CN109411362A - A kind of preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity - Google Patents
A kind of preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity Download PDFInfo
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- CN109411362A CN109411362A CN201811192693.3A CN201811192693A CN109411362A CN 109411362 A CN109411362 A CN 109411362A CN 201811192693 A CN201811192693 A CN 201811192693A CN 109411362 A CN109411362 A CN 109411362A
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- 239000000956 alloy Substances 0.000 title claims abstract description 108
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 108
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 230000035939 shock Effects 0.000 title claims abstract description 17
- 238000000137 annealing Methods 0.000 claims abstract description 40
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052709 silver Inorganic materials 0.000 claims abstract description 38
- 239000004332 silver Substances 0.000 claims abstract description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000002844 melting Methods 0.000 claims abstract description 24
- 230000008018 melting Effects 0.000 claims abstract description 24
- 238000005491 wire drawing Methods 0.000 claims abstract description 23
- 150000001875 compounds Chemical class 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 claims abstract description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229960000935 dehydrated alcohol Drugs 0.000 claims abstract description 11
- 238000004381 surface treatment Methods 0.000 claims abstract description 11
- 239000004094 surface-active agent Substances 0.000 claims abstract description 11
- 239000012153 distilled water Substances 0.000 claims abstract description 10
- 229910052754 neon Inorganic materials 0.000 claims abstract description 7
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims abstract description 7
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 230000002238 attenuated effect Effects 0.000 claims abstract description 6
- OEZQCMMAFSEXQW-UHFFFAOYSA-N calcium silver Chemical compound [Ca].[Ag] OEZQCMMAFSEXQW-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000011261 inert gas Substances 0.000 claims abstract description 6
- 239000011241 protective layer Substances 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- 239000007789 gas Substances 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 10
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 10
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052791 calcium Inorganic materials 0.000 claims description 6
- 239000011575 calcium Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 238000005868 electrolysis reaction Methods 0.000 claims description 5
- 239000003792 electrolyte Substances 0.000 claims description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 5
- 238000005554 pickling Methods 0.000 claims description 5
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 5
- 239000000314 lubricant Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000007670 refining Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
- B21C1/003—Drawing materials of special alloys so far as the composition of the alloy requires or permits special drawing methods or sequences
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
- B21C37/047—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire of fine wires
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
- C22C5/08—Alloys based on silver with copper as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Metal Extraction Processes (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention discloses a kind of preparation methods of the cold-resistant thermal shock bonding alloy wire of high intensity, comprising the following steps: S1 prepares silver strip: silver strip is made using silver bullion；S2 prepares intermediate alloy: the intermediate alloy is one of silver-calcium intermediate alloy, silver-copper intermediate alloy；S3 melting: intermediate alloy obtained in step S2 is added in 99.995% silver, and melting is carried out under the protection of inert gas neon, cast, forms alloy bar；S4 wire drawing: the alloy bar of founding is gradually drawn and attenuated on wire drawing machine；S5 annealing: annealing temperature is 300-600 DEG C, annealing speed 62mm/min；S6:, which repeating step S4 second of wire drawing of progress, and repeats step S5 carries out second of annealing；S7 surface treatment: enclosing one layer of high-molecular compound on bonding alloy wire surface, and high-molecular compound is made of 10% surfactant, 10% dehydrated alcohol and 80% distilled water, can form one layer very thin very fine and close protective layer on bonding alloy wire surface；S8 coiling.
Description
Technical field
The present invention relates to alloy wire preparation technical field, the system of specifically a kind of cold-resistant thermal shock bonding alloy wire of high intensity
Preparation Method.
Background technique
Bonding gold wire is the alloy wire for being used as connecting line in integrated circuit.Its gold content >=99.99%, high reliablity, but
It is that the price of gold is higher；Bonding brass wire is also a kind of higher bonding wire of reliability, but a disadvantage is that easily aoxidizing, by silver
The research of materials is waited, decision replaces gold with silver, and silver has and the much the same inertia of gold, and there is no as coppery easy
The characteristic of oxidation, meanwhile, some microelements are added, are provided with silver binding affinity, the characteristics of balling-up is more round, Yi Jianhe.But
In process of production, it is at this moment easy to produce the anchoring effect of self-diffusion between bonding alloy wire, because its intensity is lower, and then generates
A large amount of broken string, and it is weak vulnerable to cooling thermal impact.
Summary of the invention
The purpose of the present invention is to provide a kind of preparation methods of the cold-resistant thermal shock bonding alloy wire of high intensity, on solving
State the problem of proposing in background technique.
To achieve the above object, the invention provides the following technical scheme:
A kind of preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity, comprising the following steps:
S1 prepares silver strip: silver bullion purity being purified to 99.995% using electrolysis, and silver strip is made in it；
S2 prepares intermediate alloy: the intermediate alloy is one of silver-calcium intermediate alloy, silver-copper intermediate alloy；The production
Intermediate alloy, comprising the following steps:
A. 99.995% silver strip 99.43%-99.50% is weighed by weight percentage, weighs calcium 0.50-0.57%；Silver strip 95% is weighed,
Weigh copper sheet 5%；B. protective gas melting；C. under a shielding gas, natural cooling；D. pickling；
S3 melting: intermediate alloy obtained in step S2 is added in 99.995% silver, and in the protection of inert gas neon
Lower carry out melting, cast form alloy bar；
S4 wire drawing: the alloy bar of founding is gradually drawn and attenuated on wire drawing machine, until 70-100 μm of diameter；
S5 annealing: it is 0.2-0.4MPa, the high pressure water cleaning that water temperature is 40-80 DEG C that alloy wire resulting after wire drawing, which is mounted in pressure,
It is cleaned in system；Re-annealing, annealing temperature temperature are 300-600 DEG C, annealing speed 62mm/min；
S6:, which repeating step S4 second of wire drawing of progress, and repeats step S5 carries out second of annealing；
S7 surface treatment: one layer of high-molecular compound is enclosed on bonding alloy wire surface, high-molecular compound is by 10% surface-active
Agent, 10% dehydrated alcohol and 80% distilled water composition can form one layer very thin very fine and close protective layer on bonding alloy wire surface；
S8 coiling: bonding alloy wire is wound in finished product spool, and is vacuum-packed.
As a further solution of the present invention: the electrolyte of the electrorefining is high-purity water-reducible silver nitrate solution,
Electric current is 1.8~4.2A, and voltage is 5~12V, and temperature is to a height of 65 DEG C.
As further scheme of the invention: the surface treatment after annealing in the step S7 refers in bonding alloy silk table
One layer of high-molecular compound is enclosed in face, and high-molecular compound is by 10% surfactant, 10% dehydrated alcohol and 80% distilled water group
At.
As further scheme of the invention: remaining profit by supersonic wave cleaning machine cleaning before annealing in the step S5
Lubrication prescription.
As further scheme of the invention: the monitor system of protective gas melting is 10kW in the step S3, to
Temperature is kept to refine 10min after being completely melt.
As the present invention further scheme: in the step S2 acid cleaning process refer to the intermediate alloy of generation is first used it is pure
Water is cooling, is then put into beaker and is added concentrated hydrochloric acid, beaker is put on electric furnace and heats 15min, is washed again with pure water after having boiled,
Finally dried up with compressed air.
As the present invention further scheme: the coiling is that treated that bonding alloy wire is wound on by surface cleaning
On spool, winding tension is 2~15g, and threading speed is 50~80m/min, and line spacing is 4.5~5.5mm, and bundling length is
300~1000m/ axis.
As further scheme of the invention: in the step S4, the mold elongation percentage in drawing process is 5%-
18%, drawing speed 3-15m/s.
Compared with prior art, the beneficial effects of the present invention are: previous spun gold price is too high, alloy wire of the invention at
This is low, and the fracture load of material can be improved in microelements of calcium and copper, and reduces the radian of bonding alloy wire, and improves bonding
The intensity and cooling thermal impact degree of alloy wire, melting is protected using neon and lower carry out melting and avoid high-temperature oxydation in preparation process；
The purity of product is improved, and then improves product quality, and answering in bonding alloy wire is eliminated by twice annealing in preparation process
Power improves intensity.
Specific embodiment
The technical solution of the patent is explained in further detail With reference to embodiment.
Embodiment 1
A kind of preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity, comprising the following steps:
S1 prepares silver strip: silver bullion purity being purified to 99.995% using electrolysis, and silver strip is made in it；
S2 prepares intermediate alloy: the intermediate alloy is one of silver-calcium intermediate alloy, silver-copper intermediate alloy；The production
Intermediate alloy, comprising the following steps: a. weighs 99.995% silver strip 99.50% by weight percentage, weighs calcium 0.50%；Weigh silver
Piece 95% weighs copper sheet 5%；B. protective gas melting；C. under a shielding gas, natural cooling；D. pickling；
S3 melting: intermediate alloy obtained in step S2 is added in 99.995% silver, and in the protection of inert gas neon
Lower carry out melting, cast form alloy bar；
S4 wire drawing: the alloy bar of founding is gradually drawn and attenuated on wire drawing machine, until 70 μm of diameter；
S5 annealing: it is 0.2MPa that alloy wire resulting after wire drawing, which is mounted in pressure, and water temperature is in 40 DEG C of high pressure water cleaning system
It is cleaned；Re-annealing, annealing temperature temperature are 300 DEG C, annealing speed 62mm/min；
S6:, which repeating step S4 second of wire drawing of progress, and repeats step S5 carries out second of annealing；
S7 surface treatment: one layer of high-molecular compound is enclosed on bonding alloy wire surface, high-molecular compound is by 10% surface-active
Agent, 10% dehydrated alcohol and 80% distilled water composition can form one layer very thin very fine and close protective layer on bonding alloy wire surface；
S8 coiling: bonding alloy wire is wound in finished product spool, and is vacuum-packed.
As a further solution of the present invention: the electrolyte of the electrorefining is high-purity water-reducible silver nitrate solution,
Electric current is 1.8A, and voltage 5V, temperature is to a height of 65 DEG C.
Surface treatment after annealing in the step S7, which refers to, encloses one layer of high-molecular compound on bonding alloy wire surface, high
Molecular compound is made of 10% surfactant, 10% dehydrated alcohol and 80% distilled water.
Remaining lubricant is cleaned by supersonic wave cleaning machine before annealing in the step S5.
The monitor system of protective gas melting is 10kW in the step S3, keeps temperature refining until completely melted
10min。
Acid cleaning process, which refers to, in the step S2 first uses pure water cooling for the intermediate alloy of generation, is then put into beaker and adds
Enter concentrated hydrochloric acid, beaker is put on electric furnace and heats 15min, washed again with pure water after having boiled, is finally dried up with compressed air.
The coiling is that treated that bonding alloy wire is wound on spool by surface cleaning, winding tension 2g, coiling
Speed is 50m/min, and line spacing is 4.5mm, and bundling length is 300m/ axis.
In the step S4, the mold elongation percentage in drawing process is 5%, drawing speed 3m/s.
Embodiment two:
A kind of preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity, comprising the following steps:
S1 prepares silver strip: silver bullion purity being purified to 99.995% using electrolysis, and silver strip is made in it；
S2 prepares intermediate alloy: the intermediate alloy is one of silver-calcium intermediate alloy, silver-copper intermediate alloy；The production
Intermediate alloy, comprising the following steps: a. weighs 99.995% silver strip 99.47% by weight percentage, weighs calcium 0.53%；Weigh silver
Piece 95% weighs copper sheet 5%；B. protective gas melting；C. under a shielding gas, natural cooling；D. pickling；
S3 melting: intermediate alloy obtained in step S2 is added in 99.995% silver, and in the protection of inert gas neon
Lower carry out melting, cast form alloy bar；
S4 wire drawing: the alloy bar of founding is gradually drawn and attenuated on wire drawing machine, until 85 μm of diameter；
S5 annealing: it is 0.3MPa that alloy wire resulting after wire drawing, which is mounted in pressure, and water temperature is in 60 DEG C of high pressure water cleaning system
It is cleaned；Re-annealing, annealing temperature temperature are 450 DEG C, annealing speed 62mm/min；
S6:, which repeating step S4 second of wire drawing of progress, and repeats step S5 carries out second of annealing；
S7 surface treatment: one layer of high-molecular compound is enclosed on bonding alloy wire surface, high-molecular compound is by 10% surface-active
Agent, 10% dehydrated alcohol and 80% distilled water composition can form one layer very thin very fine and close protective layer on bonding alloy wire surface；
S8 coiling: bonding alloy wire is wound in finished product spool, and is vacuum-packed.
As a further solution of the present invention: the electrolyte of the electrorefining is high-purity water-reducible silver nitrate solution,
Electric current is 3A, and voltage 8V, temperature is to a height of 65 DEG C.
Surface treatment after annealing in the step S7, which refers to, encloses one layer of high-molecular compound on bonding alloy wire surface, high
Molecular compound is made of 10% surfactant, 10% dehydrated alcohol and 80% distilled water.
Remaining lubricant is cleaned by supersonic wave cleaning machine before annealing in the step S5.
The monitor system of protective gas melting is 10kW in the step S3, keeps temperature refining until completely melted
10min。
Acid cleaning process, which refers to, in the step S2 first uses pure water cooling for the intermediate alloy of generation, is then put into beaker and adds
Enter concentrated hydrochloric acid, beaker is put on electric furnace and heats 15min, washed again with pure water after having boiled, is finally dried up with compressed air.
The coiling is that treated that bonding alloy wire is wound on spool by surface cleaning, winding tension 8g, coiling
Speed is 65m/min, and line spacing is 5mm, and bundling length is 700m/ axis.
In the step S4, the mold elongation percentage in drawing process is 10%, drawing speed 8m/s.
Embodiment three:
A kind of preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity, comprising the following steps:
S1 prepares silver strip: silver bullion purity being purified to 99.995% using electrolysis, and silver strip is made in it；
S2 prepares intermediate alloy: the intermediate alloy is one of silver-calcium intermediate alloy, silver-copper intermediate alloy；The production
Intermediate alloy, comprising the following steps: a. weighs 99.995% silver strip 99.43% by weight percentage, weighs calcium 0.57%；Weigh silver
Piece 95% weighs copper sheet 5%；B. protective gas melting；C. under a shielding gas, natural cooling；D. pickling；
S3 melting: intermediate alloy obtained in step S2 is added in 99.995% silver, and in the protection of inert gas neon
Lower carry out melting, cast form alloy bar；
S4 wire drawing: the alloy bar of founding is gradually drawn and attenuated on wire drawing machine, until 100 μm of diameter；
S5 annealing: it is 0.4MPa that alloy wire resulting after wire drawing, which is mounted in pressure, and water temperature is in 80 DEG C of high pressure water cleaning system
It is cleaned；Re-annealing, annealing temperature temperature are 600 DEG C, annealing speed 62mm/min；
S6:, which repeating step S4 second of wire drawing of progress, and repeats step S5 carries out second of annealing；
S7 surface treatment: one layer of high-molecular compound is enclosed on bonding alloy wire surface, high-molecular compound is by 10% surface-active
Agent, 10% dehydrated alcohol and 80% distilled water composition can form one layer very thin very fine and close protective layer on bonding alloy wire surface；
S8 coiling: bonding alloy wire is wound in finished product spool, and is vacuum-packed.
As a further solution of the present invention: the electrolyte of the electrorefining is high-purity water-reducible silver nitrate solution,
Electric current is 14.2A, and voltage 12V, temperature is to a height of 65 DEG C.
Surface treatment after annealing in the step S7, which refers to, encloses one layer of high-molecular compound on bonding alloy wire surface, high
Molecular compound is made of 10% surfactant, 10% dehydrated alcohol and 80% distilled water.
Remaining lubricant is cleaned by supersonic wave cleaning machine before annealing in the step S5.
The monitor system of protective gas melting is 10kW in the step S3, keeps temperature refining until completely melted
10min。
Acid cleaning process, which refers to, in the step S2 first uses pure water cooling for the intermediate alloy of generation, is then put into beaker and adds
Enter concentrated hydrochloric acid, beaker is put on electric furnace and heats 15min, washed again with pure water after having boiled, is finally dried up with compressed air.
The coiling is that treated that bonding alloy wire is wound on spool by surface cleaning, winding tension 15g, coiling
Speed is 80m/min, and line spacing is 5.5mm, and bundling length is 1000m/ axis.
In the step S4, the mold elongation percentage in drawing process is 18%, drawing speed 15m/s.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (8)
1. a kind of preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity, which comprises the following steps:
S1 prepares silver strip: silver bullion purity being purified to 99.995% using electrolysis, and silver strip is made in it；
S2 prepares intermediate alloy: the intermediate alloy is one of silver-calcium intermediate alloy, silver-copper intermediate alloy；The production
Intermediate alloy, comprising the following steps: a. weighs 99.995% silver strip 99.43%-99.50% by weight percentage, weighs calcium 0.50-
0.57%；Silver strip 95% is weighed, copper sheet 5% is weighed；B. protective gas melting；C. under a shielding gas, natural cooling；D. pickling；
S3 melting: intermediate alloy obtained in step S2 is added in 99.995% silver, and in the protection of inert gas neon
Lower carry out melting, cast form alloy bar；
S4 wire drawing: the alloy bar of founding is gradually drawn and attenuated on wire drawing machine, until 70-100 μm of diameter；
S5 annealing: it is 0.2-0.4MPa, the high pressure water cleaning that water temperature is 40-80 DEG C that alloy wire resulting after wire drawing, which is mounted in pressure,
It is cleaned in system；Re-annealing, annealing temperature temperature are 300-600 DEG C, annealing speed 62mm/min；
S6:, which repeating step S4 second of wire drawing of progress, and repeats step S5 carries out second of annealing；
S7 surface treatment: one layer of high-molecular compound is enclosed on bonding alloy wire surface, high-molecular compound is by 10% surface-active
Agent, 10% dehydrated alcohol and 80% distilled water composition can form one layer very thin very fine and close protective layer on bonding alloy wire surface；S8
Coiling: bonding alloy wire is wound in finished product spool, and is vacuum-packed.
2. the preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity according to claim 1, which is characterized in that described
The electrolyte of electrorefining is high-purity water-reducible silver nitrate solution, and electric current is 1.8~4.2A, and voltage is 5~12V, and temperature is extremely
A height of 65 DEG C.
3. the preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity according to claim 1, which is characterized in that described
Surface treatment after annealing in step S7, which refers to, encloses one layer of high-molecular compound on bonding alloy wire surface, high-molecular compound by
10% surfactant, 10% dehydrated alcohol and 80% distilled water composition.
4. the preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity according to claim 1, which is characterized in that described
Remaining lubricant is cleaned by supersonic wave cleaning machine before annealing in step S5.
5. the preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity according to claim 1, which is characterized in that described
The monitor system of protective gas melting is 10kW in step S3, keeps temperature to refine 10min until completely melted.
6. the preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity according to claim 1, which is characterized in that described
Acid cleaning process, which refers to, in step S2 first uses pure water cooling for the intermediate alloy of generation, is then put into beaker and is added concentrated hydrochloric acid, will
Beaker, which is put on electric furnace, heats 15min, is washed with pure water after having boiled, is finally dried up with compressed air again.
7. the preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity according to claim 1, which is characterized in that described
Coiling is that treated that bonding alloy wire is wound on spool by surface cleaning, and winding tension is 2~15g, threading speed 50
~80m/min, line spacing are 4.5~5.5mm, and bundling length is 300~1000m/ axis.
8. the preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity according to claim 1, which is characterized in that described
In step S4, the mold elongation percentage in drawing process is 5%-18%, drawing speed 3-15m/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811192693.3A CN109411362A (en) | 2018-10-13 | 2018-10-13 | A kind of preparation method of the cold-resistant thermal shock bonding alloy wire of high intensity |
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| CN103996668A (en) * | 2014-05-30 | 2014-08-20 | 江西蓝微电子科技有限公司 | Silver-lanthanum-calcium alloy bonding wire and manufacturing method thereof |
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