TW200944307A - Method of making silver alloy solder wire for package wire and product thereof - Google Patents

Method of making silver alloy solder wire for package wire and product thereof Download PDF

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Publication number
TW200944307A
TW200944307A TW97114719A TW97114719A TW200944307A TW 200944307 A TW200944307 A TW 200944307A TW 97114719 A TW97114719 A TW 97114719A TW 97114719 A TW97114719 A TW 97114719A TW 200944307 A TW200944307 A TW 200944307A
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Taiwan
Prior art keywords
silver alloy
wire
alloy wire
component
silver
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Application number
TW97114719A
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Chinese (zh)
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TWI323199B (en
Inventor
jun-de Li
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jun-de Li
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Priority to TW97114719A priority Critical patent/TW200944307A/en
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Publication of TWI323199B publication Critical patent/TWI323199B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)

Abstract

This invention provides a method of making silver alloy solder wire for package wire, comprising: first, preparing a major metal raw material containing silver; then adding the metal raw material into a vacuum furnace for melting and adding several minor metal raw materials into the vacuum furnace to fabricate a silver alloy ingot; then stretching the silver alloy ingot to form a silver alloy wire; and finally, stretching the silver alloy wire to form a silver alloy solder wire with a predetermined diameter. The silver alloy solder wire made of several kinds of metal material can provide the function of metal solder wire made of pure gold and can largely reduce the costs.

Description

200944307 九、發明說明： 【發明所屬之技術領域】 本發明是關於-種金屬銲線’尤指—種用 裴製程中的銀合金銲線的製法及其成品。 、 ， 【先前技術】 绩、查Ϊ導體疋件之封裝製程中，常以打線接合將金屬鋅 =連接至晶片及電路基板上，藉金屬鋅㈣連接於晶片與 路基板，以作為w與電路基板之間的崎及電流 路徑。 一般來說’金屬銲線之荷重強度、延展性、彎曲度、 熔點電性、硬度及與Ic晶#的銲接能力等主要特性與其 所採用的材料相關。而上述特性將影響半導體元件的壽命 及穩定性。依照晶片與電路基板的型態不同，其搭配使用 之金屬銲線的規格亦有所不同。 傳統金屬銲線主要為純金材質所製成。純金材質的金 屬銲線具有較佳的延展性及導電性等物理性質，但 於純金材質的金屬銲線成本較高，也造成整體半導體元件 成本增加。 因此，對於上述問題，如何開發一種能達到純金銲線 的功效，並可大幅降低材料成本的金屬銲線，乃是本發明 主要所要解決之課題。 【發明内容】 因此，本發明之目的，在於提供一種以兩種或兩種以 上的金屬7L素調配製成，可達到純金材質的金屬銲線的功 5 200944307 效，並可降低成本之封裝導線用之銀合金銲線。 為達上述目的，本發明提供一種封裝導線用之銀合金 銲線之製法··首先備有—銀成份之主要金屬原料，然後， :該主要金屬原“料置於一真空熔爐進行熔$，並在該真空 熔爐中加入次要金屬原料進行混合熔煉，以製成一具有 90.00〜99.99 %之銀（Ag)成分的銀合金鑄塊，接$，將該銀 合金鑄塊拉伸形成—銀合金線材；最後，將該銀合金線材 拉伸成為具有一預定線徑之銀合金銲線。200944307 IX. Description of the Invention: [Technical Field] The present invention relates to a metal wire bonding wire, and more particularly to a method for producing a silver alloy wire in a bismuth process and a finished product thereof. [, prior art] In the packaging process of the performance and inspection of the conductors, the metal zinc is often connected to the wafer and the circuit substrate by wire bonding, and is connected to the wafer and the substrate by the metal zinc (4) as the w and the circuit. The current path between the substrates. In general, the main characteristics of the load strength, ductility, bending, melting point electrical properties, hardness, and welding ability of Ic Crystal # are related to the materials used. The above characteristics will affect the life and stability of the semiconductor device. Depending on the type of the chip and the circuit board, the specifications of the metal wire used in combination are also different. Traditional metal wire is mainly made of pure gold. The metal wire of pure gold has good physical properties such as ductility and electrical conductivity, but the high cost of the metal wire of pure gold material also increases the cost of the overall semiconductor component. Therefore, for the above problems, how to develop a metal bonding wire which can achieve the effect of a pure gold bonding wire and can greatly reduce the material cost is the main problem to be solved by the present invention. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a packaged wire which can be made of two or more kinds of metal 7L, which can achieve a metal bond wire of pure gold material and can reduce the cost. Silver alloy wire used. In order to achieve the above object, the present invention provides a method for preparing a silver alloy wire for encapsulating a wire. First, a main metal material of a silver component is prepared, and then: the main metal material is placed in a vacuum furnace for melting, And adding a secondary metal raw material to the vacuum melting furnace for mixed smelting to form a silver alloy ingot having a silver (Ag) composition of 90.00 to 99.99%, and then drawing the silver alloy ingot to form a silver The alloy wire; finally, the silver alloy wire is drawn into a silver alloy wire having a predetermined wire diameter.

以上述製法所製得之銀合金銲線，其組成成分主要包 含90.00〜99.99 %的銀（Ag)成分。 本發明藉由兩種或兩種以上的金屬元素調配製成之銀 口金鋒線’不僅能制純金製成的金屬銲線的功效，並且 可以大幅降低成本。 【實施方式】 有關 下 本發明之技街内容及詳細說明 的制及第二圖所^分別為本發明之銀合金銲線 二Cm:如圖所示，本發明 -具f主二原:先’在步驟對’先備有 要金=料中’進行溶煉製造’將銀成份的主 且，在真（如步驟職）進行溶煉，並 料進行混^煉it具有金（Au)及銅_之次要金屬原 (如步驟102b) ’以藉由真空熔爐煉製出一 6 200944307 銀合金鑄塊（如步驟102c)。該銀合金鑄塊的組成成分包 含：重量百分比為90.00〜99.99 %的銀、重量百分比為 0.0001〜9.9997 %的金，以及重量百分比為0.0001〜9.9997 % 的銅。 此外，更可在步驟102的溶煉過程中加入微量金屬原 料，使煉製出之銀合金鑄塊之組成成分更具有重量百分比 為0.0001〜9.9997 %的鈹（Be)，以及重量百分比為 0.0001〜9.9997 % 的鋁（A1)。 ❹ 然後，再將銀合金鑄塊經由連續鑄造以拉伸形成一預 定線徑為4〜8 mm的銀合金線材（如步驟102d)。再透過捲收 機捲取該銀合金線材（如步驟102e)，並進行銀合金線材的 成份分析（如步驟l〇2f)，以判斷其成分比例是否符合要 求。 步驟104，對鑄造完成之銀合金線材進行拉伸，使其 原本為4〜8mm的線徑經過一第一粗伸線機的拉伸縮小至 3mm或3mm以下（如步驟104a)，再經一第二粗伸線機拉伸 至1.00mm或1.00mm以下（如步驟104b)，再經一第一細伸線 機拉伸至0.50 mm或0.50 mm以下（如步驟104c)，然後， 再將0.50mm或0.50mm以下的銀合金線材依序經過一第二細 伸線機（步驟l〇4d)、一極細伸線機（步驟104e)，以及一超 極細伸線機（步驟104f)將銀合金線材拉伸為一預定線徑為 0.0508mm (2.00mil)至 0.010mm (0.40mil)範圍的特定銀合金銲 線。 步驟106，進行表面清洗，對銀合金銲線之表面進行 7 200944307 清洗。 步驟108，將經過拉伸完成的銀合金銲線進行熱退火 處理，使銀合金銲線之斷裂荷重（BreakingLoad)及斷裂應變 (Elongation)等物理性質符合預定之所需範圍。 上述本發明之銀合金銲線可應用於1C、LED及SAW封 裝作為導線之用。 以下藉數個實施例對本發明進行更詳細的說明： &lt;實施例1&gt; ❹ 將銀成分的主要金屬原料置入於真空熔爐進行熔煉製 造，並在真空熔爐中加入金及銅等次要金屬原料，更加入 鈹及鋁等微量金屬原料進行混合調配，然後，由真空熔爐 混合炫煉煉製出銀合金鑄塊。銀合金鑄塊之組成成分包 含：重量百分比為98.659%的銀、重量百分比為0.50%的 金、重量百分比為0.84%的銅、重量百分比為0.0008%的 鈹，以及重量百分比為0.0002%的銘。 將該銀合金鑄塊經由連續鎊造以拉伸出線徑為6 mm的 銀合金線材。通過捲收機捲取銀合金線材，並進行銀合金 線材的成份分析。 在銀合金線材鑄造完成後，進行線徑拉伸，使原本為 6 mm的線徑經過第一粗伸線機拉伸至3mm，經過第二粗伸 線機拉伸至1.00mm，經過第一細伸線機拉伸至0.50mm，再 將0.50mm的銀合金線材依序經過第二細伸線機、極細伸線 機，以及超極細伸線機，將銀合金線材拉伸為一預定線徑 為0.0508mm至0.010mm範圍的特定銀合金鋅線。 8 200944307 最後，對經過拉伸完成的銀合金銲線表面進行清洗， 並對銀合金銲線進行熱退火處理。 &lt;實施例2&gt; 將銀成分的主要金屬原料置入於真空熔爐進行熔煉製 造，並在真空熔爐中加入金及銅等次要金屬原料，更加入 鈹及鋁等微量金屬原料進行混合調配，然後，由真空熔爐 混合熔煉煉製出銀合金鑄塊。銀合金鑄塊之組成成分包 含：重量百分比為99.99%的銀、重量百分比為0.005%的 ❹金、重量百分比為0.003%的銅、重量百分比為0.001%的 鈹，以及重量百分比為0.001%的鋁。 將該銀合金鑄塊經由連續鑄造以拉伸出線徑為6 mm的 銀合金線材。通過捲收機捲取銀合金線材，並進行銀合金 線材的成份分析。 在銀合金線材鑄造完成後，進行線徑拉伸，使原本為 6 mm的線徑經過第一粗伸線機拉伸至3mm，經過第二粗伸 線機拉伸至0.8mm，經過第一細伸線機拉伸至0.45mm，再 將0.45mm的銀合金線材依序經過第二細伸線機、極細伸線 機，以及超極細伸線機，將銀合金線材拉伸為一預定線徑 為0.0508mm至0.010mm範圍的特定銀合金銲線。 最後，對經過拉伸完成的銀合金銲線表面進行清洗， 並對銀合金銲線進行熱退火處理。 &lt;實施例3&gt; 將銀成分的主要金屬原料置入於真空熔爐進行熔煉製 造，並在真空熔爐中加入金及銅等次要金屬原料，更加入 9 200944307 鈹及鋁等微量金屬原料進行混合調配，然後，由真空熔爐 混合熔煉煉製出銀合金鑄塊。銀合金鑄塊之組成成分包 含：重量百分比為95%的銀、重量百分比為1.25%的金、 重量百分比為1.25%的銅、重量百分比為1.25%的鈹，以 及重量百分比為1.25%的銘。 將該銀合金鎊塊經由連續鑄造以拉伸出線徑為6 mm的 銀合金線材。通過捲收機捲取銀合金線材，並進行銀合金 線材的成份分析。 ❹ 在銀合金線材鑄造完成後，進行線徑拉伸，使原本為 6 mm的線徑經過第一粗伸線機拉伸至3mm，經過第二粗伸 線機拉伸至0.9mm，經過第一細伸線機拉伸至0.45mm，再 將0.45mm的銀合金線材依序經過第二細伸線機、極細伸線 機，以及超極細伸線機，將銀合金線材拉伸為一預定線徑 為0.0508mm至0.010mm範圍的特定銀合金銲線。 最後，對經過拉伸完成的銀合金銲線表面進行清洗， 並對銀合金銲線進行熱退火處理。 ❹ — W &lt;實施例4&gt; 將銀成分的主要金屬原料置入於真空熔爐進行熔煉製 造，並在真空熔爐中加入金及銅等次要金屬原料，更加入 鈹及鋁等微量金屬原料進行混合調配，然後，由真空熔爐 混合熔煉煉製出銀合金鑄塊。銀合金鑄塊之組成成分包 含：重量百分比為90%的銀、重量百分比為0.0001%的金、 重量百分比為0.0001%的銅、重量百分比為9.9997%的鈹，以 及重量百分比為0.0001%的鋁。 200944307 將該銀合金鑄塊經由連續鑄造以拉伸出線徑為4 mm的 銀合金線材。通過捲收機捲取銀合金線材，並進行銀合金 線材的成份分析。 在銀合金線材鑄造完成後，進行線徑拉伸，使原本為 4 mm的線徑經過第一粗伸線機拉伸至2.5mm，經過第二粗 伸線機拉伸至〇.9mm，經過第一細伸線機拉伸至0.45mm， 再將0.45mm的銀合金線材依序經過第二細伸線機、極細伸 線機，以及超極細伸線機，將銀合金線材拉伸為一預定線 ❹徑為0.0508mm至0.010mm範圍的特定銀合金銲線。 最後，對經過拉伸完成的銀合金銲線表面進行清洗， 並對銀合金銲線進行熱退火處理。 &lt;實施例5&gt; 將銀成分的主要金屬原料置入於真空熔爐進行熔煉製 造，並在真空熔爐中加入金及銅等次要金屬原料，更加入 鈹及鋁等微量金屬原料進行混合調配，然後，由真空熔爐 混合熔煉煉製出銀合金鑄塊。銀合金鑄塊之組成成分包 ®含：重量百分比為90%的銀、重量百分比為9.9997%的金、 重量百分比為0.0001%的銅、重量百分比為0.0001%的鈹，以 及重量百分比為0.0001%的鋁。 將該銀合金鑄塊經由連續鑄造以拉伸出線徑為8mm的 銀合金線材。通過捲收機捲取銀合金線材，並進行銀合金 線材的成份分析。 在銀合金線材鑄造完成後，進行線徑拉伸，使原本為 8 mm的線徑經過第一粗伸線機拉伸至2mm，經過第二粗伸 11 200944307 線機拉伸至0.9mm，經過第一細伸線機拉伸至0.45mm，再 將0.45mm的銀合金線材依序經過第二細伸線機、極細伸線 機，以及超極細伸線機，將銀合金線材拉伸為一預定線徑 為0.0508mm至0.010mm範圍的特定銀合金銲線。 最後，對經過拉伸完成的銀合金銲線表面進行清洗， 並對銀合金銲線進行熱退火處理。 〈實施例6&gt; 將銀成分的主要金屬原料置入於真空熔爐進行熔煉製 ❹造，並在真空熔爐中加入金及銅等次要金屬原料，更加入 鈹及鋁等微量金屬原料進行混合調配，然後，由真空熔爐 混合熔煉煉製出銀合金鑄塊。銀合金鑄塊之組成成分包 含：重量百分比為90%的銀、重量百分比為0.0001%的金、 重量百分比為0.0001%的銅、重量百分比為0.0001%的鈹，以 及重量百分比為9.9997%的紹。 將該銀合金鑄塊經由連續鑄造以拉伸出線徑為6 mm的 銀合金線材。通過捲收機捲取銀合金線材，並進行銀合金 線材的成份分析。 在銀合金線材鑄造完成後，進行線徑拉伸，使原本為 6 mm的線徑經過第一粗伸線機拉伸至3mm，經過第二粗伸 線機拉伸至0.9mm，經過第一細伸線機拉伸至0.45mm，再 將0.45_的銀合金線材依序經過第二細伸線機、極細伸線 機，以及超極細伸線機，將銀合金線材拉伸為一預定線徑 為0.0508mm至0.010mm範圍的特定銀合金銲線。 最後，對經過拉伸完成的銀合金銲線表面進行清洗， 12 200944307 並對銀合金銲線進行熱退火處理。 &lt;實施例7&gt; 將銀成分的主要金屬原料置入於真空熔爐進行熔煉製 造，並在真空溶爐中加入金及銅等次要金屬原料，更加入 鈹及鋁等微量金屬原料進行混合調配，然後，由真空熔爐 混合熔煉煉製出銀合金鑄塊。銀合金鑄塊之組成成分包 含：重量百分比為90%的銀、重量百分比為0.0001%的金、 重量百分比為9.9997%的銅、重量百分比為0.0001%的鈹，以 ❹及重量百分比為0.0001%的鋁。 將該銀合金鑄塊經由連續鑄造以拉伸出線徑為6 mm的 銀合金線材。通過捲收機捲取銀合金線材，並進行銀合金 線材的成份分析。 在銀合金線材鑄造完成後，進行線徑拉伸，使原本為 6 mm的線徑經過第一粗伸線機拉伸至2mm，經過第二粗伸 線機拉伸至0.9mm，經過第一細伸線機拉伸至0.45mm，再 將0.45mm的銀合金線材依序經過第二細伸線機、極細伸線 W 機，以及超極細伸線機，將銀合金線材拉伸為一預定線徑 為0.0508mm至0.010mm範圍的特定銀合金銲線。 最後，對經過拉伸完成的銀合金銲線表面進行清洗， 並對銀合金銲線進行熱退火處理。 綜上所述，本發明藉由兩種或兩種以上的金屬元素調 配製成之銀合金銲線，能達到純金製成的金屬銲線的功 效，且可大幅降低成本，確實達成本發明之功效。 上述僅為本發明之較佳實施例而已，並非用來限定本 13 200944307 發明實敵範目。即凡財發㈣請專 變化與修飾，皆為本發明專# *明做的均專 【圖式簡單說明】 斤涵篕。 第一圖係本發明之銀合金 奸線之制 第二圖係第一圖之細部流# i法的流程圖。 r 士 ® L心圖。 要元件符號說明】 步騍100〜108 Ο 步驟102a〜102f 步驟104a〜104f ❹ 14The silver alloy wire prepared by the above method mainly comprises a silver (Ag) component of 90.00 to 99.99%. The silver gilt line made by the two or more metal elements of the present invention not only can produce the effect of the metal wire made of pure gold, but also can greatly reduce the cost. [Embodiment] The following is a description of the contents of the technical street and the detailed description of the present invention, and the second figure is respectively a silver alloy wire 2Cm of the present invention: as shown in the figure, the present invention has a main body: 'In the step of 'prepared with the required gold = material in the 'refining manufacturing' the silver component of the main, and in the true (such as the step) to smelt, and the material is mixed and refined it has gold (Au) and The secondary metal of copper (as in step 102b) 'to refine a 6 200944307 silver alloy ingot by vacuum melting furnace (as in step 102c). The composition of the silver alloy ingot comprises: silver in an amount of 90.00 to 99.99% by weight, gold in an amount of 0.0001 to 9.9977% by weight, and copper in an amount of 0.0001 to 9.997% by weight. In addition, a trace amount of metal raw material may be added during the smelting process of step 102, so that the composition of the refined silver alloy ingot is more than 0.0001 to 9.997% by weight of beryllium (Be), and the weight percentage is 0.0001~ 9.9997 % aluminum (A1). ❹ Then, the silver alloy ingot is further stretched by continuous casting to form a silver alloy wire having a predetermined wire diameter of 4 to 8 mm (step 102d). The silver alloy wire is then taken up by a reel (e.g., step 102e), and the composition of the silver alloy wire is analyzed (e.g., step l〇2f) to determine whether the composition ratio meets the requirements. In step 104, the cast silver alloy wire is stretched so that the wire diameter of 4~8 mm is reduced to 3 mm or less by a first thick wire drawing machine (step 104a), and then The second thick wire drawing machine is stretched to 1.00 mm or less (as in step 104b), and then stretched to 0.50 mm or less by a first thin wire drawing machine (as in step 104c), and then 0.50. The silver alloy wire of mm or less than 0.50 mm is sequentially passed through a second thin wire drawing machine (step l〇4d), a very fine wire drawing machine (step 104e), and a superfine wire drawing machine (step 104f) to form a silver alloy. The wire is stretched to a specific silver alloy wire having a predetermined wire diameter ranging from 0.0508 mm (2.00 mil) to 0.010 mm (0.40 mil). In step 106, surface cleaning is performed, and the surface of the silver alloy bonding wire is cleaned by 7 200944307. In step 108, the stretched silver alloy wire is thermally annealed so that the physical properties such as the breaking load and the breaking strain of the silver alloy wire meet the predetermined range. The above-described silver alloy wire of the present invention can be applied to 1C, LED and SAW packages for use as wires. The present invention will be described in more detail below by way of several examples: &lt;Example 1&gt; ❹ The main metal raw material of the silver component is placed in a vacuum furnace for smelting, and a secondary metal such as gold or copper is added to the vacuum melting furnace. The raw materials are further mixed with a trace amount of metal materials such as barium and aluminum, and then mixed and refined by a vacuum furnace to produce a silver alloy ingot. The composition of the silver alloy ingot comprises: 98.659% by weight of silver, 0.50% by weight of gold, 0.84% by weight of copper, 0.0008% by weight of cerium, and 0.0002% by weight. The silver alloy ingot was drawn through a continuous pound to extrude a silver alloy wire having a wire diameter of 6 mm. The silver alloy wire was taken up by a reeling machine, and the composition analysis of the silver alloy wire was performed. After the casting of the silver alloy wire is completed, the wire diameter is stretched, and the original 6 mm wire diameter is stretched to 3 mm through the first thick wire drawing machine, and stretched to 1.00 mm through the second thick wire drawing machine, after the first The thin wire drawing machine is stretched to 0.50 mm, and then the 0.50 mm silver alloy wire is sequentially passed through the second thin wire drawing machine, the ultrafine wire drawing machine, and the ultra-fine wire drawing machine to stretch the silver alloy wire into a predetermined line. A specific silver alloy zinc wire having a diameter in the range of 0.0508 mm to 0.010 mm. 8 200944307 Finally, the surface of the stretched silver alloy wire is cleaned and the silver alloy wire is thermally annealed. &lt;Example 2&gt; The main metal raw material of the silver component is placed in a vacuum melting furnace to be melt-smelted, and a secondary metal raw material such as gold or copper is added to the vacuum melting furnace, and a trace amount of a metal raw material such as barium or aluminum is further mixed and mixed. Then, a silver alloy ingot is obtained by mixing and melting in a vacuum furnace. The composition of the silver alloy ingot comprises: 99.99% by weight of silver, 0.005% by weight of ruthenium, 0.003% by weight of copper, 0.001% by weight of ruthenium, and 0.001% by weight of aluminum. . The silver alloy ingot was continuously cast to obtain a silver alloy wire having a wire diameter of 6 mm. The silver alloy wire was taken up by a reeling machine, and the composition analysis of the silver alloy wire was performed. After the casting of the silver alloy wire is completed, the wire diameter is stretched, and the original wire diameter of 6 mm is stretched to 3 mm by the first thick drawing machine, and stretched to 0.8 mm by the second thick drawing machine, after the first The thin wire drawing machine is stretched to 0.45 mm, and then the 0.45 mm silver alloy wire is sequentially passed through the second thin wire drawing machine, the ultra-fine wire drawing machine, and the ultra-fine wire drawing machine to stretch the silver alloy wire into a predetermined line. Specific silver alloy wire with a diameter in the range of 0.0508mm to 0.010mm. Finally, the surface of the stretched silver alloy wire is cleaned and the silver alloy wire is thermally annealed. &lt;Example 3&gt; The main metal raw material of the silver component was placed in a vacuum melting furnace for smelting production, and a secondary metal material such as gold and copper was added to the vacuum melting furnace, and a trace amount of metal materials such as lanthanum and aluminum were mixed for mixing. The mixture is then blended and smelted in a vacuum furnace to produce a silver alloy ingot. The composition of the silver alloy ingot comprises: 95% by weight of silver, 1.25% by weight of gold, 1.25% by weight of copper, 1.25% by weight of bismuth, and 1.25% by weight. The silver alloy pound block was continuously cast to extrude a silver alloy wire having a wire diameter of 6 mm. The silver alloy wire was taken up by a reeling machine, and the composition analysis of the silver alloy wire was performed. ❹ After the casting of the silver alloy wire is completed, the wire diameter is stretched, and the original 6 mm wire diameter is stretched to 3 mm by the first thick wire drawing machine, and is stretched to 0.9 mm by the second thick wire drawing machine. A fine wire drawing machine is stretched to 0.45 mm, and then the 0.45 mm silver alloy wire is sequentially passed through a second thin wire drawing machine, a very fine wire drawing machine, and an ultra-fine wire drawing machine to stretch the silver alloy wire into a predetermined one. Specific silver alloy wire with a wire diameter in the range of 0.0508mm to 0.010mm. Finally, the surface of the stretched silver alloy wire is cleaned and the silver alloy wire is thermally annealed. ❹ — W &lt;Example 4&gt; The main metal raw material of the silver component is placed in a vacuum furnace for smelting, and a secondary metal material such as gold and copper is added to the vacuum melting furnace, and a trace amount of metal materials such as bismuth and aluminum are further added. The mixture is blended, and then a silver alloy ingot is obtained by mixing and melting in a vacuum furnace. The composition of the silver alloy ingot comprises: 90% by weight of silver, 0.0001% by weight of gold, 0.0001% by weight of copper, 9.997% by weight of bismuth, and 0.0001% by weight of aluminum. 200944307 The silver alloy ingot was continuously cast to extrude a silver alloy wire having a wire diameter of 4 mm. The silver alloy wire was taken up by a reeling machine, and the composition analysis of the silver alloy wire was performed. After the casting of the silver alloy wire is completed, the wire diameter is stretched, and the original wire diameter of 4 mm is stretched to 2.5 mm through the first thick wire drawing machine, and is stretched to 〇.9 mm through the second thick wire drawing machine. The first thin wire drawing machine is stretched to 0.45 mm, and then the 0.45 mm silver alloy wire is sequentially passed through the second thin wire drawing machine, the ultrafine wire drawing machine, and the ultra-fine wire drawing machine to stretch the silver alloy wire into one. A specific silver alloy wire having a predetermined diameter in the range of 0.0508 mm to 0.010 mm. Finally, the surface of the stretched silver alloy wire is cleaned and the silver alloy wire is thermally annealed. &lt;Example 5&gt; The main metal raw material of the silver component is placed in a vacuum melting furnace for smelting production, and a secondary metal raw material such as gold or copper is added to the vacuum melting furnace, and a trace amount of metal raw materials such as bismuth and aluminum are further mixed and mixed. Then, a silver alloy ingot is obtained by mixing and melting in a vacuum furnace. The composition of the silver alloy ingot package contains: 90% by weight of silver, 9.997% by weight of gold, 0.0001% by weight of copper, 0.0001% by weight of bismuth, and 0.0001% by weight. aluminum. This silver alloy ingot was continuously cast to obtain a silver alloy wire having a wire diameter of 8 mm. The silver alloy wire was taken up by a reeling machine, and the composition analysis of the silver alloy wire was performed. After the casting of the silver alloy wire is completed, the wire diameter is stretched, and the original wire diameter of 8 mm is stretched to 2 mm through the first thick wire drawing machine, and is stretched to 0.9 mm through the second thick stretch 11 200944307 wire machine. The first thin wire drawing machine is stretched to 0.45 mm, and then the 0.45 mm silver alloy wire is sequentially passed through a second thin wire drawing machine, a very fine wire drawing machine, and an ultra-fine wire drawing machine to stretch the silver alloy wire into one. A specific silver alloy wire having a predetermined wire diameter ranging from 0.0508 mm to 0.010 mm. Finally, the surface of the stretched silver alloy wire is cleaned and the silver alloy wire is thermally annealed. <Example 6> The main metal raw material of the silver component was placed in a vacuum melting furnace to be smelted and manufactured, and a secondary metal raw material such as gold or copper was added to the vacuum melting furnace, and a trace amount of metal materials such as bismuth and aluminum were further mixed and mixed. Then, a silver alloy ingot is obtained by mixing and melting in a vacuum furnace. The composition of the silver alloy ingot comprises: 90% by weight of silver, 0.0001% by weight of gold, 0.0001% by weight of copper, 0.0001% by weight of cerium, and 9.997% by weight. The silver alloy ingot was continuously cast to obtain a silver alloy wire having a wire diameter of 6 mm. The silver alloy wire was taken up by a reeling machine, and the composition analysis of the silver alloy wire was performed. After the casting of the silver alloy wire is completed, the wire diameter is stretched, and the original 6 mm wire diameter is stretched to 3 mm through the first thick wire drawing machine, and stretched to 0.9 mm through the second thick wire drawing machine, after the first The fine wire drawing machine is stretched to 0.45 mm, and then the 0.45_ silver alloy wire is sequentially passed through the second thin wire drawing machine, the ultrafine wire drawing machine, and the ultra-fine wire drawing machine to stretch the silver alloy wire into a predetermined line. Specific silver alloy wire with a diameter in the range of 0.0508mm to 0.010mm. Finally, the surface of the stretched silver alloy wire is cleaned, 12 200944307 and the silver alloy wire is thermally annealed. &lt;Example 7&gt; The main metal raw material of the silver component is placed in a vacuum melting furnace for smelting production, and a secondary metal raw material such as gold or copper is added to the vacuum melting furnace, and a trace amount of metal raw materials such as bismuth and aluminum are further added for mixing and blending. Then, a silver alloy ingot is obtained by mixing and melting in a vacuum furnace. The composition of the silver alloy ingot comprises: 90% by weight of silver, 0.0001% by weight of gold, 9.997% by weight of copper, 0.0001% by weight of bismuth, and by weight of 0.0001% by weight. aluminum. The silver alloy ingot was continuously cast to obtain a silver alloy wire having a wire diameter of 6 mm. The silver alloy wire was taken up by a reeling machine, and the composition analysis of the silver alloy wire was performed. After the casting of the silver alloy wire is completed, the wire diameter is stretched, and the original 6 mm wire diameter is stretched to 2 mm through the first thick wire drawing machine, and stretched to 0.9 mm through the second thick wire drawing machine, after the first The fine wire drawing machine is stretched to 0.45 mm, and then the 0.45 mm silver alloy wire is sequentially passed through the second thin wire drawing machine, the ultrafine wire drawing machine, and the ultra-fine wire drawing machine to stretch the silver alloy wire into a predetermined one. Specific silver alloy wire with a wire diameter in the range of 0.0508mm to 0.010mm. Finally, the surface of the stretched silver alloy wire is cleaned and the silver alloy wire is thermally annealed. In summary, the silver alloy wire prepared by blending two or more metal elements can achieve the effect of a metal wire made of pure gold, and can greatly reduce the cost, and indeed achieve the present invention. efficacy. The foregoing is only a preferred embodiment of the present invention and is not intended to limit the scope of the invention. That is to say, where the financial development (four) please change and modify, are the specialization of the invention # * Ming do the uniform [simplified diagram] Jin Han Han. The first figure is the system of the silver alloy of the present invention. The second figure is the flow chart of the detail flow of the first figure. r 士 ® L heart map. Element symbol description] Steps 100~108 Ο Steps 102a to 102f Steps 104a to 104f ❹ 14

Claims (1)

200944307 十、申請專利範園： 1 種封裝導線用之銀合金銲線的製法，包含： ⑻備有一為銀成份之主要金屬原料； (b)將該主要金屬原料置於一真空熔爐進行熔煉，並 在该真空熔爐中加入金成份及銅成分之次要金屬 疋素進行混合熔煉，以製成一銀合金鑄塊； ❹ （）將銀合金鑄塊拉伸形成一銀合金線材；及 ()將銀合金線材拉伸為一預定線徑的銀合金銲線。200944307 X. Application for Patent Park: A method for preparing a silver alloy wire for packaging wires, comprising: (8) preparing a main metal material which is a silver component; (b) placing the main metal material in a vacuum furnace for melting, And adding a gold component and a copper component of the secondary metal sulphate to the vacuum melting furnace to prepare a silver alloy ingot; ❹ () stretching the silver alloy ingot to form a silver alloy wire; and () The silver alloy wire is drawn into a silver alloy wire of a predetermined wire diameter. 如申β專利範圍第1項所述之銀合金銲線的製法，其 中，步驟a的銀成分之重量百分比為9〇〇〇〜9999 %。 如申明專利範圍第2項所述之銀合金銲線的製法，其 中，步驟b的金成份之重量百分比為〇〇〇〇1〜99997 %。 申清專利範圍第3項所述之銀合金銲線的製法，其 中’步驟b的銅成分之重量百分比為〇〇〇〇1〜99997 %。 如申請專利範圍第4項所述之銀合金銲線的製法，其 中’在步帮b中更包含加入皱成分及紹成分之微量金 屬原料進行混合熔煉。 6、如申請專利範圍第5項所述之銀合金辉線的製法，其 15 200944307 中，步驟b中的微量金屬元素包含有重量百分比為 0.0001 〜9.9997 % 之鈹成分。 7、 如申請專利範圍第6項所述之銀合金銲線的製法，其 中，步驟b中的微量金屬元素包含有重量百分比為 0.0001〜9.9997 %之鋁成分。 … 8、 如申請專利範圍第1項所述之銀合金銲線的製法，其 中，步驟b中的銀合金鑄塊經由連續鑄造以拉伸形成 ❹ 一預定線控為4〜8 mm的銀合金線材，再透過捲收機捲 取銀合金線材，並進行銀合金線材的成份分析。 9、 如申請專利範圍第8項所述之銀合金銲線的製法，其 中，步驟d中，將原本線徑為4〜8mm之該銀合金線 材，經過一第一粗伸線機的拉伸縮小其線徑至或 3_以下，再經一第二粗伸線機拉伸其線徑至1〇〇_ 或1.00mm以下，再經一第一細伸線機拉伸其線徑至 ❹ 0.50mm或〇.5〇mm以下，然後，再將〇.5〇mm或 0.50mm以下的銀合金線材依序經過一第二細伸線機、 一極細伸線機，以及一超極細伸線機將銀合金線材拉 伸為一預定線控為 0.0508mm (2.00mil)至 O.OlOmm (〇.4〇mil) 範圍的銀合金銲線。 10、 如申請專利範圍第9項所述之銀合金銲線的製法，其 中’步驟d後進行表面清洗及熱退火處理。 11 一種封裝導線用之銀合金銲線，其組成成分包含： 16 200944307 以及 重量百分比為90.00〜99.99 %的銀成分； 重量百分比為0.0001〜9.9997 %的金成份 重量百分比為0.0001〜9.9997 %的銅成分 中，該 12、 如申請專利範圍第11項所述之銀合金銲線， 銀合金銲線之組成成分更包含重量百分比為 0.0001〜9.9997 %的鈹成分。 中，該 13、 如申請專利範圍第12項所述之銀合金銲線， 銀合金銲線之組成成分更包含重量百分比為 0.0001〜9.9997 %的鋁成分。 17The method for producing a silver alloy wire according to the first aspect of the invention, wherein the weight percentage of the silver component of the step a is from 9 99 to 9999 %. The method for preparing a silver alloy wire according to claim 2, wherein the weight percentage of the gold component in the step b is 〇〇〇〇1 to 99997%. The method for preparing a silver alloy wire according to item 3 of the patent scope, wherein the weight percentage of the copper component in the step b is 〇〇〇〇1 to 99997%. For example, in the method for preparing a silver alloy wire according to the fourth aspect of the patent application, in the step b, a micro-metal raw material containing a wrinkle component and a component is further mixed and smelted. 6. The method for preparing a silver alloy wire as described in claim 5, wherein in the element of 2009 2009, the trace metal element in the step b comprises 0.0001 to 9.9977% by weight of the cerium component. 7. The method of preparing a silver alloy wire according to claim 6, wherein the trace metal element in step b comprises an aluminum component in a weight percentage of 0.0001 to 9.997%. 8. The method for preparing a silver alloy wire according to claim 1, wherein the silver alloy ingot in step b is formed by continuous casting to form a silver alloy having a predetermined wire length of 4 to 8 mm. The wire is then taken up by a reeling machine to take up the silver alloy wire and analyze the composition of the silver alloy wire. 9. The method for preparing a silver alloy wire according to claim 8, wherein in step d, the silver alloy wire having a wire diameter of 4 to 8 mm is stretched by a first thick wire drawing machine. Reduce the wire diameter to or below 3_, and then stretch the wire diameter to 1〇〇_ or 1.00mm or less through a second thick wire drawing machine, and then stretch the wire diameter to the wire through a first thin wire drawing machine. 0.50mm or less than 〇5〇mm, and then the silver alloy wire of 〇.5〇mm or less than 0.50mm is sequentially passed through a second thin wire drawing machine, a very fine wire drawing machine, and a superfine wire. The machine stretches the silver alloy wire into a silver alloy wire with a predetermined wire control range of 0.0508 mm (2.00 mil) to O.OlOmm (〇.4 mil). 10. The method for preparing a silver alloy wire as described in claim 9 wherein the step d is followed by surface cleaning and thermal annealing. 11 A silver alloy wire for packaging wires, comprising: 16 200944307 and a silver component having a weight percentage of 90.00 to 99.99%; a weight percentage of 0.0001 to 9.997% by weight of a gold component of 0.0001 to 9.997% by weight of a copper component 12. The silver alloy wire of claim 11, wherein the composition of the silver alloy wire further comprises a bismuth component of 0.0001 to 9.997% by weight. 13. The silver alloy wire as described in claim 12, wherein the composition of the silver alloy wire further comprises an aluminum component in a weight percentage of 0.0001 to 9.997%. 17
TW97114719A 2008-04-22 2008-04-22 Method of making silver alloy solder wire for package wire and product thereof TW200944307A (en)

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