TW201028227A - Method for manufacturing composite metal wire and product thereof - Google Patents

Method for manufacturing composite metal wire and product thereof Download PDF

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Publication number
TW201028227A
TW201028227A TW98102770A TW98102770A TW201028227A TW 201028227 A TW201028227 A TW 201028227A TW 98102770 A TW98102770 A TW 98102770A TW 98102770 A TW98102770 A TW 98102770A TW 201028227 A TW201028227 A TW 201028227A
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wire
gold
silver
palladium
component
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TW98102770A
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TWI373382B (en
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jun-de Li
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jun-de Li
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    • HELECTRICITY
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/43Manufacturing methods
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139Silver (Ag) as principal constituent
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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Abstract

This invention provides a method for manufacturing a composite metal wire, comprising the steps of: providing a main metallic material containing gold ingredient and silver ingredient; placing the main metallic material in a vacuum furnace and adding different proportions of palladium into the vacuum furnace as secondary metallic material to be mixed, and then performing mix smelting to produce a silver-palladium alloy melted liquid; then, continuously casting the silver-palladium alloy melting liquid and drawing into a silver-palladium alloy wire; and finally, drawing the gold-silver-palladium alloy wire into a gold-silver-palladium alloy solder wire having a predetermined diameter. The gold-silver-palladium alloy solder wire manufactured by mixing three metallic materials of gold, silver, and palladium not only can reach the efficacy of metallic bonding wire made of pure gold, but also can greatly reduce the cost.

Description

201028227 VI. Description of the Invention: [Technical Field] The present invention relates to a metal bonding wire, and more particularly to a method for producing a composite gold wire used in a semiconductor packaging process and a finished product thereof. [Prior Art] In the packaging process of a semiconductor device, a metal bonding wire is often connected to a wafer and a circuit substrate by wire bonding, and is electrically connected to the wafer and the circuit substrate by a metal bonding wire to serve as a wafer and a circuit substrate. Signal and current transfer path. In general, the main characteristics of the load strength, ductility, bending, melting point, electrical properties, hardness, and welding ability of the 1C wafer of the metal wire are related to the materials used. The above characteristics will affect the life and stability of the semiconductor device. Depending on the type of the chip and the circuit board, the specifications of the metal wire used in combination are also different. Traditional metal wire is mainly made of pure gold. The gold wire of pure gold has a good physical property such as ductility and electrical conductivity. However, due to the high cost of the metal wire of pure gold, the cost of the entire semiconductor component is also increased. Therefore, the above-mentioned problem 'how to develop a metal wire which can achieve the effect of pure gold fresh wire' and can greatly reduce the material cost is the main problem to be solved by the present invention. [Summary of the Invention]

Therefore, the object of the present invention is that the AA is made of gold, silver and three kinds of metal elements, which can be used for the metal welding wire of the pure gold material, 201028227, and A composite gold line that reduces costs. In order to achieve the above object, the present invention provides a method for preparing a composite gold wire, comprising: providing a main metal raw material comprising a gold component and a silver component; placing the main metal raw material in a vacuum melting furnace, and adding different in the vacuum melting furnace The proportion of pure palladium metal is prepared by mixing the secondary metal materials, and then performing mixed smelting to prepare a silver-plated financial melt liquid; then, the silver-palladium financial melt liquid is further drawn and drawn into a silver-palladium alloy wire through continuous casting; Finally, the gold-silver-palladium alloy wire is drawn into a gold-silver-palladium alloy wire of a predetermined wire diameter. In addition, the present invention further provides a composite gold wire obtained by the above method, the composition of which mainly comprises: a gold component of 8 〇〇 to 3 〇〇〇% by weight, and a silver component of 06.00 〜90.00% by weight. And the weight percentage is 0.01~6.00% of the ingredients. The composite gold wire prepared by blending gold, silver and saturated metal elements can not only achieve the effect of the metal welding wire made of pure gold, but also can greatly reduce the cost. _ [Embodiment] The technical content and detailed description of the present invention are described below with reference to the following drawings: As shown in the first and second figures, respectively, a flow chart of a method for manufacturing a composite gold wire of the present invention and a detailed process thereof Figure. As shown in the figure, in the method for producing a composite gold wire of the present invention, first, in step 100, a main metal material containing a gold component and a silver component is first provided. Next, in step 102, smelting is performed to place a main metal material containing a gold component and a silver component in a vacuum furnace (as in step 4 201028227 102a), and a secondary powder having palladium (Pd) is added to the vacuum furnace. The metal material is subjected to mixed smelting (step 102b) to refine a gold and silver liquid by a vacuum furnace (step 102c). The composition of the gold and silver financial liquid comprises: 8.00 to 30.00% by weight of gold component, 66.00 to 90.00% by weight of silver, and 0.01 to 6.00 % by weight of I bar. Then, the gold-silver-palladium financial melt liquid is further drawn and stretched by continuous casting to form a gold-silver alloy wire having a predetermined wire diameter of 4 to 8 mm (step 102d). The gold-silver-palladium alloy wire is then taken up by a retractor (step 102e), and the composition analysis of the gold-silver Ig alloy wire (step 102f) is performed to determine whether the composition ratio meets the requirements. Step 104, stretching the cast gold-silver-palladium alloy wire to reduce the wire diameter of 4~8 mm originally to 3 mm or less by a first thick wire drawing machine (step 104a), and then a second thick wire drawing machine is stretched to 1.00 mm or less (as in step 104b), and then stretched to 0.18 mm or less by a first® fine wire drawing machine (as in step 104c), and then The gold-silver alloy wire of 〇18mm or less is passed through a second thin wire drawing machine (step 104d), a very fine wire drawing machine (step 104e), and a super-fine wire drawing machine (step 104f). The gold-silver-palladium alloy wire is stretched into a specific gold-silver alloy wire with a predetermined wire diameter ranging from 0.050 mm (2.00 mil) to 0.010 mm (0.40 mil). In step 106, surface cleaning is performed to clean the surface of the gold-silver-palladium alloy wire. In step 108, the stretched gold, silver and palladium alloy wire is dried and thermally annealed in 201028227, so that the gold and silver meet the predetermined physical properties such as the breaking load and the elongation strain of the alloy wire. range. The composite gold wire of the present invention described above can be applied to 1C, LED and SAW packages for use as wires. The present invention will be described in more detail below by way of several examples: <Example 1> A main metal raw material containing a gold component and a silver component is placed in a vacuum melting furnace, and a secondary metal raw material of palladium is added to the vacuum melting furnace. Then, a gold-silver-palladium financial melt liquid is prepared by mixing and melting in a vacuum furnace. The composition of the gold-silver-palladium alloy melt liquid comprises: gold in an amount of 30.00% by weight, silver in a weight percentage of 66.00%, and a weight of 4.00%. The gold-silver-palladium financial melt liquid was drawn through a continuous casting to obtain a gold-silver Ie alloy wire having a wire diameter of 4 mm. The gold wire and silver wire are taken up by a reeling machine, and the composition of the alloy wire is analyzed by gold and silver. After the alloy wire is cast in gold and silver, the wire diameter is stretched, and the original wire diameter of 4 mm is stretched to 3 mm through the first thick wire drawing machine, and stretched to 1.0 mm through the second thick wire drawing machine. A thin wire drawing machine is stretched to 0.18 mm, and then the 0.18 mm gold-silver alloy wire is sequentially passed through a second thin wire drawing machine, a very fine wire drawing machine, and a super-fine wire drawing machine to stretch the gold, silver and palladium alloy wires into A specific gold-silver-palladium alloy wire having a predetermined wire diameter ranging from 0.050 mm to 0.010 mm. Finally, the surface of the gold-silver-palladium alloy wire which has been stretched is cleaned, and the gold-silver-palladium alloy wire is dried and thermally annealed. 6 201028227 <Example 2> A main metal raw material containing a gold component and a silver component is placed in a vacuum furnace, and a secondary metal raw material of palladium is added to the vacuum melting furnace, and then mixed and refined by vacuum melting furnace to produce gold and silver. Financial refining liquid. The composition of the gold-silver Ig and financial melt liquid comprises: 8% by weight of gold, 86.00% by weight of silver, and 6.00% by weight of palladium. The gold and silver blended financial solution body was continuously drawn through a continuous casting to produce a gold-silver-palladium alloy wire having a diameter of 6 mm. The gold, silver, and palladium alloy wires were taken up by a reeling machine, and the composition of the gold and silver alloy wires was analyzed. After the casting of the gold-silver Ιε alloy wire is completed, the wire diameter is stretched, and the original 6 mm wire diameter is stretched to 3 mm through the first thick wire drawing machine, and is stretched to 1.0 mm through the second thick wire drawing machine. A thin wire drawing machine is stretched to 0.18 mm, and then the 0.18 mm gold and silver alloy wire is sequentially passed through a second thin wire drawing machine, a very fine wire drawing machine, and a superfine wire drawing machine to stretch the gold and silver Ig alloy wire into A specific gold-silver® palladium alloy wire with a predetermined wire diameter in the range of 0.050 mm to 0.010 mm. Finally, the surface of the gold-silver-palladium alloy wire which has been stretched is cleaned, and the gold-silver-palladium alloy wire is dried and thermally annealed. <Example 3> A main metal raw material containing a gold component and a silver component is placed in a vacuum melting furnace, and a secondary metal raw material of palladium is added to the vacuum melting furnace, and then molten and refined by a vacuum melting furnace to produce a gold-silver-palladium financial melt liquid. The composition of the gold-silver-palladium financial melt liquid comprises: 9.99% by weight of gold, 90.00% by weight of silver, and 0.01% by weight of palladium. 7 201028227 The gold-silver-palladium financial melt liquid was drawn through a continuous casting to obtain a gold-silver-palladium alloy wire having a wire diameter of 8 mm. The gold, silver, and palladium alloy wires were taken up by a reeling machine, and the composition of the gold and silver Ie alloy wires was analyzed. After the alloy wire is cast in gold and silver, the wire diameter is stretched, and the original wire diameter of 8 mm is stretched to 2 mm through the first thick wire drawing machine, and stretched to 1 · 0 mm by the second thick wire drawing machine. After being stretched to 0.18 mm by the first thin wire drawing machine, the 0.18 mm gold-silver alloy wire is sequentially passed through the second fine wire drawing machine, the ultra-fine wire drawing machine, and the ultra-fine wire drawing machine, and the gold and silver alloy wire Stretching into a specific gold and silver I bar alloy fresh wire with a predetermined wire diameter ranging from 0.050 mm to 0.010 mm. Finally, the surface of the gold-silver-palladium alloy wire which has been stretched is cleaned, and the gold-silver-palladium alloy wire is dried and thermally annealed. In summary, the composite gold wire prepared by the above metal element can achieve the effect of the metal wire made of pure gold, and can greatly reduce the cost and achieve the effect of the present invention. The above is only the preferred embodiment of the invention and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a flow chart of the method for producing a composite gold wire of the present invention. The second figure is a detailed flow chart of the first figure. [Description of main component symbols] Steps 100 to 108 Steps 102a to 102f 8 201028227 Steps 104a to 104f

Claims (1)

  1. 201028227 VII. Patent application scope: 1. A method for preparing a composite gold wire, comprising: (8) providing a main metal material containing a gold component and a silver component; (b) placing the main metal material in a vacuum furnace and at the vacuum The secondary metal element of the palladium component is mixed and smelted to form a gold-silver-palladium financial melt liquid; (c) the gold-silver-palladium financial melt liquid is drawn and stretched by continuous casting to form a gold, silver and palladium. The alloy wire; and (6) the gold-silver-palladium alloy wire is stretched into a predetermined wire diameter of gold and silver to make the alloy fresh wire. 2. The method of preparing a composite gold wire according to claim 1, wherein the weight percentage of the gold component of step a is from 00 to 300%. 3. The method of preparing a composite gold wire according to claim 2, wherein the weight percentage of the silver component in the step a is 66.00 to 90.00%. ❺ 4. The method for producing a composite gold wire according to claim 3, wherein the weight percentage of the palladium component in the step b is 〇〇1 to 6〇〇%. 5. The method for preparing a composite gold wire according to claim 1, wherein the gold-silver-palladium financial melt liquid in step b is drawn and drawn by continuous casting to form a gold and silver having a predetermined wire diameter of 4 to 8 mm. The alloy wire and the coiler are taken up by the reeling machine, and the composition of the gold, silver and palladium alloy wire is analyzed. 6. The method for preparing a composite gold wire according to claim 5, wherein in the step d, the gold-silver-palladium alloy wire having an original wire diameter of 4 to 8 mm is stretched by a first thick wire drawing machine. Reduce the wire diameter to 3mm or 3mm 10 201028227 or less, and then stretch the wire diameter to 1. 〇〇mm or 1.00mm through a second thick wire drawing machine, and then stretch the wire through a first thin wire drawing machine. The diameter is up to 18 mm or less, and then the gold-silver I-bar alloy wire of 0.18 mm or less is passed through a second fine wire drawing machine, a very fine wire drawing machine, and a super-fine wire drawing. The wire machine stretches the gold-silver-palladium alloy wire into a gold-silver alloy wire with a predetermined wire diameter ranging from 0.050 mm to 0.010 mm. 7. For the method of preparing the composite gold wire according to item 6 of the patent application, in step @, the gold-silver-palladium alloy wire is surface-cleaned, dried and thermally annealed. 8. A composite gold wire comprising: a gold component having a weight percentage of 8.00 to 30.00%; a silver component having a weight percentage of 66.00 to 90.00%; and a palladium component having a weight percentage of 0.01 to 6.00%.
TW98102770A 2009-01-23 2009-01-23 TWI373382B (en)

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TW98102770A TWI373382B (en) 2009-01-23 2009-01-23
JP2009233478A JP5541440B2 (en) 2009-01-23 2009-10-07 Alloy wire and manufacturing method thereof

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TW201028227A true TW201028227A (en) 2010-08-01
TWI373382B TWI373382B (en) 2012-10-01

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CN105429469A (en) * 2014-09-11 2016-03-23 Mk电子株式会社 Silver alloy bonding wire and manufacturing method thereof

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