CN109763015A - A kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging - Google Patents
A kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging Download PDFInfo
- Publication number
- CN109763015A CN109763015A CN201910225073.3A CN201910225073A CN109763015A CN 109763015 A CN109763015 A CN 109763015A CN 201910225073 A CN201910225073 A CN 201910225073A CN 109763015 A CN109763015 A CN 109763015A
- Authority
- CN
- China
- Prior art keywords
- silver
- bonding line
- degree
- alloy
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Conductive Materials (AREA)
Abstract
The invention discloses a kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line materials used for electronic packaging.According to weight percent, the ingredient of the alloy are as follows: Mn:20.0-25.0wt.%, In:1.0-2.0wt.%, Ni:4.0-5.0wt.%, Cu:15.0-20.0wt.%, Sc:0.1-0.2wt.%, Ge:0.5-0.8wt.%, Zn:2.0-4.0wt.%, Te:0.1-0.2wt.%, surplus are silver.The material provides a kind of silver-colored bonding line for encapsulation for the electronic device used in the environment of serious vibration, status that can be undesirable efficiently against existing silver-colored bonding line damping capacity.Silver-colored bonding line not only can be effectively avoided due to vibrating bring fatigue rupture in the implementation and industrialization of the material, while can also obtain the economic benefit of great social benefit.
Description
Technical field
The present invention relates to technical field of alloy, specifically, being related to a kind of silver alloy.
Background technique
Industrial vibration bring noise pollution, which has become, to endanger greatly the one of the mankind, and and water pollution, atmosphere pollution one
It rises and is seen as worldwide three main Environmental Problems.There are many source of vibration and noise, and most important type is: (1)
The rotation of machinery itself or a part of part bring abnormal vibrations and noise due to the defect of the loss of assembling and bearing;
(2) a large amount of kinetic energy is converted to vibration and noise in a short time when object is impacted;(3) due to natural frequency of object and outside
The frequency of vibration is added to have resonance caused by coincidence;(4) sinuous flow that the fluid of high-speed motion encounters barrier and generates will lead to vibration
Dynamic and noise.
Vibration in mechanical structure can cause serious broadband random vibration and noisy environment, can also excitation structure and electricity
The formant of control device device.Thus, so that mechanical structure fatigue failure occurs and dynamic buckling is fixed, can make when serious
Electronic control equipment precision is reduced and is broken down.In aerospace field, the ground flying of rocket and aircraft test failure
One third is related with vibration.In addition, harm caused by the vibration as caused by earthquake is even more well-known.Noise can be brought to people
Physiologically with psychological harm, mainly hearing damage, reduces cardiovascular function and influence the nervous system of people.Thus existing
Foundry industry and transportation must fundamentally from technology, economy and effect etc. be subject to choosing comprehensively and solve vibration and
Noise.
All harm caused by vibration and noise can be solved by reducing the amplitude of material or structure,
Namely reducing vibration is the essential measure for reducing noise.It fundamentally gets on very well, the bad damping capacity of structural material is to cause
Vibration brings the major reason of serious harm.Damping material is the material that solid mechanical vibrational energy is changed into thermal energy and is dissipated,
It is mainly used for vibration and noise control.In order to improve the damping capacity of structure, structural material and damping material can be used simultaneously
In structure design, i.e., is met with stresses with structural material and generate damping action with damping material.Structural material and damping material
Synergy can make entire mechanical structure generate damping action outstanding to reach control vibration and reduce the target of noise.
Most important two types are organic damping material and alloy damping material in damping material.Organic damping material by
In mechanical property is low and non-refractory the disadvantages of and it cannot function as structural member to be designed.Damping alloy has excellent machinery
Performance and damping vibration attenuation performance can be directly used in structural vibration reduction design when Machine Design and not have to additional others and subtract
Vibration means.Damping alloy has multiple kinds, and the damping alloy of different cultivars has different mechanical property and damping capacity.
Apply at present it is more be manganese base and copper-based damping alloy, but they are non-ferrous metals and processing technology is cumbersome.Base
In aluminium base, magnesium-based and iron-based damping alloy are due to having a variety of excellent physical properties, and mechanical property and damping capacity are gradually
Start to occupy leading position.
In recent years, the quality of the Alloy Materials in China, performance, green metallurgical level are obviously improved, Alloy Materials
Industry development also for China's industrial repositioning upgrading provide new opportunity.Currently, also just in field of new materials in world wide
Sound vertical industry cooperative mechanism is established, and accelerates new material in the application and popularization of industrial circle.It is contemplated that not
In the industrialization fast development process come, damping alloy will be obtained in vibration damping, some high-tech sectors such as noise reduction and electromagnetic shielding
More wide application.Thus, high-performance is developed, the New Damping alloy of high-tech and high-quality will become current main side
To.
Summary of the invention
The purpose of the present invention is to overcome the deficiency in the prior art, provides a kind of resistance to brittle failure of damp type high thermal conductivity used for electronic packaging
Silver-colored bonding line material.
To achieve the goals above, the present invention adopts the following technical scheme:
A kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging.By weight percentage, the composition of alloy
For Mn:20.0-25.0wt.%, In:1.0-2.0wt.%, Ni:4.0-5.0wt.%, Cu:15.0-20.0wt.%, Sc:0.1-
0.2wt.%, Ge:0.5-0.8wt.%, Zn:2.0-4.0wt.%, Te:0.1-0.2wt.%, surplus are silver.
A kind of above-mentioned damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging: the raw material as above matched is existed
Melting in electric induction furnace, wherein active or Volatile Elements are added in the form of intermediate alloy;Graphite is used in fusion process
Crucible and argon gas protection；Crucible forms alloy melt after being heated to 1000-1100 degree, and is sufficiently stirred using electromagnetic agitation effect
15 minutes or so;Alloy melt is cast in waterglass or graphite jig after 1000 degree of heat preservations stand 15 minutes and is cast
Cause rodlike (diameter 50-60mm).
A kind of above-mentioned damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging, including following procedure of processing:
(1) cogging of first time takes out after being heated to 500-600 degree in ingot material vacuum drying oven and carries out rotary blooming processing, directly
Then it is cooling to carry out room temperature after vacuum 500-600 degree is tempered 1 hour by diameter contracting 5-8%.(2) multi-pass is swaged, and is carried out to bar
Processing of swaging under room temperature, per pass diameter contracting 5-8% will carry out the vacuum recrystallization annealing 1 of 500-600 degree after every two passage
Hour and furnace cooling so repeat to reach 1-2mm until final diameter of rod.(3) wire drawing of multi-pass, to bar material into
The room temperature wire drawing of row multi-pass, per pass diameter contracting 5-6%, the recrystallization annealing 1 that 500-600 degree is carried out after every two passage are small
When and furnace cooling, so repeat to reach required billon bond wire diameter until final silk material diameter.(4) last heat
Processing will be provided with silver-colored bonding line 4 hours of timeliness and furnace cooling under 400-420 degree of final size.
Compared with prior art, the invention has the following beneficial effects:
(1) wire bonding is low in cost to account for packing forms multifarious features in Electronic Packaging field due to technical maturity
There is dominant position.The characteristics of gold bonding wire is due to corrosion resistance and good and high reliablity, but due to involving great expense only
It is widely used in mid- to high-end product.Due to its high hardness, bonding when, is easy to cause chip to damage to copper bonding line, and non-hermetically sealed
The shortcomings that being easily corroded in the environment of property and the product for being only used for low and middle-end.In comparison, silver-colored bonding line is in addition to excellent
Outside elegant heating conduction and stability, due also to there is cost factor appropriate and start gradually to apply in microelectronics Packaging.
Semiconductor product will be subjected to very big vibration for vibrating bigger occasion, these vibrate the key so that in semiconductor equipment
Zygonema cracking caused by pad vibration and failure, seriously reduce service life of equipment.Silver-colored bonding line resistance existing at present
Damping properties do not protrude, and just face equipment after packaging due to failure caused by vibrating.This patent is exactly to solve existing silver
A kind of materialogy solution that the damping capacity of bonding line is insufficient and proposes.
(2) high-damping silver bonding wire material belongs to silver-colored Mn series alloy, and the damping mechanism in microstructure is from suitable
Twin boundary is deformed in material by external force in the antiferromagnetic fct formed after magnetic-antiferromagnetic transition and fcc-fct martensitic traoformation
Movement and bring energy dissipation in the process.Substantially, the silver-colored manganese alloy solid solution of fcc structure is only greater than in manganese content
70wt% or more Shi Caihui is due to Martensite temperature spontaneous carry out martensite transfor mation at room temperature higher than room temperature.However, when silver closes
In gold manganese content be higher than 30wt% after casting flaw clearly, the serious quality for reducing final products.Manganese in this patent
Content is controlled in 20-25wt%, thus the composition alloy at room temperature can not spontaneous carry out martensite transfor mation.Since fcc phase exists
Spinodal decomposition can occur between 400-420 degree, the uniform solid solution of Initial Composition can generate the microcosmic area of rich manganese due to unstability
Domain (manganese content is greater than 70wt%).As it can be seen that the region Fu Meng after spinodal decomposition in the alloy just has generates horse at room temperature
The ability of family name's body phase transformation.Broadly, then the silver-colored manganese alloy of this patent is existed by being cooled to fcc phase state after alloy melting
Spinodal decomposition (including due to caused by paramagnetic-antiferromagnetic transition) Fu Meng afterwards occurs for (1 hour of 400-420 degree) under aging technique
The martensitic traoformation (fcc-fct) in region.The martensite transformation temperature in silver manganese alloy region Fu Meng after timeliness is 80-85
Degree, thus the alloy can generate the maximum temperature of damping no more than the temperature section after Electronic Packaging.This material
Micro Instructional Design principle be this patent silver manganese base high-damping alloy established structure basis.
(3) alloy has extremely excellent casting character, and the temperature being completely melt maintains 820-870 degree, fusing temperature
Degree range can achieve 130-150 degree.Passing through multiple drawing handle, after recrystallization annealing and final timeliness, which can be with
Reach the mechanical property of conventional silver bonding line: elasticity modulus 95-100GPa, yield strength 110-120MPa, tensile strength
For 150-160MPa, elongation percentage 12-15%.The material also has very excellent damping capacity: SDC=18-20%, and traditional
The SDC of silver-colored bonding line is less than 5%.In addition, the material is with excellent heat transfer coefficient: 380-390W/m ﹒ K, and conventional silver alloys
Heat transfer coefficient is less than 320 W/m ﹒ K.The excellent heat conducting performance of the material makes electron device package in use due to outside thus
Allowing temperature, sharply silver-colored bonding line by itself quick heat transfer makes temperature be reduced to geneva in raised situation
Below temperature, to restore the damping capacity of the material.
(4) traditional silver-colored bonding line is moved in the atom that silver wire surface can occur at use temperature of high current and electronic device
It moves, results in the generation of compound between contacting interface metal between silver wire and matrix.A series of mechanical behaviors of bonded interface and
The ingredient of bonding reliability and intermetallic compound and performance have direct close relationship, and the aging of silver alloy wire can be accelerated crisp
Change, to influence electrical property and signal transmission, there is very big harmfulness.Present patent application protection novel silver bonding line by
In the optimization for having carried out material prescription and organizational aspects, the generation of silver wire migration can be substantially reduced, and therefore reduces gold
The formation speed of compound between category.Thus after using 5 years, which is not in that bonded interface forms silver wire caused by crackle
Bonding failure, effectively extends the service life of electronic packing piece.The alloy can be produced using traditional equipment, and be added
Work method is simple and efficient.Not only contribute to industrial production, moreover it is possible to solve to obtain great market price while industry problems again
Value.
Specific embodiment
Embodiment 1
A kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging.By weight percentage, the composition of alloy
For Mn:20.0wt.%, In:1.0wt.%, Ni:4.0wt.%, Cu:15.0wt.%, Sc:0.1wt.%, Ge:0.5wt.%, Zn:
2.0wt.%, Te:0.1wt.%, surplus are silver.
A kind of above-mentioned damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging, including following smelting step:
The melting in electric induction furnace by the raw material as above matched, wherein active or Volatile Elements are added in the form of intermediate alloy;
It is protected in fusion process using graphite crucible and argon gas；Crucible forms alloy melt after being heated to 1000-1100 degree, and utilizes electricity
Magnetic agitation effects are sufficiently stirred 15 minutes or so;Alloy melt is cast to after 1000 degree of heat preservations stand 15 minutes waterglass or
It carries out being cast as rodlike (diameter 50-60mm) in person's graphite jig.
A kind of above-mentioned damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging, including following procedure of processing:
(1) cogging of first time takes out after being heated to 500-600 degree in ingot material vacuum drying oven and carries out rotary blooming processing, directly
Then it is cooling to carry out room temperature after vacuum 500-600 degree is tempered 1 hour by diameter contracting 5-8%.(2) multi-pass is swaged, and is carried out to bar
Processing of swaging under room temperature, per pass diameter contracting 5-8% will carry out the vacuum recrystallization annealing 1 of 500-600 degree after every two passage
Hour and furnace cooling so repeat to reach 1-2mm until final diameter of rod.(3) wire drawing of multi-pass, to bar material into
The room temperature wire drawing of row multi-pass, per pass diameter contracting 5-6%, the recrystallization annealing 1 that 500-600 degree is carried out after every two passage are small
When and furnace cooling, so repeat to reach required silver alloy bond wire diameter until final silk material diameter.(4) last heat
Processing will be provided with silver-colored bonding line 4 hours of timeliness and furnace cooling under 400-420 degree of final size.
The alloy has extremely excellent casting character, and the temperature being completely melt maintains 850 degree, and fusion temperature range can
To reach 132 degree.Passing through multiple drawing handle, after recrystallization annealing and final timeliness, which can achieve conventional silver key
The mechanical property of zygonema: elasticity modulus 98GPa, yield strength 115MPa, tensile strength 152MPa, elongation percentage 14%.
The material also has very excellent damping capacity: SDC=18%, and the SDC of conventional silver bonding line is less than 5%.In addition, the material
With excellent heat transfer coefficient: 385W/m ﹒ K, and the heat transfer coefficient of conventional silver alloys is less than 320 W/m ﹒ K.The material it is excellent
Heating conduction make electron device package in use due to it is outer so that temperature sharply silver-colored bonding line can in raised situation
To make temperature be reduced to Martensite temperature or less by itself quick heat transfer, to restore the damping and amortization of the material
Energy.Due to having carried out the optimization of material prescription and organizational aspects, which can substantially reduce the generation of silver wire migration, and therefore
And the formation speed of intermetallic compound is reduced, effectively extend the service life of electronic packing piece.
Embodiment 2
A kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging.By weight percentage, the composition of alloy
For Mn:25.0wt.%, In:2.0wt.%, Ni:5.0wt.%, Cu:20.0wt.%, Sc:0.2wt.%, Ge:0.8wt.%, Zn:
4.0wt.%, Te:0.2wt.%, surplus are silver.
A kind of above-mentioned damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging, including following smelting step:
The melting in electric induction furnace by the raw material as above matched, wherein active or Volatile Elements are added in the form of intermediate alloy;
It is protected in fusion process using graphite crucible and argon gas；Crucible forms alloy melt after being heated to 1000-1100 degree, and utilizes electricity
Magnetic agitation effects are sufficiently stirred 15 minutes or so;Alloy melt is cast to after 1000 degree of heat preservations stand 15 minutes waterglass or
It carries out being cast as rodlike (diameter 50-60mm) in person's graphite jig.
A kind of above-mentioned damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging, including following procedure of processing:
(1) cogging of first time takes out after being heated to 500-600 degree in ingot material vacuum drying oven and carries out rotary blooming processing, directly
Then it is cooling to carry out room temperature after vacuum 500-600 degree is tempered 1 hour by diameter contracting 5-8%.(2) multi-pass is swaged, and is carried out to bar
Processing of swaging under room temperature, per pass diameter contracting 5-8% will carry out the vacuum recrystallization annealing 1 of 500-600 degree after every two passage
Hour and furnace cooling so repeat to reach 1-2mm until final diameter of rod.(3) wire drawing of multi-pass, to bar material into
The room temperature wire drawing of row multi-pass, per pass diameter contracting 5-6%, the recrystallization annealing 1 that 500-600 degree is carried out after every two passage are small
When and furnace cooling, so repeat to reach required silver alloy bond wire diameter until final silk material diameter.(4) last heat
Processing will be provided with silver-colored bonding line 4 hours of timeliness and furnace cooling under 400-420 degree of final size.
The alloy has extremely excellent casting character, and the temperature being completely melt maintains 860 degree, and fusion temperature range can
To reach 145 degree.Passing through multiple drawing handle, after recrystallization annealing and final timeliness, which can achieve conventional silver key
The mechanical property of zygonema: elasticity modulus 98GPa, yield strength 118MPa, tensile strength 154MPa, elongation percentage 14%.
The material also has very excellent damping capacity: SDC=19%, and the SDC of conventional silver bonding line is less than 5%.In addition, the material
With excellent heat transfer coefficient: 385W/m ﹒ K, and the heat transfer coefficient of conventional silver alloys is less than 320 W/m ﹒ K.The material it is excellent
Heating conduction make electron device package in use due to it is outer so that temperature sharply silver-colored bonding line can in raised situation
To make temperature be reduced to Martensite temperature or less by itself quick heat transfer, to restore the damping and amortization of the material
Energy.Due to having carried out the optimization of material prescription and organizational aspects, which can substantially reduce the generation of silver wire migration, and therefore
And the formation speed of intermetallic compound is reduced, effectively extend the service life of electronic packing piece.
Claims (3)
1. a kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging；According to weight percent, the alloy
Ingredient are as follows: Mn:20.0-25.0wt.%, In:1.0-2.0wt.%, Ni:4.0-5.0wt.%, Cu:15.0-20.0wt.%, Sc:
0.1-0.2wt.%, Ge:0.5-0.8wt.%, Zn:2.0-4.0wt.%, Te:0.1-0.2wt.%, surplus are silver.
2. a kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging according to claim 1, feature
It is to include following smelting step: the melting in electric induction furnace by the raw material as above matched, wherein active or Volatile Elements
It is added in the form of intermediate alloy;It is protected in fusion process using graphite crucible and argon gas；After crucible is heated to 1000-1100 degree
Alloy melt is formed, and is sufficiently stirred 15 minutes or so using electromagnetic agitation effect;Alloy melt is stood in 1000 degree of heat preservations
It is cast to after 15 minutes and carries out being cast as rodlike (diameter 50-60mm) in waterglass or graphite jig.
3. a kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging according to claim 1, feature
Be to include following procedure of processing: (1) cogging of first time is taken out after being heated to 500-600 degree in ingot material vacuum drying oven
And rotary blooming processing is carried out, then it is cooling to carry out room temperature after vacuum 500-600 degree is tempered 1 hour by diameter contracting 5-8%；(2) more
Passage is swaged, and carries out the processing of swaging under room temperature to bar, per pass diameter contracting 5-8%, to carry out 500- after every two passage
600 degree of vacuum recrystallization annealing simultaneously furnace cooling in 1 hour, so repeats to reach 1-2mm until final diameter of rod；(3)
The wire drawing of multi-pass carries out the room temperature wire drawing of multi-pass to bar material, per pass diameter contracting 5-6%, to carry out after every two passage
The recrystallization annealing simultaneously furnace cooling in 1 hour of 500-600 degree so repeats to close until final silk material diameter reaches required silver
Gold bonding wire diameter；(4) last heat treatment will be provided with the silver-colored bonding line of final size 4 hours of timeliness under 400-420 degree
And furnace cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910225073.3A CN109763015A (en) | 2019-03-25 | 2019-03-25 | A kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910225073.3A CN109763015A (en) | 2019-03-25 | 2019-03-25 | A kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109763015A true CN109763015A (en) | 2019-05-17 |
Family
ID=66458717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910225073.3A Pending CN109763015A (en) | 2019-03-25 | 2019-03-25 | A kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109763015A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110055438A (en) * | 2019-05-20 | 2019-07-26 | 杭州辰卓科技有限公司 | A kind of novel jewellery silver alloy with surface fence diffraction effect |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011118009A1 (en) * | 2010-03-25 | 2011-09-29 | 田中電子工業株式会社 | HIGH-PURITY Cu BONDING WIRE |
| CN102214630A (en) * | 2011-05-18 | 2011-10-12 | 苏州衡业新材料科技有限公司 | Silver-base microalloy bonding wire and preparation method thereof |
| CN103131885A (en) * | 2011-11-21 | 2013-06-05 | 赫劳斯材料工艺有限及两合公司 | Silver bond wire for semiconductor devices |
| CN103834832A (en) * | 2014-03-10 | 2014-06-04 | 浙江佳博科技股份有限公司 | Imitation gold bonding alloy wire and preparation method thereof |
| CN103985687A (en) * | 2013-02-07 | 2014-08-13 | 光洋应用材料科技股份有限公司 | Silver alloy solder wire for semiconductor package |
| CN106119590A (en) * | 2015-05-07 | 2016-11-16 | Mk电子株式会社 | Silver alloy closing line and manufacture method thereof |
-
2019
- 2019-03-25 CN CN201910225073.3A patent/CN109763015A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011118009A1 (en) * | 2010-03-25 | 2011-09-29 | 田中電子工業株式会社 | HIGH-PURITY Cu BONDING WIRE |
| CN102214630A (en) * | 2011-05-18 | 2011-10-12 | 苏州衡业新材料科技有限公司 | Silver-base microalloy bonding wire and preparation method thereof |
| CN103131885A (en) * | 2011-11-21 | 2013-06-05 | 赫劳斯材料工艺有限及两合公司 | Silver bond wire for semiconductor devices |
| CN103985687A (en) * | 2013-02-07 | 2014-08-13 | 光洋应用材料科技股份有限公司 | Silver alloy solder wire for semiconductor package |
| CN103834832A (en) * | 2014-03-10 | 2014-06-04 | 浙江佳博科技股份有限公司 | Imitation gold bonding alloy wire and preparation method thereof |
| CN106119590A (en) * | 2015-05-07 | 2016-11-16 | Mk电子株式会社 | Silver alloy closing line and manufacture method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110055438A (en) * | 2019-05-20 | 2019-07-26 | 杭州辰卓科技有限公司 | A kind of novel jewellery silver alloy with surface fence diffraction effect |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109338200B (en) | High-temperature high-damping high-entropy alloy and preparation method thereof | |
| US9340856B2 (en) | Ni—Fe—Cr alloy and engine valve welded with the same alloy | |
| CN102978485A (en) | Novel high-silicon aluminum alloy electronic packaging material and preparation method thereof | |
| CN108315616B (en) | A kind of polynary Mn-Cu base damping alloy and preparation method thereof | |
| JP5532149B2 (en) | High electrical resistance aluminum alloy | |
| CN105018813B (en) | A kind of Creep-resistant rare earth magnesium alloy and preparation method thereof | |
| CN107881378B (en) | Aluminum alloy composition, aluminum alloy element, communication product and preparation method of aluminum alloy element | |
| CN102676876B (en) | Copper alloy material with high strength and conductivity and manufacturing method of copper alloy material | |
| CN108907495A (en) | NiCr44Ti welding wire and its production technology | |
| CN107904440A (en) | A kind of high-temperature titanium alloy material and preparation method thereof | |
| CN104946943A (en) | Al-Er-Cu high-strength high-electric conductivity aluminium alloy and thermomechanical treatment technology thereof | |
| CN107263885A (en) | A kind of AMORPHOUS ALLOY RIBBONS modified fish oil racquet frame and preparation method thereof | |
| CN103233147B (en) | A kind of Al-Er-Zr-Si aluminium alloy and thermal treatment process | |
| CN109763015A (en) | A kind of damp type high thermal conductivity silver of resistance to brittle failure bonding line material used for electronic packaging | |
| CN106191701A (en) | A kind of heat-resisting steel material as turbine blade and preparation method thereof | |
| CN102796954B (en) | Low-manganese iron-based shape memory alloy | |
| CN109777991A (en) | A kind of electric leads bonding corrosion-resistant high-damping silver alloy and its technique | |
| CN104862590B (en) | A kind of shock proof composite material and preparation method thereof | |
| CN110804712A (en) | Magnesium-containing high-entropy alloy and preparation method thereof | |
| CN109852838A (en) | It is a kind of that wire material is bonded based on spinodal decomposition and the high-damping silver of martensite transfor mation | |
| CN109881037A (en) | A kind of electronic field bonding line high-damping high thermal conductivity billon and its technique | |
| CN109112374A (en) | A kind of high-strength magnesium-tin-zinc-lithium-sodium alloy and preparation method thereof | |
| CN106756573A (en) | The additive and its application method of a kind of raising Mn Cu damping alloy Martensite temperatures | |
| CN109750182A (en) | A kind of billon used for electronic packaging and technique having reuse and high-damping | |
| CN109811176A (en) | A kind of electron device package high-damping bonding line billon and its technique |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190517 |
|
| RJ01 | Rejection of invention patent application after publication |