JP4198745B1 - 半導体ダイのピックアップ装置及びピックアップ方法 - Google Patents

半導体ダイのピックアップ装置及びピックアップ方法 Download PDF

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Publication number
JP4198745B1
JP4198745B1 JP2008121460A JP2008121460A JP4198745B1 JP 4198745 B1 JP4198745 B1 JP 4198745B1 JP 2008121460 A JP2008121460 A JP 2008121460A JP 2008121460 A JP2008121460 A JP 2008121460A JP 4198745 B1 JP4198745 B1 JP 4198745B1
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JP
Japan
Prior art keywords
semiconductor die
lid
holding sheet
contact surface
suction opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008121460A
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English (en)
Japanese (ja)
Other versions
JP2009272430A (ja
Inventor
沖人 梅原
真一 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2008121460A priority Critical patent/JP4198745B1/ja
Priority to PCT/JP2008/061610 priority patent/WO2009136450A1/ja
Priority to KR1020107023438A priority patent/KR20110014569A/ko
Priority to TW097136280A priority patent/TW200946427A/zh
Application granted granted Critical
Publication of JP4198745B1 publication Critical patent/JP4198745B1/ja
Publication of JP2009272430A publication Critical patent/JP2009272430A/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
JP2008121460A 2008-05-07 2008-05-07 半導体ダイのピックアップ装置及びピックアップ方法 Expired - Fee Related JP4198745B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008121460A JP4198745B1 (ja) 2008-05-07 2008-05-07 半導体ダイのピックアップ装置及びピックアップ方法
PCT/JP2008/061610 WO2009136450A1 (ja) 2008-05-07 2008-06-26 半導体ダイのピックアップ装置及びピックアップ方法
KR1020107023438A KR20110014569A (ko) 2008-05-07 2008-06-26 반도체 다이의 픽업 장치 및 픽업 방법
TW097136280A TW200946427A (en) 2008-05-07 2008-09-22 Semiconductor die pickup device and pickup metho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008121460A JP4198745B1 (ja) 2008-05-07 2008-05-07 半導体ダイのピックアップ装置及びピックアップ方法

Publications (2)

Publication Number Publication Date
JP4198745B1 true JP4198745B1 (ja) 2008-12-17
JP2009272430A JP2009272430A (ja) 2009-11-19

Family

ID=40239520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008121460A Expired - Fee Related JP4198745B1 (ja) 2008-05-07 2008-05-07 半導体ダイのピックアップ装置及びピックアップ方法

Country Status (4)

Country Link
JP (1) JP4198745B1 (https=)
KR (1) KR20110014569A (https=)
TW (1) TW200946427A (https=)
WO (1) WO2009136450A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101621561B1 (ko) 2009-01-22 2016-05-16 에섹 에스에이 다이 이젝터
CN113109357A (zh) * 2021-04-09 2021-07-13 徐州盛科半导体科技有限公司 一种可拆卸的半导体分析装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4397429B1 (ja) 2009-03-05 2010-01-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
KR20170122287A (ko) * 2011-02-28 2017-11-03 샌디스크 세미컨덕터 (상하이) 컴퍼니, 리미티드 비균일 진공 프로파일 다이 부착 팁
TWI485786B (zh) * 2012-04-16 2015-05-21 Gallant Micro Machining Co Ltd Grain Stripping Method and Device
CN108962807B (zh) * 2018-09-07 2024-08-30 先进光电器材（深圳）有限公司 自动抓取机构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264203A (ja) * 2002-03-11 2003-09-19 Hitachi Ltd 半導体装置の製造方法
JP4457715B2 (ja) * 2003-04-10 2010-04-28 パナソニック株式会社 チップのピックアップ装置およびピックアップ方法
JP3999744B2 (ja) * 2004-01-05 2007-10-31 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101621561B1 (ko) 2009-01-22 2016-05-16 에섹 에스에이 다이 이젝터
CN113109357A (zh) * 2021-04-09 2021-07-13 徐州盛科半导体科技有限公司 一种可拆卸的半导体分析装置

Also Published As

Publication number Publication date
JP2009272430A (ja) 2009-11-19
WO2009136450A1 (ja) 2009-11-12
TWI353957B (https=) 2011-12-11
TW200946427A (en) 2009-11-16
KR20110014569A (ko) 2011-02-11

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