CN101786154A - Composite gold wire and manufacture method thereof - Google Patents
Composite gold wire and manufacture method thereof Download PDFInfo
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- CN101786154A CN101786154A CN200910077605A CN200910077605A CN101786154A CN 101786154 A CN101786154 A CN 101786154A CN 200910077605 A CN200910077605 A CN 200910077605A CN 200910077605 A CN200910077605 A CN 200910077605A CN 101786154 A CN101786154 A CN 101786154A
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- palladium alloy
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Abstract
The invention provides a manufacture method of a composite gold wire, comprising the steps of providing a main metal raw material containing a silver componnet; putting the main metal raw material in a vacuum melting furnace and carrying out mixing melting after adding a minor metal material containing a palladium component in the vacuum melting furnace and mixing to prepare a silver-palladium alloy melting liquid; then continuously casting and pulling and stretching the silver-palladium alloy melting liquid into a silver-palladium alloy wire rod; and at last, stretching the silver-palladium alloy wire rod into a silver-palladium alloy bonding wire with the preset wire diameter. The invention also provides the composite gold wire comprising the following ingredients in percentage by weight: 90.00-99.99 percent of silver and 0.01-10.00 percent of palladium. By dint of the silver-palladium alloy bonding wire prepared by mixing the two metal raw materials such as silver and palladium, the invention can not only achieve the effect of metal wire rods made of pure gold but also greatly reduce the cost.
Description
Technical field
The present invention refers to a kind of composite gold wire and manufacture method thereof that is used for semiconductor packaging process especially relevant for a kind of metal bonding wire.
Background technology
In the packaging technology of semiconductor element, often engage the metal bonding wire is connected on chip and the circuit substrate with routing, borrow the metal bonding wire to be electrically connected on chip and circuit substrate, with as signal between chip and the circuit substrate and current delivery path.
In general, the loading intensity of metal bonding wire, ductility, flexibility, fusing point, electrical, hardness and relevant with its material that is adopted with the key properties such as Weldability of integrated circuit (IC) chip.And above-mentioned characteristic will influence the life-span and the stability of semiconductor element.Different with the kenel of circuit substrate according to chip, the specification of the metal bonding wire that its collocation is used is also different.
The conventional metals bonding wire is mainly made by the proof gold material.The metal bonding wire of proof gold material has physical propertys such as preferable ductility and electric conductivity, still, because the metal bonding wire cost of proof gold material is higher, also causes overall semiconductor element cost to increase.
Therefore, for the problems referred to above, how developing a kind of effect that can reach the proof gold bonding wire, and can significantly reduce the metal bonding wire of material cost, is the problem that the present invention mainly solves.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of effect that can reach the metal bonding wire of proof gold material, and the composite gold wire and the manufacture method thereof that can reduce cost.
For achieving the above object, the invention provides a kind of manufacture method of composite gold wire, comprise: at first, provide the raw material of the major metal with silver-colored composition; Secondly, this major metal raw material is placed vacuum melting furnace, and after the adding different proportion has the minor metal raw material allotment of palladium composition in this vacuum melting furnace, carry out mixed smelting, to make silver palladium alloy melting liquid; Then, silver palladium alloy melting liquid is formed the silver palladium alloy wire rod via casting the stretching of pulling again continuously; At last, with the silver palladium alloy wire stretching be the silver palladium alloy bonding wire in preset lines footpath.
In addition, the present invention also provides a kind of composite gold wire that is made by above-mentioned manufacture method, and its constituent mainly comprises: percentage by weight is 90.00～99.99% silver-colored composition; And percentage by weight is 0.01～10.00% palladium composition.
The composite gold wire that the present invention makes by two kinds of metallic elements allotments of silver and palladium can not only reach the effect of the metal bonding wire that proof gold makes, and can significantly reduce cost.
Description of drawings
Fig. 1 is the flow chart of the manufacture method of composite gold wire of the present invention;
Fig. 2 is the refinement flow chart of Fig. 1.
Description of reference numerals
The specific embodiment
Relevant technology contents of the present invention and detailed description, conjunction with figs. is described as follows:
As shown in Figures 1 and 2, be respectively the flow chart and the refinement flow chart thereof of the manufacture method of composite gold wire of the present invention.As shown in Figure 1 and Figure 2, the manufacture method of composite gold wire of the present invention at first, in step 100, provides a kind of major metal raw material with silver-colored composition earlier.
Secondly, in step 102, the major metal raw material that will have silver-colored composition is placed in vacuum melting furnace (as step 102a), and in vacuum melting furnace, add minor metal raw material and carry out mixed smelting (as step 102b), to refine out silver palladium alloy melting liquid (as step 102c) by vacuum melting furnace with palladium (Pd) composition.The constituent of this silver palladium alloy melting liquid comprises: percentage by weight is 90.00～99.99% silver-colored composition, and percentage by weight is 0.01～10.00% palladium composition.
Then, directly be the silver palladium alloy wire rod (as step 102d) of 4～8mm with this silver palladium alloy melting liquid via casting the stretching of pulling again formation preset lines continuously.Batch this silver palladium alloy wire rod (as step 102e) by winding machine again, and carry out the constituent analysis (as step 102f) of this silver palladium alloy wire rod, whether meet the requirements to judge its component ratio.
Step 104, the silver palladium alloy wire rod that casting is finished stretches, making it is that the line footpath of 4～8mm is contracted to 3mm or (as step 104a) below the 3mm through the stretching of the first thick wire drawing machine originally, be stretched to 1.00mm or (as step 104b) below the 1.00mm through the second thick wire drawing machine again, be stretched to 0.50mm or (as step 104c) below the 0.50mm through the first thin wire drawing machine again, then, directly be that 0.50mm or the silver palladium alloy wire rod below the 0.50mm are in regular turn through the second thin wire drawing machine (step 104d) again with line, superfine wire drawing machine (step 104e), and super superfine wire drawing machine (step 104f), be that preset lines directly is the specific silver palladium alloy bonding wire of 0.0508mm (being 2.00mil) to 0.010mm (being 0.40mil) scope with the silver palladium alloy wire stretching.
The composite gold wire of the invention described above can be used as lead and is applied to IC, light emitting diode (LED) and surface acoustic wave (SAW) encapsulation.
Below the present invention will be described in more detail by several embodiment:
Embodiment 1
The major metal raw material that will have silver-colored composition is placed in vacuum melting furnace and carries out the melting manufacturing, and adds the minor metal raw material with palladium composition in vacuum melting furnace, then, refines out silver palladium alloy melting liquid by the vacuum melting furnace mixed smelting.The constituent of silver palladium alloy melting liquid comprises: percentage by weight is 99.99% silver-colored composition, and percentage by weight is 0.01% palladium composition.
This silver palladium alloy melting liquid directly is the silver palladium alloy wire rod of 4mm via casting pulling stretching outlet again continuously.Batch the silver palladium alloy wire rod by winding machine, and carry out the constituent analysis of silver palladium alloy wire rod.
After the casting of silver palladium alloy wire rod is finished, carrying out line directly stretches, make script be stretched to 3mm through the first thick wire drawing machine for the line footpath of 6mm, be stretched to 1.0mm through the second thick wire drawing machine, be stretched to 0.18mm through the first thin wire drawing machine, the silver palladium alloy wire rod that with line directly is 0.18mm again becomes preset lines directly to be the specific silver palladium alloy bonding wire of 0.050mm to 0.010mm scope the silver palladium alloy wire stretching in regular turn through the second thin wire drawing machine, superfine wire drawing machine and super superfine wire drawing machine.
At last, stretched silver palladium alloy bonding wire surface of finishing is cleaned, and the silver palladium alloy bonding wire is dried and thermal anneal process.
Embodiment 2
The major metal raw material that will have silver-colored composition is placed in vacuum melting furnace, and adds the minor metal raw material with palladium composition in vacuum melting furnace, then, refines out silver palladium alloy melting liquid by the vacuum melting furnace mixed smelting.The constituent of silver palladium alloy melting liquid comprises: percentage by weight is 95.00% silver-colored composition, and percentage by weight is 5.00% palladium composition.
This silver palladium alloy melting liquid directly is the silver palladium alloy wire rod of 6mm via casting pulling stretching outlet again continuously.Batch the silver palladium alloy wire rod by winding machine, and carry out the constituent analysis of silver palladium alloy wire rod.
After the casting of silver palladium alloy wire rod is finished, carrying out line directly stretches, make script be stretched to 3mm through the first thick wire drawing machine for the line footpath of 6mm, be stretched to 1.0mm through the second thick wire drawing machine, be stretched to 0.18mm through the first thin wire drawing machine, the silver palladium alloy wire rod that with line directly is 0.18mm again becomes preset lines directly to be the specific silver palladium alloy bonding wire of 0.050mm to 0.010mm scope the silver palladium alloy wire stretching in regular turn through the second thin wire drawing machine, superfine wire drawing machine and super superfine wire drawing machine.
At last, stretched silver palladium alloy bonding wire surface of finishing is cleaned, and the silver palladium alloy bonding wire is dried and thermal anneal process.
Embodiment 3
The major metal raw material that will have silver-colored composition is placed in vacuum melting furnace, and adds the minor metal raw material with palladium composition in vacuum melting furnace, then, refines out silver palladium alloy melting liquid by the vacuum melting furnace mixed smelting.The constituent of silver palladium alloy melting liquid comprises: percentage by weight is 90.00% silver-colored composition, and percentage by weight is 10.00% palladium composition.
This silver palladium alloy melting liquid directly is the silver palladium alloy wire rod of 8mm via casting pulling stretching outlet again continuously.Batch the silver palladium alloy wire rod by winding machine, and carry out the constituent analysis of silver palladium alloy wire rod.
After the casting of silver palladium alloy wire rod is finished, carrying out line directly stretches, make script be stretched to 2mm through the first thick wire drawing machine for the line footpath of 8mm, be stretched to 1.0mm through the second thick wire drawing machine, be stretched to 0.18mm through the first thin wire drawing machine, the silver palladium alloy wire rod that with line directly is 0.18mm again becomes preset lines directly to be the specific silver palladium alloy bonding wire of 0.050mm to 0.010mm scope the silver palladium alloy wire stretching in regular turn through the second thin wire drawing machine, superfine wire drawing machine and super superfine wire drawing machine.
At last, stretched silver palladium alloy bonding wire surface of finishing is cleaned, and the silver palladium alloy bonding wire is dried and thermal anneal process.
In sum, the silver palladium alloy bonding wire of composite gold wire of the present invention for making by the allotment of above-mentioned metallic element can reach the effect of the metal bonding wire that proof gold makes, and can significantly reduce cost.
The above is preferred embodiment of the present invention only, is not to be used for limiting scope of the invention process.Every equalization that claims are done according to the present invention changes and modifies, and all is encompassed in the claim of the present invention.
Claims (7)
1. the manufacture method of a composite gold wire is characterized in that, comprising:
A, provide the raw material of the major metal with silver-colored composition;
B, this major metal raw material is placed vacuum melting furnace, and in this vacuum melting furnace, add minor metal raw material, carry out mixed smelting, to make silver palladium alloy melting liquid with palladium composition;
C, this silver palladium alloy melting liquid stretch is formed the silver palladium alloy wire rod via casting pulling again continuously; And
D, be the silver palladium alloy bonding wire in preset lines footpath with this silver palladium alloy wire stretching.
2. the manufacture method of composite gold wire according to claim 1 is characterized in that, the percentage by weight of the silver-colored composition of step a is 90.00～99.99%.
3. the manufacture method of composite gold wire according to claim 2 is characterized in that, the percentage by weight of the palladium composition of step b is 0.01～10.00%.
4. the manufacture method of composite gold wire according to claim 1, it is characterized in that, silver palladium alloy melting liquid among the step b directly is the silver palladium alloy wire rod of 4～8mm via casting the stretching of pulling again formation preset lines continuously, batch this silver palladium alloy wire rod by winding machine again, and carry out the constituent analysis of this silver palladium alloy wire rod.
5. the manufacture method of composite gold wire according to claim 4, it is characterized in that, in the steps d, with the script line directly is this silver palladium alloy wire rod of 4～8mm, dwindle its line footpath to 3mm or below the 3mm through the stretching of the first thick wire drawing machine, stretch its line footpath to 1.00mm or below the 1.00mm through the second thick wire drawing machine again, stretch its line footpath to 0.18mm or below the 0.18mm through the first thin wire drawing machine again, then, directly be that 0.18mm or this silver palladium alloy wire rod below the 0.18mm are in regular turn through the second thin wire drawing machine again with line, superfine wire drawing machine, and super superfine wire drawing machine, become preset lines directly to be the silver palladium alloy bonding wire of 0.050mm to 0.010mm scope this silver palladium alloy wire stretching.
6. the manufacture method of composite gold wire according to claim 5 is characterized in that, also this silver palladium alloy bonding wire is carried out surface clean, oven dry and thermal anneal process after the steps d.
7. a composite gold wire is characterized in that, its constituent comprises:
Percentage by weight is 90.00～99.99% silver-colored composition; And
Percentage by weight is 0.01～10.00% palladium composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910077605A CN101786154A (en) | 2009-01-24 | 2009-01-24 | Composite gold wire and manufacture method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910077605A CN101786154A (en) | 2009-01-24 | 2009-01-24 | Composite gold wire and manufacture method thereof |
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| CN101786154A true CN101786154A (en) | 2010-07-28 |
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| CN200910077605A Pending CN101786154A (en) | 2009-01-24 | 2009-01-24 | Composite gold wire and manufacture method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214630A (en) * | 2011-05-18 | 2011-10-12 | 苏州衡业新材料科技有限公司 | Silver-base microalloy bonding wire and preparation method thereof |
| CN103311209A (en) * | 2013-05-17 | 2013-09-18 | 矽品科技（苏州）有限公司 | Silver-alloy welding wire |
| CN103409654A (en) * | 2012-09-12 | 2013-11-27 | 田中电子工业株式会社 | Silver-gold-palladium alloy bump manufacturing line |
| WO2014026463A1 (en) * | 2012-08-17 | 2014-02-20 | Yuan Hong | Embroidery thread and manufacturing method therefor |
| CN106119590A (en) * | 2015-05-07 | 2016-11-16 | Mk电子株式会社 | Silver alloy closing line and manufacture method thereof |
-
2009
- 2009-01-24 CN CN200910077605A patent/CN101786154A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214630A (en) * | 2011-05-18 | 2011-10-12 | 苏州衡业新材料科技有限公司 | Silver-base microalloy bonding wire and preparation method thereof |
| WO2014026463A1 (en) * | 2012-08-17 | 2014-02-20 | Yuan Hong | Embroidery thread and manufacturing method therefor |
| CN103409654A (en) * | 2012-09-12 | 2013-11-27 | 田中电子工业株式会社 | Silver-gold-palladium alloy bump manufacturing line |
| CN103409654B (en) * | 2012-09-12 | 2015-06-24 | 田中电子工业株式会社 | silver-gold-palladium alloy bump manufacturing line |
| CN103311209A (en) * | 2013-05-17 | 2013-09-18 | 矽品科技（苏州）有限公司 | Silver-alloy welding wire |
| CN106119590A (en) * | 2015-05-07 | 2016-11-16 | Mk电子株式会社 | Silver alloy closing line and manufacture method thereof |
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Application publication date: 20100728 |