CN106119590A - Silver alloy closing line and manufacture method thereof - Google Patents
Silver alloy closing line and manufacture method thereof Download PDFInfo
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- CN106119590A CN106119590A CN201610225123.4A CN201610225123A CN106119590A CN 106119590 A CN106119590 A CN 106119590A CN 201610225123 A CN201610225123 A CN 201610225123A CN 106119590 A CN106119590 A CN 106119590A
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- closing line
- silver alloy
- alloy closing
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- line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
Abstract
The invention discloses a kind of silver alloy closing line and manufacture method thereof, described silver alloy closing line comprises: first addition element of about 1 to about 20 weight (wt) %；Second addition element of about 3 to about 100wt ppm；With surplus silver (Ag), wherein the first addition element includes gold (Au), palladium (Pd) or their alloy, described second addition element includes at least one in the following: calcium (Ca), lanthanum (La), beryllium (Be), germanium (Ge), nickel (Ni), bismuth (Bi), yttrium (Y), manganese (Mn), stannum (Sn), titanium (Ti), ferrum (Fe), copper (Cu) and magnesium (Mg), the percentage elongation of silver alloy closing line is in the range of about 15% to about 25%, and the Young's modulus of silver alloy closing line is in the range of about 60GPa to about 80GPa.
Description
Cross-Reference to Related Applications
This application claims Korean Patent Application No. 10-2015-submitted on May 7th, 2015 to Korean Intellectual Property Office
The priority of 0063880, the disclosure of which is incorporated herein by reference in their entirety.
Technical field
Embodiment relates to silver (Ag) alloy bond line and manufacture method thereof, and connects more particularly, to having excellence
Close silver alloy closing line and the manufacture method thereof of character.
Background technology
Packaging part for mounting semiconductor includes various types of structure comprising closing line.Closing line by
It is widely used in connection substrate and semiconductor device or for connecting semiconductor device.Gold closing line is widely used as engaging
Line.But, because the cost that gold is expensive material and gold the most quickly goes up, thus existing for gold joint can be substituted
The demand of the closing line of line.
In the case of using copper (Cu) closing line (copper as key component is the alternative of Au), due to the natural height of copper
Hardness, so chip probably ftractures (i.e. pad (pad) cracking phenomena) during engaging online.Accordingly, because copper is high hard
Degree and strong oxidation, it is difficult to carry out stitch (stitch-on-bump) (SOB) on the salient point of highly integrated packaging part.
As a solution, developing relatively cheap argentiferous (Ag) joint as key component the most energetically
Line aspect conducts a research.Although making efforts to by by silver with other are metal element alloyed and develop and show excellent properties
Closing line, but still have the biggest room for promotion.
Summary of the invention
The embodiment of present inventive concept provides the mechanical property having by changing them in the fabrication process and (such as stretches
Long rate) and silver (Ag) the alloy bond line of joint character that improves.
The embodiment of present inventive concept is not limited to above-mentioned purpose, and those of ordinary skill in the art see following description
It is clearly understood that other purposes according to present inventive concept.
Other side will partly be given, and described other side is followed description and partly will
Be from description it will be apparent that or the exemplary that occurred by enforcement can be known.
The silver alloy closing line of an embodiment according to present inventive concept comprises: about 1 to about 20 weight (wt) %'s
First addition element；Second addition element of about 3 to about 100wt ppm；With surplus silver (Ag), wherein said first addition element
Including gold (Au), palladium (Pd) or their alloy, described second addition element includes at least one in the following: calcium
(Ca), lanthanum (La), beryllium (Be), germanium (Ge), nickel (Ni), bismuth (Bi), yttrium (Y), manganese (Mn), stannum (Sn), titanium (Ti), ferrum (Fe), copper
(Cu) and magnesium (Mg), the percentage elongation of silver alloy closing line is in the range of about 15% to about 25%, and the poplar of silver alloy closing line
Family name's modulus is in the range of about 60GPa to about 80GPa.
Silver alloy closing line according to claim 1, the percentage elongation of wherein said silver alloy closing line is about 18%
In the range of about 22%.
In an exemplary embodiment, the Young's modulus of silver alloy closing line can be in the scope of about 65GPa to about 80GPa
In.
In an exemplary embodiment, when free air balls (FAB) is formed at the end of silver alloy closing line, without air
Ball has the about 50Hv transverse section hardness to about 80Hv.
In an exemplary embodiment, after silver alloy closing line is combined with bond pad, the joint of silver alloy closing line
Part can have the about 80Hv transverse section hardness to about 120Hv.
In an exemplary embodiment, when in air atmosphere free air balls can be formed at the end of silver alloy closing line
Time the probability that ruptures of pad be substantially equal to the weldering when free air balls is formed at the end of silver alloy closing line in gas atmosphere
The probability that dish ruptures.
A kind of method of silver alloy closing line manufacturing an embodiment according to present inventive concept, described method includes
Preparing the first metal wire (first wire), described first metal wire comprises first addition element, about of about 1 to about 20 weight %
Second addition element of 3 to about 100wt ppm and surplus silver (Ag), wherein said first addition element includes gold (Au), palladium
(Pd) or their alloy, described second addition element includes at least one in the following: calcium (Ca), lanthanum (La),
Beryllium (Be), germanium (Ge), nickel (Ni), bismuth (Bi), yttrium (Y), manganese (Mn), stannum (Sn), titanium (Ti), ferrum (Fe), copper (Cu) and magnesium (Mg)
Described first metal wire is annealed to obtain about 15% to about 25% in the range of about 500 DEG C to about 700 DEG C by blanket of nitrogen
Percentage elongation and about 60GPa are to the Young's modulus of about 80GPa.
In an exemplary embodiment, the percentage elongation of the first metal wire can be in the range of about 18% to about 22%.
In an exemplary embodiment, the Young's modulus of the first metal wire can be in the scope of about 65GPa to about 80GPa
In.
Accompanying drawing explanation
According to the explanation of following exemplary embodiment, in conjunction with the accompanying, these and/or other aspect will become bright
Aobvious and easier to understand, wherein:
Figure 1A and 1B is the image of free air balls (FAB) cross section formed at silver (Ag) alloy bond thread end；
Fig. 2 A and 2B is the block diagram illustrating to manufacture the method for the silver alloy closing line according to an embodiment；With
Fig. 3 A and 3B is the side view according to embodiment silver alloy closing line after splicing and plane graph respectively.
Detailed description of the invention
It is described more fully below this now with reference to the accompanying drawing of the exemplary that illustrated therein is present inventive concept
Bright design.But, present inventive concept can be embodied in many different forms, and should not be construed as being limited to institute herein
The exemplary of statement；But these embodiments are provided so that the disclosure will fully and completely, and will be to ability
Field technique personnel fully pass on the design of present inventive concept.In the accompanying drawings, similar reference represents similar key element, and
And therefore will omit their description.Additionally, various key elements shown in the drawings and region are only example.Therefore, the present invention
Concept is not limited to relative size or the distance illustrated in the accompanying drawings.In embodiments, wt% (weight %) represents based on 100%
The weight of the component of alloy gross weight.
Although such term such as " first ", " second " etc. can be used to describe different components, but such component
Do not limited by terms above.Using terms above is only a component to be distinguished with another.Such as, as long as at this
In the range of bright concept, can be by the first named second component of component, and can be by named for second component the first component.
Terminology used in this article is used only for explaining specific embodiment, and is not intended to limit present inventive concept.
The expression way used with odd number includes the expression way of plural number, unless it has the most different implications within a context.?
It should be understood that term such as " including ", " having " and " comprising " is intended to suggest that disclosed in this manual special in this specification
Levy, quantity, step, effect, component, parts or the existence of combinations thereof, and be not intended to eliminating and can exist and maybe can add
Add one or more other features, quantity, step, effect, component, parts or the probability of combinations thereof.
Unless otherwise defined, whole terms used herein, including technology or scientific terminology, all have and structure of the present invention
Those identical implications that those skilled in the art belonging to think of is possible are generally understood that.As defined in conventional dictionary
Those terms are interpreted as having the implication matched with the implication in the context of correlation technique, and unless the clearest
Ground definition, be not construed as ideal form or excessive form.
According to embodiment, in order to obtain the high weld-ring character (loop characteristics) as gold closing line
With spherical uniformity and in order to prevent when in air atmosphere formed free air balls time pad rupture, change in the fabrication process
Mechanical property (such as percentage elongation) engages character to improve.By doing so it is possible, obtain that solder pad of semiconductor device is had high bonding
The silver alloy closing line of intensity.
Improving proportional to the percentage elongation of closing line, their Young's modulus also increases.Due to stitch bond it
The elasticity of rear closing line, the linearity are improved, thus the inclination of free air balls does not occur.Therefore, closing line after joint
Spherical can have high-caliber uniformity.
In order to test the joint character of the silver alloy closing line according to an embodiment, can in gas atmosphere and
End online in air atmosphere carries out the formation of free air balls (FAB).
In the case of silver alloy closing line, when being formed in gas atmosphere, can be as shown in Figure 1A inside FAB；
When being formed in air atmosphere, can be as shown in Figure 1B inside FAB, including line parts.Due to line parts, the FAB of formation
Can have high rigidity, and when wire bonding, semiconductor pads can rupture.
The percentage elongation that silver alloy engages is the highest, and the granularity of the alloy constituting silver alloy closing line is the biggest.Therefore, remain in
The hardness of the line parts within FAB can reduce more than 30%.
Silver alloy closing line according to an embodiment can aid in the relatively low probability that semiconductor pads ruptures, i.e.
Make when FAB is formed in air atmosphere and is combined with pad.
Terms used herein " gas atmosphere " refers to nitrogen (N2) gas atmosphere or comprise hydrogen (H2) and nitrogen (N2) gas gas
Atmosphere, wherein hydrogen (H2) and nitrogen (N2) ratio be about 1: 99 to 10: 90.Terms used herein " in air atmosphere " refers to not
It is gas atmosphere, but refers to ambient atmospheric conditions.
Generally, in gas atmosphere, the shape of FAB is uniform.But, in order to manufacture gas atmosphere, gas equipment and
Gas causes extra cost.Additionally, the shape of FAB can change according to the inflow of gas.It is to say, when at gas atmosphere
During middle manufacture closing line, need long time and a lot of effort.
1. the preparation of sample
Silver alloy closing line (being hereinafter also referred to as closing line) according to an embodiment comprises about 80 to 99 weights
The silver (Ag) of amount % and other element.Silver (Ag) has high conductance in a metal, such as, higher than gold about at least 30%
Level.Silver (Ag) is more cheap than gold, thus advantageously reduces manufacturing cost.Mechanical property and the metallographic of silver (Ag) seemingly, therefore, i.e.
Make for silver (Ag), it is possible to use conventional gold thread joint technology.
In one embodiment, closing line can also comprise gold (Au).In this case, the amount of gold can engage
In the range of about 1 weight % to 20 weight % of line gross weight.When the amount of gold is too small, the shape of the ball formed in closing line end
Shape may be too big with complete spheroid difference, causes bad joint character.On the other hand, when the amount of gold is too high, the wire bonding phase
Between the hardness of ball that formed in closing line end may increase too much, thus destroy bond pad and/or be positioned at bond pad
Under substrate.
In one embodiment, closing line can also comprise palladium (Pd).In this case, the amount of palladium can engage
In the range of about 1 weight % to 20 weight % of line gross weight.When the amount of palladium is too small, the acid resistance of closing line may reduce, and makes
Proper when being exposed to nitric acid or sulphuric acid closing line may easily corrode or short circuit (short out).When not containing palladium, silver closes
The antioxidation performance of gold closing line may reduce.On the other hand, when palladium amount is too high, in closing line end during wire bonding
The hardness of the ball that place is formed may increase too much, thus destroy bond pad and/or be positioned at the substrate under bond pad.
In one embodiment, closing line can comprise gold (Au) and palladium (Pd) simultaneously, and the amount of gold and palladium is each
Can be in the range of about 1 weight % to 20 weight % of closing line gross weight.When gold is too low with the ratio of palladium, engaging line end
The shape of the ball formed at portion may be excessive with complete spheroid difference, causes bad joint character.Additionally, the surface of closing line
Can be the most oxidized and fade.On the other hand, when gold is too high with the ratio of palladium, the ball formed in closing line end
Shape can be excessive with complete spheroid difference.Additionally, the hardness forming ball in closing line end may improve too much, thus broken
Bad bond pad and/or be positioned at the substrate under bond pad.
In one embodiment, closing line can comprise selected from the following with the amount of about 3 to 100 weight (wt) ppm
At least one element: calcium (Ca), lanthanum (La), beryllium (Be), germanium (Ge), nickel (Ni), bismuth (Bi), yttrium (Y), manganese (Mn), stannum (Sn),
Titanium (Ti), ferrum (Fe), copper (Cu) and magnesium (Mg).Calcium (Ca), lanthanum (La) and yttrium (Y) can cause uniform delicate tissues.But,
When the amount of calcium (Ca), lanthanum (La) or yttrium (Y) is less than about 3wt ppm, occur without this effect.When calcium (Ca), lanthanum (La) or yttrium (Y)
Amount when being greater than about 100wt ppm, granularity can be reduced to micron (micro) level, cause hardness to improve.Stannum (Sn), ferrum
(Fe), copper (Cu) and magnesium (Mg) can improve the machinability of closing line.But, when stannum (Sn), ferrum (Fe), copper (Cu) or magnesium
(Mg), when amount is less than about 3wt ppm, this effect is occurred without.When the amount of stannum (Sn), ferrum (Fe), copper (Cu) or magnesium (Mg) is greater than about
During 100wt ppm, the hardness of closing line may increase and be likely to occur segregation.Beryllium (Be), nickel (Ni) and titanium (Ti) can increase
Add the reliability of closing line.But, when the amount of beryllium (Be), nickel (Ni) or titanium (Ti) is less than about 3wt ppm, occur without this effect
Really.When the amount of beryllium (Be), nickel (Ni) or titanium (Ti) is greater than about 100wt ppm, the hardness that processing hardening causes may increase also
And precipitation may occur on the surface of the alloy formed.Bismuth (Bi), manganese (Mn) and germanium (Ge) can improve spherical uniformity.So
And, when the amount of bismuth (Bi), manganese (Mn) or germanium (Ge) is less than about 3wt ppm, occur without this effect.When bismuth (Bi), manganese (Mn) or
When the amount of germanium (Ge) is greater than about 100wt ppm, in the alloy formed, segregation can occur.
In one embodiment, when the percentage elongation of closing line and Young's modulus are too small, engaging character may deterioration: example
As, weld-ring character and spherical uniformity may deterioration, and be likely to occur pad and rupture.On the other hand, when percentage elongation and Young
When modulus is too high, it may not be possible to form closing line.
In one embodiment, when closing line, there is too high FAB transverse section hardness and too high joint ball cross section
During hardness, joint character may deteriorate: such as, and weld-ring character and spherical uniformity may deteriorate, and it is broken to be likely to occur pad
Split.On the other hand, when FAB have too low transverse section hardness and engage ball have too low transverse section hardness time, may not
There is wire bonding.
2. manufacture method
Fig. 2 A is the block diagram illustrating to manufacture the method for the silver alloy closing line according to an embodiment.
Operation S100: high-purity silver can be used, or comprise silver as key component by fusing and direct casting preparation
And comprise gold (Au) and the alloy of palladium (Pd) of the amount of about 1 to 20 weight %.High-purity silver or alloy can experience include many
The continuously elongated technique of individual step has the line of the about 200 following diameters of μm with preparation.
With reference to Fig. 2 B, there is this method of target ratio of components constituting the component of raw material metal, will comprise silver-colored conduct
The raw material metal of key component is in fusing melt in furnace and casting, to prepare the alloy molten solution (S110) of raw material metal.
Thus, the material can being added thereto to outside desilver.
Afterwards, the alloy molten solution of raw material metal cooled down and solidifies, and experienced forging afterwards and roll, thus
Prepare alloy sheet (S 120).Afterwards, thinning for alloy sheet one-tenth is had the about 6mm line (S130) to about 9mm diameter.
In one embodiment, alloy molten solution thinning of raw material metal can be carried out, so that alloy molten solution experience
Direct casting and prepare the line (S115) that there is about 6mm to about 9mm diameter.
Stretching and heat treatment (S140) will be carried out to the line of the diameter of about 9mm by the thinning about 6mm that has obtained.Stretching
Can include the most thinning for line and heat treatment with heat treatment.Line can be allowed to pass through multiple die head, thus reduce the transversal of line
Area.
When the diameter of line is in the range of about 0.5mm to about 5mm, the first heat treatment can be carried out.Can be e.g., from about 550
DEG C at a temperature of about 700 DEG C, carry out the first heat treatment about 0.5 second to 5 seconds, for example, it is possible to the temperature of about 600 DEG C to 650 DEG C
Under carry out the first heat treatment about 2 seconds to about 4 seconds.
Optionally, when the diameter of line is in the range of about 0.05mm to about 0.5mm, can carry out further at the second heat
Reason.The second heat treatment can be carried out about 0.5 second to 5 seconds at a temperature of e.g., from about 550 DEG C to about 700 DEG C, for example, it is possible to about
The second heat treatment is carried out about 2 seconds to about 4 seconds at a temperature of 600 DEG C to 650 DEG C.
It will appreciated by the skilled person that how the diameter of line is when allowing line to pass sequentially through multiple die head
Reduce.In other words, by line is passed through first to arrange multiple moulds that this type of mode of the die head with large hole arranges
Head reduces the diameter of line.
When the diameter of line is in particular range, these heat treatments can be carried out between die head.In other words, when line
When diameter is in the range of about 0.5mm to about 5mm, the first heat treatment can be carried out between two die heads.When the diameter of line is about
Time in the range of 0.05mm to about 0.5mm, the second heat treatment can be carried out between two die heads.
Subsequently, by drawing process, the cross section of line is reduced until line has aimed dia.Thus, Jing Guomo
Between before and after Tou, the cross section of line is reduced proportion adjustment is in the range of about 7% to about 15%.It is to say, can build
Drawing process so that the cross-sectional area of line after by die head than line by the cross-sectional area little about 7% before die head to
15%.Such as, in the case of the drawing process for obtaining the about 50 following diameters of μm, the cross-sectional area of line can be adjusted to
In the range of about 7% to about 15%.
When the cross-sectional area reduction ratio of line is too high, the crystal grain in line may excessively disperse.On the other hand, when the horizontal stroke of line
Sectional area reduce ratio too low time, need to carry out drawing process repeatedly to obtain aimed dia, thus cause high manufacture
Cost.
Once it is completely carried out stretching, control of percentage elongation (S150) can be carried out by carrying out annealing.For regulating percentage elongation
Annealing conditions can change according to the composition of line, the reduction ratio of line cross-sectional area, heat treatment condition.For example, it is possible to
Carry out at a temperature of about 500 DEG C to 700 DEG C annealing about 1 second to 20 minutes.
When annealing temperature is too low, ductility and malleability may be not suitable for wire bonding.On the other hand, annealing temperature is worked as
Time too high, crystal grain is possible oversize and weld-ring may warp.
In one embodiment, line can be carried out annealing process with suitable speed by smelting furnace.Line is through superfusion
The speed of stove can depend on the size of annealing time and smelting furnace.
In comparative example herein and embodiment, by by the thinning line obtained at a temperature of about 400 DEG C to about 850 DEG C
At nitrogen (N2) atmosphere anneals have various different percentage elongation.
In order to manufacture the closing line with about 5% to about 10% percentage elongation, annealing temperature can be at about 400 DEG C to about 500
In the range of DEG C；In order to manufacture the closing line with about 11% to about 15% percentage elongation, annealing temperature can be at about 500 DEG C to about
In the range of 600 DEG C；And in order to manufacture the closing line with about 16% to 25% percentage elongation, annealing temperature can be at about 600 DEG C
In the range of 850 DEG C.
Operation S200: by electrolytic degreasing or activating pretreatment closing line, and can rush after each operation
Wash and air blast.As result, obtain the silver alloy of composition ratio shown in table 1 and 2 that has according to comparative example and embodiment and connect
Zygonema.
3. method of testing
(1) wire bonding
Fig. 3 A is that the side view that stitch on salient point (SOB) engages is described, and Fig. 3 B is the plane graph of part B of Fig. 3 A.Ginseng
According to Fig. 3 A, the first bond pad 10 and the second bond pad 20 are configured to be electrically connected to each other, and salient point 30 is arranged on second
On bond pad 20.Salient point 30 can be ball salient point or stud salient point (stud bump).Herein, will be spiral shell according to salient point 30
The situation of post salient point describes embodiment.
Salient point 30 is arranged on the second bond pad 20 among the first and second bond pads 10 and 20.How to arrange convex
Point 30 is known to a person of ordinary skill in the art, and therefore, their description will be omitted in this article.
First bond pad 10 carries out ball bond, i.e. form ball in the end of silver alloy closing line 100, and
Afterwards, silver alloy closing line 100 is guided the salient point 30 on the second bond pad 20 to carry out stitch bond on salient point 30.
With reference to Fig. 3 B, the shape of stitch bond can be substantially symmetrical with centrage C.During stitch bond, when
Relative to silver alloy closing line 100 whole even width apply the performance of energy and silver alloy closing line 100 relative to
When whole width is almost uniform, the shape and size of pin contact surface can be substantially symmetrical with centrage C.
In order to improve the joint character of silver alloy closing line 100 further, mechanical property can be changed by annealing process
(such as percentage elongation).When elongation change, Young's modulus correspondingly changes, and as result, the first and second seam weldings
Dish 10 and 20 can have the joint character of excellence and can not rupture.
(2) spherical uniformity
In evaluating spherical uniformity, this mode of about 42 μ m diameter is had to have with the ball that engages formed on pad
The end having the closing line of about 20 μ m diameter is attached to pad, and confirms the following afterwards: engage ball horizontal length with
The ratio of vertical length whether close to 1, closing line whether engage on ball be center, the edge engaging ball whether with complete ball
Whether the most smooth or joint ball the edge of body has is spent the same lobate curve.
Evaluation result is expressed as:
◎-the horizontal length of joint ball and the ratio of vertical length are more than 0.99, and closing line is positioned at the center engaging ball,
And the edge engaging ball does not have spends the same lobate curve.
Zero-when engaging the ratio of horizontal length and vertical length of ball 0.96 less than in the range of 0.99, engage
Line is positioned to engage the center of ball and engage the edge of ball and has when spending the same lobate curve；
△-when the ratio of the horizontal length and the vertical length that engage ball is more than 0.9, engages as the edge of ball has and spend
Lobate curve and when being unsatisfactory for the condition of ◎ and zero；With
Other situations of x-.
(3) weld-ring character
Among with the spaced 2 row's bond pads of about 3000 μm, row's bond pad carries out ball bond and shape
Become salient point, and carry out ball bond on another row's bond pad.Afterwards, enterprising at salient point while forming weld-ring (loop)
Row stitch bond.
Afterwards, among the interval of paired weld-ring, determine minimum interval as be expressed as to the value of spacing of weld-ring.
By doing so it is possible, evaluate the linearity of weld-ring.
◎ represents the typical spacing situation in 111 μm to 125 μ m of wherein weld-ring；Zero allusion quotation representing wherein weld-ring
Type is spaced in the situation in the range of below more than 105 μm and 111 μm, and △ represents that wherein the typical spacing of weld-ring is less than 105 μ
The situation of m.
(4) pad ruptures
Row's bond pad carries out ball bond to form salient point, and remove ball bond afterwards, and confirm seam welding
Whether dish ruptures.
Analyze and amount to 100 bond pads.Represent that the most all bond pads do not rupture by following evaluation analysis result: ◎
Situation, zero represents situation that wherein 1 to 5 bond pad ruptures, and △ represents the feelings that wherein 6 to 10 bond pads rupture
Condition, and × represent the situation that wherein 11 bond pads rupture.
4. result of the test
(1) interpretation of result
For evaluation comparison example and the mechanical property of embodiment, the HM2000 manufactured by Fisher Company by use
Equipment, application time be 10 seconds, the wriggling time (crepp time) is 5 seconds and applies under conditions of load is 20mN, to survey
Amount Vickers hardness (hardness Vickers) (Hv).
For the joint character of evaluation comparison example and embodiment, carry out wherein existing in gas atmosphere and in air atmosphere
The end of silver alloy closing line forms the operation of FAB.When forming FAB on silver alloy closing line in gas atmosphere, knot
Fruit is shown in Table 1, and when, in air atmosphere, having such as the silver alloy closing line of the same composition used in gas atmosphere
During upper formation FAB, result is shown in Table 2.
(2-A) comparative example 1A and 2A
Silver when the silver manufacturing the amount with less than about 80 weight % in this type of mode that their percentage elongation is about 22%
During alloy bond line, Young's modulus has the value of about 73 to 78GPa.When forming FAB in gas atmosphere, weld-ring character and ball
Shape uniformity be the best and pad to rupture be appropriate.It is to say, in the case of comparative example 1A and 2A, even if
When percentage elongation and Young's modulus being adjusted to equal in the case of the embodiment with the silver (being approximately less than 80 weight %) of low content
Percentage elongation and during Young's modulus, the joint character of prepared silver alloy closing line is also bad.
(2-B) comparative example 1B and 2B
Silver when the silver manufacturing the amount with less than about 80 weight % in this type of mode that their percentage elongation is about 22%
During alloy bond line, Young's modulus has the value of about 73 to 78GPa.When forming FAB in air atmosphere, weld-ring character and ball
Shape uniformity be the best and pad to rupture be bad.It is to say, in the case of comparative example 1B and 2B, even if
When percentage elongation and Young's modulus being adjusted to equal in the case of the embodiment with the silver (being approximately less than 80 weight %) of low content
Percentage elongation and during Young's modulus, the joint character of prepared silver alloy closing line is also bad.
(3-A) comparative example 3A to 5A
Use and there is the silver of about 90 weight %, the gold of about 8 weight %, the palladium of about 2 weight %, the calcium of about 10wt ppm, about
The silver alloy closing line of the germanium of the copper of 50wt ppm, the beryllium of about 5wt ppm and about 15wt ppm.Elongation by silver alloy closing line
Rate changes to about 14% from about 8%.The Young's modulus that the biggest percentage elongation is the biggest in the range of causing about 51 to 54GPa, and
The lowest FAB transverse section hardness and the lowest joint ball transverse section hardness.
When in gas atmosphere formed FAB time, in the case of comparative example 3A, weld-ring character is moderate, spherical uniformly
Property be bad and pad to rupture be moderate.In the case of comparative example 4A, weld-ring character is moderate, spherical uniformity
Bad and pad to rupture be good.In the case of comparative example 5A, weld-ring character and spherical uniformity are moderate
And it is the best that pad ruptures.It is to say, when percentage elongation increases to about 14% from about 8%, Young's modulus increases
And engage character to increase.But, it is bad for engaging character.
(3-B) comparative example 3B to 5B
Use and there is the silver of about 90 weight %, the gold of about 8 weight %, the palladium of about 2 weight %, the calcium of about 10wt ppm, about
The silver alloy closing line of the germanium of the copper of 50wt ppm, the beryllium of about 5wt ppm and about 15wt ppm.Elongation by silver alloy closing line
Rate changes to about 14% from about 8%.The Young's modulus that the biggest percentage elongation is the biggest in the range of causing about 51 to 54GPa, and
The lowest FAB transverse section hardness and the lowest joint ball transverse section hardness.
When in air atmosphere formed FAB time, in the case of comparative example 3B, weld-ring character is moderate, spherical uniformly
Property be bad and pad to rupture be bad.In the case of comparative example 4B, weld-ring character is moderate, spherical uniformity
Bad and pad to rupture be good.In the case of comparative example 5B, weld-ring character and spherical uniformity are moderate
And it is all moderate that pad ruptures.It is to say, when percentage elongation increases to about 14% from about 8%, Young's modulus increase is also
And engage character increase.But, it is bad for engaging character.
(4) comparative example 6A and 6B
In the case of comparative example 6A and 6B, there is the silver alloy closing line of about more than 28% percentage elongation not at mechanical property
Matter and joint properties are evaluated.
(5-A) embodiment 1A
Compared with comparative example 1A and 2A, when the amount of silver is about 80 weight % and percentage elongation is about 22%, Young's modulus
It is about 76GPa.When forming FAB in gas atmosphere, weld-ring character and spherical uniformity are the best and pad breaks
It is good for splitting.That is, it can be seen that when the amount of silver is more than about 80 weight %, silver alloy closing line has ratio when silver
Amount preferably engage character when being less than about 80 weight %.
(5-B) embodiment 1B
Compared with comparative example 1B and 2B, when the amount of silver is about 80 weight % and percentage elongation is about 22%, Young's modulus
It is about 76GPa.When forming FAB in air atmosphere, weld-ring character and spherical uniformity are the best and pad breaks
It is good for splitting.That is, it can be seen that when the amount of silver is more than about 80 weight %, silver alloy closing line has ratio and works as
The amount of silver preferably engages character when being less than about 80 weight %.
(6-A) embodiment 2A and 3A
Compared with comparative example 3A to 5A, use and there are the silver of about 90 weight %, the gold of about 8 weight %, about 2 weight %
The silver alloy closing line of the germanium of palladium, the calcium of about 10wt ppm, the copper of about 50wt ppm, the beryllium of about 5wt ppm and about 15wt ppm.
The percentage elongation of silver alloy closing line is changed to less than about 18% from about more than 15%.The biggest percentage elongation causes the biggest poplar
Family name's modulus, and the lowest FAB transverse section hardness and the lowest joint ball transverse section hardness.
When forming FAB in gas atmosphere, in the case of embodiment 2A, weld-ring character and spherical uniformity are good
And pad to rupture be the best.In the case of embodiment 3A, weld-ring character and spherical uniformity be good also
And pad to rupture be the best.
It is to say, in the case of the silver alloy closing line with about more than 15% percentage elongation, even if when silver alloy connects
When the joint character of zygonema is the most bad, because within engaging the error span that character produces in the fabrication process, determining
Silver alloy closing line has good joint character.
(6-B) embodiment 2B and 3B
Compared with comparative example 3B to 5B, use and there are the silver of about 90 weight %, the gold of about 8 weight %, about 2 weight %
The silver alloy closing line of the germanium of palladium, the calcium of about 10wt ppm, the copper of about 50wt ppm, the beryllium of about 5wt ppm and about 15wt ppm.
The percentage elongation of silver alloy closing line is changed to less than about 18% from about more than 15%.The biggest percentage elongation causes the biggest poplar
Family name's modulus, and the lowest FAB transverse section hardness and the lowest joint ball transverse section hardness.
When forming FAB in air atmosphere, in the case of embodiment 2B, weld-ring character and spherical uniformity are good
And pad to rupture be the best.In the case of comparative example 3B, weld-ring character is the best, spherical uniformity
The best and pad to rupture be the best.
It is to say, in the case of the silver alloy closing line with about more than 15% percentage elongation, even if when silver alloy connects
When the joint character of zygonema is not very good, also because within engaging the error span that character produces in the fabrication process, so
Determine that silver alloy closing line has good joint character.
(7-A) embodiment 4A to 6A
Among all embodiments used herein, these embodiments have the mechanical property showing suitable result.
Compared with comparative example 3A to 5A, use and there are the silver of about 90 weight %, the gold of about 8 weight %, about 2 weight %
The silver alloy closing line of the germanium of palladium, the calcium of about 10wt ppm, the copper of about 50wt ppm, the beryllium of about 5wt ppm and about 15wt ppm.
The percentage elongation of silver alloy closing line is changed to about 22% from about 18%.When percentage elongation increases, Young's modulus and increase
Proportionally the increasing to 76GPa, FAB transverse section hardness from about 73GPa and be reduced to 55Hv from about 58Hv of percentage elongation, and engage
The transverse section hardness of ball is reduced to 93Hv from about 94Hv.
When in gas atmosphere formed FAB time, in the case of embodiment 4A to 6A, weld-ring character, spherical uniformity and
It is all the best that pad ruptures.It is to say, within the scope of corresponding to the percentage elongation of embodiment 4A to 6A, obtain being suitable for
Engage character.
(7-B) embodiment 4B to 6B
Among all embodiments used herein, these embodiments have the mechanical property demonstrating suitable result.
Compared with comparative example 3B to 5B, use and there are the silver of about 90 weight %, the gold of about 8 weight %, about 2 weight %
The silver alloy closing line of the germanium of palladium, the calcium of about 10wt ppm, the copper of about 50wt ppm, the beryllium of about 5wt ppm and about 15wt ppm.
The percentage elongation of silver alloy closing line is changed to about 22% from about 18%.When percentage elongation increases, Young's modulus and increase
Proportionally the increasing to 76GPa, FAB transverse section hardness from about 73GPa and be reduced to 60Hv from about 63Hv of percentage elongation, and engage
The transverse section hardness of ball is reduced to 100Hv from about 101Hv.
When in air atmosphere formed FAB time, in the case of embodiment 4B to 6B, weld-ring character, spherical uniformity and
It is all the best that pad ruptures.It is to say, within the scope of corresponding to the percentage elongation of embodiment 4A to 6A, obtain being suitable for
Engage character.
(8-A) embodiment 7A and 8A
Compared with comparative example 3A to 6A, use and there are the silver of about 90 weight %, the gold of about 8 weight %, about 2 weight %
The silver alloy closing line of the germanium of palladium, the calcium of about 10wt ppm, the copper of about 50wt ppm, the beryllium of about 5wt ppm and about 15wt ppm.
The percentage elongation of silver alloy closing line is changed to less than about 25% from about more than 23.5%.The biggest percentage elongation causes the biggest
Young's modulus, and the lowest FAB transverse section hardness and the lowest joint ball transverse section hardness.
When in gas atmosphere formed FAB time, in the case of embodiment 7A to 8A, weld-ring character be the best,
Spherical uniformity be good and pad to rupture be the best.It is to say, stretch having less than about 22% to 25%
In the case of the silver alloy closing line of long rate, even if when the joint character of silver alloy closing line is not very good, also because connecing
Within closing the error span that character produces in the fabrication process, so determining that silver alloy closing line has good joint character.
(8-B) embodiment 7B and 8B
Compared with comparative example 3B to 6B, use and there are the silver of about 90 weight %, the gold of about 8 weight %, about 2 weight %
The silver alloy closing line of the germanium of palladium, the calcium of about 10wt ppm, the copper of about 50wt ppm, the beryllium of about 5wt ppm and about 15wt ppm.
The percentage elongation of silver alloy closing line is changed to about 25% from about 23.5%.The biggest percentage elongation causes the biggest Young mould
Amount, and the lowest FAB transverse section hardness and the lowest joint ball transverse section hardness.
When forming FAB in air atmosphere, in the case of embodiment 7B and 8B, weld-ring character is the best,
Spherical uniformity be good and pad to rupture be the best.It is to say, stretch having less than about 22% to 25%
In the case of the silver alloy closing line of long rate, even if when the joint character of silver alloy closing line is not very good, also because
Within engaging the error span that character produces in the fabrication process, so determining that silver alloy closing line has good zygosity
Matter.
5. conclusion
According to embodiment, when by changing alloy composition and mechanical property (such as its percentage elongation, Young's modulus or transversal
Surface hardness) and the silver alloy closing line of the mechanical property with particular range that obtains in gas atmosphere or in air atmosphere
When forming FAB and be engaged to solder pad of semiconductor device by wire bonding, silver alloy closing line can have relative to half
The excellent joint character of conductor device pad, and also high product stability is provided.
According to present inventive concept, even if when forming FAB in the end of closing line in the atmosphere be formed without blanket of nitrogen,
The such as performance of ball shape and high humility reliability etc is also good, such that it is able to reduce manufacturing cost.
Should be appreciated that exemplary should being regarded only as herein described is illustrative rather than limiting purpose.To each exemplary
In example, the description of feature or aspect is typically considered to can be used for other similar features of other illustrative examples or aspect.
Claims (9)
1. a silver alloy closing line, described silver alloy closing line comprises:
First addition element of about 1 to about 20 weight (wt) %；
Second addition element of about 3 to about 100wt ppm；With
The silver (Ag) of surplus,
Wherein
Described first addition element includes gold (Au), palladium (Pd) or their alloy,
Described second addition element includes at least one selected from the following: calcium (Ca), lanthanum (La), beryllium (Be), germanium (Ge), nickel
(Ni), bismuth (Bi), yttrium (Y), manganese (Mn), stannum (Sn), titanium (Ti), ferrum (Fe), copper (Cu) and magnesium (Mg),
The percentage elongation of described silver alloy closing line in the range of about 15% to about 25%, and
The Young's modulus of described silver alloy closing line is in the range of about 60GPa to about 80GPa.
Silver alloy closing line the most according to claim 1, wherein
The percentage elongation of described silver alloy closing line is in the range of about 18% to about 22%.
Silver alloy closing line the most according to claim 1, wherein
The Young's modulus of described silver alloy closing line is in the range of about 65GPa to about 80GPa.
Silver alloy closing line the most according to claim 1, wherein
When forming free air balls (FAB) in the end of described silver alloy closing line, described free air balls has about 50Hv extremely
The transverse section hardness of about 80Hv.
Silver alloy closing line the most according to claim 1, wherein
After described silver alloy closing line engages with bond pad, the bonding part of described silver alloy closing line has about 80Hv
Transverse section hardness to about 120Hv.
Silver alloy closing line the most according to claim 5, wherein
When forming free air balls in the end of described silver alloy closing line in air atmosphere, the probability that pad ruptures is basic
The upper probability ruptured equal to the pad when forming free air balls in gas atmosphere in the end of described silver alloy closing line.
7. the method manufacturing silver alloy closing line, described method includes:
Preparing the first metal wire, described first metal wire comprises
First addition element of about 1 to about 20 weight %,
Second addition element of about 3 to about 100wt ppm, and
The silver (Ag) of surplus,
Wherein said first addition element includes gold (Au), palladium (Pd) or their alloy,
Described second addition element includes at least one selected from the following: calcium (Ca), lanthanum (La), beryllium (Be), germanium (Ge), nickel
(Ni), bismuth (Bi), yttrium (Y), manganese (Mn), stannum (Sn), titanium (Ti), ferrum (Fe), copper (Cu) and magnesium (Mg)；With
Described first metal wire is annealed in blanket of nitrogen in the range of about 500 DEG C to about 700 DEG C, to obtain about 15% to about
The percentage elongation of 25% and the Young's modulus of about 60GPa to about 80GPa.
Method the most according to claim 7, wherein
The percentage elongation of described first metal wire is in the range of about 18% to about 22%.
Method the most according to claim 7, wherein
The Young's modulus of described first metal wire is in the range of about 65GPa to about 80GPa.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150063880A KR101687598B1 (en) | 2015-05-07 | 2015-05-07 | Silver alloy bonding wire and manufacturing method thereof |
| KR10-2015-0063880 | 2015-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106119590A true CN106119590A (en) | 2016-11-16 |
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ID=57269776
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610225123.4A Pending CN106119590A (en) | 2015-05-07 | 2016-04-12 | Silver alloy closing line and manufacture method thereof |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101687598B1 (en) |
| CN (1) | CN106119590A (en) |
| PH (1) | PH12016000121A1 (en) |
| TW (1) | TW201639972A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411362A (en) * | 2018-10-13 | 2019-03-01 | 深圳粤通应用材料有限公司 | A kind of preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity |
| CN109763015A (en) * | 2019-03-25 | 2019-05-17 | 杭州辰卓科技有限公司 | A kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging |
| CN109777991A (en) * | 2019-03-25 | 2019-05-21 | 杭州辰卓科技有限公司 | A kind of electric leads bonding corrosion-resistant high-damping silver alloy and its technique |
| CN111599783A (en) * | 2020-04-03 | 2020-08-28 | 广东佳博电子科技有限公司 | Silver-platinum bonding wire utilizing silver-platinum coating and preparation process thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI796739B (en) * | 2021-07-26 | 2023-03-21 | 樂金股份有限公司 | Alloy bonding wire |
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| JPS5258014A (en) * | 1975-11-10 | 1977-05-13 | Kenkichi Tachiki | Silver based alloy with anti fading property |
| CN101458980A (en) * | 2007-12-14 | 2009-06-17 | 李俊德 | Composite metal line for packaging conductive wire and manufacturing method thereof |
| CN101786154A (en) * | 2009-01-24 | 2010-07-28 | 李俊德 | Composite gold wire and manufacture method thereof |
| KR20150027626A (en) * | 2013-09-04 | 2015-03-12 | 엠케이전자 주식회사 | Silver alloy bonding wire and manufacturing method thereof |
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| JP4596467B2 (en) * | 2005-06-14 | 2010-12-08 | 田中電子工業株式会社 | Gold alloy wire for bonding wire with high bonding reliability, high roundness of crimped ball, high straightness and high resin flow resistance |
| KR20110047582A (en) * | 2009-10-30 | 2011-05-09 | 엠케이전자 주식회사 | Apparatus for manufacturing bonding wires using atmosphere plasma cleaning and method of manufacturing bonding wires using the same |
| KR101334282B1 (en) * | 2013-02-12 | 2013-11-28 | 엠케이전자 주식회사 | Ag-based wire for semiconductor package and semiconductor package having the same |
-
2015
- 2015-05-07 KR KR1020150063880A patent/KR101687598B1/en active Application Filing
-
2016
- 2016-03-03 TW TW105106413A patent/TW201639972A/en unknown
- 2016-03-28 PH PH12016000121A patent/PH12016000121A1/en unknown
- 2016-04-12 CN CN201610225123.4A patent/CN106119590A/en active Pending
Patent Citations (4)
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|---|---|---|---|---|
| JPS5258014A (en) * | 1975-11-10 | 1977-05-13 | Kenkichi Tachiki | Silver based alloy with anti fading property |
| CN101458980A (en) * | 2007-12-14 | 2009-06-17 | 李俊德 | Composite metal line for packaging conductive wire and manufacturing method thereof |
| CN101786154A (en) * | 2009-01-24 | 2010-07-28 | 李俊德 | Composite gold wire and manufacture method thereof |
| KR20150027626A (en) * | 2013-09-04 | 2015-03-12 | 엠케이전자 주식회사 | Silver alloy bonding wire and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411362A (en) * | 2018-10-13 | 2019-03-01 | 深圳粤通应用材料有限公司 | A kind of preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity |
| CN109763015A (en) * | 2019-03-25 | 2019-05-17 | 杭州辰卓科技有限公司 | A kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging |
| CN109777991A (en) * | 2019-03-25 | 2019-05-21 | 杭州辰卓科技有限公司 | A kind of electric leads bonding corrosion-resistant high-damping silver alloy and its technique |
| CN111599783A (en) * | 2020-04-03 | 2020-08-28 | 广东佳博电子科技有限公司 | Silver-platinum bonding wire utilizing silver-platinum coating and preparation process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101687598B1 (en) | 2016-12-20 |
| PH12016000121A1 (en) | 2018-03-05 |
| KR20160131456A (en) | 2016-11-16 |
| TW201639972A (en) | 2016-11-16 |
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