JP2010080860A - Electromagnetic wave shield material, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield material in which a failure such as disconnection, the poor shape, low adhesiveness of a pattern due to poor transfer of a conductive compound is not generated, and which prevents scattering of light by a prism effect at the foot where a primer layer inclines to reduce a haze value. <P>SOLUTION: The electromagnetic wave shield material has: a transparent base material 1; the primer layer 2 formed on the transparent base material 1; a conductive layer 3 formed by a predetermined pattern on the primer layer 2; and a metal layer 4 formed on the conductive layer 3. Of the primer layer 2, thickness T<SB>A</SB>in a pattern formation part A where the conductive layer 3 is formed is thicker than thickness T<SB>B</SB>in a pattern non-formation part B where the conductive layer 3 is not formed, and the pattern formation part A has a projected cross-sectional form constituted of a first mountain 17 consisting of the primer layer 2 and a second mountain 17 consisting of the conductive layer 3 formed at a part higher than the middle 20 of the first mountain 17. Then, the metal layer 4 is constituted so as to exist at least right above a part of the foot 13 lower than the middle 20 of the first mountain 17. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electromagnetic wave shielding material in which a metal layer is provided on a conductive layer formed in a predetermined pattern to reduce the haze value, and a method for manufacturing the same.

  Examples of display devices (image display devices) such as monitors for televisions and personal computers include cathode ray tube (CRT) display devices, liquid crystal display devices (LCD), plasma display devices (PDP), and electroluminescence (EL) display devices. Are known. Among these display devices, plasma display devices that are attracting attention in the field of large-screen display devices use plasma discharge for light emission. Therefore, unnecessary electromagnetic waves in the 30 MHz to 1 GHz band leak to the outside and other devices ( For example, remote control devices, information processing apparatuses, etc.) may be affected. Therefore, it is common to provide a film-like electromagnetic shielding material for shielding electromagnetic waves that leak from the front side (observer side) of the plasma display panel used in the plasma display device.

  Various electromagnetic shielding materials have been studied so far. For example, in Patent Literature 1, a catalyst paste for electroless plating is silk-screen printed in a mesh pattern on a transparent substrate, and a metal layer is electrolessly plated thereon. An electromagnetic shielding material is proposed. Patent Document 2 discloses that a conductive ink composition is intaglio offset printed on a transfer body in a mesh pattern, the mesh pattern on the transfer body is transferred onto a transparent substrate, and a metal layer is formed on the mesh pattern on the transparent substrate. An electromagnetic shielding material obtained by electroplating is proposed. Patent Document 3 proposes an electromagnetic wave shielding material in which a conductive ink composition is directly intaglio-printed on a transparent substrate in a mesh pattern, and a metal layer is electrolytically plated on the mesh pattern on the transparent substrate. Yes.

  In addition, although the form is different from the electromagnetic shielding material having the conductive mesh pattern, in FIGS. 1 and 2 of Patent Documents 4 and 5, first, the compound 64 is placed in the recess 16 formed on the surface of the drum 10. After filling, the formulation 64 is cured, and then the adhesive material 68 is fed onto the cured formulation 64, and then the adhesive material 68 is sandwiched between the sheets 46 fed thereon, after which the adhesive material 68 And a retroreflective sheet produced by releasing the compound 64 and the adhesive material 68 cured in the plate recess from the plate recess (the reference numerals here are described in the same document). Stuff.) The retroreflective sheet has a structure in which an adhesive material 68 is provided between the base sheet 46 and the convex object, as shown in FIG.

  However, since the electromagnetic wave shielding material described in Patent Document 1 forms a mesh pattern by silk screen printing, which is difficult to form a fine pattern, and forms a metal layer by electroless plating with a slow film formation speed, However, there is a problem that the cost cannot be reduced. The electromagnetic shielding material described in Patent Document 2 forms a mesh pattern by intaglio printing, so that a fine pattern can be formed. However, since an offset method is employed, the transfer body is once transferred from the intaglio to the transfer body. Since the second transfer to the transparent substrate is performed, the intaglio mesh pattern as the original plate may not be faithfully transferred to the transparent substrate.

  Furthermore, the electromagnetic wave shielding materials described in Patent Documents 2 and 3 have untransferred portions or transfer defects inferior in adhesiveness when transferred (also referred to as transfer) from an intaglio to a transfer body or transparent substrate. May occur. Specifically, as shown in FIG. 13 of the present application, when the conductive ink composition 103 is applied on the intaglio plate 101 and then scraped with a doctor blade 102 to fill the concave ink 104 with the conductive ink composition 103, As shown in FIG. 13 (B), the conductive ink composition 103 in the recess 104 after scraping with the doctor blade 102 has a recess 105 at the top. The recess 105 is then formed as shown in FIG. 13C when the transparent base 106 is pressure-bonded onto the intaglio 101 and the conductive ink composition 103 in the recess 104 is transferred onto the transparent base 106. This is a factor that hinders adhesion between the transparent substrate 106 and the conductive ink composition 103. As a result, an untransferred portion of the conductive ink composition is generated on the transparent substrate 106, or a transfer failure inferior in adhesiveness is generated, which causes a decrease in electromagnetic shielding characteristics.

JP 11-170420 A JP 2001-102792 A Japanese Patent Laid-Open No. 11-174174 US Pat. No. 3,811,983 US Pat. No. 3,935,359

  In response to the above problem, the present applicant is an unpublished patent application at present, but a printing plate having a predetermined pattern of recesses filled with an uncured conductive composition, and a transfer target of the conductive composition. The conductive composition is extremely well bonded to one side of the substrate, which is a non-cured primer layer, and is cured from at least the primer layer after the primer layer is cured while maintaining the pressure bonding. We have discovered an epoch-making method that can form a conductive layer pattern that can be transferred and has a high transfer rate. The conductive layer pattern of the obtained electromagnetic wave shielding material has a protruding shape composed of a first peak made of a primer layer and a second peak made of a conductive layer formed above the middle of the first peak. The cross-sectional shape of the conductive composition was such that there were no problems such as pattern disconnection, shape failure, and low adhesion due to poor transfer of the conductive composition. In addition, a metal layer may be provided as necessary.

  In this method, in order to improve the ease of peeling (transferability) of the conductive composition from the intaglio surface, to facilitate the manufacture of the intaglio plate, the pattern forming surface of the obtained electromagnetic wave shielding material is used as another member. In order to prevent air bubbles from remaining when adhering to each other, it is preferable that the cross-sectional shape of the intaglio surface is trapezoidal or conical. However, in this case, the primer layer on which the conductive layer is not formed is exposed at the heel portion gently inclined below the middle of the first mountain, and light is incident on this portion. Then, light is scattered by the prism effect. In particular, when an electromagnetic wave shielding material is provided on the front surface of a display device such as a PDP, image light from the display device such as a PDP is scattered, and a haze value that causes a problem in the display device increases and image characteristics deteriorate. Problem arises.

  The present invention has been made in order to solve these problems, and the object thereof is an electromagnetic wave shielding material that does not cause defects such as pattern disconnection, shape defect, and low adhesion due to poor transfer of the conductive composition. Then, it is providing the electromagnetic wave shielding material which can prevent scattering of the light by the prism effect in the inclined collar part of a primer layer, and can reduce a haze value, and its manufacturing method.

  The electromagnetic wave shielding material of the present invention for solving the above problems comprises a transparent substrate, a primer layer formed on the transparent substrate, and a conductive composition formed in a predetermined pattern on the primer layer. A conductive layer, and a metal layer formed on the conductive layer, and the thickness of the primer layer in the pattern forming portion of the primer layer where the conductive layer is formed is such that the conductive layer is formed. It is thicker than the thickness of the primer layer in the non-pattern forming part, and the pattern forming part consists of a first peak made of the primer layer and the conductive layer formed above the middle of the first peak. It has a projection-like cross-sectional shape composed of a second mountain, and the metal layer is present immediately above at least a part of the buttock below the middle of the first mountain. And

  According to the present invention, in the projecting pattern forming portion composed of the first mountain made of the primer layer and the second mountain made of the conductive layer formed above the middle of the first mountain, Since the metal layer is configured to be present immediately above at least a part of the ridge below the middle of the first mountain, even if light is incident on the ridge, the metal present immediately above the heel The layer acts to prevent light scattering. That is, the gently sloping collar is usually a portion where the primer layer where the conductive layer is not formed is exposed, but a metal layer is intentionally provided at least directly above that portion. In at least a portion where the metal layer is intentionally provided, the metal layer can prevent scattering of light transmitted through the primer layer. As a result, particularly when an electromagnetic wave shielding material is provided on the front surface of a display device such as a PDP, image light from the display device such as a PDP is scattered, resulting in a high haze value that causes a problem in the display device. Can be prevented from decreasing.

  Furthermore, according to this invention, in order to improve the ease of peeling (transferability) from the intaglio surface of the conductive composition, to facilitate the production of the intaglio, and further to provide the pattern forming surface of the obtained electromagnetic shielding material. Based on poor transfer of the conductive composition, it is possible to solve the problems that may occur as a result of the cross-sectional shape of the intaglio surface being trapezoidal or conical to prevent bubbles from remaining when adhering to other members. For electromagnetic shielding materials that do not cause defects such as pattern disconnection, shape defects, and low adhesion, it is effective in that the image characteristics can be improved by reducing the haze value, and light scattering is prevented by the metal layer. It also has the effect of further improving the electromagnetic shielding characteristics.

  A preferable aspect of the electromagnetic wave shielding material of the present invention is configured such that the metal layer is present at least immediately above the entire saddle portion of the first mountain.

  According to the present invention, since the metal layer is present at least directly above the entire ridge portion of the first mountain, the light at the ridge portion is covered by covering all of the ridge portion where light scattering due to the prism effect may occur. Scattering can be prevented. In addition, although it is referred to as “all buttocks” here, since the buttocks are gently inclined parts, how far is the buttocks and where is the flat part (flat part of the pattern non-formation part) Although it cannot be strictly divided, if a part where light scattering due to the prism effect occurs and the haze value becomes substantially high is defined as a collar part, the “total collar part” indicates such a part.

  In a preferred aspect of the electromagnetic wave shielding material of the present invention, the boundary portion between the primer layer and the conductive layer in the pattern forming portion is obtained by mixing (a) a component constituting the primer layer and a component constituting the conductive layer. (B) a region where the primer layer and the conductive layer are arranged in a non-linear manner, and (c) a component contained in the primer layer is present in the conductive composition constituting the conductive layer. The region is configured to be any one or two or more of the regions.

  According to the present invention, since the boundary portion between the primer layer and the conductive layer does not have a simple boundary surface structure, the adhesion between the two layers is improved. This represents a form in which the transfer (transfer) of the conductive composition filled in to the transparent substrate was reliably performed under a high transfer rate.

  An electromagnetic shielding material manufacturing method according to the first aspect of the present invention for solving the above problems is an electromagnetic shielding material manufacturing method in which a conductive layer is formed in a predetermined pattern on one surface of a transparent substrate. A transparent base material preparation step for preparing a transparent base material having a primer layer formed on one side thereof that can maintain fluidity until cured, and a plate-like or cylindrical plate surface in which concave portions are formed in a predetermined pattern After applying a conductive composition capable of forming a conductive layer after curing, filling the conductive composition into the concave portion by scraping the conductive composition adhering to other than the concave portion The primer layer and the conductive composition in the recess are bonded to the primer layer side of the transparent substrate after the transparent substrate preparation step and the concave side of the plate surface after the conductive composition filling step. And a crimping process that adheres without gaps; A primer layer curing step in which the primer layer is cured after the pressure-bonding step, but the conductive composition is not completely cured; and after the primer layer curing step, the transparent substrate and the primer layer are peeled off from the plate surface to form the concave portion. A transfer step of transferring the conductive composition on the primer layer, and after the transfer step, the conductive composition formed in a predetermined pattern on the primer layer is cured to form a conductive layer, Forming a pattern forming portion having a projecting cross-sectional configuration composed of a first peak made of a primer layer and a second peak made of the conductive layer formed above the middle of the first peak; After the conductive composition curing step and the conductive composition curing step, a metal layer is plated on the conductive layer, and the metal layer is formed on at least a part of the buttock below the middle of the first mountain. Directly above A plating step of forming, characterized by having a.

  Moreover, the manufacturing method of the electromagnetic shielding material which concerns on the 2nd aspect of this invention is a manufacturing method of the electromagnetic shielding material by which a conductive layer is formed in one surface of a transparent base material with a predetermined pattern, Comprising: A transparent base material preparing step for preparing a transparent base material on which one primer layer capable of maintaining fluidity is formed, and a plate-like or cylindrical plate surface in which concave portions are formed in a predetermined pattern, and a conductive layer after curing After applying a conductive composition capable of forming a conductive composition, scraping off the conductive composition adhering to other than the inside of the recess, and filling the conductive composition into the recess, and the transparent composition The primer layer side of the transparent base material after the base material preparation step and the concave portion side of the plate surface after the conductive composition filling step are pressure-bonded, and the primer layer and the conductive composition in the concave portion are in close contact with no gap. And after the crimping process A simultaneous curing step of simultaneously curing the primer layer and the conductive composition; and after the simultaneous curing step, the transparent substrate and the primer layer are peeled off from the plate surface, and the conductive composition in the recess is used as the conductive layer. A protrusion-like cross-sectional shape which is composed of a first peak made of the primer layer and a second peak made of the conductive layer formed above the middle of the first peak. A transfer step for forming a pattern forming portion, and after the transfer step, a metal layer is plated on the conductive layer, and the metal layer is directly applied to at least a part of the flange portion below the middle of the first mountain. And a plating step formed on the upper portion.

  According to the first and second aspects of the present invention, the protrusion formed of the first mountain made of the primer layer and the second mountain made of the conductive layer formed above the middle of the first mountain. Forming a pattern-like pattern-forming portion with good transferability (transferability), and further forming a metal layer directly on at least a part of the ridge below the middle of the first mountain, so that the obtained electromagnetic shielding material In this case, even if light is incident on the collar portion, the metal layer located immediately above the same acts to prevent light scattering.

  Further, according to the inventions according to the first and second aspects, the primer layer side of the transparent base material on which the primer layer retaining fluidity is formed and the concave side of the plate surface after the conductive composition filling step are pressure bonded. Therefore, the flowable primer layer is filled in the recess that is likely to be formed on the conductive composition in the recess. As a result, the primer layer adheres to the conductive composition without voids, so that the conductive composition in the recess can be accurately transferred without any untransferred portion on the transparent substrate side. Therefore, it is possible to produce an electromagnetic shielding material that does not cause defects such as disconnection, shape failure, low adhesion due to poor transfer of the conductive composition, and the obtained electromagnetic shielding material has a reduced haze value. The image characteristics can be improved, and the electromagnetic wave shielding characteristics can be further improved.

  According to the electromagnetic wave shielding material and the method for manufacturing the same according to the present invention, even if light is incident on the buttocks below the middle of the first mountain, the metal layer existing immediately above the light acts to prevent light scattering. Therefore, particularly when this electromagnetic shielding material is provided on the front surface of a display device such as a PDP, image light from the display device such as a PDP is scattered, resulting in a high haze value that causes a problem in the display device. The problem can be prevented if the drop occurs.

  Therefore, according to the electromagnetic wave shielding material and the manufacturing method thereof of the present invention, in order to improve the ease of peeling (transferability) of the conductive composition from the intaglio surface, it is further obtained to facilitate the production of the intaglio. In order to prevent residual bubbles when bonding the pattern forming surface of the electromagnetic shielding material to other members, it is possible to solve problems that may arise as a result of making the cross-sectional shape of the intaglio surface trapezoidal or conical, For the electromagnetic shielding material that does not cause defects such as pattern disconnection, shape defect, low adhesion due to poor transfer of the conductive composition, there is an effect in that the image characteristics can be improved by reducing the haze value, In addition, since the metal layer prevents light scattering, the electromagnetic wave shielding characteristics can be further improved.

  Next, embodiments of the present invention will be described in detail, but the present invention is not limited to the following embodiments, and various modifications can be made within the scope of the gist of the present invention.

[Electromagnetic wave shielding material]
FIG. 1 is a schematic plan view showing an example of the electromagnetic wave shielding material of the present invention, and FIG. 2 is an enlarged view of the AA ′ cross section in FIG. FIG. 3 is a schematic cross-sectional view showing an example of a conductive pattern constituting the electromagnetic shielding material of the present invention, and FIGS. 4 and 5 show other conductive patterns constituting the electromagnetic shielding material of the present invention. It is typical sectional drawing which shows an example. In the following, the “conductive layer pattern” means a pattern of the conductive layer 3 provided with good transferability (transfer rate), and the “conductive pattern” means that the metal layer 4 is formed on the conductive layer 3. It refers to the later pattern.

The electromagnetic wave shielding material 10 of the present invention includes a transparent substrate 1, a primer layer 2 formed on the transparent substrate 1, and a conductive layer 3 made of a conductive composition formed in a predetermined pattern on the primer layer 2. And a metal layer 4 formed on the conductive layer 3, and further has a protective layer 9 as shown in FIG. 2 if necessary. The feature of the present invention is that the thickness TA of the primer layer 2 in the pattern forming portion _A where the conductive layer 3 is formed in the primer layer 2 is the same as that in the pattern non-forming portion B where the conductive layer 3 is not formed. greater than the thickness T _B of the primer layer 2, the pattern forming portion a is composed of the first and the mountain 17, the first conductive layer 3 formed above the middle 20 of the mountain 17 consisting of a primer layer 2 It has a projecting cross-sectional shape composed of the second mountain 18, and the metal layer 4 is present directly above at least a part of the collar 13 below the middle 20 of the first mountain 17. There is to be.

  Here, the “predetermined pattern” is a mesh (net or lattice) shape, a stripe (parallel line group or stripe pattern) shape, or a spiral (or spiral) shape that is a general electromagnetic wave shielding pattern of the electromagnetic wave shielding material 10. Or a pattern of line segments. In FIG. 1, reference numeral 7 is an electromagnetic shielding pattern portion located at the center and facing the image display area of the display device, and reference numeral 8 is present at least at a part of the peripheral edge of the electromagnetic shielding pattern portion. It is a grounding part. In the grounding portion 8, the grounding ability is preferably as shown in FIG. 1 so as to surround the entire periphery of the peripheral portion of the electromagnetic wave shielding pattern portion 7. Further, the grounding portion 8 may be formed in a pattern shape having an opening such as a mesh, but more preferably, as shown in FIG. 1, the non-opening (solid) conductive layer (or Conductive layer and metal layer). In the present invention, the grounding portion 8 as shown in FIG. 1 does not have to exist in the peripheral portion, and the whole can be formed into a seamless mesh shape. In this case, continuous formation is possible regardless of the size of the display. Further, the spiral (or spiral) pattern can be used when a spiral coil used for a transmission / reception antenna of an IC tag or a non-contact IC card is entirely covered.

  Hereinafter, the configuration of the present invention will be described in detail.

(Transparent substrate)
The transparent base material 1 is a base material for the electromagnetic wave shielding material 10 and has various thicknesses of various materials in consideration of required transparency such as desired transparency, mechanical strength, adhesiveness with the primer layer 2, and the like. Just choose. The transparent substrate 1 may be a resin substrate or an inorganic substrate such as a glass substrate. Moreover, as thickness form of the transparent base material 1, a film form, a sheet form, or a plate form may be sufficient. Usually, a resin transparent film is preferably used.

  The material constituting the resin base material is preferably a film based on an acrylic resin (here, used as a concept including a so-called methacrylic resin), a polyester resin, or the like, but is not limited thereto. Specific examples of the resin material include cellulose resins such as triacetyl cellulose, diacetyl cellulose, and acetate butyrate cellulose, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), ethylene glycol-terephthalic acid-isophthalic acid copolymer Polymers, polyester resins such as terephthalic acid-ethylene glycol-1,4 cyclohexanedimethanol copolymer, polyester thermoplastic elastomer, polyolefin resins such as polyethylene, polypropylene, polymethylpentene, cyclic polyolefin, polyvinyl chloride, polyvinylidene chloride Halogen-containing resins such as polyether sulfone resin, polyacrylic resin, polyurethane resin, polycarbonate resin, styrene resin such as polystyrene, polyamide Fat, polyimide resins, polysulfone resins, polyether resins, polyether ketone, (meth) acrylonitrile and the like can be used. Among them, the biaxially stretched PET film is preferable in that it has excellent transparency and durability, and has heat resistance that does not cause thermal deformation even when subjected to ultraviolet irradiation treatment or heat treatment in the subsequent steps.

  On the other hand, as inorganic materials constituting the inorganic base material, soda glass, potash glass, lead glass, borosilicate glass, quartz glass, phosphate glass, etc., crystalline quartz (quartz), calcite (calcium carbonate), diamond ( And transparent inorganic crystals such as gold goethite, and transparent ceramics such as PLZT.

  The transparent substrate 1 may be a continuous long belt-like film that can be processed by rolls, tows, or rolls, or may be a sheet film having a predetermined size. Here, the term “roll toe roll” means that a long belt-like base material is supplied in the form of a roll (roll), and the belt-like sheet is unwound from the roll to perform a predetermined process, and thereafter It means a form of use of the film that is wound up, stored and transported again in the form of winding. The thickness of the transparent substrate 1 is usually preferably about 8 μm to 5000 μm, but is not limited thereto. The light transmittance of the transparent substrate 1 is ideally 100% for installation on the front surface of the display device, but it is preferable to select a light transmittance of 80% or more. If necessary, an easy-adhesion layer is provided on the surface of the transparent substrate 1 to improve the adhesion between the primer layer 2 and the transparent substrate 1, which will be described later, or corona discharge treatment, plasma treatment, flame treatment, etc. The surface treatment may be performed. As an easily bonding layer, it comprises from resin which has adhesiveness in both the transparent base material 1 and the primer layer 2. FIG. The resin for the easy adhesion layer is appropriately selected from resins such as urethane resin, epoxy resin, polyester resin, acrylic resin, and chlorinated polypropylene.

(Primer layer)
The primer layer 2 is provided on the transparent substrate 1 with good adhesion. A conductive layer 3 is provided on the primer layer 2 with good adhesion. Therefore, the primer layer 2 is preferably a material having good adhesion to both the transparent substrate 1 and the conductive layer 3 and, of course, is transparent for installation on the front surface of the display device. Is preferred. For example, a layer formed by applying an ionizing radiation curable resin or a thermoplastic resin is preferable. Various additives and modified resins may be used to improve adhesion, durability, and impart various physical properties.

  Examples of the thermoplastic resin include acrylic resins such as polymethyl methacrylate (PMMA), vinyl chloride-vinyl acetate copolymers, polyester resins, and polyolefin resins.

  As the ionizing radiation curable resin, a monomer (monomer) that is polymerized and cured by a reaction such as crosslinking with ionizing radiation, or a prepolymer or an oligomer is used. As the monomer, for example, a radical polymerizable monomer, specifically, 2-ethylhexyl (meth) acrylate, diethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, trimethylolpropane tri (meth) Examples thereof include various (meth) acrylates such as acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, and dipentaerythritol hexa (meth) acrylate. Examples of the prepolymer (or oligomer) include radically polymerizable prepolymers, specifically, urethane (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, triazine (meth) acrylate, and the like. (Meth) acrylate prepolymers, polythiol prepolymers such as trimethylolpropane trithioglycolate, pentaerythritol tetrathioglycolate, and unsaturated polyester prepolymers. Other examples include cationically polymerizable prepolymers such as novolac epoxy resin prepolymers and aromatic vinyl ether resin prepolymers. Here, the notation (meth) acrylate means acrylate or methacrylate.

  These monomers or prepolymers may be used alone or in combination of two or more types of monomers, two or more types of prepolymers, or one type of monomer, depending on the required performance, coating suitability, etc. A mixture of the above and one or more prepolymers can be used.

  As the photopolymerization initiator, in the case of a radically polymerizable monomer or prepolymer, a benzophenone-based, acetophenone-based, thioxanthone-based, benzoin-based compound, etc., or in the case of a cationic polymerization-based monomer or prepolymer, , Metallocene-based, aromatic sulfonium-based and aromatic iodonium-based compounds are used. These photopolymerization initiators are added in an amount of about 0.1 to 5 parts by weight with respect to 100 parts by weight of the composition comprising the monomer and / or prepolymer.

  The ionizing radiation is typically ultraviolet rays or electron beams, but other than these, electromagnetic waves such as visible rays, X-rays and γ rays, or charged particle beams such as α rays can also be used.

  Additives are added as necessary. Examples of the additive include a heat stabilizer, a radical scavenger, a plasticizer, a surfactant, an antistatic agent, an antioxidant, an ultraviolet absorber, an infrared absorber, a dye (colored dye, colored pigment), and an extender pigment. And a light diffusing agent.

  In particular, the present invention is characterized in that the primer layer 2 can maintain two states of a fluidized state and a cured state in a state where the primer layer 2 is pressure-bonded to the plate. As an example, the primer layer 2 is provided on the transparent substrate 1 in a state where the fluidity can be maintained after coating, and then the conductive composition 3 ′ (see FIG. 8) on the primer layer 2. When the film is transferred and formed, it must be able to change from a fluidized state to a cured state in a short time. By forming the primer layer 2 on the transparent substrate 1, when transferring the conductive composition 3 ′ onto the primer layer 2, there is a gap between the conductive composition 3 ′ and the primer layer 2. Therefore, it is possible to eliminate the generation of a gap between the conductive composition 3 ′ and the primer layer 2, which may possibly occur in the past, and transfer defects and adhesion defects due to the existence of the gap. There is no problem.

  As used herein, “fluidity” or “fluid state” refers to a property or state that flows (deforms) by pressure when the primer layer 2 is pressure-bonded to a printing plate filled with a conductive composition, Thus, it is not necessary to have a low viscosity. Further, it is not always necessary to have Newtonian viscosity, and it may have non-Newtonian viscosity such as thixotropic property or dilatancy property. After the primer layer adjusted to a viscosity suitable for coating is applied on the transparent substrate 1, when the primer layer 2 is a thermoplastic resin, it may flow (deform) when it is pressure-bonded to the plate surface. The primer layer 2 only needs to be at a temperature at which it flows (deforms) during pressure bonding. In this case, it may be paraphrased as a softened state.

  The viscosity of the primer layer 2 in a fluidized state is usually in the range of 1 mPa · s to 100,000 mPa · s, and preferably in the range of 50 mPa · s to 2000 mPa · s.

  Such a fluid state of the primer layer 2 can be obtained by simply applying an ionizing radiation curable ink on the transparent substrate 1 when an ionizing radiation curable resin is used as the primer layer resin. The ionizing radiation curable ink is generally composed of monomers and oligomers having ionizing radiation curable properties as described above, and, if necessary, further includes a photopolymerization initiator (in the case of ultraviolet curing or photocuring), various additives, and the like. It is fluid until it is cured with ionizing radiation. This ink may contain a solvent, but in this case, since a drying step is required after coating, the ink is preferably of a type that does not contain a solvent (so-called non-solvent type).

  In addition, when a thermoplastic resin composition is used as the primer layer resin, the thermoplastic resin composition is applied on the transparent substrate 1 and becomes fluid (eg, about 50 ° C. to 200 ° C.). ) Can be generated by heating. If the primer layer 2 in such a fluid state is pressure-bonded to a plate surface filled with a conductive composition as will be described later and then cured and transferred by cooling, the conductive composition 3 ′ and the primer layer 2 are transferred. The transfer can be performed in a state where there is no gap between the two. Here, as a method of applying the thermoplastic resin composition on the transparent substrate 1, there are a method of applying a solution of the thermoplastic resin composition and then drying, and a method of applying a resin in a hot melt state. The thermoplastic resin composition applied on the transparent substrate 1 may be heated before contacting the plate surface filled with the conductive composition, and a heating roll or the like is used when pressure-bonding to the plate surface. However, in any case, when transferring the conductive composition 3 ′ to the primer layer 2, it needs to be cooled to such an extent that the fluidity of the primer layer is lost.

Although not particularly limited thickness of the primer layer 2, usually formed so as to extent in a thickness of 1μm or more 100μm following after curing (numbers were evaluated by the later thickness T _B). In addition, the thickness (T _B ) of the primer layer 2 is usually the sum of the conductive layer 3 and the primer layer 2 (total thickness. In FIG. 3, the top of the conductive layer 3 and the surface of the transparent substrate 1 Of 1% or more and 50% or less). In addition, although it explains in full detail in the description column of a later manufacturing method, after electroconductive composition 3 'is transcribe | transferred on the primer layer 2, and also the electroconductive composition 3' is hardened and manufactured an electromagnetic shielding material. primer layer 2, as shown in FIG. 3, the thickness T _a of the portion a conductive layer 3 is formed is thicker than the thickness T _B of the portion B of the conductive layer 3 is not formed. As will be described in detail in the description of the conductive layer, the conductive layer 3 is formed above the middle part 20 of the thick portion A of the primer layer 2, and the conductive layer 3 is formed from the middle part thereof. The conductive layer 3 wraps around at least a part of the lower part 13 of the lower part 13 (the side of the part B where the primer layer 2 is thin).

  The mountain shape (first mountain 17) of the primer layer 2 shown in FIG. 3 is obtained by placing the primer layer 2 in a fluid state before being cured, provided on one surface S1 of the transparent substrate 1, in the intaglio plate 62. The fluidized state before pressure-bonding to the provided conductive composition 3 ′ (see FIGS. 9A and 9C described later) or curing on the conductive composition 3 ′ provided in the intaglio 62 The primer layer 2 is provided, and the primer layer 2 and the transparent substrate 1 are pressure-bonded. As a result, the primer layer 2 is filled in the recess 6 of the conductive composition 3 ′ without any gap, and then the primer layer 2 is cured. Alternatively, the primer layer 2 and the conductive composition 3 ′ are simultaneously cured, and then the transparent substrate 1 is peeled off, and then the conductive layer 3 composed of the primer layer 2 and the conductive composition 3 ′ on the transparent substrate 1 side. This is caused by the transfer of.

  Specifically, as illustrated in the manufacturing process diagram of FIG. 8 to be described later, the primer layer 2 in a fluid state is provided on the transparent substrate 1, and the primer layer 2 is placed in the recess 64 with the conductive composition 3 ′. The primer layer 2 is cured after being pressure-bonded to the plate surface 63 after filling and filling the recess 6 of the conductive composition 3 ′ with the primer layer 2 without any gap. The plate surface 63 is scraped off by the doctor blade 21 or a wiping roll other than the conductive composition 3 ′ other than in the concave portion 64, and at that time, on the upper portion of the conductive composition 3 ′ in the concave portion 64, The dent 6 is likely to be generated, and the primer layer 2 having the dent 6 is pressure-bonded to the plate surface 63 so that the fluid primer layer 2 flows into the dent 6 and is filled. 3 forms a first mountain 17 as shown in FIG.

(Conductive layer)
The conductive layer 3 is provided on the primer layer 2 in a predetermined electromagnetic shielding pattern such as a mesh or stripe. The conductive composition for forming the conductive layer 3 is not particularly limited as long as it is finally a conductive layer after various steps. The electromagnetic shielding pattern may be a mesh shape or a stripe shape that is usually employed for the electromagnetic wave shielding material, and the line width and the pitch between the lines may be dimensions that are usually employed. For example, the line width can be 5 μm or more and 50 μm or less, and the line-to-line pitch can be 100 μm or more and 500 μm or less. The aperture ratio (ratio occupied by the total area of the openings in the total area of the electromagnetic shielding pattern) is usually about 50% to 95%. In addition to the electromagnetic shielding pattern of mesh or stripe shape, as shown in FIG. 1, there may be a grounding pattern such as a frame-like all-solid (non-opening portion) layer adjacent to it while maintaining electrical continuity therewith.

  The conductive composition is not particularly limited as long as it has fluidity at the time of filling in the recesses of the plate, and is formed into a desired pattern and exhibits desired conductivity after being cured. Various materials and forms can be used. A typical example is an ink or paste-like material having fluidity containing a conductive powder and a resin, and further containing a solvent or a dispersant for dissolving or dispersing the resin as necessary. The conductive layer 3 made of this conductive composition is a coating film made of a solid after the conductive composition is dried or cured. The reason why the conductive composition is dissolved or dispersed is that the conductive composition includes a colloidal form as well as a solution form.

  For example, as described later, the viscosity of the conductive composition is such that the primer component in the primer layer 2 penetrates into the conductive composition to increase the viscosity, or the primer layer 2 and the conductive composition are simultaneously cured. However, it is generally impossible to say the magnitude of the preferred viscosity in relation to the production process, but the usable range is usually in the range of 100 mPa · s to 1000000 mPa · s, preferably It is in the range of several thousand mPa · s to tens of thousands mPa · s.

  As the binder resin constituting the conductive composition, any of thermosetting resins, ionizing radiation curable resins, and thermoplastic resins can be used. Examples of the thermosetting resin include resins such as melamine resin, polyester-melamine resin, epoxy-melamine resin, polyimide resin, thermosetting acrylic resin, thermosetting polyurethane resin, phenol resin, and thermosetting polyester resin. Examples of the ionizing radiation curable resin include those described above as the material for the primer layer. Examples of the thermoplastic resin include resins such as a polyester resin, a polyvinyl butyral resin, an acrylic resin, and a thermoplastic polyurethane resin. Can be mentioned. These resins may be used alone, or a plurality of resins may be mixed and used. In addition, when using a thermosetting resin, you may add a curing catalyst as needed. When using an ionizing radiation curable resin such as a photocurable resin, a polymerization initiator may be added as necessary.

  Further, in order to obtain fluidity suitable for filling the concave portion of the plate, these resins are usually used as a varnish dissolved in a solvent. There is no restriction | limiting in particular in the kind of solvent, The solvent generally used for printing ink can be used. For example, acetone, methyl ethyl ketone, methyl isobutyl ketone, ketones such as cyclohexanone and cyclopentanone, ethers such as methyl ether and ethyl ether, ethyl acetate, methyl acetate butyl butyrate, diethylene glycol-n-butyl ether acetate, ethylene glycol monobutyl ether acetate Esters such as, aliphatic hydrocarbons such as pentane, hexane and octane, aromatic hydrocarbons such as benzene, toluene and xylene, alcohols such as methyl alcohol, ethyl alcohol, propyl alcohol, isopropyl alcohol, butyl alcohol and terpineol 1 type or 2 types or more suitably selected from the class, water, etc. are used. The content of the solvent is usually about 10% by weight or more and 70% by weight or less, but is preferably as small as possible within a range where necessary fluidity can be obtained. In addition, when an ionizing radiation curable resin such as a photo-curable resin is used, a solvent is not necessarily required because it originally has fluidity.

  In addition, examples of the conductive powder constituting the conductive composition include low resistivity metal powders such as gold, silver, platinum, copper, tin, palladium, nickel, and aluminum, and materials other than low resistivity metals as core particles. The surface of the powder (metal powder other than the above low resistivity metal, resin powder such as acrylic resin and melamine resin, inorganic powder such as silica, alumina, barium sulfate, zeolite, etc.) is coated with a low amount of gold or silver as a coating material. Preferable examples include powder obtained by plating a resistivity metal, and powder of conductive carbon such as graphite and carbon black. Also, conductive ceramics or conductive organic polymer powders can be used. The shape can also be selected from a spherical shape, a spheroid shape, a polyhedron shape, a scale shape, a disk shape, a fiber shape (or needle shape), and the like. These materials and shapes may be appropriately mixed and used. Since the size of the conductive powder is arbitrarily selected according to the type, it cannot be specified unconditionally. For example, in the case of scale-like silver powder, the average particle size of the powder is about 0.1 μm to 10 μm In the case of carbon black powder, an average particle size of 0.01 μm or more and 1 μm or less can be used.

  The content of the conductive powder in the conductive composition is arbitrarily selected according to the conductivity of the conductive powder and the form of the powder. For example, among the 100 parts by weight of the solid content of the conductive composition, the conductive powder The powder can be contained in the range of 40 to 99 parts by weight. In the present application, the average particle diameter refers to a value measured by a particle size distribution meter or TEM observation. In the case of an aspherical shape such as a polyhedron shape or a fiber shape, the particle size is usually defined by the diameter of the circumscribed sphere, the diagonal length, or the side length of the longest side.

Further, an appropriate additive may be added to the conductive composition for the purpose of improving the quality. For example, carbon black is not necessary because it is black in itself, but by adding a predetermined amount of black pigment or black dye as necessary, the contrast when an electromagnetic wave shield panel is constructed is improved and visibility is improved. Can be made. Further, in order to prevent reflection on the back surface of the transparent substrate due to the metallic luster of the metal plating layer, which will be described later, and to suppress color unevenness, metal color, etc., it is desirable to contain such a black pigment or black dye. Examples of black pigments include carbon black, Fe ₃ O ₄ , CuO—Cr ₂ O ₃ , CuO—Fe ₃ O ₄ —Mn ₂ O ₃ , and CoO—Fe ₂ O ₃ —Cr ₂ O ₃ that also function as conductive powder. The type and shape are not particularly limited, and a black pigment or black dye having a large coloring power with an average particle diameter of 0.1 μm or less that can be easily dispersed in the binder resin is preferable. In addition, when using carbon black, carbon black for coloring materials such as channel black, furnace black or lamp black, conductive carbon black, acetylene black and the like can be mentioned, and among them, the average particle diameter is 20 nm or less. Is preferably used. As the black dye, a dye such as aniline black can be used. Also, in order to improve the fluidity and stability of the conductive composition, as long as the conductivity and adhesion to the primer layer are not adversely affected, fillers, thickeners, surfactants, antioxidants are appropriately used. Etc. may be added.

  The thickness of the conductive layer 3 will be described in detail in the description section of the conductive pattern. Usually, the resistance value of the conductive layer 3 and the electromagnetic wave shielding performance and the adhesion suitability of other members on the conductive layer 3 are described. From the balance, in the measurement at the central portion (the top of the projection pattern), it is usually 2 μm or more and 50 μm or less, preferably 5 μm or more and 20 μm or less.

  As illustrated in FIG. 8 to be described later, the conductive layer 3 is first formed on the plate-like or cylindrical plate surface 63 in which the concave portions 64 are formed in a predetermined mesh or stripe pattern, etc. After applying ', the conductive composition 3' adhering outside the concave portion 64 is scraped off by the doctor blade 21 or the like to fill the concave portion 64 with the conductive composition 3 '. Next, the transparent base material 1 in which the primer layer 2 retaining fluidity is formed on one surface S1 is prepared, and the primer layer 2 side of the transparent base material 1 and the conductive composition 3 ′ are placed in the recess 64. By crimping the filled plate surface 63, the primer layer 2 is also filled in the recess 6 of the conductive composition 3 ′, and the conductive composition 3 ′ and the primer layer 2 are brought into close contact with each other without any gap. After eliminating (curing) the fluidity of the primer layer 2, the conductive composition 3 ′ is transferred to the transparent substrate 1 side together with the primer layer 2, and has a predetermined mesh or stripe pattern. Form composition 3 ′. The conductive composition 3 ′ may be transferred onto the primer layer 2 and then subjected to a curing process (for example, a drying process, an ultraviolet / electron beam irradiation process, a heating process, or a cooling process). A curing process may be performed at the same time, and the conductive layer 3 is formed.

  In the present invention, as described above, when the excess conductive composition other than the inside of the recess is scraped off by a doctor blade, a wiping roll, or the like, in the recess 6 formed at the top of the conductive composition in the recess, The primer layer 2 is filled with the fluidity-preserving primer layer 2 and the conductive composition and the primer layer 2 are in close contact with each other without any gaps. Therefore, the conductive composition is transferred onto the primer layer 2 without defective transfer. can do.

  In the above, what was mainly comprised with electroconductive powder and resin was demonstrated as an electroconductive composition. Such a conductive composition itself becomes the conductive layer 3, but other conductive compositions may be applied in the present invention. For example, a sol (dispersion) of an organometallic compound is used as a conductive composition, for example, heated and solidified before and after the transfer step, and further baked as necessary to form a conductive layer 3 made of a conductive metal or metal compound. Also good. Further, for example, a known conductive resin such as polythiophene may be used as the conductive composition, and the conductive layer 3 itself may be used.

(Metal layer)
The metal layer 4 is formed as an essential component on the conductive layer 3 and constitutes the conductive pattern 22 together with the conductive layer 3. The metal layer 4 has an advantage that when the conductivity of the conductive layer 3 is insufficient, the conductivity as the conductive pattern 22 can be increased and the electromagnetic wave shielding characteristics can be improved. The metal layer 4 is formed on the conductive layer 3 by plating. Plating methods include electrolytic (electrical) plating and electroless plating. Electrolytic plating can increase the plating rate several times by increasing the amount of current compared to electroless plating, and productivity Can be remarkably improved.

  In the case of electrolytic plating, power is supplied to the conductive layer 3 from an electrode such as a current-carrying roll that is in contact with the surface on which the conductive layer 3 is formed. Therefore, electrolytic plating can be performed without any problem. Examples of the material constituting the metal layer 4 include copper, silver, gold, chromium, nickel, and tin, which are highly conductive and can be easily plated. Since the metal layer 4 generally has a volume resistivity smaller than that of the conductive layer 3 by one digit or more, the amount of necessary conductive material can be reduced as compared with the case where the conductive layer alone secures electromagnetic wave shielding properties. .

  After the metal layer 4 is formed, the metal layer 4 may be blackened, the surface roughened, or a protective layer 9 as shown in FIG. 2 may be provided as necessary. . Examples of the blackening treatment include blackening nickel plating and copper-cobalt alloy plating, and the protective layer 9 can be formed using, for example, an acrylic ionizing radiation curable resin. Usually, the protective layer 9 is formed to fill the unevenness of the conductive layer 3 and flatten the surface.

(Conductive pattern form)
Next, the form of the conductive pattern which is a feature of the present invention will be described. First, the form of the conductive pattern 22 (22A to 22C) shown in FIGS. 3 to 5 will be described, and then the conductive layer pattern 19 (19A to 19D) constituting the conductive pattern 22 will be described with reference to FIGS. I will explain.

  As shown in FIGS. 3 to 5, the conductive pattern 22 of the electromagnetic wave shielding material 10 according to the present invention includes a first pattern layer A in which the conductive layer 3 of the primer layer 2 is formed. The projection 17 has a projecting cross-sectional shape composed of a mountain 17 and a second mountain 18 made of the conductive layer 3 formed above the middle 20 of the first mountain 17. The metal layer 4 provided in is located in the upper part of at least a part of the flange 13 below the middle 20 of the first mountain 17. Here, the “middle 20” means the pattern forming portion A in which the conductive layer 3 is formed on the slope of the first peak 17 (primer layer 2) where the second peak 18 made of the conductive layer 3 is provided. And the non-patterned portion B where the conductive layer 3 is not formed. The “ridge 13” is a first portion where the second peak 18 made of the conductive layer 3 is not provided. It points to the slope of the mountain 17 (primer layer 2), and “directly above” means that it is directly above the corresponding saddle at the top and bottom of the drawing when FIGS. . 3-5, the code | symbol 23 points out the flat part, and is the area | region where the collar part 13 of the 1st peak 17 which consists of a primer layer 2 was finished.

  According to the form shown in FIGS. 3 to 5, even if light enters the flange portion 13 from the transparent base material 1 side, the metal layer 4 existing immediately above the same acts to prevent light scattering. That is, the gently sloping collar portion 13 is usually a portion where the primer layer 2 on which the conductive layer 3 is not formed is exposed, but in the present invention, at least a part directly above that portion (the collar portion 13). Since the metal layer 4 is intentionally provided, at least in the part where the metal layer 4 is intentionally provided, the metal layer 4 scatters the light transmitted through the primer layer 2 from the transparent substrate 1 side. Will stop. As a result, when the electromagnetic wave shielding material 10 formed with such a conductive pattern 22 is provided on the front surface of a display device such as a PDP, image light from the display device such as a PDP is scattered, causing a problem in the display device. When the haze value becomes high and the image characteristics deteriorate, the problem can be prevented.

  In the conductive pattern 22 </ b> A shown in FIG. 3, the metal layer 4 is present immediately above all the regions (also referred to as all the ridges 13) of the ridge 13 of the first peak 17. When the metal layer 4 is formed by electrolytic plating, the metal layer 4 is formed on the conductive layer 3 through which electricity flows, and therefore the metal layer 4 is formed only on the first peak 17. . However, when the thickness of the metal layer 4 is increased by increasing the time of electrolytic plating or increasing the current density, the metal layer 4 is located below the middle 20 as shown in FIG. It grows so that it may extend to the collar part 13, and as a result, all the upper parts of the collar part 13 to the flat part 23 can be covered. Electrolytic plating conditions for covering the immediate upper portion of the entire collar portion 13 are set according to various conditions such as the length of the collar portion 13 of the first peak 17 and the type of plating material.

  In the form shown in FIG. 3, the metal layer 4 is present immediately above the entire brim portion 13 of the first peak 17, and therefore, by covering all the brim portions 13 that may cause light scattering due to the prism effect, Light scattering at the portion 13 can be prevented. In addition, although it is set as "the whole collar part" here, since the collar part 13 is a part which inclines gently, how far is the collar part 13 and where is a flat part (flat part of the pattern non-formation part B). Although it cannot be strictly divided, if the portion where the haze value is substantially increased due to light scattering due to the prism effect is defined as the collar portion 13, the “entire collar portion” refers to such a portion. .

  In the conductive pattern 22 </ b> B shown in FIG. 4, the metal layer 4 is present immediately above a part of the flange 13 of the first peak 17. Even when the electrolytic plating time is short or the current density is not so high and the thickness of the metal layer 4 is thin, the metal layer 4 is formed from the pattern forming portion A to the pattern non-forming portion B as shown in FIG. It is formed so as to protrude to the side. In this case, the protruding metal layer 4 covers the upper part of some of the flanges 13, and in the portion where the metal layer 4 protrudes, the scattering of the light transmitted through the primer layer 2 is limited. Can be blocked.

  In the conductive pattern 22 </ b> C shown in FIG. 5, the metal layer 4 covers all the flanges 13 of the first peak 17 and further reaches the flat part 23. When the electroplating time is increased or the current density is increased to increase the thickness of the metal layer 4, the metal layer 4 extends further to the flat portion 23 side than the mode shown in FIG. May cover. Even in such a case, as described with reference to FIG. 3, it is possible to cover all the upper portions of the flange portion 13, so that scattering of light transmitted through the primer layer 2 can be prevented.

  Although not illustrated, due to the influence of the shape of the recess filled with the conductive composition 3 ′, the flange 13 and the flat portion 23 of the first peak 17 constituting the transferred (transferred) conductive layer pattern 19 are formed. Some of them may be recessed. Even when such a dent exists, in order to prevent the light transmitted through the primer layer 2 from being scattered, it is preferable to extend the metal layer 4 so as to reach the dent.

  The metal layer 4 is the primer layer 2 when the middle 20 is used as a boundary between the pattern forming portion A where the conductive layer 3 is formed and the pattern non-forming portion B where the conductive layer 3 is not provided. It is most preferable that all the collars 13 that scatter the light that has passed through are provided, but at least 1 μm or more in the horizontal coordinate axis is provided from the middle 20 to the collar 13 side. Preferably, it is more preferably 2 μm or more. By providing the metal layer 4 with such dimensions, the light scattered immediately below it can be blocked at that limit. In addition, although an upper limit is the length which can cover all the collar parts 13 which the light which permeate | transmitted the primer layer 2 scatters, what reached the flat part 23 beyond the collar parts 13 may be sufficient. .

  Next, the conductive layer pattern 19 serving as the base of the conductive pattern 22 described above will be described. The conductive layer pattern 19 is a pattern form of the conductive layer 3 formed in a predetermined pattern on the primer layer 2. 6 and 7 are schematic cross-sectional views showing first to fourth forms of the conductive layer pattern 19 (19A to 19D).

The conductive layer pattern 19 includes a primer layer 2 and a conductive layer 3 made of a conductive composition 3 ′ formed in a predetermined pattern on the primer layer 2. In any of the conductive layer patterns 19A to 19D shown in FIGS. 6 and 7, the thickness TA of the primer layer 2 in the pattern forming portion _A where the conductive layer 3 is formed is the same as that in which the conductive layer 3 is formed. It is thicker than the primer layer 2 thickness T _B of the pattern without non-formation part B.

  Such a form has the effect derived from the form that the adhesiveness of the primer layer 2 and the conductive layer 3 is excellent compared with the case where the conductive layer 3 is formed on the primer layer 2 which consists of a flat surface. In addition, such a form is caused by the manufacturing method as described above, and when the conductive composition other than the inside of the concave portion is scraped off by a doctor blade or a wiping roll on the plate surface, the concave portion A recess 6 is likely to be formed on the upper portion of the conductive composition in the inside, and the primer layer 2 having fluidity is filled in the recess 6 by press-bonding the primer layer 2 to the plate surface with the recess 6. This is caused by peeling after curing. Each conductive layer pattern 19 can provide an electromagnetic wave shielding material in which the primer layer 2 is in close contact with the conductive layer 3 without a gap, and problems such as disconnection, shape failure, and low adhesion due to poor transfer of the conductive layer 3 do not occur.

In the structure composed of “T _A > T _B ”, the primer layer 2 is also present in the pattern non-formed part B and / or the conductive composition 3 constituting the conductive layer 3 in the pattern non-formed part B 'Is virtually non-existent. Due to the former “the presence of the primer layer 2 also in the non-pattern forming part B”, for example, the conductive composition 3 ′ is surely transferred to the transparent substrate 1 together with the primer layer 2 during the transfer step described later. That is, when the transparent base material 1 and the primer layer 2 are peeled off from the printing plate during the transfer process, the conductive composition 3 ′ filled in the concave portion of the printing plate becomes “peeling resistance”, and its conductivity The composition 3 ′ is peeled off from the transparent substrate 1 together with the primer layer 2, and tries to remain in the recess. However, in the present invention, the primer layer 2 of the pattern formation part A and the primer layer 2 of the pattern non-formation part B are continuously provided on the transparent substrate 1 although the thickness is different. The conductive layer pattern 19 composed of the conductive composition 3 ′ and the primer layer 2 can be peeled off from the concave portion and transferred satisfactorily against “resistance”.

  In the above transfer process, (1) the adhesive force between the concave portion of the plate surface and the conductive composition 3 ′ is F1, and (2) the adhesive force between the conductive composition 3 ′ and the primer layer 2 is F2. (3) When the adhesion force between the primer layer 2 and the transparent substrate 1 is F3, it is preferable that the adhesion force F1 is the smallest among the adhesion forces F1 to F3 in order to improve transferability. As a condition, the constituent material of the electromagnetic wave shielding material of the present invention normally satisfies the condition unless the inner surface of the concave portion is subjected to anchor processing (for example, processing such as forming fine irregularities). For example, when an inorganic base material such as a glass base material used as the transparent base material 1 is used, the size of the adhesion forces F1 and F3 among the adhesion forces F1 to F3 is a problem. Even so, F1 is often the smallest among the adhesion forces F1 to F3. In order to satisfy such preferable conditions, the surface of the transparent substrate 1 may be treated as necessary to improve the adhesion with the primer layer 2. In addition, although the magnitude | size of said F1-F3 can be mentioned as one of preferable conditions when improving transferability, the conditions are not necessarily essential conditions.

  In addition, when the latter “the conductive composition 3 ′ constituting the conductive layer 3 is not substantially present in the pattern non-formed portion B”, for example, when an electromagnetic wave shielding material is disposed and used on the front surface of the display device, Further, it is possible to ensure the transparency of the opening portion which is the pattern non-forming portion B, and it is possible to ensure the brightness and contrast of the display image. Here, “substantially no conductive composition 3 ′” includes the case where the conductive composition 3 ′ is not present at all, and even if it is present to some extent, as described above. It means that the brightness, contrast, etc. of the display image can be ensured, and the presence of the conductive composition 3 ′ is allowed to such an extent that the metal layer 4 does not spread by electrolytic plating and does not cause a problem even if it is deposited by electroless plating. is doing. When the conductive composition 3 ′ is acceptable, there are a state where the conductive composition 3 ′ is present with a slightly wide coverage and a state where the conductive composition 3 ′ is present sparsely. As the allowable degree, for example, the thickness of the conductive layer 3 made of the conductive composition 3 ′, the coverage of the conductive composition 3 ′ in the pattern non-formed part B, the transmittance of the pattern non-formed part B, etc. Can be mentioned. Among these, although the thickness of the conductive layer 3 made of the conductive composition 3 ′ varies depending on the type of the conductive composition 3 ′, for example, 0.3 μm or less or the conductive composition 3 ′ is opaque. In the case where such particles are included, the thickness is preferably equal to or smaller than the average particle diameter of the particles. It is unlikely to reduce the sheath or contrast. Further, the coverage of the conductive composition 3 ′ in the pattern non-formation part B varies depending on the type of the conductive composition 3 ′. For example, when the conductive composition 3 ′ is opaque, no pattern is formed. It is preferable that the area is 10% or less with respect to the opening area of the part B. If the area is less than the ratio, it is unlikely that the light transmittance of the pattern non-formation part B is lowered, and the brightness and contrast of the display image It is difficult to think of lowering etc. Moreover, if it specifies with the transmittance | permeability of the pattern non-formation part B, it will be 90% or more about conductive composition 3 'when the time when the conductive composition 3' does not exist in the pattern non-formation part B is set to 100%. May exist in the non-pattern-forming portion B, and it is difficult to reduce the brightness and contrast of the display image. These allowable ranges are not necessarily limited to the above-mentioned values because they vary depending on the design as the electromagnetic wave shielding material (target specifications and properties of other combined members).

  As described above, in the electromagnetic wave shielding material of the present invention, the primer layer 2 is also present in the pattern non-formed part B and / or the conductive composition constituting the conductive layer 3 in the pattern non-formed part B. It is preferable that the product 3 ′ is substantially absent, and it is particularly preferable that both of them are requirements.

  The four forms shown in FIGS. 6 and 7 show further characteristics of the conductive layer pattern having the above-described characteristics, and are forms in which the conductive layer pattern shown in FIG. The conductive layer pattern 19 of the first to fourth embodiments has a bell-shaped conductive layer pattern 19 because the shape-forming mold for forming the conductive layer pattern is a bell-shaped. Yes, it is not limited to these shapes.

  As shown in FIG. 6A, the conductive layer pattern 19A of the first form is a form in which the boundary portion 12 between the primer layer 2 and the conductive layer 3 is in a non-linear manner. In this embodiment, the boundary portion 12 may be configured to be an interface between the resin constituting the primer layer 2 and the resin or filler constituting the conductive layer 3. The “filler” in this case is an arbitrary powder and may be a conductive powder or a non-conductive powder. For example, when the conductive composition is composed of a conductive powder and a binder resin, the conductive powder in the conductive layer 3, the binder resin, and the resin constituting the primer layer 2 are complicated at the interface. It is formed in a non-linear manner. The degree of intricacy at this time is affected by the shape and size of the conductive powder. For example, when the conductive composition does not contain a filler and contains a conductive resin or a conductive compound, the primer layer 2 and the conductive layer 3 are caused by pressure or the like when the primer layer 2 is pressure-bonded in the recess. It is in the form where the boundary part is complicated. In the conductive layer pattern 19 </ b> A of the first form, the intricate boundary portion 12 as a whole (as an envelope shape) has a mountain-shaped cross-sectional shape with a high center and constitutes the first mountain 17.

  The conductive layer pattern 19A of the first form has good adhesion even if the conductive layer 3 is formed on the primer layer 2 composed of the first peak 17 which is not a flat surface in the first place. Thus, since the boundary portion 12 is in a non-linear manner, the adhesion between the primer layer 2 and the conductive layer 3 is remarkably high due to the so-called anchoring effect. Further, when the conductive layer pattern 19A is formed, the conductive composition filled in the plate recess is transferred to the primer layer 2 with a very high transfer rate (almost 100%). ing.

  As shown in FIG. 6 (B), the conductive layer pattern 19B of the second form has a primer component contained in the primer layer 2 and a conductive composition 3 ′ at the boundary portion 12 between the primer layer 2 and the conductive layer 3. The area | region 14 with which the component which comprises is mixed exists. In FIG. 6B, the boundary portion 12 is clearly represented as a line. However, in the actual mixed region 14, such a boundary line does not appear clearly, and an unclear and ambiguous boundary portion appears. Further, in FIG. 6B, the mixed region 14 exists so as to sandwich the boundary portion 12 up and down. In this case, a primer component (for example, a solvent) in the primer layer 2 and an arbitrary component (for example, a monomer component) in the conductive layer 3 penetrate into each other. Note that the mixed region 14 may exist only on the upper side or the lower side of the boundary portion 12. As a case where the mixed region 14 exists only above the boundary portion 12, the primer component in the primer layer 2 enters the conductive layer 3, and any component in the conductive layer 3 does not enter the primer layer 2. On the other hand, when the mixed region 14 exists only below the boundary portion 12, any component in the conductive layer 3 penetrates into the primer layer 2, and the primer component in the primer layer 2 becomes the conductive layer. This is a case where it does not enter 3. The thickness of the mixed region 14 (the thickness in the vertical direction in FIG. 6B) is not particularly limited.

  Even in the case where the conductive layer pattern 19B of the second form is formed on the primer layer 2 composed of the first peak 17 which is not a flat surface as in the case of the first form, the adhesiveness can be obtained. In addition, since the mixed region 14 is provided in the boundary portion 12 as described above, the adhesion between the primer layer 2 and the conductive layer 3 is remarkably enhanced. Furthermore, when forming the conductive layer pattern 19B, the conductive composition filled in the plate recess is transferred to the primer layer 2 with a very high transfer rate (almost 100%). ing.

  The conductive layer pattern 19C of the third form is a form in which the primer component 16 included in the primer layer 2 is present in the conductive composition constituting the conductive layer 3, as shown in FIG. 7A. . FIG. 7A schematically shows a mode in which the primer component 16 is large at the boundary portion 12 and decreases toward the top, but is not particularly limited to this mode. In short, the primer component 16 is electrically conductive. It only has to exist in the layer 3. The primer component 16 may penetrate into the conductive layer 3 to the extent that it is detected from the top of the conductive layer 3, or may be detected in the vicinity of the boundary portion 12. In the third embodiment, particularly when the region where the primer component 16 is present in the conductive layer is localized in the vicinity of the boundary portion 12, the mixed region 14 is located above the boundary portion 12 in the second embodiment. It can be said that it corresponds to a form that exists only in

  Similarly to the case of the first and second embodiments, the conductive layer pattern 19C of the third form has the conductive layer 3 formed on the primer layer 2 composed of the first peak 17 that is not a flat surface. In addition, the adhesion between the primer layer 2 and the conductive layer 3 is remarkably increased because the primer component 16 penetrates to such an extent that the primer component 16 exists in the conductive layer 3 as described above. Further, when the conductive layer pattern 19C is formed, the conductive composition filled in the plate recess is transferred to the primer layer 2 with an extremely high transfer rate (almost 100%). ing.

  In addition, in the conductive layer pattern 19 of the second and third embodiments, when the primer component 16 in the primer layer 2 penetrates into the conductive layer 3, the primer component 16 is conductive even though it depends on the primer component 16. The composition can be thickened or gelled or semi-solidified, or the curable component in the primer can be infiltrated into the conductive layer composition layer 3 ′. Thereafter, in the transfer step after only the primer layer 2 is cured, the thickened or semi-cured conductive composition can be transferred (transferred) at a transfer rate of approximately 100%. Further, in the transfer step after simultaneously curing the primer layer 2 and the conductive composition, the interlayer adhesion between both layers is increased, so that the conductive composition is transferred (transferred) at a transfer rate of almost 100%. Can do.

  As shown in FIG. 7B, the conductive layer pattern 19D of the fourth form is a first peak 17 in which the base portion (the ridge portion 13) is configured by the protruding portion of the primer layer 2, and the first The conductive layer 3 formed on the mountain 17 is configured to be a second mountain 18 provided on the upper side of the base portion (the middle 20 of the first mountain 17). As shown in FIG. 7B, the feature of the fourth embodiment is that the middle 20 of the first mountain 17 has a discontinuous portion with an inclined contour surface. Owing to such discontinuous portions, the conductive layer 3 can be further prevented from falling off. Such a discontinuous portion of the inclined surface is generated when the primer layer 2 flows into the conductive composition 3 ′ during the manufacturing method of the present invention. This is a portion where the inclination of the contour surface (outer surface) of the first peak 17 of the primer layer 2 changes discontinuously. Furthermore, in the fourth embodiment (the same applies to the first to third embodiments), the side edge 5 of the conductive layer 3 is at an angle close to the inclined form of the flange 13 that rises obliquely. The tip of the side edge 5 (portion 20) is difficult to peel off from the primer layer 2. For example, even in a peel test using a general adhesive tape, the peel strength of the conductive layer pattern 19 having such a form was high.

  Although it is preferable to have at least one feature of the conductive layer pattern 19 in the first to fourth embodiments, it may have two or more features, or may have all four features.

  Moreover, since the conductive layer pattern 19 which concerns on the 1st-4th form demonstrated above can improve the transferability of a conductive composition (conductive layer 3) in addition to said effect, intaglio, such as normal gravure printing, is used. Compared to the method used, the thickness of the conductive composition (conductive layer 3) after transfer can be increased. Therefore, by increasing the thickness of the conductive layer pattern 19, there is also an effect that it is possible to ensure the conductivity necessary for the electromagnetic wave shield.

As mentioned above, although the structure of the electromagnetic wave shielding material 10 of this invention was demonstrated, the electromagnetic wave shielding material 10 of this invention is the part A in which the conductive layer 3 is formed among the primer layers 2 provided on the transparent base material 1. FIG. since the thickness T _a of which is a thicker form than the thickness T _B of the portion B of the conductive layer 3 is not formed, and the primer layer 2 is provided so as to fill the depressions 6 that noted above problem Yes. The primer layer 2 having such a form is formed by filling the recess 6 above the conductive composition in the recess after scraping with a doctor blade, a wiping roll or the like when the electromagnetic shielding material 10 is manufactured. As a result, the electromagnetic wave shielding material 10 in which the conductive composition is pressure-bonded to the primer layer 2 with good adhesion and does not cause defects such as disconnection, shape defect, and low adhesion due to poor transfer of the conductive composition 3 ′ is provided. There is an effect that can be done.

  Further, in the electromagnetic wave shielding material 10 of the present invention, the primer layer 2 is provided at least under the conductive layer 3, but the primer layer 2 has a so-called opening other than the region where the conductive layer pattern 19 is formed, that is, the conductive layer 3 has It is preferable to exist over the entire surface of the transparent substrate 1 that is not formed. By forming the primer layer 2 on the entire surface, peeling of the conductive layer pattern 19 from the transparent substrate 1 is less likely to occur than when the primer layer 2 exists only under the conductive layer 3 and does not exist in the opening. There is an effect.

[Method of manufacturing electromagnetic shielding material]
8 and 9 are process diagrams showing an example of the method for producing an electromagnetic wave shielding material of the present invention. 10 and 11 are schematic configuration diagrams showing an example of an apparatus for carrying out the manufacturing method of the present invention. In the present application, “transfer” and “transfer” are used synonymously. Therefore, “transfer” can be replaced with “transfer”, and “transfer process” can be replaced with “transfer process”.

  The manufacturing method according to the first aspect includes a transparent base material preparation step (not shown) for preparing a transparent base material 1 in which a primer layer 2 capable of maintaining fluidity until it is cured is formed on one surface S1, and a predetermined pattern. After applying the conductive composition 3 ′ (which is fluid in an uncured state) that can form the conductive layer 3 after curing to the plate-like or cylindrical plate surface 63 in which the recess 64 is formed, except in the recess The conductive composition adhering to the conductive composition is scraped to fill the concave portion 64 with the conductive composition 3 ′ (see FIG. 8B). At this stage, the concave portion 64 is filled. 9 is formed in the upper part of the conductive composition 3 '.), The primer layer 2 side of the transparent base material 1 after the transparent base material preparation step, and the conductive composition filling step The plate surface 63 is pressed against the concave portion 64 side so that the primer layer 2 and the concave portion 64 The pressure-bonding step (see FIG. 8 (c)) for closely adhering the electrically conductive composition 3 ′ without a gap, and the primer layer 2 is cured (non-fluidized or solidified) after the pressure-bonding step, but the conductive composition 3 ′ is completely Is a primer layer curing step (not shown) that does not cure, and a transfer that peels off the transparent substrate 1 and the primer layer 2 from the plate surface 63 after the primer layer curing step and transfers the conductive composition 3 ′ in the recesses onto the primer layer 2. After the step (see FIG. 8D) and the transfer step, the conductive composition 3 ′ formed in a predetermined pattern on the primer layer 2 is cured to form the conductive layer 3, and the first layer comprising the primer layer 2 is formed. The conductive film forming the pattern forming portion A having a projecting cross-sectional shape including the first peak 17 and the second peak 18 made of the conductive layer 3 formed above the middle 20 of the first peak 17. Conductive composition curing step and conductive composition hard After the process, the metal layer 4 is plated on the conductive layer 2 to form the metal layer 4 on at least a part of the flange 13 below the middle 20 of the first mountain 17 (FIG. 8). (See (e)).

  Moreover, the manufacturing method which concerns on a 2nd aspect is a transparent base material preparation process (not shown) which prepares the transparent base material 1 in which the primer layer 2 which can maintain fluidity until it hardens | cures was formed in one surface S1, predetermined | prescribed After applying the conductive composition 3 ′ (which is fluid in an uncured state) that can form the conductive layer 3 after curing to the plate-like or cylindrical plate surface 63 in which the recesses 64 are formed in the pattern of A conductive composition filling step (see FIG. 8B) in which the conductive composition adhering to other than the inside is scraped to fill the concave portion 64 with the conductive composition 3 ′ (see FIG. 8B). A dent 6 as shown in FIG. 9 is formed on the top of the filled conductive composition 3 ′.), The primer layer 2 side of the transparent substrate 1 after the transparent substrate preparation step, and the filling of the conductive composition The primer layer 2 and the concave portion 6 are pressure-bonded to the concave portion 64 side of the plate surface 63 after the process. A pressure-bonding step (see FIG. 8C) for closely adhering the inner conductive composition 3 ′ without a gap, and the primer layer 2 and the conductive composition 3 ′ are simultaneously cured (non-fluidized or solidified) after the pressure-bonding step. Simultaneous curing step (see FIG. 8 (c)), and primer that peels the transparent substrate 1 and the primer layer 2 from the plate surface 64 after the simultaneous curing step and cures the cured conductive composition 3 'in the recess as the conductive layer 3. Protrusions that are transferred onto the layer 2 and are composed of a first peak 17 made of the primer layer 2 and a second peak 18 made of the conductive layer 3 formed above the middle 20 of the first peak 17. The pattern forming portion A having the cross-sectional shape of FIG. 5 and the metal layer 4 is plated on the conductive layer 3 after the transfer step so that the metal layer 4 is below the middle 20 of the first mountain 17. A plating step (FIG. 8 () ) Reference) and, those having a.

  Hereinafter, each step will be described with reference to the drawings.

(Transparent substrate preparation process)
As shown in FIG. 9 (A), the transparent base material preparation step is a step of preparing the transparent base material 1 in which the primer layer 2 that can maintain fluidity until it is cured is formed on one surface S1. The primer layer 2 is formed by applying a primer layer resin composition on the transparent substrate 1, and since the primer layer resin composition is as described above, the description thereof is omitted here. When the primer layer 2 is available as a film of a thermoplastic resin composition that is solid at room temperature, it may be laminated with the transparent substrate 1 instead of being applied. In any case, it is necessary that the primer layer 2 is in a state in which the fluidity is maintained during the crimping step described later.

  For example, when an ionizing radiation curable resin composition is used as the primer layer resin composition, only the solvent in the ionizing radiation curable resin composition is removed by drying in an unirradiated state where no ionizing radiation is irradiated. It is preferable to form a primer layer 2 made of a fluidized state on the transparent substrate 1 as a coating film, and to supply to the pressure-bonding step described later in that state. Of course, when the ionizing radiation curable resin composition used here is a so-called non-solvent type that does not contain a solvent, a drying step when forming the primer layer 2 is not necessary.

  In addition, when a thermoplastic resin composition that is solid at room temperature is used as the resin composition for the primer layer, it is sufficient that the primer layer 2 is in a fluidized state by heating in the press-bonding process described later. Heat treatment may be performed, and heating of the primer layer 2 and pressure bonding to the plate surface 63 may be performed simultaneously with a heat roll or the like. As a method for applying the primer layer, various coating methods can be used. For example, the primer layer can be appropriately selected from various methods such as gravure coating, comma coating, die coating, and roll coating.

(Resin filling process)
In the resin filling step, as shown in FIGS. 8A and 8B, the conductive layer 3 is cured on the plate-like or cylindrical plate surface 63 in which the concave portions 64 are formed in a predetermined pattern of mesh or stripe. After applying the conductive composition 3 'in a fluid state that can be formed, the conductive composition adhering to other than the inside of the recess is scraped with a doctor blade 21 or a wiping roll to fill the recess with the conductive composition 3'. It is a process to do. In this step, a dent 6 is formed on the conductive composition 3 ′ filled in the recess 64. The cause is that when the conductive composition 3 ′ other than the concave portion is scraped off by the doctor blade 21 or a wiping roll, a dent is generated on the surface due to the rheological behavior of the conductive composition 3 ′. If 'contains a diluting solvent, it is presumed that it is due to volume shrinkage due to volatilization of the diluting solvent, or due to the combined action of both. Since the conductive composition 3 ′ is as described above, the description thereof is omitted here.

  The combination of the conductive composition with respect to the primer layer resin composition is not particularly limited, and the curing treatment of the primer layer resin composition and the curing treatment of the conductive composition may be different, but the conductive composition 3 ′. When an ionizing radiation curable resin containing conductive powder is employed, the primer layer resin composition is also preferably an ionizing radiation curable resin composition. By such a combination, the primer layer 2 is cured and electrically conductive as in the manufacturing method of the second aspect by the ionizing radiation irradiation treatment at the time of the pressure bonding step after the resin filling step and the subsequent curing step of the primer layer. The composition 3 'can be cured simultaneously. At this time, since the conductive powder is generally colored, when the ionizing radiation to be irradiated is light or ultraviolet rays, ultraviolet rays having an appropriate wavelength with high transmittance of the conductive powder or deep portions where the ionizing radiation is difficult to reach. It can be cured by selecting a combination of a curable photopolymerization initiator and a photocurable resin. Moreover, when irradiating an electron beam, it is not necessary to consider the color of the conductive powder.

  The coating method shown in FIG. 8B is an example of a process performed before the transparent base material 1 having the primer layer 2 is pressure-bonded to the intaglio roll 62. Specifically, the coating method shown in FIGS. As shown, the pick-up roll 61 comes into contact with the conductive composition filling container 68 at the bottom, and the conductive composition 3 ′ is pulled up and applied to the plate surface 63 of the intaglio roll 62. At this time, the conductive composition 3 ′ is scraped off by the wiping roll 69 or the doctor blade 65 so that the conductive composition 3 ′ does not get on the plate surface 63 other than the concave portion 64.

(Crimping process)
As shown in FIG. 8 (c) and FIG. 9 (C), the crimping step includes the concave portion 64 side of the plate surface 63 after the resin filling step, and the primer layer 2 side of the transparent substrate 1 after the transparent substrate preparation step. Is a step in which the conductive composition 3 ′ in the recess 64 and the primer layer 2 are closely adhered without a gap. Since the primer layer 2 has fluidity at this point, the primer layer 2 also flows into the recess 6 above the conductive composition 3 ′ filled in the recess 64 of the plate surface, and the recess 6 The space between the transparent substrate 1 and the conductive composition 3 ′ is filled with the primer layer 2 without any gap. Specifically, as shown in FIGS. 10 and 11, the pressure bonding is performed by the nip roll 66 and urged against the intaglio roll 62 with a predetermined pressure. The nip roll 66 is provided with a biasing pressure adjusting means, and the biasing pressure is arbitrarily adjusted according to the fluidity of the primer layer 2.

  When the primer layer 2 is a thermoplastic resin, the nip roll 66 is preferably a heatable roll. In this case, the primer layer 2 is softened and flowable by thermocompression bonding.

  In this crimping step, the primer layer 2 flows into the recess 6 on the upper side of the conductive composition 3 ′ filled in the concave portion 64 of the plate surface, the recess 6 is filled, and then undergoes a curing step and a transfer step. An electromagnetic shielding material is manufactured. Therefore, the obtained conductive layer pattern 19 becomes the first to fourth conductive layer patterns 19 shown in FIGS. 6 and 7.

  Specifically, in this pressure-bonding step, the primer component contained in the primer layer 2 is filled into the plate surface by entering the conductive composition constituting the conductive layer 3 and then undergoing a curing step and a transfer step described later. Further, the transfer (transfer) of the conductive composition 3 ′ to the transparent substrate 1 is reliably performed under a high transfer rate. And as shown in FIG.6 and FIG.7, as for the conductive layer pattern 19 which the obtained electromagnetic wave shielding material has, the boundary part 12 of the primer layer 2 and the conductive layer 3 does not become a simple boundary part structure, but both layers Improved adhesion.

  In addition, the primer layer 2 flows into the recess 6 on the upper side of the conductive composition 3 ′ filled in the recess 64 of the plate surface, and the recess 6 is filled, and then the curing process and the transfer process are performed. As shown in FIG. 3 and the like, the conductive layer pattern includes a first peak 17 made of the primer layer 2 and a conductive composition 3 ′ (conductive layer formed above the middle of the first peak 17. A projecting pattern constituted by the second crest 18 of 3) is obtained.

(Curing process)
The curing step is a step of curing the primer layer 2 after the pressure-bonding step by the urging force of the nip roll 66, and the primer layer 2 and the conductive composition 3 'are in close contact with each other by performing a curing process after the pressure-bonding. Can be cured. Specifically, when the primer layer resin composition is an ionizing radiation curable resin composition, ionizing radiation is irradiated in an irradiation zone (in the example of FIG. 10, described as “UV zone”). And cured. In this case, the primer layer 2 is sandwiched between the transparent substrate 1 and the plate surface 63 and is not necessarily inhibited by the oxygen in the air, so that a nitrogen purge device or the like is not necessarily required. The curing treatment is selected in accordance with the types of the primer layer resin composition and the conductive composition, as described above, and is subjected to curing treatment such as ionizing radiation irradiation treatment and cooling treatment.

  In addition, as described above, when both the resin composition for the primer layer and the conductive composition are ionizing radiation curable resins, a simultaneous curing step in which ionizing radiation irradiation treatment is performed during the curing step following the pressure bonding step; You can also

(Transfer process)
As shown in FIG. 9D and FIG. 10, the transfer step peels off the transparent substrate 1 and the cured primer layer 2 from the plate surface 63 of the intaglio roll 62 after the curing step, and the conductive composition 3 ′ in the recess 64. Is transferred onto the primer layer 2. Since the primer layer 2 is cured in the primer layer curing step prior to this step, the conductive composition 3 ′ in close contact with the primer layer 2 is recessed by peeling from the plate surface 63 of the intaglio roll 62 together with the transparent substrate 1. It is transferred from the inside to the primer layer 2 neatly and becomes a conductive composition 3 ′. As shown in FIGS. 10 and 11, the peeling is performed by a nip roll 67 provided on the outlet side.

  In the transfer step, the conductive composition 3 ′ is not necessarily cured, and can be transferred even when the conductive composition 3 ′ contains a solvent. This is because the primer layer 2 and the conductive composition 3 ′ are not only in close contact with each other without a gap, but also part of the primer layer penetrates into the conductive composition and the two are mixed with each other. Therefore, the adhesive force between the primer layer 2 and the conductive composition 3 ′ cured in a state where they are entangled with each other, the inner wall of the concave portion 64 of the roll-shaped intaglio and the conductive composition 3 ′ This is presumably because it is larger than the adhesive strength between them. In addition, particularly when the conductive composition 3 ′ is in an uncured state, a part of the primer layer penetrates into the conductive composition, changes its fluidity, and easily escapes from the recess 64. It is also speculated to do.

FIG. 9 is a schematic view showing a form in which the primer layer 2 is filled in the recess 6 of the conductive composition 3 ′ in the recess 64 and the conductive composition 3 ′ is transferred. As shown in FIG. 9D, when the form of the primer layer 2 after the transfer step and the form of the conductive layer 3 made of the conductive composition 3 ′ are observed, the primer layer 2 is made of the conductive composition 3 ′. The thickness T _A of the primer layer 2 composed of the first peak 17 to which the conductive layer 3 has been transferred is thicker than the thickness T _B of the flat portion 23 of the primer layer 2 to which the conductive composition 3 ′ has not been transferred. . The conductive layer 3 is provided above the middle 20 of the thick first mountain 17. In such a form, the primer layer 2 side of the transparent base material 1 on which the primer layer 2 retaining fluidity is formed and the concave portion 64 side of the plate surface 63 after the resin filling step are shown in FIGS. By pressure bonding in this manner, the fluid primer layer 2 flows into and fills the recesses 6 that are likely to be formed above the conductive composition in the recesses 64. Therefore, the form after transfer is as shown in FIG. the thickness of the thickness T _a conductive layer 3 is not formed flat portion 23 of the first peak 17 where the conductive layer 3 of the primer layer 2 provided on the transparent substrate 1 is formed T _It is thicker than _B , and the conductive layer 3 is configured to reach the middle 20 of the thick first mountain 17.

Usually, the thickness T _A of the primer layer 2 composed of the first peak 17 on which the conductive layer 3 is formed becomes thicker toward the peak of the peak as shown in FIG. That is, in the cross section of the electromagnetic shielding pattern portion (see, for example, FIG. 3), the cross-sectional shape of the primer layer 2 is a so-called semicircle, semi-ellipse, or the like that is convex toward the top away from the transparent substrate 1. It has a bell-shaped shape, a triangular shape, a trapezoidal shape, a so-called mountain shape such as a pentagonal shape, or a similar shape. In addition, according to this invention, since the transferability (it is also called transferability) of electrically conductive composition 3 'can be improved, compared with the method using intaglio, such as normal gravure printing, the electrically conductive composition after transfer. it is possible to increase the thickness T _C 3 '. Therefore, by increasing the thickness of the conductive layer 3, the conductivity can be increased, and the electromagnetic shielding performance of the obtained electromagnetic shielding material can be enhanced.

  Further, the boundary portion 12 between the primer layer 2 and the conductive layer 3 is not only in a form in which the primer layer 2 and the conductive layer 3 are merely physically or chemically bonded, as shown in FIGS. 6 (A) and 7 (B). As shown in FIGS. 6B and 7A, in the vicinity of the boundary portion 12, the materials of both layers may be dissolved, permeated or diffused with each other. . Since this dissolution, permeation, or diffusion is performed before the conductive layer 3 or the primer layer 2 is cured, the conductive layer 3 or the primer layer 2 is cured after such a state, whereby a boundary portion having a high interlayer adhesive force is obtained. It becomes. These forms can be realized by selecting materials for both layers and selecting manufacturing conditions.

  In the electromagnetic wave shielding material produced by the production method of the present invention, since the conductive layer pattern 19 having the above boundary portion form is formed, the interlayer adhesive force between the primer layer 2 and the conductive composition 3 ′ to the conductive layer 3. The conductive composition 3 ′ filled in the plate recess can be transferred (transferred) at a transfer rate of almost 100%. Furthermore, even when a plate depression having a large aspect ratio (depth / opening width) of 2/10 or more is used, the conductive composition 3 ′ filled in the depression is transferred (transferred) with a transfer rate of almost 100%. Can be made. Incidentally, in normal intaglio printing that does not employ the primer layer of the present invention, it is extremely difficult to achieve ink transfer in a shape with an aspect ratio exceeding 2/10.

  Since the electromagnetic wave shielding material 10 obtained by the production method of the present invention has such a form, problems such as disconnection, shape failure, and adhesion due to poor transfer of the conductive composition 3 ′ forming the conductive layer 3 do not occur. There is an effect. In addition, after a transfer process, a drying process, a hardening process, etc. are performed as needed.

(Plating process)
Although not shown, the plating step is a step of plating the metal layer 4 on the conductive layer 3 formed in a predetermined pattern (the same as the formation pattern of the primer layer 2) on the primer layer 2 after the transfer step. Examples of the metal to be plated include copper, silver, gold, nickel and the like, and copper plating which is particularly inexpensive and has high conductivity is preferable. A commercially available plating solution can be used as the copper plating solution, and among them, a copper plating solution with improved uniform plating properties is preferably employed. In addition, when subjected to a plating process, a normal pretreatment (for example, a degreasing cleaning process) is performed. However, as described above, it may be supplied in-line from the transfer process, or a separate plating may be performed. It may be provided to the line. After the plating step, it is wound as it is after passing through other steps (for example, a blackening treatment step and a rust prevention step of the metal layer 4 and a formation step of the protective layer 9 as shown in FIG. 2) as necessary. Alternatively, it may be cut into a predetermined size to form a sheet.

(Other)
FIG. 9B will be supplementarily described. FIG. 9B shows that the primer layer 2 that can maintain fluidity is provided until it is cured so that the uncured conductive composition 3 ′ is filled in the recess 64 and further covers the entire plate surface 63 including the recess 63. In this step, the transparent substrate 1 is pressure-bonded from the primer layer 2. In both of this step and the step shown in FIG. 9A, a plate surface 63 having a predetermined pattern of recesses 64 filled with uncured conductive composition 3 ′ and its conductive composition 3 ′. The process of trying to press-bond with the one surface S1 of the transparent base material 1 which is the transfer object of this through the primer layer 2 that can maintain fluidity until it is cured. Any of these two steps may be applied to the method for producing an electromagnetic wave shielding material of the present invention.

  Further, FIG. 9C is a step of pressure-bonding the transparent substrate 1 and the plate surface 63 through the primer layer 2 that can maintain fluidity until cured, but in the process route of FIG. 9B, When the primer layer 2 is provided on the plate surface 63, the primer layer 2 fills the recess 6. Therefore, in the step of FIG. 9C, the transparent base material 1 and the plate surface 63 are pressure-bonded in a mode through the primer layer 2, and as a result, the primer layer 2 having fluidity until cured is a conductive composition. Since the 3 ′ recess 6 is filled, at least the primer layer 2 is cured in the present invention while the pressure bonding is maintained.

  Next, the difference between the manufacturing methods of FIGS. 10 and 11 will be supplementarily described. The manufacturing method shown in FIG. 10 corresponds to the process route of FIG. 9A. First, the primer layer 2 is applied to one surface of the supplied transparent substrate 1. This application process is performed by the pickup roll 81 coming into contact with the primer layer resin composition 82 in the container 83 at the lower side, pulling up the primer layer resin composition 82 and applying it to the transparent substrate 1. The transparent substrate 1 to which the primer layer 2 is applied is performed by pressing the transparent substrate surface on the primer layer 2 side to the plate surface 63 with a nip roll 66. On the other hand, the conductive composition 3 ′ is applied to the plate surface 63 to be pressed. The application process at this time is performed by the pickup roll 61 coming into contact with the conductive composition 3 ′ in the container 68 below, and pulling up the conductive composition 3 ′ and applying it to the plate surface 63. In FIG. 10, the wiping roll 84 is used to scrape off the conductive composition 3 ′ so that the conductive composition 3 ′ does not get on the portion other than the concave portion 64 on the plate surface 63.

  On the other hand, the manufacturing method shown in FIG. 11 corresponds to the process route of FIG. 9B, and the process up to the crimping process is different from the manufacturing method shown in FIG. That is, first, the transparent substrate 1 is supplied so as to be pressure-bonded to the plate surface 63 by the nip roll 66. As shown in FIG. 11, the conductive composition 3 ′ is first applied to the plate surface 63 to which the transparent substrate 1 is pressure-bonded, and then the primer layer 2 is applied and formed. The coating process of the conductive composition 3 ′ is performed by the pickup roll 61 contacting the conductive composition 3 ′ in the container 68 at the lower side and pulling up the conductive composition 3 ′ and coating it on the plate surface 63. Subsequently, the conductive composition 3 ′ is scraped off by a doctor blade 65 so that the conductive composition 3 ′ does not get on any portion other than the concave portion 64 on the plate surface 63. Similarly, in the application process of the primer layer 2, the pickup roll 81 contacts the primer layer resin composition 82 in the container 83 at the lower side, pulls up the primer layer resin composition 82, and conducts in the recess 64. It is performed by applying a predetermined thickness on the plate surface 63 filled with the composition 3 ′. Since the primer layer resin composition is not yet cured and has fluidity, the primer layer resin composition is filled in the recesses 6 without gaps, as shown in FIG. 8B.

  In this way, the roll-shaped or sheet-shaped electromagnetic shielding material 10 is produced. As described above, according to the production method of the electromagnetic shielding material of the present invention, the primer layer 2 and the conductive layer 3 are interposed between them. Therefore, it is possible to manufacture an electromagnetic wave shielding material that does not cause defects such as disconnection, shape failure, and low adhesion due to transfer failure of the conductive layer 3. Further, since the transfer can be performed at a high transfer rate, the thickness of the conductive layer 3 can be increased, and the electromagnetic wave shielding property can be improved. Further, a projection-shaped pattern forming portion composed of a first peak 17 made of the primer layer 2 and a second peak 18 made of the conductive layer 3 formed above the middle 20 of the first peak 17. A is formed with good transferability (transferability), and further, the metal layer 4 is formed immediately above at least a part of the flange 13 below the middle 20 of the first mountain 17, so that the obtained electromagnetic shielding material The metal layer 4 existing immediately above the light acts on the collar 13 so as to prevent light scattering even when light enters the flange 13.

  For example, if a plate having a recess having a depth of 20 μm is used, a conductive layer pattern having a thickness of about 20 μm which is almost the same as the shape of the plate can be formed. This is unthinkable when printing intaglio (gravure) a conductive composition containing a large amount of conductive powder. Further, in the method for producing an electromagnetic wave shielding material of the present invention, the conductive composition contains a solvent and is not a binding material that solidifies in a short time, but can be transferred with a high transfer rate even when separate drying is required. it can. Further, when the conductive composition is UV curable, the conductive composition contains a pigment, the pigment is a high-concentration metal-based conductive powder, and the conductive powder shields ultraviolet rays, Even when ultraviolet rays do not reach the intaglio plate holes, they can be transferred with a high transfer rate.

  The electromagnetic shielding material 10 obtained in this way can be used as an optical filter by providing an optical adjustment layer. Although not described in detail here, the conventionally known optical adjustment layer may be used as it is, for example, a toning layer, a near infrared absorption layer, a neon light absorption layer, an ultraviolet absorption layer, an antireflection layer, and an antiglare layer. Etc. Furthermore, in addition to the optical adjustment layer, other functional layers having various functions can be laminated on the electromagnetic wave shielding material 10. Examples of such a functional layer include a hard coat layer, an antifouling layer, an antistatic layer, an antibacterial layer, an antifungal layer (a layer that prevents mold), an antistatic layer, and an impact absorbing layer.

  These optical adjustment layers and / or functional layers are formed in the form of (1) a layer formed in advance as an independent sheet or plate, and an adhesive layer (including a so-called pressure-sensitive adhesive layer) between them. (2) A layer previously formed on the releasable substrate sheet is appropriately pasted on the electromagnetic shielding material of the present invention via an adhesive layer in between. In addition, after that, only the releasable base sheet is peeled and removed, a form formed by a so-called transfer method, and (3) a composition in which a material exhibiting the above various functions is added to an appropriate resin binder. Form formed by coating on the electromagnetic shielding material of the invention, (4) Although it is one form of the above (3), to adhere this to the desired adherend on the electromagnetic shielding material of the present invention When the adhesive layer is applied, the above functions are expressed in the adhesive layer. Material by adding that the form used also the adhesive layer and the various layers, (5) wherein (1) a combination of two or more forms in the form of - (4), but can be appropriately selected. Here, these optical adjustment layers and / or functional layers may be present either on the front or back of the electromagnetic wave shielding material of the present invention, or on both sides. Such an electromagnetic shielding material 10 or an optical filter having the electromagnetic shielding material 10 can be attached to the front surface of various image display devices. For example, a plasma display device can be obtained by mounting on a plasma display panel.

  Further, by SIMS (Secondary Ion Mass Spectrometry), (i) the surface of the functional ink layer pattern to which the conductive composition 3 ′ has been transferred, (ii) the portion where the conductive composition 3 ′ has not transferred (opening or pattern) The surface of the primer layer of the non-forming part B), (iii) the surface of the coating film obtained by solid-coating the conductive composition 3 'on the transparent substrate 1, and (iv) applying the primer layer 2 to the transparent substrate 1 The surface of the coating film solidified on top and solidified was analyzed. As a result, the fragment found in (i) and (ii) was not detected in the coating film of the conductive composition 3 ′ of (iii), but was found in (i) and (ii). It was suggested that the component was diffusing in the conductive composition 3 ′. Considering from these situations, when the fluid primer layer 2 is brought into contact with the conductive composition 3 ′, the boundary portion is dissolved and / or the boundary is disturbed, and the primer layer 2 is solidified in this state. In the region from the boundary portion toward the conductive composition 3 ′, a phenomenon such as thickening or gelation of the conductive composition 3 ′ occurs, and the conductive composition 3 ′ is easily pulled out from the plate. It is guessed that.

  Moreover, when a part of the components constituting the flowable primer layer 2 is mixed with the conductive composition 3 ′ in the concave portion and the primer layer 2 is solidified, the viscosity of the conductive composition 3 ′ is generally increased. There is also a possibility. In any case, if the flowable primer layer 2 is brought into contact with the conductive composition 3 ′ and at least the primer layer 2 is solidified and then peeled, the conductive composition 3 ′ is not completely solidified. Nevertheless, almost 100% transfer was possible.

  Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples.

Example 1
An electromagnetic shielding material was manufactured by the apparatus shown in FIG. First, as the transparent substrate 1, a colorless and transparent biaxially stretched polyethylene terephthalate (PET) film having a width of 1000 mm and a thickness of 100 μm and having an easy adhesion treatment on one side was used. The PET film set in the supply part was drawn out, and a photocurable resin composition for the primer layer was applied and formed on the easy adhesion treatment surface so as to have a thickness of 5 μm. The application method employs a normal gravure reverse coating method, and the photocurable resin composition includes 35 parts by weight of an epoxy acrylate prepolymer, 12 parts by weight of a urethane acrylate prepolymer, and 44 weights of a monofunctional acrylate monomer comprising phenoxyethyl acrylate. 9 parts by weight of trifunctional acrylate monomer consisting of ethylene oxide-modified isocyanuric acid triacrylate, and further 3 parts by weight of Irgacure 184 (substance name: 1-hydroxy-cyclohexyl-phenyl-ketone, manufacturer: Ciba Specialty Chemicals) as a photoinitiator The added one was used. The viscosity at this time was about 1300 mPa · s (25 ° C., B-type viscometer), and the primer layer 2 after application showed fluidity when touched, but did not flow down from the PET film.

  Next, the PET film on which the primer layer 2 is formed is provided to an intaglio roll 62 that performs a transfer process. Prior to that, the opening has a line width of 21 μm, a line pitch of 300 μm, a plate depth of 10 μm, and a trapezoidal base angle of 75. The conductive composition 3 ′ is applied by the pick-up roll 61 to the plate surface 63 of the intaglio roll 62 in which the grid mesh pattern of the concave shape at the angle is formed, and the conductive composition other than the inside of the concave portion 64 is applied by the doctor blade 65. The conductive composition 3 ′ was filled only in the recess 64 by scraping. The PET film on which the primer layer 2 is formed is supplied between the intaglio roll 62 filled with the conductive composition 3 ′ in the recess 64 and the nip roll 66, and the pressing force of the nip roll 66 against the intaglio roll 62 The (priming force) causes the primer layer 2 to flow into the recess 6 of the conductive composition 3 ′ existing in the recess 64, thereby bringing the conductive composition 3 ′ and the primer layer 2 into close contact with each other without any gaps. A part was permeated into the conductive composition 3 ′ in the recess 64. In addition, the used conductive composition used the silver paste of the following compositions.

<Preparation of conductive composition (silver paste)>
After blending 93 parts by weight of scaly silver powder having an average particle size of about 2 μm as the conductive powder, 7 parts by weight of thermoplastic polyester urethane resin as the binder resin, and 25 parts by weight of butyl carbitol acetate as the solvent, and thoroughly stirring and mixing A conductive composition was prepared by kneading with three rolls.

  Next, the transfer process performed is as follows. First, the PET film on which the primer layer 2 is formed is sandwiched between the intaglio roll 62 and the nip roll 66 with the primer layer 2 facing the plate surface 63 side of the intaglio roll 62. The primer layer 2 of the PET film is pressed against the plate surface 63 between the intaglio roll 62 and the nip roll 66. Since the primer layer 2 has fluidity, the primer layer 2 pressed against the plate surface 63 also flows into the recess 64 filled with the conductive composition 3 ′, and the conductive composition generated in the recess 64. The recess 6 of the object 3 ′ is filled (see FIG. 9C). Thus, the primer layer 2 is in close contact with the conductive composition 3 ′ without any gap. Thereafter, the intaglio roll 62 is further rotated and irradiated with ultraviolet rays by a UV lamp made of high-pressure mercury lamp, and the primer layer 2 made of the photocurable resin composition is cured. Due to the curing of the primer layer 2, the conductive composition in the recess 64 of the intaglio roll 62 comes into close contact with the primer layer 2, and then the film is peeled from the intaglio roll 62 by the nip roll 67 on the outlet side. The conductive layer 3 is transferred and formed (see FIG. 9D). The transfer film thus obtained was passed through a drying zone at 110 ° C. to evaporate the solvent of the silver paste and solidified to form a conductive layer 3 having a mesh pattern on the primer layer 2. At this time, the thickness of the pattern portion where the conductive layer 3 exists (the difference in thickness between the mesh pattern portion where the conductive layer 3 is formed and the other portion) is about 10 μm, which is the same thickness as the plate depth. The silver paste in the concave portion 64 of the plate was transferred with a high transfer rate. When the inside of the recess 64 after the transfer was visually observed, no plate residue of the paste was observed, and no disconnection or shape defect of the mesh pattern was observed. The transfer film having only the conductive layer pattern 19 thus obtained is referred to as “Sample 1”.

Subsequently, copper plating was performed with respect to the obtained transfer film. As the copper plating method, the obtained transfer film is immersed in a copper sulfate plating solution, and a current of ² A / dm ² is passed using the mesh-like conductive layer pattern 19 formed on the surface as a cathode and the copper plate as an anode. Then, electrolytic copper plating was performed. The copper plating film was selectively formed on the conductive layer 3 with a thickness of 4 μm. The obtained electromagnetic shielding material had a surface resistance value of 0.1Ω / □. The electromagnetic shielding material thus obtained is referred to as “Sample 2”.

(Example 2)
In place of the plate surface of the intaglio roll of Example 1, the intaglio in which a grid-like mesh pattern having a concave shape with an opening portion line width of 21 μm, a line pitch of 300 μm, a plate depth of 9 μm, and a trapezoidal base angle of 75 ° is formed. “Sample 3” before copper plating and “sample 4” after copper plating were obtained in the same manner as in Example 1 except that the plate surface 63 of the roll 62 was used.

(Example 3)
In place of the plate surface of the intaglio roll of Example 1, the intaglio roll having a grid-like mesh pattern having a line width of openings of 16 μm, a line pitch of 290 μm, a plate depth of 8.5 μm, and a bell-shaped concave shape. “Sample 5” before copper plating and “sample 6” after copper plating were obtained in the same manner as in Example 1 except that 62 plate surface 63 was used. In Example 3, the copper plating thickness of Sample 6 was 2 μm.

Example 4
In place of the plate surface of the intaglio roll of Example 1, a grid-like mesh pattern in the form of recesses having a line width of openings of 16 μm, a line pitch of 270 μm, a plate depth of 10.0 μm, and a trapezoidal base angle of 85 ° is formed. Except for using the plate surface 63 of the intaglio roll 62, in the same manner as in Example 1, "Sample 7" before copper plating and "Sample 8" after copper plating were obtained. In Example 4, the copper plating thickness of Sample 6 was 2 μm.

(Measurement of haze value)
The haze values of Samples 1 and 2 were measured using a haze meter (manufactured by Murakami Color Research Laboratory, HM-150) based on the method defined in JIS-K7136. The results are shown in Table 1.

(Cross section observation)
The cross sections of Samples 1 and 2 were observed with a scanning electron microscope. As shown in FIG. 12, a first peak 17 made of the primer layer 2 and a second peak 18 made of the conductive layer 3 are formed with high transfer efficiency above the middle 20 of the first peak 17. It was confirmed. Further, in the cross section of the sample 2 in which the copper plating as the metal layer 4 is formed on the conductive layer 3, the copper plating covers the upper portion of the flange portion 13 of the first peak 17 made of the primer layer 2. confirmed. When this observation result is compared with the result of the above-described haze value, the copper plating covers the flange portion 13 of the first peak 17, thereby preventing light scattering that may occur at the flange portion 13 and the haze value being small. It is thought that the value was shown.

(Electromagnetic wave shielding characteristics)
The electromagnetic wave shielding characteristics were measured for Samples 1 and 2 using a shielding material evaluator (manufactured by Advantest Co., Ltd., TR17301A). Sample 2 on which copper plating was formed had a shielding characteristic of about −30 dB or less (specifically, −36 dB) in the range of 200 to 600 MHz, and showed a good electromagnetic wave shielding characteristic. On the other hand, about the sample 1 which has not formed copper plating, it is -31 dB in the range of 200-600 MHz, and the electromagnetic wave shielding characteristic was inferior to the sample 2. This difference is considered to be a difference in surface resistance value depending on the presence or absence of copper plating.

It is a typical top view which shows an example of the electromagnetic wave shielding material of this invention. It is an enlarged view of the A-A 'cross section in FIG. It is typical sectional drawing which shows an example of the conductive pattern which comprises the electromagnetic wave shielding material of this invention. It is typical sectional drawing which shows another example of the conductive pattern which comprises the electromagnetic wave shielding material of this invention. It is typical sectional drawing which shows another example of the conductive pattern which comprises the electromagnetic wave shielding material of this invention. It is a schematic cross section which shows the conductive layer pattern which concerns on a 1st and 2nd form. It is a schematic cross section which shows the conductive layer pattern which concerns on a 3rd and 4th form. It is process drawing which shows an example of the manufacturing method of the electromagnetic wave shielding material of this invention. It is explanatory drawing of the manufacturing method of the electromagnetic wave shielding material of this invention. It is a schematic block diagram which shows an example of the apparatus which enforces the manufacturing method of this invention. It is a schematic block diagram which shows another example of the apparatus which enforces the manufacturing method of this invention. 2 is an electron micrograph of a cross section of Samples 1 and 2 obtained in Example 1. FIG. It is explanatory drawing of the conventional phenomenon which the non-transfer part of an electroconductive ink composition generate | occur | produces on a transparent base material.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transparent base material 2 Primer layer 3 Conductive layer 3 'Conductive composition 4 Metal layer 5 Side edge 6 Recess 7 Electromagnetic wave shielding pattern part 8 Grounding part 9 Protective layer 10 Electromagnetic wave shielding material 12 Boundary part of primer layer and conductive layer 13 Buttock 14 mixed region 16 primer component 17 first peak 18 second peak 19A, 19B, 19C, 19D conductive layer pattern 20 middle 21 doctor blade 22A, 22B, 22C conductive pattern (including metal layer)
23 Flat part 61 Pickup roll 62 Intaglio roll (intaglio)
63 Plate surface 64 Concave portion 65 Doctor blade 66 Nip roll 67 Nip roll 68 Filling container 69 Wiping roll A A portion where a conductive layer is formed (pattern forming portion)
T _A A thickness B Part where conductive layer is not formed (pattern non-formation part)
T _B B thickness S1 One side of substrate

Claims (5)

A transparent substrate, a primer layer formed on the transparent substrate, a conductive layer made of a conductive composition formed in a predetermined pattern on the primer layer, and a metal layer formed on the conductive layer And
Of the primer layer, the thickness of the primer layer in the pattern forming portion where the conductive layer is formed is thicker than the thickness of the primer layer in the pattern non-forming portion where the conductive layer is not formed,
The pattern forming portion has a projecting cross-sectional shape composed of a first peak made of the primer layer and a second peak made of the conductive layer formed above the middle of the first peak. Have
The electromagnetic wave shielding material according to claim 1, wherein the metal layer is present immediately above at least a part of a buttock below the middle of the first mountain.   The electromagnetic wave shielding material according to claim 1, wherein the metal layer is present at least directly above the entire collar portion of the first mountain.   The boundary portion between the primer layer and the conductive layer in the pattern forming portion is (a) a region where the component constituting the primer layer and the component constituting the conductive layer are mixed, and (b) the primer layer and the conductive layer. One or two of a region where the conductive layer is in a non-linear manner, and (c) a region where a component contained in the primer layer is present in the conductive composition constituting the conductive layer The electromagnetic shielding material according to claim 1 or 2, which is as described above. A method for producing an electromagnetic shielding material in which a conductive layer is formed in a predetermined pattern on one surface of a transparent substrate,
A transparent base material preparing step of preparing a transparent base material on which one primer layer capable of maintaining fluidity until cured is formed;
After applying a conductive composition capable of forming a conductive layer after curing on a plate-like or cylindrical plate surface having concave portions formed in a predetermined pattern, scraping off the conductive composition adhering outside the concave portions A conductive composition filling step of filling the conductive composition into the recess;
The primer layer side of the transparent substrate after the transparent substrate preparation step and the concave side of the plate surface after the conductive composition filling step are pressure-bonded, and the primer layer and the conductive composition in the concave portion are void. A crimping process that closely adheres,
A primer layer curing step that cures the primer layer after the crimping step but does not completely cure the conductive composition;
A transfer step of peeling off the transparent substrate and the primer layer from the plate surface after the primer layer curing step, and transferring the conductive composition in the recesses onto the primer layer;
After the transfer step, the conductive composition formed in a predetermined pattern on the primer layer is cured to form a conductive layer. From the first mountain of the primer layer and the middle of the first mountain A conductive composition curing step for forming a pattern forming portion having a projection-like cross-sectional shape composed of a second peak made of the conductive layer formed thereon;
After the conductive composition curing step, a metal layer is plated on the conductive layer, and the metal layer is formed directly on at least a part of the heel below the middle of the first mountain. And a method for producing an electromagnetic wave shielding material. A method for producing an electromagnetic shielding material in which a conductive layer is formed in a predetermined pattern on one surface of a transparent substrate,
A transparent base material preparing step of preparing a transparent base material on which one primer layer capable of maintaining fluidity until cured is formed;
After applying a conductive composition capable of forming a conductive layer after curing on a plate-like or cylindrical plate surface having concave portions formed in a predetermined pattern, scraping off the conductive composition adhering outside the concave portions A conductive composition filling step of filling the conductive composition into the recess;
The primer layer side of the transparent substrate after the transparent substrate preparation step and the concave side of the plate surface after the conductive composition filling step are pressure-bonded, and the primer layer and the conductive composition in the concave portion are void. A crimping process that closely adheres,
A simultaneous curing step of simultaneously curing the primer layer and the conductive composition after the crimping step;
After the simultaneous curing step, the transparent substrate and the primer layer are peeled off from the plate surface, the conductive composition in the recess is transferred onto the primer layer as a conductive layer, and a first peak made of the primer layer; A transfer step of forming a pattern forming portion having a projecting cross-sectional shape composed of a second peak made of the conductive layer formed above the middle of the first peak;
A plating step of plating a metal layer on the conductive layer after the transfer step, and forming the metal layer directly on at least a part of the ridge below the middle of the first mountain. The manufacturing method of the electromagnetic wave shielding material characterized by the above-mentioned.

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