CN109750182A - A kind of billon used for electronic packaging and technique having reuse and high-damping - Google Patents
A kind of billon used for electronic packaging and technique having reuse and high-damping Download PDFInfo
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- CN109750182A CN109750182A CN201910224995.2A CN201910224995A CN109750182A CN 109750182 A CN109750182 A CN 109750182A CN 201910224995 A CN201910224995 A CN 201910224995A CN 109750182 A CN109750182 A CN 109750182A
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Abstract
The invention discloses a kind of billons used for electronic packaging and technique for having reuse and high-damping.According to weight percent, the ingredient of the alloy are as follows: Mn:20.0-25.0wt.%, Co:4.0-5.0wt.%, Cu:2.0-3.0wt.%, Bi:0.5-0.8wt.%, Sc:0.1-0.2wt.%, Ti:2.0-3.0wt.%, Sn:1.5-1.8wt.%, B:0.1-0.2wt.%, surplus are gold.The material provides a kind of solution different from traditional material in the billon bonding line vibrated in obvious electronic device for work, can not have the status of damping capacity efficiently against current gold bonding wire.It is contemplated that gold bonding wire not only can be effectively avoided due to vibrating bring fatigue rupture in the implementation and industrialization of the material, while it can also obtain the economic benefit of great social benefit.
Description
Technical field
The present invention relates to technical field of alloy, specifically, being related to a kind of billon.
Background technique
With increasing, the danger that various vibration and noises generate of industrial continuous development and various industrial machineries
Evil and pollution are also increasingly severe.For noise always with vibration association, the noise pollution of generation, which has become, endangers very the mankind
One kind of big environmental pollution.It various equipment and mechanical creation and is widely used, in addition to bringing prosperity and the people in the market
Outside improvement of living standard, the also increasingly severe every aspect for having influenced industrial circle and people's physical and mental health.
The shock between various mechanical parts in field of traffic and industrial production, friction are the main sources of vibration.This
Outside, high speed or high-pressure fluid encounter barrier during the motion and can also cause comparable vibration.These vibrations will finally turn
It is changed to noise and is transmitted in the medium of surrounding.The passive aspect of vibration is very much: influencing instrument and equipment function, reduces mechanical
The operating accuracy of equipment aggravates component wear, or even structural fatigue is caused to destroy.Moreover, it is also possible to be shortened by mechanical breakdown
Life of product.The noise being transmitted in air also can generate serious harm to the physical and mental health of people around, can make to hearing
At damage, moreover it is possible to induce a variety of carcinogenic fatal diseases.In short, vibration and noise developed into the big public hazards of current three it
One.
It reduces vibration and the control of noise is inhibited worldwide to be introduced into structure design, and become vibration damping and drop
The effective means made an uproar.Their purpose is to absorb or prevent the transmission of vibration and noise, and the vibration between isolation junction component passes
It broadcasts, impact absorbing is carried out by internally-damped design, reduces structure resonance behavior etc..Damping is the energy attenuation of material internal
The energy of vibration is converted to heat by certain organization mechanism and dissipated by behavior.Using the structural member of damper mechanism, no
Vibration and noise can only be lowered, moreover it is possible to improve mechanical operating accuracy and prolong the service life.Even for the such grade of earthquake
Other vibration, people can also lower the loss of earthquake by improving the method for structural damping performance in interior of building, show
The vibration resistance of the raising building and bridge of work.
Presently, common damping material by organic damping material (rubber etc.) and alloy damps material in world wide
Material.It is used since the disadvantages of organic damping material mechanical property is low and non-refractory cannot function as structural material.And alloy damps
Material has the mechanical property of common structure alloy, and some kinds also have high temperature resistant and corrosion resistant excellent properties.Damping is closed
The appearance of gold is to prevent the generation for vibrating and reducing noise from opening an approach new and with more practical future.It will damping
Alloy not only can achieve the effect of apparent vibration and noise reducing for vibration source and source of students position, moreover it is possible to eliminate mechanical violent vibration
Fatigue damage caused by dynamic maximum can also prolong the service life in the case where guaranteeing mechanical normal working condition.
More damping alloy in engineering is iron-based, aluminium base, magnesium-based and manganese base damping alloy, is mainly used in navigating
Sky, space flight, in vehicle and machine industry.In recent years, the quality of the Alloy Materials in China, performance, green metallurgical are horizontal
It is obviously improved, the industry development of Alloy Materials also provides new opportunity for China's industrial repositioning upgrading.Currently, world's model
Also sound vertical industry cooperative mechanism is just established in enclosing in field of new materials, and accelerates new material in the application of industrial circle
And popularization.Thus, high-performance is developed, the New Damping alloy of high-tech and high-quality will become current Main way.
Summary of the invention
The purpose of the present invention is to overcome the deficiency in the prior art, provides a kind of Electronic Packaging for having reuse and high-damping
With billon and technique.
To achieve the goals above, the present invention adopts the following technical scheme:
A kind of billon used for electronic packaging and technique having reuse and high-damping.By weight percentage, the composition of alloy
For Mn:20.0-25.0wt.%, Co:4.0-5.0wt.%, Cu:2.0-3.0wt.%, Bi:0.5-0.8wt.%, Sc:0.1-
0.2wt.%, Ti:2.0-3.0wt.%, Sn:1.5-1.8wt.%, B:0.1-0.2wt.%, surplus are gold.
A kind of above-mentioned billon used for electronic packaging and technique for having reuse and high-damping, including following smelting step:
The melting in electric induction furnace by the raw material as above matched, wherein active or Volatile Elements are added in the form of intermediate alloy;
It is protected in fusion process using graphite crucible and argon gas；Crucible forms alloy melt after being heated to 1100-1200 degree, and utilizes electricity
Magnetic agitation effects are sufficiently stirred 15 minutes or so;Alloy melt is cast to after 1100 degree of heat preservations stand 15 minutes waterglass or
It carries out being cast as rodlike (diameter 50-60mm) in person's graphite jig.
A kind of above-mentioned billon used for electronic packaging and technique for having reuse and high-damping, including following procedure of processing:
(1) cogging of first time takes out after being heated to 600-700 degree in ingot material vacuum drying oven and carries out rotary blooming processing, directly
Then it is cooling to carry out room temperature after vacuum 600-700 degree is tempered 1 hour by diameter contracting 5-6%.(2) multi-pass is swaged, and is carried out to bar
Processing of swaging under room temperature, per pass diameter contracting 5-6% will carry out the vacuum recrystallization annealing 1 of 600-700 degree after every two passage
Hour and furnace cooling so repeat to reach 1-2mm until final diameter of rod.(3) wire drawing of multi-pass, to bar material into
The room temperature wire drawing of row multi-pass, per pass diameter contracting 5-6%, the recrystallization annealing 1 that 600-700 degree is carried out after every two passage are small
When and furnace cooling, so repeat to reach required billon bond wire diameter until final silk material diameter.(4) last heat
Processing will be provided with gold bonding wire 4 hours of timeliness and furnace cooling under 400-420 degree of final size.
Compared with prior art, the invention has the following beneficial effects:
(1) since the fast development of encapsulation technology in recent years makes encapsulating products higher and higher to material requirements.At present normal
In the chip package of rule, the bonding wire mode using gold thread is conventional chip packaging method.Since gold thread is with excellent
Reliability and electric conductivity, there are no other materials can replace it completely for mesh.While its bonding technology is in the semiconductor device
Be it is highly developed, also the performance of product and quality control in play an important role.But semiconductor product is for shaking
Bigger occasion, such as aircraft and mechanical equipment are moved, very big vibration is subjected to.These vibration not only serious influences
Mechanical service life itself, but also the gold thread in semiconductor equipment be faced at bonding (pad) due to vibration and
Caused cracking and failure.There is no in-fightings needed for vibration damping to act on design of material for current existing gold bonding wire, thus
When relevant encapsulating products are for being just faced with the consequence of equipment fault when vibrating bigger occasion.Thus, this patent proposes
A kind of semiconductor packages bonding gold thread material and its processing technology with damper mechanism.
(2) the gold bonding wire material of present patent application protection belongs to golden manganese systems damping alloy.For microcosmic mechanism, the conjunction
Twin boundary in the antiferromagnetic fct that the high-damping of gold is formed after paramagnetic-antiferromagnetic transition and fcc-fct martensitic traoformation
Energy dissipation brought by relaxation process under the effect of external force.In principle, when the content of manganese in alloy is lower than 75wt%, close
The magnetic transformation and martensitic transformation temperature of gold are well below room temperature.Therefore being quenched near room temperature from high temperature fcc phase will not
Above-mentioned phase transformation occurs, and is in oversaturated metastable state.However, when the alloy is (400-420 degree 4 in aging range
Hour) when carrying out timeliness, which occurs spinodal decomposition, generates the part richness Mn and rich gold part.In subsequent cooling procedure
In, Fu Meng partially due to paramagnetic-antiferromagnetic transition and martensite transformation temperature be higher than room temperature and occur paramagnetic-antiferromagnetic transition and
Martensitic traoformation (fcc-fct).Thus for this patent, the manganese content in alloy is 20-25wt%, by melting, casting
With can be by spinodal decomposition bring composition transfer, to make in 4 hour ag(e)ing processes of 400-420 degree after hot-working
The phase transition temperature for obtaining solid solution increases.The billon can be thus made to be obtained at room temperature because martensitic traoformation bring is high
Damping capacity.
(3) the golden manganese alloy of present patent application generates martensite (fct) and its twin-plane boundary after heat treatment.These are twin
Crystal boundary is mobile in material internal during matrix is deformed by external force, along with the variation in martensite quantity or direction.
Due to the process dissipation energy, thus play internally-damped mechanism.It is contemplated that the twin-plane boundary of the type is more, close
The damping capacity of gold will be bigger.The billon of present patent application, the martensite transformation temperature in the richness region Mn is 80- after timeliness
90 degree, thus the alloy is being the maximum temperature that can play of damper mechanism no more than the martensitic traoformation for damping effect
Temperature.This can play during military service and prevent well in the normal use temperature range of electron device package
Gold bonding wire fatigue rupture due to caused by vibration.In addition, when electronic device makes in local temperature for some reason
When being raised to the Martensite temperature or more, since horse can occur again when temperature is lower than the Martensite temperature in subsequent temperature-fall period
Family name's body changes and the damper mechanism of gold bonding wire is restored, so that the service life and efficiency for electron device package provide
Structure basis.
(4) alloy has very excellent casting character, and fusing point maintains 920-960 degree.The alloy melt is due to tool
There are good mobility and wide solidification temperature range (120-140 degree), can often go out efficiently against in conventional cast
A variety of casting problems such as existing stomata, sand holes, shrinkage porosite, slag inclusion, crackle.Since interdendritic gap is had in process of setting
The compensation of effect, thus the compactness of casting is very high (98% or more).It can be generated in the casting and deformation production process of alloy a large amount of
The returns such as running channel, waste product.Since alloy inevitably volatilizees in fusion process, oxidation, the problems such as air-breathing,
Thus changes will occur for the ingredient of casting alloy each time, the serious metallurgical quality for having influenced alloy and casting character.
The reuse of degradation problem and alloy itself during alloy reuse has close relationship.Present patent application protection
Alloy cast member after 4 reuses appearance profile it is clear, any surface finish illustrates alloy without obvious blackspot or discoloration
Reuse is very good.Thus ratio defective product not only can be improved in the excellent casting character of the material, can also be dropped significantly by reuse
Low production cost.
(5) material has very excellent mechanical property and damping capacity.Passing through multiple drawing handle, recrystallization annealing
After final timeliness, electric property, mechanical property and damping capacity are as follows: relative electric conductivity is 72-74%(relative to fine silver),
Yield strength is 95-110MPa, tensile strength 150-155MPa, elongation percentage 6-7%%, SDC 24-27%.Comparatively,
The performance of gold bonding wire common at present are as follows: relative electric conductivity is 70-71%(relative to fine silver), yield strength 95-110Pa,
Tensile strength is 130-140MPa, and elongation percentage 4-5%%, SDC is less than 5%.The thus gold bonding wire material of present patent application protection
With excellent electric property, mechanical property and damping capacity.In addition, the material has very outstanding aging stability,
The phenomenon that failing close under the use environment of room temperature by 5 years without apparent mechanical property and damping capacity.Simultaneously because should
Material is smelted and processing method is simple, and production cost is low, is conducive to industrialized production while guaranteeing alloy service life.
Specific embodiment
Embodiment 1
A kind of billon used for electronic packaging and technique having reuse and high-damping.By weight percentage, the composition of alloy
For Mn:20.0wt.%, Co:4.0wt.%, Cu:2.0wt.%, Bi:0.5wt.%, Sc:0.1wt.%, Ti:2.0wt.%, Sn:
1.5wt.%, B:0.1wt.%, surplus are gold.
A kind of above-mentioned billon used for electronic packaging and technique for having reuse and high-damping, including following smelting step:
The melting in electric induction furnace by the raw material as above matched, wherein active or Volatile Elements are added in the form of intermediate alloy;
It is protected in fusion process using graphite crucible and argon gas；Crucible forms alloy melt after being heated to 1100-1200 degree, and utilizes electricity
Magnetic agitation effects are sufficiently stirred 15 minutes or so;Alloy melt is cast to after 1100 degree of heat preservations stand 15 minutes waterglass or
It carries out being cast as rodlike (diameter 50-60mm) in person's graphite jig.
A kind of above-mentioned billon used for electronic packaging and technique for having reuse and high-damping, including following procedure of processing:
(1) cogging of first time takes out after being heated to 600-700 degree in ingot material vacuum drying oven and carries out rotary blooming processing, directly
Then it is cooling to carry out room temperature after vacuum 600-700 degree is tempered 1 hour by diameter contracting 5-6%.(2) multi-pass is swaged, and is carried out to bar
Processing of swaging under room temperature, per pass diameter contracting 5-6% will carry out the vacuum recrystallization annealing 1 of 600-700 degree after every two passage
Hour and furnace cooling so repeat to reach 1-2mm until final diameter of rod.(3) wire drawing of multi-pass, to bar material into
The room temperature wire drawing of row multi-pass, per pass diameter contracting 5-6%, the recrystallization annealing 1 that 600-700 degree is carried out after every two passage are small
When and furnace cooling, so repeat to reach required billon bond wire diameter until final silk material diameter.(4) last heat
Processing will be provided with gold bonding wire 4 hours of timeliness and furnace cooling under 400-420 degree of final size.
The alloy has very excellent casting character, and fusing point maintains 940 degree.Due to the optimization for carrying out materialogy,
The chance and degree that melt reacts with casting mold are looked down upon, and the degree of purity of alloy melt is very high.The alloy melt is due to having
Good mobility and wide solidification temperature range (125 degree), can be efficiently against the gas often occurred in conventional cast
A variety of casting problems such as hole, sand holes, shrinkage porosite, slag inclusion, crackle.The material has very excellent mechanical property and damping capacity.
Passing through multiple drawing handle, after recrystallization annealing and final timeliness, electric property, mechanical property and damping capacity are as follows: opposite
Conductivity is 73%(relative to fine silver), yield strength 98MPa, tensile strength 152MPa, elongation percentage 6%, SDC 25%.
Comparatively, the performance of gold bonding wire common at present are as follows: relative electric conductivity is 70-71%(relative to fine silver), yield strength is
95-110Pa, tensile strength 130-140MPa, elongation percentage 4-5%%, SDC is less than 5%.The thus gold of present patent application protection
Being bonded wire material has excellent electric property, mechanical property and damping capacity.In addition, the material has very outstanding timeliness
Stability, the phenomenon that decline by 5 years without apparent mechanical property and damping capacity under the use environment close to room temperature.
Embodiment 2
A kind of billon used for electronic packaging and technique having reuse and high-damping.By weight percentage, the composition of alloy
For Mn:25.0wt.%, Co:5.0wt.%, Cu:3.0wt.%, Bi:0.8wt.%, Sc:0.2wt.%, Ti:3.0wt.%, Sn:
1.8wt.%, B:0.2wt.%, surplus are gold.
A kind of above-mentioned billon used for electronic packaging and technique for having reuse and high-damping, including following smelting step:
The melting in electric induction furnace by the raw material as above matched, wherein active or Volatile Elements are added in the form of intermediate alloy;
It is protected in fusion process using graphite crucible and argon gas；Crucible forms alloy melt after being heated to 1100-1200 degree, and utilizes electricity
Magnetic agitation effects are sufficiently stirred 15 minutes or so;Alloy melt is cast to after 1100 degree of heat preservations stand 15 minutes waterglass or
It carries out being cast as rodlike (diameter 50-60mm) in person's graphite jig.
A kind of above-mentioned billon used for electronic packaging and technique for having reuse and high-damping, including following procedure of processing:
(1) cogging of first time takes out after being heated to 600-700 degree in ingot material vacuum drying oven and carries out rotary blooming processing, directly
Then it is cooling to carry out room temperature after vacuum 600-700 degree is tempered 1 hour by diameter contracting 5-6%.(2) multi-pass is swaged, and is carried out to bar
Processing of swaging under room temperature, per pass diameter contracting 5-6% will carry out the vacuum recrystallization annealing 1 of 600-700 degree after every two passage
Hour and furnace cooling so repeat to reach 1-2mm until final diameter of rod.(3) wire drawing of multi-pass, to bar material into
The room temperature wire drawing of row multi-pass, per pass diameter contracting 5-6%, the recrystallization annealing 1 that 600-700 degree is carried out after every two passage are small
When and furnace cooling, so repeat to reach required billon bond wire diameter until final silk material diameter.(4) last heat
Processing will be provided with gold bonding wire 4 hours of timeliness and furnace cooling under 400-420 degree of final size.
The alloy has very excellent casting character, and fusing point maintains 930 degree.Due to the optimization for carrying out materialogy,
The chance and degree that melt reacts with casting mold are looked down upon, and the degree of purity of alloy melt is very high.The alloy melt is due to having
Good mobility and wide solidification temperature range (128 degree), can be efficiently against the gas often occurred in conventional cast
A variety of casting problems such as hole, sand holes, shrinkage porosite, slag inclusion, crackle.The material has very excellent mechanical property and damping capacity.
Passing through multiple drawing handle, after recrystallization annealing and final timeliness, electric property, mechanical property and damping capacity are as follows: opposite
Conductivity is 74%(relative to fine silver), yield strength 105MPa, tensile strength 152MPa, elongation percentage 6%, SDC is
26%.Comparatively, the performance of gold bonding wire common at present are as follows: relative electric conductivity is 70-71%(relative to fine silver), surrender is strong
Degree is 95-110Pa, and tensile strength 130-140MPa, elongation percentage 4-5%%, SDC is less than 5%.Thus present patent application protection
Gold bonding wire material have excellent electric property, mechanical property and damping capacity.In addition, the material is with very outstanding
Aging stability showed by 5 years without what apparent mechanical property and damping capacity failed under the use environment close to room temperature
As.
Claims (3)
1. a kind of billon used for electronic packaging and technique for having reuse and high-damping；According to weight percent, the alloy
Ingredient are as follows: Mn:20.0-25.0wt.%, Co:4.0-5.0wt.%, Cu:2.0-3.0wt.%, Bi:0.5-0.8wt.%, Sc:0.1-
0.2wt.%, Ti:2.0-3.0wt.%, Sn:1.5-1.8wt.%, B:0.1-0.2wt.%, surplus are gold.
2. a kind of billon used for electronic packaging and technique for having reuse and high-damping according to claim 1, feature
It is to include following smelting step: the melting in electric induction furnace by the raw material as above matched, wherein active or Volatile Elements
It is added in the form of intermediate alloy;It is protected in fusion process using graphite crucible and argon gas；After crucible is heated to 1100-1200 degree
Alloy melt is formed, and is sufficiently stirred 15 minutes or so using electromagnetic agitation effect;Alloy melt is stood in 1100 degree of heat preservations
It is cast to after 15 minutes and carries out being cast as rodlike (diameter 50-60mm) in waterglass or graphite jig.
3. a kind of billon used for electronic packaging and technique for having reuse and high-damping according to claim 1, feature
Be to include following procedure of processing: (1) cogging of first time is taken out after being heated to 600-700 degree in ingot material vacuum drying oven
And rotary blooming processing is carried out, then it is cooling to carry out room temperature after vacuum 600-700 degree is tempered 1 hour by diameter contracting 5-6%；(2) more
Passage is swaged, and carries out the processing of swaging under room temperature to bar, per pass diameter contracting 5-6%, to carry out 600- after every two passage
700 degree of vacuum recrystallization annealing simultaneously furnace cooling in 1 hour, so repeats to reach 1-2mm until final diameter of rod；(3)
The wire drawing of multi-pass carries out the room temperature wire drawing of multi-pass to bar material, per pass diameter contracting 5-6%, to carry out after every two passage
The recrystallization annealing simultaneously furnace cooling in 1 hour of 600-700 degree so repeats to close until final silk material diameter reaches required gold
Gold bonding wire diameter；(4) last heat treatment will be provided with the gold bonding wire of final size 4 hours of timeliness under 400-420 degree
And furnace cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910224995.2A CN109750182A (en) | 2019-03-25 | 2019-03-25 | A kind of billon used for electronic packaging and technique having reuse and high-damping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910224995.2A CN109750182A (en) | 2019-03-25 | 2019-03-25 | A kind of billon used for electronic packaging and technique having reuse and high-damping |
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| Publication Number | Publication Date |
|---|---|
| CN109750182A true CN109750182A (en) | 2019-05-14 |
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ID=66409283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910224995.2A Pending CN109750182A (en) | 2019-03-25 | 2019-03-25 | A kind of billon used for electronic packaging and technique having reuse and high-damping |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3658997A (en) * | 1968-08-20 | 1972-04-25 | Johnson Matthey Co Ltd | Gold-base brazing alloys |
| DE2150987A1 (en) * | 1971-10-13 | 1973-04-19 | Degussa | Gold-manganese alloy wire for measurements of - low temp - in resistance thermometers |
| JP2011129942A (en) * | 2004-06-16 | 2011-06-30 | Nippon Steel Materials Co Ltd | Metallic material, and method of manufacturing the same |
| CN103014401A (en) * | 2012-12-05 | 2013-04-03 | 昆明贵金属研究所 | Novel aurum alloy and preparation method for same |
-
2019
- 2019-03-25 CN CN201910224995.2A patent/CN109750182A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3658997A (en) * | 1968-08-20 | 1972-04-25 | Johnson Matthey Co Ltd | Gold-base brazing alloys |
| DE2150987A1 (en) * | 1971-10-13 | 1973-04-19 | Degussa | Gold-manganese alloy wire for measurements of - low temp - in resistance thermometers |
| JP2011129942A (en) * | 2004-06-16 | 2011-06-30 | Nippon Steel Materials Co Ltd | Metallic material, and method of manufacturing the same |
| CN103014401A (en) * | 2012-12-05 | 2013-04-03 | 昆明贵金属研究所 | Novel aurum alloy and preparation method for same |
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Application publication date: 20190514 |