TW200946427A - Semiconductor die pickup device and pickup metho - Google Patents

Semiconductor die pickup device and pickup metho Download PDF

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Publication number
TW200946427A
TW200946427A TW097136280A TW97136280A TW200946427A TW 200946427 A TW200946427 A TW 200946427A TW 097136280 A TW097136280 A TW 097136280A TW 97136280 A TW97136280 A TW 97136280A TW 200946427 A TW200946427 A TW 200946427A
Authority
TW
Taiwan
Prior art keywords
semiconductor die
cover
suction opening
picked
semiconductor
Prior art date
Application number
TW097136280A
Other languages
English (en)
Chinese (zh)
Other versions
TWI353957B (https=
Inventor
Okito Umehara
Shinichi Sasaki
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200946427A publication Critical patent/TW200946427A/zh
Application granted granted Critical
Publication of TWI353957B publication Critical patent/TWI353957B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
TW097136280A 2008-05-07 2008-09-22 Semiconductor die pickup device and pickup metho TW200946427A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008121460A JP4198745B1 (ja) 2008-05-07 2008-05-07 半導体ダイのピックアップ装置及びピックアップ方法

Publications (2)

Publication Number Publication Date
TW200946427A true TW200946427A (en) 2009-11-16
TWI353957B TWI353957B (https=) 2011-12-11

Family

ID=40239520

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097136280A TW200946427A (en) 2008-05-07 2008-09-22 Semiconductor die pickup device and pickup metho

Country Status (4)

Country Link
JP (1) JP4198745B1 (https=)
KR (1) KR20110014569A (https=)
TW (1) TW200946427A (https=)
WO (1) WO2009136450A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475606B (zh) * 2011-02-28 2015-03-01 晟碟半導體（上海）有限公司 非均勻真空分佈晶粒附著尖端
TWI485786B (zh) * 2012-04-16 2015-05-21 Gallant Micro Machining Co Ltd Grain Stripping Method and Device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG163493A1 (en) 2009-01-22 2010-08-30 Esec Ag Die ejector
JP4397429B1 (ja) 2009-03-05 2010-01-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
CN108962807B (zh) * 2018-09-07 2024-08-30 先进光电器材（深圳）有限公司 自动抓取机构
CN113109357B (zh) * 2021-04-09 2021-11-23 徐州盛科半导体科技有限公司 一种可拆卸的半导体分析装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264203A (ja) * 2002-03-11 2003-09-19 Hitachi Ltd 半導体装置の製造方法
JP4457715B2 (ja) * 2003-04-10 2010-04-28 パナソニック株式会社 チップのピックアップ装置およびピックアップ方法
JP3999744B2 (ja) * 2004-01-05 2007-10-31 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475606B (zh) * 2011-02-28 2015-03-01 晟碟半導體（上海）有限公司 非均勻真空分佈晶粒附著尖端
US9038264B2 (en) 2011-02-28 2015-05-26 Sandisk Semiconductor (Shanghai) Co., Ltd. Non-uniform vacuum profile die attach tip
TWI485786B (zh) * 2012-04-16 2015-05-21 Gallant Micro Machining Co Ltd Grain Stripping Method and Device

Also Published As

Publication number Publication date
JP2009272430A (ja) 2009-11-19
WO2009136450A1 (ja) 2009-11-12
TWI353957B (https=) 2011-12-11
JP4198745B1 (ja) 2008-12-17
KR20110014569A (ko) 2011-02-11

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MM4A Annulment or lapse of patent due to non-payment of fees