JP5541440B2 - Alloy wire and manufacturing method thereof - Google Patents

Alloy wire and manufacturing method thereof Download PDF

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JP5541440B2
JP5541440B2 JP2009233478A JP2009233478A JP5541440B2 JP 5541440 B2 JP5541440 B2 JP 5541440B2 JP 2009233478 A JP2009233478 A JP 2009233478A JP 2009233478 A JP2009233478 A JP 2009233478A JP 5541440 B2 JP5541440 B2 JP 5541440B2
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gold
silver
wire
palladium
alloy wire
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JP2010171378A (en
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俊徳 李
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俊徳 李
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    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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Description

  The present invention relates to a gold wire, and more particularly to an alloy wire in a semiconductor package process and a method for manufacturing the same.

  In the semiconductor device packaging process, the gold wire is connected to the chip and the substrate. The chip and the substrate are electrically connected by the gold wire, and signals and current are transmitted between the chip and the substrate.

  Main characteristics such as load strength, stretchability, bendability, melting point, electrical property, hardness, and ability to connect to an IC chip are related to the materials used. The above characteristics adversely affect the lifetime and stability of the semiconductor device. The standard of the gold wire used varies depending on the form of the chip and the substrate.

Conventional gold wires are mainly manufactured from pure gold. Gold wires made from pure gold have the physical properties of relatively good stretchability and conductivity. However, a gold wire made from a pure gold material has a high cost, thus increasing the cost of a semiconductor device. Therefore, it is an object of the present invention to provide a gold wire that has an effect equivalent to that of a pure gold wire and greatly reduces the cost.
On the other hand, as a prior art, for example, Patent Document 1 discloses a composition of a gold alloy bonding wire made of gold, silver, and any one of germanium, silicon, aluminum, or copper.

Japanese Patent No. 4130843

  An object of the present invention is to provide an alloy wire that is manufactured from three kinds of metals, gold, silver, and palladium, has the same effect as a pure gold wire, and reduces the cost, and a manufacturing method thereof.

In order to achieve the above object, the present invention provides an alloy wire substantially composed of silver, gold, and palladium and a method for producing the same. Alloy wire and a manufacturing method of the present invention, in a process, the main metallic material is provided that includes a component of 8.00 to 30.00 wt% of gold and from 66.00 to 90.00 wt% silver. In step b, when the main metal material is placed in a vacuum furnace and a secondary raw metal material containing 0.01 to 6.00 wt% palladium is mixed in the vacuum furnace, a gold-silver-palladium alloy solution is produced. It is. In step c, the gold-silver-palladium alloy solution is continuously cast and stretched to form a gold-silver-palladium alloy wire. In step d, the gold-silver-palladium alloy wire is stretched and processed into a gold-silver-palladium alloy wire having a predetermined wire diameter.

  The alloy wire of the present invention is manufactured from three kinds of metals, gold, silver and palladium, and has the same effect as a pure gold wire, and can greatly reduce the cost.

2 is a flowchart showing a method of manufacturing an alloy wire according to an embodiment of the present invention. 2 is a flowchart showing details of FIG. 1.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  Please refer to FIG. 1 and FIG. FIG. 1 is a flowchart showing a method of manufacturing an alloy wire according to an embodiment of the present invention. FIG. 2 is a flowchart showing details of FIG. As shown in FIG. 1 and FIG. 2, in the method of manufacturing an alloy wire of the present invention, first, in step 100, a main metallic material containing gold and silver components is provided.

  In step 102, melt refining is performed. The main metallic material containing the components of gold and silver is put in the vacuum furnace (step 102a), and then the secondary raw metallic material containing palladium is mixed and melted in the vacuum furnace (see FIG. Step 102b). As a result, the vacuum furnace creates a gold-silver-palladium alloy solution (step 102c). The gold-silver-palladium alloy solution contains 8.00 to 30.00% by weight of gold, 66.00 to 90.00% by weight of silver, and 0.01 to 6.00% by weight of palladium.

  A gold-silver-palladium alloy solution is continuously cast and stretched to form a gold-silver-palladium alloy wire having a wire diameter of 4 to 8 mm (step 102d). The gold-silver-palladium alloy wire is wound up by the reel (step 102e). Whether the component ratio is correct or not is analyzed for the gold-silver-palladium alloy wire (step 102f).

  In step 104, the cast gold-silver-palladium alloy wire is drawn. A gold-silver-palladium alloy wire having a wire diameter of 4 to 8 mm is drawn to 3 mm or less by the first thick wire drawing machine (step 104a). Subsequently, it is drawn to 1 mm or less by the second thick wire drawing machine (step 104b). It is drawn to 0.18 mm or less by the first fine wire drawing machine (step 104c). A gold-silver-palladium alloy wire of 0.18 mm or less is drawn in turn to a second fine wire drawing machine (process 104d), an extra fine wire drawing machine (process 104e) and a super extra fine wire drawing machine (process 104f) to 0.050 mm ( 2.00 mil) to 0.010 mm (0.40 mil) gold-silver-palladium alloy wire.

  In step 106, the surface of the gold-silver-palladium alloy wire is cleaned.

  In step 108, the gold-silver-palladium alloy wire is dried and annealed so that the physical properties such as breaking strength and elongation of the gold-silver-palladium alloy wire are limited within a predetermined range. So that

  This gold-silver-palladium alloy wire is used as a conductor in IC, LED and SAW packages.

  Hereinafter, three embodiments of the present invention will be described in detail.

First Embodiment When a main metal material containing gold and silver components is put in a vacuum furnace, and then a secondary raw metal material containing palladium is mixed in the vacuum furnace, a vacuum is formed. The furnace stirs and melts to produce a gold-silver-palladium alloy solution. The gold-silver-palladium alloy solution contains 30.00% by weight of gold, 66.00% by weight of silver, and 4.00% by weight of palladium.

  A gold-silver-palladium alloy solution is continuously cast and stretched to form a gold-silver-palladium alloy wire having a wire diameter of 4 mm. A gold-silver-palladium alloy wire is wound up by the reel. The component analysis of the gold-silver-palladium alloy wire is performed to check whether the component ratio is correct.

  When the cast gold-silver-palladium alloy wire is formed, stretching is performed. A gold-silver-palladium alloy wire having a wire diameter of 4 mm is drawn to 3 mm or less by the first thick wire drawing machine. Subsequently, it is drawn to 1 mm by the second thick wire drawing machine. It is drawn to 0.18 mm by the first fine wire drawing machine. A 0.18 mm gold-silver-palladium alloy wire is drawn in turn by a second fine wire drawing machine, a super fine wire drawing machine, and a super fine wire drawing machine to form a 0.0550 mm-0.010 mm gold-silver-palladium alloy wire.

  When the surface of the gold-silver-palladium alloy wire is cleaned, drying and annealing are performed.

Second Embodiment When a main metal material containing gold and silver components is put in a vacuum furnace, and then a secondary raw metal material containing palladium is mixed in the vacuum furnace, a vacuum is formed. The furnace stirs and melts to produce a gold-silver-palladium alloy solution. The gold-silver-palladium alloy solution contains 8.00% by weight of gold, 86.00% by weight of silver, and 6.00% by weight of palladium.

  A gold-silver-palladium alloy solution is continuously cast and stretched to form a gold-silver-palladium alloy wire having a wire diameter of 6 mm. A gold-silver-palladium alloy wire is wound up by the reel. The component analysis of the gold-silver-palladium alloy wire is performed to check whether the component ratio is correct.

  When the cast gold-silver-palladium alloy wire is formed, stretching is performed. A gold-silver-palladium alloy wire having a wire diameter of 6 mm is drawn to 3 mm or less by the first thick wire drawing machine. Subsequently, it is drawn to 1 mm by the second thick wire drawing machine. It is drawn to 0.18 mm by the first fine wire drawing machine. A 0.18 mm gold-silver-palladium alloy wire is drawn in turn by a second fine wire drawing machine, a super fine wire drawing machine, and a super fine wire drawing machine to form a 0.0550 mm-0.010 mm gold-silver-palladium alloy wire.

  When the surface of the gold-silver-palladium alloy wire is cleaned, drying and annealing are performed.

Third Embodiment A main metal material containing gold and silver components is put in a vacuum furnace, and then a secondary raw metal material containing palladium is mixed in the vacuum furnace. The furnace stirs and melts to produce a gold-silver-palladium alloy solution. The gold-silver-palladium alloy solution contains 9.99% by weight of gold, 90.00% by weight of silver, and 0.01% by weight of palladium.

  A gold-silver-palladium alloy solution is continuously cast and stretched to form a gold-silver-palladium alloy wire having a wire diameter of 8 mm. A gold-silver-palladium alloy wire is wound up by the reel. The component analysis of the gold-silver-palladium alloy wire is performed to check whether the component ratio is correct.

  When the cast gold-silver-palladium alloy wire is formed, stretching is performed. A gold-silver-palladium alloy wire having a wire diameter of 8 mm is drawn to 2 mm or less by the first thick wire drawing machine. Subsequently, it is drawn to 1 mm by the second thick wire drawing machine. It is drawn to 0.18 mm by the first fine wire drawing machine. A 0.18 mm gold-silver-palladium alloy wire is drawn in turn by a second fine wire drawing machine, a super fine wire drawing machine, and a super fine wire drawing machine to form a 0.0550 mm-0.010 mm gold-silver-palladium alloy wire.

  When the surface of the gold-silver-palladium alloy wire is cleaned, drying and annealing are performed.

  An alloy wire prepared by using three kinds of metals, gold, silver and palladium, has the effect of a pure gold wire, and can greatly reduce the cost.

  Although preferred embodiments of the present invention have been disclosed as described above, they are not intended to limit the present invention in any way, and anyone skilled in the art is within the spirit and scope of the present invention. Various changes and modifications can be made. Therefore, the scope of protection of the present invention is based on the contents specified in the claims.

Step 100 Main metal material provided Step 102 Melting and refining step 104 Stretching step 106 Surface cleaning step 108 Annealing step 102a Placed in vacuum furnace 102b Stirring Step 102c in which gold and silver palladium alloy solution is created 102d Step in which gold and silver palladium alloy wire is formed 102e Step in which gold and silver palladium alloy wire is wound up 102f Step in which component analysis is performed 104a First thick wire drawing Step 104b in which stretching is performed by a machine Step 104c in which stretching is performed by a second thick wire drawing machine Step 104d in which stretching is performed by a first thin wire drawing machine Step 104e in which stretching is performed by a second thin wire drawing machine Stretching is performed by an extra fine wire drawing machine. Step 104f Stretching is performed by a super fine wire drawing machine.

Claims (5)

  1. A manufacturing method for manufacturing an alloy wire made of silver, gold, and palladium, which is used as a conductive wire in an IC, LED, and SAW package ,
    Providing a primary metallic material comprising a component of 8.00 to 30.00% by weight of gold and 66.00 to 90.00% by weight of silver;
    The primary metal material is placed in a vacuum flash furnace, the added metal material is 0.01 to 6.00 wt% palladium into the vacuum flash furnace is incorporated, b step gold-silver-palladium alloy solution is created When,
    C step in which the gold-silver-palladium alloy solution is continuously cast and stretched directly without forming an ingot to form a gold-silver-palladium alloy wire;
    A d-process in which the gold-silver-palladium alloy wire is stretched and processed into a gold-silver-palladium alloy wire having a predetermined wire diameter.
  2.   The gold-silver-palladium alloy solution in the step b is continuously cast and stretched to form the gold-silver-palladium alloy wire having a wire diameter of 4 to 8 mm, and the gold-silver-palladium alloy wire is wound up by a reel. 2. The method for producing an alloy wire according to claim 1, wherein component analysis of the palladium alloy wire is performed.
  3. In the step d, the gold-silver-palladium alloy wire having a wire diameter of 4 to 8 mm is drawn to 3 mm or less by the first thick wire drawing machine, and drawn to 1 mm or less by the second thick wire drawing machine,
    It is drawn to 0.18 mm or less by the first fine wire drawing machine, and the gold-silver-palladium alloy wire rod of 0.18 mm or less is sequentially applied to the second fine wire drawing machine, the extra fine wire drawing machine and the super extra fine wire drawing machine. 3. The method of manufacturing an alloy wire according to claim 2, wherein the alloy wire is drawn to become the gold-silver-palladium alloy wire having a thickness of 0.050 to 0.010 mm.
  4.   4. The method of manufacturing an alloy wire according to claim 3, wherein after the step d, when the surface of the gold-silver-palladium alloy wire is washed, drying and annealing treatment are performed.
  5. An alloy wire composed of silver, gold, and palladium, whose composition component is used as a conductor in IC, LED, and SAW packages ,
    8.00 to 30.00 wt% gold;
    66.00 to 90.00% by weight silver,
    0.01 to 6.00% by weight of palladium,
    An alloy wire characterized by being continuously cast from the above alloy solution and drawn and drawn directly without forming an ingot .
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