RU2010125988A - ADHESIVE TAPE AND METHOD FOR ITS MANUFACTURE - Google Patents

ADHESIVE TAPE AND METHOD FOR ITS MANUFACTURE Download PDF

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RU2010125988A
RU2010125988A RU2010125988/05A RU2010125988A RU2010125988A RU 2010125988 A RU2010125988 A RU 2010125988A RU 2010125988/05 A RU2010125988/05 A RU 2010125988/05A RU 2010125988 A RU2010125988 A RU 2010125988A RU 2010125988 A RU2010125988 A RU 2010125988A
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adhesive tape
metals
noble
polymer resin
conductive filler
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RU2010125988/05A
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Russian (ru)
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Хан ДЖЕОНГ (KR)
Хан ДЖЕОНГ
Джеонгван ЧОЙ (KR)
Джеонгван ЧОЙ
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ЗМ Инновейтив Пропертиз Компани (US)
Зм Инновейтив Пропертиз Компани
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Publication of RU2010125988A publication Critical patent/RU2010125988A/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/06Elements
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/02Ingredients treated with inorganic substances
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

1. Клейкая лента, содержащая: ! клейкую полимерную смолу; и ! хлопьевидный проводящий наполнитель, распределенный в клейкой полимерной смоле, ! при этом хлопьевидный проводящий наполнитель электрически и непрерывно размещен в клейкой полимерной смоле в горизонтальных направлениях (х и y направления) и в направлении толщины (z направление). ! 2. Клейкая лента по п.1, которая имеет толщину 10~200 мкм. ! 3. Клейкая лента по п.1, которая имеет поверхностное сопротивление 0,1 Ω/м2 или более. ! 4. Клейкая лента по п.1, которая имеет вертикальное сопротивление 0,001 Ω или более. ! 5. Клейкая лента по п.1, в которой хлопьевидный проводящий наполнитель имеет толщину в диапазоне от 100 нм до 25 мкм. ! 6. Клейкая лента по п.1, которая содержит хлопьевидный проводящий наполнитель в количестве 20-60 мас.%, исходя из общей массы клейкой ленты. ! 7. Клейкая лента по п.1, в которой хлопьевидный проводящий наполнитель выбран из группы, состоящей из: пластинчатых металлов, включая благородные металлы и неблагородные металлы; пластинчатых благородных или неблагородных металлов, покрытых благородным металлом; пластинчатых благородных или неблагородных металлов, покрытых неметаллом; пластинчатых неметаллов, покрытых благородным или неблагородным металлом; пластинчатых проводящих неметаллов; и их смесей. ! 8. Клейкая лента по п.7, в которой благородные металлы включают золото, серебро и платину; неблагородные металлы включают никель, медь, олово и алюминий; пластинчатые благородные металлы или неметаллы, покрытые благородным металлом, включают покрытые серебром медь, никель, алюминий, олово и золото; пластинчатые благородные металлы или неблагородные металлы 1. An adhesive tape containing:! adhesive polymer resin; and! flocculent conductive filler distributed in adhesive polymer resin! wherein the flaky conductive filler is electrically and continuously placed in the adhesive polymer resin in the horizontal directions (x and y directions) and in the thickness direction (z direction). ! 2. The adhesive tape according to claim 1, which has a thickness of 10 ~ 200 μm. ! 3. The adhesive tape according to claim 1, which has a surface resistance of 0.1 Ω / m2 or more. ! 4. The adhesive tape according to claim 1, which has a vertical resistance of 0.001 Ω or more. ! 5. The adhesive tape according to claim 1, in which the flocculent conductive filler has a thickness in the range from 100 nm to 25 μm. ! 6. The adhesive tape according to claim 1, which contains a flocculent conductive filler in an amount of 20-60 wt.%, Based on the total weight of the adhesive tape. ! 7. The adhesive tape according to claim 1, in which the flocculent conductive filler is selected from the group consisting of: plate metals, including noble metals and base metals; lamellar noble or base metals coated with a noble metal; lamellar noble or base metals coated with non-metal; lamellar non-metals coated with a noble or base metal; plate conductive non-metals; and mixtures thereof. ! 8. The adhesive tape according to claim 7, in which the noble metals include gold, silver and platinum; base metals include nickel, copper, tin and aluminum; lamellar noble metals or non-metal coated with a noble metal include silver plated copper, nickel, aluminum, tin and gold; lamellar noble metals or base metals

Claims (20)

1. Клейкая лента, содержащая:1. An adhesive tape containing: клейкую полимерную смолу; иadhesive polymer resin; and хлопьевидный проводящий наполнитель, распределенный в клейкой полимерной смоле,a flocculent conductive filler dispersed in an adhesive polymer resin, при этом хлопьевидный проводящий наполнитель электрически и непрерывно размещен в клейкой полимерной смоле в горизонтальных направлениях (х и y направления) и в направлении толщины (z направление).wherein the flaky conductive filler is electrically and continuously placed in the adhesive polymer resin in the horizontal directions (x and y directions) and in the thickness direction (z direction). 2. Клейкая лента по п.1, которая имеет толщину 10~200 мкм.2. The adhesive tape according to claim 1, which has a thickness of 10 ~ 200 μm. 3. Клейкая лента по п.1, которая имеет поверхностное сопротивление 0,1 Ω/м2 или более.3. The adhesive tape according to claim 1, which has a surface resistance of 0.1 Ω / m 2 or more. 4. Клейкая лента по п.1, которая имеет вертикальное сопротивление 0,001 Ω или более.4. The adhesive tape according to claim 1, which has a vertical resistance of 0.001 Ω or more. 5. Клейкая лента по п.1, в которой хлопьевидный проводящий наполнитель имеет толщину в диапазоне от 100 нм до 25 мкм.5. The adhesive tape according to claim 1, in which the flocculent conductive filler has a thickness in the range from 100 nm to 25 μm. 6. Клейкая лента по п.1, которая содержит хлопьевидный проводящий наполнитель в количестве 20-60 мас.%, исходя из общей массы клейкой ленты.6. The adhesive tape according to claim 1, which contains a flocculent conductive filler in an amount of 20-60 wt.%, Based on the total weight of the adhesive tape. 7. Клейкая лента по п.1, в которой хлопьевидный проводящий наполнитель выбран из группы, состоящей из: пластинчатых металлов, включая благородные металлы и неблагородные металлы; пластинчатых благородных или неблагородных металлов, покрытых благородным металлом; пластинчатых благородных или неблагородных металлов, покрытых неметаллом; пластинчатых неметаллов, покрытых благородным или неблагородным металлом; пластинчатых проводящих неметаллов; и их смесей.7. The adhesive tape according to claim 1, in which the flocculent conductive filler is selected from the group consisting of: plate metals, including noble metals and base metals; lamellar noble or base metals coated with a noble metal; lamellar noble or base metals coated with non-metal; lamellar non-metals coated with a noble or base metal; plate conductive non-metals; and mixtures thereof. 8. Клейкая лента по п.7, в которой благородные металлы включают золото, серебро и платину; неблагородные металлы включают никель, медь, олово и алюминий; пластинчатые благородные металлы или неметаллы, покрытые благородным металлом, включают покрытые серебром медь, никель, алюминий, олово и золото; пластинчатые благородные металлы или неблагородные металлы, покрытые неблагородным металлом, включают покрытые никелем медь и серебро; пластинчатые неметаллы, покрытые благородным металлом или неблагородным металлом включают покрытые серебром или никелем графит, стекло, керамики, пластики, эластомеры и слюду; и пластинчатые проводящие неметаллы включают углеродную сажу и углеродное волокно.8. The adhesive tape according to claim 7, in which the noble metals include gold, silver and platinum; base metals include nickel, copper, tin and aluminum; lamellar noble metals or non-metal coated with a noble metal include silver plated copper, nickel, aluminum, tin and gold; lamellar noble metals or base metals coated with a base metal include nickel plated copper and silver; lamellar non-metals coated with a noble metal or base metal include silver or nickel coated graphite, glass, ceramics, plastics, elastomers and mica; and plate conductive non-metals include carbon black and carbon fiber. 9. Клейкая лента по п.1 которая содержит клейкую полимерную смолу в количестве 40-80 мас.%, исходя из общей массы клейкой ленты.9. The adhesive tape according to claim 1, which contains an adhesive polymer resin in an amount of 40-80 wt.%, Based on the total weight of the adhesive tape. 10. Клейкая лента по п.1, в которой клейкая полимерная смола включает акриловую полимерную смолу.10. The adhesive tape according to claim 1, in which the adhesive polymer resin includes an acrylic polymer resin. 11. Клейкая лента по п.10, в которой акриловая полимерная смола является сополимером алкилакрилатэфирного мономера, содержащего C1-14 алкильную группу, с полярным сополимеризующимся мономером.11. The adhesive tape of claim 10, in which the acrylic polymer resin is a copolymer of an alkyl acrylate ester monomer containing a C 1-14 alkyl group with a polar copolymerizable monomer. 12. Клейкая лента по п.11, в которой соотношение алкилакрилатэфирного мономера и полярного сополимеризующегося мономера составляет 99-50:1-50.12. The adhesive tape of claim 11, wherein the ratio of the alkyl acrylate ester monomer to the polar copolymerizable monomer is 99-50: 1-50. 13. Способ изготовления клейкой ленты, включающий стадии, на которых:13. A method of manufacturing an adhesive tape, comprising the steps of: (i) смешивают мономер с формированием клейкой полимерной смолы с хлопьевидным проводящим наполнителем;(i) mixing the monomer to form a sticky polymer resin with a flocculent conductive filler; (ii) формируют смесь в лист;(ii) form a mixture in a sheet; (iii) размещают фотошаблон на одну сторону или обе стороны листа; и(iii) place the photomask on one side or both sides of the sheet; and (iv) облучают обе стороны листа светом для фотополимеризации мономера таким образом, чтобы сформировать клейкую полимерную смолу,(iv) irradiating both sides of the sheet with light to photopolymerize the monomer so as to form an adhesive polymer resin, при этом фотошаблон имеет рисунок экранирования света, сформированный на нем, а свет излучают на всю или на часть поверхности листа в зависимости от рисунка экранирования света.wherein the photomask has a light shielding pattern formed on it, and the light is emitted on all or part of the sheet surface depending on the light shielding pattern. 14. Способ по п.13, в котором на стадии фотополимеризации, хлопьевидный проводящий наполнитель размещают в горизонтальных направлениях (х и y направления) и в направлении толщины (z направление) в зависимости от конфигурации рисунка экранирования света.14. The method according to item 13, in which at the stage of photopolymerization, a flaky conductive filler is placed in the horizontal directions (x and y directions) and in the thickness direction (z direction) depending on the configuration of the light shielding pattern. 15. Способ по п.13, в котором фотошаблон состоит из пропускающей свет съемной пленки, имеющей рисунок экранирования света, сформированный на ней.15. The method according to item 13, in which the photomask consists of a light-transmitting removable film having a light shielding pattern formed on it. 16. Способ по п.13, в котором рисунок экранирования света, сформированный на фотошаблоне, представляет собой сетчатую структуру или решетчатую структуру.16. The method of claim 13, wherein the light shielding pattern formed on the photomask is a mesh structure or a lattice structure. 17. Способ по п.15, в котором пропускающая свет съемная пленка представляет собой полиэтиленовую пленку, полипропиленовую пленку или полиэтилентерефталатную (PET) пленку.17. The method according to clause 15, in which the light-transmitting removable film is a plastic film, polypropylene film or polyethylene terephthalate (PET) film. 18. Способ по п.13, в котором стадия смешивания мономера для клейкой полимерной смолы с хлопьевидным проводящим наполнителем включает подстадии, на которых:18. The method according to item 13, in which the stage of mixing the monomer for an adhesive polymer resin with a flaky conductive filler includes substages, in which: частично полимеризуют мономер для клейкой полимерной смолы с образованием полимерного сиропа; иpartially polymerizing the monomer for an adhesive polymer resin to form a polymer syrup; and добавляют хлопьевидный проводящий наполнитель к полимерному сиропу и перемешивают смесь.add a flocculent conductive filler to the polymer syrup and mix the mixture. 19. Способ по п.18, в котором полимерный сироп имеет вязкость 500-20000 сП.19. The method according to p, in which the polymer syrup has a viscosity of 500-20000 SP. 20. Способ по п.13, в котором концентрация кислорода при облучении светом составляет менее, чем 1000 ppm. 20. The method according to item 13, in which the concentration of oxygen when irradiated with light is less than 1000 ppm.
RU2010125988/05A 2007-12-21 2008-12-11 ADHESIVE TAPE AND METHOD FOR ITS MANUFACTURE RU2010125988A (en)

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KR1020070135804A KR20090067964A (en) 2007-12-21 2007-12-21 Adhesive tape and method for preparing the same

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JP (1) JP2011508012A (en)
KR (1) KR20090067964A (en)
CN (1) CN101903484A (en)
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KR100608533B1 (en) 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Polymer resin having excellent electroconductivity and manufacturing method thereof
WO2013062836A1 (en) * 2011-10-25 2013-05-02 3M Innovative Properties Company Nonwoven adhesive tapes and articles therefrom
CN110746901A (en) * 2019-11-12 2020-02-04 湖南省和祥润新材料有限公司 Combined type shading adhesive and manufacturing process thereof
RU2724650C1 (en) * 2020-01-22 2020-06-25 ООО "РТ-технологии" Electroconductive materials dispersed in non-conductive organic material
KR102271126B1 (en) * 2020-12-28 2021-07-02 주식회사 스파이더실크 High Thermal Conductivity Heat Dissipation Composite Material And Manufacturing Method Thereof
CN115181505B (en) * 2022-07-12 2024-02-27 东莞市兆科电子材料科技有限公司 Heat conduction gasket and preparation method thereof

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US4731282A (en) * 1983-10-14 1988-03-15 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film
JP2004265729A (en) * 2003-02-28 2004-09-24 Jst Mfg Co Ltd Anisotropic conductive sheet
US7034403B2 (en) * 2003-04-10 2006-04-25 3M Innovative Properties Company Durable electronic assembly with conductive adhesive
JP4385794B2 (en) * 2004-02-26 2009-12-16 ソニーケミカル&インフォメーションデバイス株式会社 Anisotropic conductive connection method
JP4686274B2 (en) * 2005-06-30 2011-05-25 ポリマテック株式会社 Heat dissipation component and manufacturing method thereof

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KR20090067964A (en) 2009-06-25
CN101903484A (en) 2010-12-01
TW200948927A (en) 2009-12-01
CA2709934A1 (en) 2009-07-09
BRPI0821289A2 (en) 2015-06-16
EP2235130A2 (en) 2010-10-06
WO2009085631A3 (en) 2009-08-27
JP2011508012A (en) 2011-03-10
WO2009085631A2 (en) 2009-07-09

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