TW200944331A - Surface treatment method, showerhead, treatment container, and treatment apparatus using same - Google Patents

Surface treatment method, showerhead, treatment container, and treatment apparatus using same Download PDF

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Publication number
TW200944331A
TW200944331A TW098108759A TW98108759A TW200944331A TW 200944331 A TW200944331 A TW 200944331A TW 098108759 A TW098108759 A TW 098108759A TW 98108759 A TW98108759 A TW 98108759A TW 200944331 A TW200944331 A TW 200944331A
Authority
TW
Taiwan
Prior art keywords
sandblasting
base material
surface treatment
treatment method
metal base
Prior art date
Application number
TW098108759A
Other languages
English (en)
Chinese (zh)
Inventor
Takashi Kakegawa
Kensaku Narushima
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200944331A publication Critical patent/TW200944331A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/003—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/06—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for producing matt surfaces, e.g. on plastic materials, on glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00—Selection of abrasive materials or additives for abrasive blasts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0254—Physical treatment to alter the texture of the surface, e.g. scratching or polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cleaning In General (AREA)
TW098108759A 2008-03-19 2009-03-18 Surface treatment method, showerhead, treatment container, and treatment apparatus using same TW200944331A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008071718 2008-03-19

Publications (1)

Publication Number Publication Date
TW200944331A true TW200944331A (en) 2009-11-01

Family

ID=41090987

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098108759A TW200944331A (en) 2008-03-19 2009-03-18 Surface treatment method, showerhead, treatment container, and treatment apparatus using same

Country Status (6)

Country Link
US (2) US20110061432A1 (fr)
JP (1) JP2009255277A (fr)
KR (1) KR20100138864A (fr)
CN (1) CN101842193A (fr)
TW (1) TW200944331A (fr)
WO (1) WO2009116588A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI722089B (zh) * 2016-01-15 2021-03-21 日商東京威力科創股份有限公司 載置台之表面處理方法、載置台及電漿處理裝置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102154630A (zh) * 2010-09-30 2011-08-17 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体反应腔室及其设备、部件的制造方法和处理基片的方法
CN102152438A (zh) * 2010-11-30 2011-08-17 常州市依斯特互感器有限公司 套管座注塑工艺
JP5800601B2 (ja) * 2011-06-27 2015-10-28 キヤノン株式会社 表面処理方法及び電子写真感光体の製造方法
KR101987943B1 (ko) * 2017-12-11 2019-06-12 주식회사 싸이노스 금속부재의 클리닝 방법
JP7180984B2 (ja) * 2018-03-01 2022-11-30 株式会社ニューフレアテクノロジー 気相成長方法
JP7164332B2 (ja) * 2018-06-20 2022-11-01 株式会社ニューフレアテクノロジー 気相成長装置
CN110923644B (zh) * 2020-02-12 2020-06-19 上海陛通半导体能源科技股份有限公司 用于反应溅射的物理气相沉积设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2632141B2 (ja) * 1995-06-23 1997-07-23 ショーボンド建設株式会社 研掃方法
JP3015713B2 (ja) * 1995-07-06 2000-03-06 株式会社東芝 金属廃棄物の除染処理方法およびその装置
JP3961665B2 (ja) * 1998-04-22 2007-08-22 澁谷工業株式会社 洗浄剥離方法及びその装置
JP2002115068A (ja) * 2000-10-11 2002-04-19 Applied Materials Inc シャワーヘッド、基板処理装置および基板製造方法
US6648982B1 (en) * 2001-06-11 2003-11-18 Quantum Global Technologies, Llc Steam cleaning system and method for semiconductor process equipment
US6554909B1 (en) * 2001-11-08 2003-04-29 Saint-Gobain Ceramics & Plastics, Inc. Process for cleaning components using cleaning media
JP3958080B2 (ja) * 2002-03-18 2007-08-15 東京エレクトロン株式会社 プラズマ処理装置内の被洗浄部材の洗浄方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI722089B (zh) * 2016-01-15 2021-03-21 日商東京威力科創股份有限公司 載置台之表面處理方法、載置台及電漿處理裝置

Also Published As

Publication number Publication date
US20110061432A1 (en) 2011-03-17
JP2009255277A (ja) 2009-11-05
WO2009116588A1 (fr) 2009-09-24
US20120115400A1 (en) 2012-05-10
KR20100138864A (ko) 2010-12-31
CN101842193A (zh) 2010-09-22

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