processed is 190 DEG C, and control time is 1.2 hours, is then cooled to room temperature with furnace temperature, obtains foamable asphalt mixtures modified by epoxy resin
The insulation material of fat organosilicon, the thermal conductivity factor that the sample of this preparation is obtained by thermal conductivity test is 0.052 W/m*K.Fig. 1
The SEM figures of silica, Fig. 2 are the photos for preparing sample, and Fig. 3 is the SEM figures for preparing small sample, and Fig. 4 is the guarantor for preparing sample
The photo of warm cylinder.
Embodiment 2：Weigh 1000 cst and the g of 12500 cst mixing silicone oil 60（Mass ratio is 2:1）With the height of one-component
The g of temperature epoxy resin 75 is placed in container, and it is 90 DEG C to be fixed in constent temperature heater and adjust temperature, and the speed for adjusting mixer is
250 rpm, 25 min of stirring obtain well mixed resin system.Then 10 g azodicarbonamides are weighed（AC foaming agents）With
The g of nano silicon 1.5, the g of aluminium hydroxide 15, the magnesium hydroxide 15 that 10g sodium acid carbonates, laboratory are prepared by Stober methods
G, the g of the butadiene-styrene rubber 10 and g of polyamide 5, and 1.5 g KH-560 and KH-620 mixture（Mass ratio is 1:1）Point
Do not add in uniform resin system, after 80 rpm speed stirs, then the mixed at high speed 30 by 900 rpm
Min, well mixed resin system is transferred in PTFE mould, then mould is placed in the baking oven of temperature controllable, controlled
Expansion temperature processed is 185 DEG C, and control time is 1.5 hours, is then cooled to room temperature with furnace temperature, obtains foamable asphalt mixtures modified by epoxy resin
The insulation material of fat organosilicon, the thermal conductivity factor that the sample of this preparation is obtained by thermal conductivity test is 0.048W/m*K.
Claims (6)
- A kind of 1. preparation method of epoxy resin composite organic insulation material, it is characterised in that：The weight of raw and auxiliary material used Part matches：High temperature resistant single component epoxy 10 ~ 40；20 ~ 55 parts of organic silicone oil；5 ~ 20 parts of fire retardant；Foaming agent 0.5 ~ 10 Part；0.1 ~ 2 part of nano silicon；Modifying agent is 1 ~ 10 part of 0.1 ~ 2 part of silane coupler and toughener, and its preparation method includes Following steps：（1）Prepare uniform resin system：The epoxy resin and organic silicone oil of amount of calculation are weighed, is then heated in thermostat And be uniformly mixed, wherein, thermostat is constant temperature water bath apparatus or oil bath device, and control temperature is permanent at 75 ~ 110 DEG C The warm time is 30 ~ 40 min, and hybrid mode is that mechanical agitation or three-roller stir, wherein churned mechanically speed be 150 ~ 1000 rpm, three-roller are the rpm of constant speed 200；（2）Prepare well mixed epoxy resin organosilicon material：In above-mentioned steps（1）Added in the resin system of gained fire-retardant Agent, foaming agent, nano silicon and modifying agent are simultaneously uniformly mixed；（3）Prepare the epoxy resin silicone body based material of high-temperature molding：By above-mentioned steps（2）Middle gained hybrid resin system turns It is injected into polytetrafluoroethylene PTFE mould or steel mold, is then transferred into thermostatic expansion in high temperature furnace, then by being stripped To a kind of insulation of epoxy resin composite organic with heat-insulating property and the material of fire resistance, wherein, the temperature of constant temperature It it is 130 ~ 200 DEG C, constant temperature time is 60 ~ 240 min.
- 2. preparation method according to claim 1, it is characterised in that the organic silicone oil includes methyl-silicone oil, ethyl silicon Oil, phenyl silicone oil, methyl phenyl silicone oil, methyl vinyl silicon oil, ethyl containing hydrogen silicone oil and one kind in hydroxyl hydrogen silicone oil or Several mixing, a kind of or viscosity not of the same race it is used in mixed way in specifically used middle selection.
- 3. preparation method according to claim 1, it is characterised in that the fire retardant is aluminium hydroxide, magnesium hydroxide, non- One or more of mixing in halogen organic matter NP-300, melamine cyanurate salt MCA and silicon-series five-retardant.
- 4. preparation method according to claim 1, it is characterised in that the foaming agent is azodicarbonamide, macromolecule One or more of mixing in tiny balloon and carbonate foaming agent.
- 5. preparation method according to claim 1, it is characterised in that the nano silicon is laboratory by Stober The SiO 2 powder that the granularity of method preparation is 80 ~ 200 nm, or the nano-silica powder of commercialized oleophylic type End.
- 6. preparation method according to claim 1, it is characterised in that the silane coupler is KH-550, KH560, KH- 570th, one or more of mixing in KH-580 and KH-620；Described toughener is butadiene-styrene rubber, polyamide and received Rice CaCO3In one or more of mixing.
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106084525A (en) * | 2016-06-27 | 2016-11-09 | 林春梅 | A kind of novel light adiabator and preparation method thereof |
| CN106673581A (en) * | 2016-12-09 | 2017-05-17 | 广西北海浩邦新能源科技有限公司 | Flame retardant heat insulating material |
| CN106673509A (en) * | 2016-12-09 | 2017-05-17 | 广西北海浩邦新能源科技有限公司 | Heat insulating material with good flame retardant property |
| CN107739441A (en) * | 2017-09-30 | 2018-02-27 | 烟台德邦先进硅材料有限公司 | A kind of synthetic method of novel organosilicon modified epoxy |
| CN111908945A (en) * | 2019-05-10 | 2020-11-10 | 南通联鑫新材料科技有限公司 | Lightweight epoxy resin composite board and preparation method thereof |
| CN115073744B (en) * | 2022-06-17 | 2023-12-05 | 中国科学院长春应用化学研究所 | High-cohesiveness silicon rubber and preparation method thereof |
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|---|---|---|---|---|
| CN101319085A (en) * | 2008-07-22 | 2008-12-10 | 上海材料研究所 | Light-high-strength epoxy foam material and preparation method thereof |
| CN102863747A (en) * | 2012-09-25 | 2013-01-09 | 中国工程物理研究院化工材料研究所 | High-temperature-resistance high-strength epoxy foam plastic and preparation method thereof |
| CN103910974A (en) * | 2014-04-22 | 2014-07-09 | 济南大学 | Hollow-microsphere-filled epoxy resin composite foam material and preparation method thereof |
| CN104629361A (en) * | 2015-02-09 | 2015-05-20 | 中国工程物理研究院化工材料研究所 | High-temperature-resistant foamed plastic composition and preparation method thereof |
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2015
- 2015-10-27 CN CN201510704834.5A patent/CN105176092B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101319085A (en) * | 2008-07-22 | 2008-12-10 | 上海材料研究所 | Light-high-strength epoxy foam material and preparation method thereof |
| CN102863747A (en) * | 2012-09-25 | 2013-01-09 | 中国工程物理研究院化工材料研究所 | High-temperature-resistance high-strength epoxy foam plastic and preparation method thereof |
| CN103910974A (en) * | 2014-04-22 | 2014-07-09 | 济南大学 | Hollow-microsphere-filled epoxy resin composite foam material and preparation method thereof |
| CN104629361A (en) * | 2015-02-09 | 2015-05-20 | 中国工程物理研究院化工材料研究所 | High-temperature-resistant foamed plastic composition and preparation method thereof |
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