KR20110014569A - 반도체 다이의 픽업 장치 및 픽업 방법 - Google Patents

반도체 다이의 픽업 장치 및 픽업 방법 Download PDF

Info

Publication number
KR20110014569A
KR20110014569A KR1020107023438A KR20107023438A KR20110014569A KR 20110014569 A KR20110014569 A KR 20110014569A KR 1020107023438 A KR1020107023438 A KR 1020107023438A KR 20107023438 A KR20107023438 A KR 20107023438A KR 20110014569 A KR20110014569 A KR 20110014569A
Authority
KR
South Korea
Prior art keywords
semiconductor die
holding sheet
lid
suction opening
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107023438A
Other languages
English (en)
Korean (ko)
Inventor
오키토 우메하라
신이치 사사키
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20110014569A publication Critical patent/KR20110014569A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
KR1020107023438A 2008-05-07 2008-06-26 반도체 다이의 픽업 장치 및 픽업 방법 Withdrawn KR20110014569A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-121460 2008-05-07
JP2008121460A JP4198745B1 (ja) 2008-05-07 2008-05-07 半導体ダイのピックアップ装置及びピックアップ方法

Publications (1)

Publication Number Publication Date
KR20110014569A true KR20110014569A (ko) 2011-02-11

Family

ID=40239520

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107023438A Withdrawn KR20110014569A (ko) 2008-05-07 2008-06-26 반도체 다이의 픽업 장치 및 픽업 방법

Country Status (4)

Country Link
JP (1) JP4198745B1 (https=)
KR (1) KR20110014569A (https=)
TW (1) TW200946427A (https=)
WO (1) WO2009136450A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG163493A1 (en) 2009-01-22 2010-08-30 Esec Ag Die ejector
JP4397429B1 (ja) 2009-03-05 2010-01-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
KR20170122287A (ko) * 2011-02-28 2017-11-03 샌디스크 세미컨덕터 (상하이) 컴퍼니, 리미티드 비균일 진공 프로파일 다이 부착 팁
TWI485786B (zh) * 2012-04-16 2015-05-21 Gallant Micro Machining Co Ltd Grain Stripping Method and Device
CN108962807B (zh) * 2018-09-07 2024-08-30 先进光电器材（深圳）有限公司 自动抓取机构
CN113109357B (zh) * 2021-04-09 2021-11-23 徐州盛科半导体科技有限公司 一种可拆卸的半导体分析装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264203A (ja) * 2002-03-11 2003-09-19 Hitachi Ltd 半導体装置の製造方法
JP4457715B2 (ja) * 2003-04-10 2010-04-28 パナソニック株式会社 チップのピックアップ装置およびピックアップ方法
JP3999744B2 (ja) * 2004-01-05 2007-10-31 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置

Also Published As

Publication number Publication date
JP2009272430A (ja) 2009-11-19
WO2009136450A1 (ja) 2009-11-12
TWI353957B (https=) 2011-12-11
JP4198745B1 (ja) 2008-12-17
TW200946427A (en) 2009-11-16

Similar Documents

Publication Publication Date Title
KR100996151B1 (ko) 반도체 다이의 픽업 장치 및 픽업 방법
KR100979474B1 (ko) 반도체 다이의 픽업 장치 및 픽업 방법
JP4927979B2 (ja) 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法
JP4215818B1 (ja) 半導体ダイのピックアップ装置及びピックアップ方法
KR100978360B1 (ko) 반도체 다이의 픽업 장치 및 픽업 방법
KR20110014569A (ko) 반도체 다이의 픽업 장치 및 픽업 방법
KR20150145255A (ko) 반도체 다이의 픽업 장치 및 픽업 방법
CN109037124B (zh) 一种大尺寸超薄芯片阶段化高速剥离装置及其方法
JPH09181150A (ja) 半導体チップのピックアップ装置及びこれを用いたピックアップ方法
KR100874367B1 (ko) 다이 본더와 다이 본더의 열압착 테이프편 절취 및 첩부방법 및 프로그램을 기록한 컴퓨터 판독가능한 기록매체
JP2007103826A (ja) 半導体チップのピックアップ装置
JP2003118859A (ja) 可撓性板状体の取出装置および取出方法
JPWO2008004270A1 (ja) ピックアップ方法およびピックアップ装置
JPH0234174B2 (https=)
JP2010040657A (ja) チップ剥離装置およびチップ剥離方法
JP4613838B2 (ja) チップピックアップ装置およびチップピックアップ方法
KR100914896B1 (ko) 테이프 반송 장치, 방법 및 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R11 Change to the name of applicant or owner or transfer of ownership requested

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R11-ASN-PN2301 (AS PROVIDED BY THE NATIONAL OFFICE)

R13 Change to the name of applicant or owner recorded

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R13-ASN-PN2301 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000