200940933 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種對玻璃基板等板狀體經熱處理之後進 行冷卻之板狀體冷卻裝置、及採用有該板狀體冷卻裝置之 熱處理系統。 【先前技術】 先前以來，具備用以對玻璃基板等板狀體進行熱處理之 熱處理裝置、與用以對經熱處理之板狀體進行冷卻之板狀 參 體冷卻裝置之熱處理系統，用於液晶顯示器（LCD: Liquid Crystal Display)或電聚顯示器（PDP: Plasma Display)、有 機EL顯示器等此類平板顯示器（FPD : Flat Panel Display) 之製作。作為如此之熱處理系統中所採用之板狀體冷卻裝 置之一例，有如下述專利文獻1所揭示者。 專利文獻1中揭示之先前技術係將板狀體加熱進行熱處 理之熱處理槽與進行冷卻之冷卻槽分開，將熱處理結束後 之板狀體自熱處理槽搬運至冷卻槽中進行冷卻。當利用如 參 此之裝置進行連續熱處理之情形時，由於熱處理槽之溫度 幾乎未經降溫便可進行冷卻’因此，可降低熱處理槽中所 使用之能量。 [專利文獻1]曰本專利特開2002-71936號公報 【發明内容】 [發明所欲解決之問題] 如上述先前技術所述，於熱處理槽與冷卻槽分開設置的 裝置之情形時’若未能使各自之槽中之工序之處理能力大 136346.doc 200940933 致相同，則其中之一的能力將會過剩，而導致無法 效之處理。並且，若冷卻槽中之冷卻時間較長，則每一單 位時間中能夠冷卻之板狀體之片數將會變少。因此，於採 用先前技術之構成之情形時，存在為確保冷卻槽中之處理 能力’而使冷卻槽大型化之問題。 又’板狀體之冷卻，亦如專利文獻1所揭示，一般而 言，隔開間隔排列板狀體，並自其中一側對板狀體之間供 給用以進行冷卻之空氣，且使該空氣朝另一側流動來進行 冷卻。因此’於如此構成之情形時，存在如下問題，即， 會導致空氣之流動方向下游側附近之空氣流變得緩慢，使 得板狀體之冷卻需要時間’或者板狀體之冷卻因部位不同 而不均一，使得下游側之溫度變得高於上游側。 因此，本發明之目的在於提供一種能夠順利對經熱處理 之板狀體進行冷卻之板狀體冷卻裝置，以及具備該板狀體 冷卻裝置之熱處理系統。 [解決問題之技術手段] 為解決上述課題而提供之本發明之板狀體冷卻裝置之第 1態樣’其特徵在於：其係包括配置作為冷卻對象之板狀 體之板狀體配置機構及送風機構，自側方對上述板狀體配 置機構進行取出和放入上述板狀體，並能配置於上述板狀 體配置機構上，且上述板狀體配置機構具有自下方支持上 述板狀體之支持機構，而上述送風機構可自沿上下方向接 近上述板狀體之位置對上述板狀體送風。 本發明之板狀體冷卻裝置中，送風機構可自接近板狀體 136346.doc -6 - 200940933 配置機構上所配置之板狀體之位置對板狀體進行送風。因 此，本發明之板狀體冷卻裝置中，自送風機構送出之風將 通過形成於板狀體與送風機構之間的狹窄空間。因此，本 發明之板狀體冷卻裝置中，低溫之空氣將不斷地於板狀體 與送風機構之間流動，僅該部分板狀體順利得到冷卻。 如上所述，本發明之板狀體冷卻裝置，可不斷地順利冷 卻板狀體。因此’若成為上述構成，則無需使板狀體冷卻 裝置過分地大型化來確保板狀體之冷卻處理能力，故可有 〇 助於板狀體冷卻裝置之小型化。 上述本發明之板狀體冷卻裝置較好的是，於送風機構之 側方具有板狀體之取出和放入用之移載裝置可動作之動作 區域，且由支持機構所支持之板狀體與送風機構之間隙高 度低於上述動作區域之高度。 又’為解決同樣之課題而提供之本發明之板狀體冷卻裝 置之第2態樣，其特徵在於包括：配置作為冷卻對象之板 狀體之板狀體配置機構、及可對配置於該板狀體配置機構 上之板狀體送風之送風機構，自側方對上述板狀體配置機 構取出和放入上述板狀體，並可配置於上述送風機構之上 方，且上述板狀體配置機構包括：支持機構，其係自下方 支持上述板狀體；送風機構配置部，其係以可自下方朝向 由該支持機構所支持之上述板狀鱧而對其送風之方式配置 上述送風機構；及動作區域，其係設於該送風機構配置部 之側方；於該動作區域中，上述板狀體之取出和放入用之 移載裝置能夠進行動作。 136346.doc 200940933 本發明之板狀艎冷卻裝置中，於設於板狀體配置機構之 送風機構配置部配置著送風機構。另一方面，板狀體配置 機構於送風機構配置部之側方具有動作區域，且可將該動 作區域，有效用作使移載裝置動作以取出和放入板狀體之 區域。因此，本發明之板狀體冷卻裝置之裝置構成較為小 型。 又，若如上所述構成為將移載裝置動作用之動作區域設 於送風機構之側方’則僅該部分即便降低支持機構之高 度’亦能碟保足以使移載裝置動作之大小之動作區域。因 此’本發明之板狀體冷卻裝置中，能夠縮小由支持機構所 支持之板狀體與送風機構之間隔。又，本發明之板狀體冷 卻裝置中所採用之送風機構，配置成可自下方對板狀體進 行送風。因此，本發明之板狀餿冷卻裝置中，自送風機構 送出之風能夠通過板狀體與送風機構之間所形成之狹窄空 間。因此’本發明之板狀體冷卻裝置中，流動於板狀體與 送風機構間之風之風速較快，僅該部分板狀體順利得到冷 卻。 上述本發明之板狀體冷卻裝置，較理想的是包括空氣冷 郃機構’其係可冷卻自送風機構朝板狀體送出且沿著板狀 體流動之空氣。 根據如此之構成，可利用空氣冷卻機構冷卻為冷卻板狀 體而自送風機構送風之空氣，可更進一步使板狀體順利得 到冷卻^ 又，上述本發明之板狀體冷卻裝置，較理想的是於板狀 136346.doc 200940933 體配置機構中隔開間隔配置著複數個送風機構，且可經由 形成於與該送風機構鄰接之位置之空間，在比上述送風機 構更上方侧之空間與下方側之空間之間可通過空氣。 本發明之板狀體冷卻裝置中，可使自送風機構朝板狀體 送風且由熱交換所加熱之空氣經由形成於送風機構側方之 空間’自送風機構之上方側空間朝下方側之空間通過。因 此’本發明之板狀體冷卻裝置中，藉由熱交換達到高溫之 空氣難以滞留在送風機構或板狀體配置機構與板狀體之 間°因此’根據本發明，板狀體能夠順利得到冷卻。 又’由於形成上述構成，對板狀鱧配置著複數個送風機 構’因而，能夠防止於送風機構或板狀體配置機構與板狀 體之間，局部滯留因與板狀體之熱交換而達到高溫之空 氣。因此’根據本發明’便能提供一種使板狀趙無論於何 種部位均能大致均勻地冷卻之板狀體冷卻裝置。 上述板狀體冷卻裝置，較理想的是於板狀體配置機構中 設置著複數個送風機構，於板狀體配置機構之上方配置著 板狀體之狀態下，於該板狀體之外周側區域沿著上述板狀 趙流動之空氣之風速比於上述板狀體之中央側區域沿著上 述板狀體流動之空氣之風速低速。 根據上述構成，通常係對於放熱大且易於冷卻之板狀體 之周邊部’提高中央側部分之冷卻能力，使板狀體整體之 溫度分布大致均勻化。因此，根據本發明之板狀體冷卻裝 置’可使板狀體無論於任何部位均能順利冷卻。 上述本發明之板狀體冷卻裝置係板狀體配置機構係組合 136346.doc -9- 200940933 縱襟與橫樑而構成之骨架構造，於形成於鄰接之縱樑間之 送風機構配置部中設置著送風機構，板狀體之取出和放入 用之移載裝置能夠動作之動作區域以沿著縱樑延伸之方式 形成於上述送風機構配置部之側方。 又’上述本發明之板狀體冷卻裝置具有可對中空之板狀 體配置機構供給空氣之空氣供給機構，板狀體配置機構具 備起可作為送風機構之送風部，該送風部亦可具有能夠釋 放被導入板狀體配置機構内之空氣，而喷向板狀體之送風 ⑩ 〇。 又’本發明之熱處理系統之特徵在於包括：熱處理裝 置’其係進行板狀體之熱處理；上述板狀體冷卻裝置；及 移載裝置，其係將經熱處理之板狀體取出後搬入上述板狀 體冷卻裝置中。 本發明之熱處理系統具備上述板狀體冷卻裝置，故而可 順利冷卻由熱處理裝置熱處理之板狀體。因此，根據本發 ❹明之熱處理系統，能夠有效地進行板狀體之熱處理至冷卻 為止之一系列作業。 [發明之效果] 根據本發明’能夠提供一種裝置構成小型，能夠大致均 一且順利地冷卻經熱處理之板狀體之板狀體冷卻裝置，以 及具備該板狀體冷卻裝置之熱處理系統。 【實施方式】 繼而’ 一面參照圖式，一面對本發明之一實施形態之熱 處理系統1及板狀體冷卻裝置10加以詳細說明。 136346.doc -10- 200940933 如圖1所示’熱處理系統1具備熱處理裝置2與板狀體冷 卻裝置10(以下，亦簡稱為冷卻裝置1〇)、以及包括機器手 之移載裝置11。熱處理裝置2係將玻璃板等基板（板狀體）投 放到熱處理裝置2中進行熱處理者。 冷卻裝置10係用以對經熱處理裝置2熱處理之基板進行 冷卻者。冷卻裝置1〇構成為隔著特定之間隔於上下方向上 排列著複數個板狀體配置機構20。如圖3或圖4(b)、（c)等 所示’於各板狀體配置機構20中，設置有動作區域25。 又，於各板狀體配置機構20中，設置有送風機構配置部 30。於送風機構配置部30中，配置著送風機構4〇。 進而’具鱧加以說明，如圖3所示，板狀艎配置機構20 具備如下骨架構造’即，隔開特定之間隔大致平行地排列 著10根縱樑21，且於該等縱樑21之兩端部分安裝著橫樑 22。板狀體配置機構20配置成縱樑21朝著冷卻裝置1〇之縱 深方向（圖3中為上下方向）延伸，橫樑22朝著冷卻裝置10之 寬度方向（圖3中為左右方向）延伸。 於縱樑21中，沿其長度方向每隔特定之間隔排列安裝著 複數個支持銷23。又，當縱樑21按照板狀體配置機構20之 寬度方向上排列之順序設為縱樑21a〜21j時，位於板狀體 配置機構20之寬度方向兩端上之縱樑21a、2 lj，成為板狀 體配置機構20之外緣。於縱樑21a、2 lj與位於寬度方向内 侧上與該等縱樑21a、21j鄰接之位置上之縱樑21b、21i之 間’分別形成著動作區域25。同樣地，亦於縱樑21c、21d 之間或縱樑21e、21f之間、縱樑21g、21h之間形成著動作 136346.doc 200940933 區域25 ^動作區域25分別沿著縱樑2U〜21j呈直線狀延 伸。 又’板狀體配置機構20，於縱樑21b、21c之間或縱樑 21d、21e之間、縱樑21f、21g之間、縱樑21h、21i之間具 有送風機構配置部30»如圖3或圖4(a)所示，於各送風機構 配置部30中，沿著縱樑21b〜21i之長度方向每隔特定之間 隔各設置著四個送風機構4〇。又，於縱樑2ib〜21 i之長度 方向兩側鄰接於各送風機構40之位置上，配置著空氣冷卻 〇 機構50。 如圖5(a)所示’送風機構4〇具備送風扇41與濾網43。送 風扇41以吸氣口 45朝向下方，排氣口46朝向上方之姿態安 裝。又’濾網43由先前公知之HEPA濾網（High Efficiency Particulate Air Filter，高效微粒空氣濾網）構成，且配置於 送風扇41之排氣口 46之上方。因此，送風機構40，可使自 位於下方之吸氣口 45吸入之空氣通過濾網43後得以清潔 ©化’並自濾網43之上表面47朝上方排放。又，濾網43之上 表面47，位於與各縱樑21中所設置之支持銷23之前端部分 相比略低之位置上。具體而言，當於支持銷23上配置著基 板W時，基板W之背面與濾網43之上表面47之間隙s較窄， 充分低於板狀體配置部20之底部至支持銷23之前端為止之 高度h。亦即，間隙s之高度充分小於位於送風機構4〇側方 之動作區域25之高度h。因此，如圖5(a)中箭頭所示，若於 支持銷23上配置著基板W之狀態下使送風扇41動作，則空 氣將迅猛地流動於濾網43之上表面47與基板W之間所形成 136346.doc -12· 200940933 之狭小間隙S之間。 空7卻機構50包括水冷式冷卻裝置。空氣冷卻 經由冷媒迴路51(圖2)而與未圖示之供水源連接。空氣 冷部機構50,可藉由與經由冷媒迴路^進行循環 ❹ 媒）之熱交換，來冷卻空氣。如圖5⑷中箭頭所示，自位: 與空氣冷卻機構5〇鄰接之位置上之送風機構40朝向基㈣ 放出之空氣，於板狀體配置機構20之上方侧沿著基板w流 動之後’將流人該空氣冷卻機構对H空氣冷卻機 構50’可將自送風機構4()中放出之空氣冷卻。 繼而’以冷卻裝置10之動作為中心，就熱處理系統旧 基板w之處理方法加以說明。由熱處理系統1進行處理之 基板W’利用機n手等而投放至熱處理裝置2中。其後， 基板W於特定時間内暴露於調整為特定溫度（本實施形態中 為230°c〜250°c)之氣體環境下進行熱處理。 以上述方式由熱處理裝置2進行之熱處理結束後，藉由 移載裝置11將基板W自熱處理裝置2中取出。將熱處理完 畢之基板W’配置於構成冷卻裝置1〇之複數個板狀體配置 機構20中未進行基板W之冷卻處理者之上。進一步具體而 言’移載裝置11如圖1所示具有具備5根叉形爪13之叉形部 12’該又形部12插入至位於熱處理裝置2内之基板w之下 方並抬起之後，藉由自熱處理裝置2中拉出該叉形部12， 而將基板W自熱處理裝置2中取出。 若以上述方式將基板W自熱處理裝置2中取出，則移載 裝置11之叉形部12,將於搭載著基板霣之狀態下朝向冷卻 136346.doc -13· 200940933 裝置10側。其後，移載裝置11之叉形部12，插入至構成冷 卻裝置10之板狀體配置機構20中未進行基板W之冷卻處理 者之上方。此時，將叉形部12之高度，調整為基板w不會 干擾設於板狀體配置機構20中之支持銷23。又，又形部12 之位置調整為各叉形爪13能夠侵入構成板狀體配置機構20 之各動作區域25内之位置。若如此般經位置調整後，叉形 部12自上下鄰接之板狀體配置機構20之近前側（其中之一 的橫樑22侧）插入至裏側（另一橫樑22側），則又形部12之各 © 叉形爪13將於動作區域25内緩慢下降。藉此，搭載於叉形 部12之基板W，成為載置於多個設置於板狀體配置機構20 之支持銷23上之狀態。其後，叉形部12之各又形爪13，沿 著各縱樑21於與先前相反方向上進行水平移動，並自各動 作區域25中退出》 於板狀體配置機構20中配置著基板W之狀態下，若多個 設於板狀體配置機構20之送風機構40之送風扇41進行動 作，則會產生圖5(a)中箭頭所示之空氣之回流。進而加以 詳細說明，若送風扇41進行動作，則自設於其底面側之吸 氣口 45吸入之空氣將成為上升流，並自排氣口 46朝向遽網 43流動。自排氣口 46排出之空氣，進而通過濾網43經清潔 化之後，自濾網43之上表面47朝著設於上方之基板w進行 喷附。 此處，如上所述，濾網43之上表面47與基板W之間隙s 極窄。因此，自濾網43中放出之空氣，不會滯留於上表面 47與基板W之裏側之間，而是不斷地進行流動，來冷卻基 136346.doc -14· 200940933 板w。通過基板w之裏侧之空氣，其後，於位於與各送風 機構40之兩側相鄰接之位置上之空氣冷卻機構％中得到冷 卻。流入空氣冷卻機構50中經冷卻之空氣，將流出至板狀 體配置機構20之底面側。以如此方式得以冷卻之空氣自 位於與各空氣冷卻機構50相鄰接之位置上之送風機構4〇之 吸氣口 45中吸入後，用於基板貿之冷卻。 藉由隨著送風扇41之動作而產i之回流使得基板|達到 冷卻至特定之溫度為止之狀態後，移載裝置u將被插入至 β 丨板胃之下方°此時’移載裝置11，以與基板_置於板 狀體配置機構20上以進行冷卻處理時相同之動作插入。亦 即，於對冷卻處理完畢之基板W進行支持之板狀體配置機 構20中所設置之各動作區域25中，自板狀體配置機構2〇之 側方沿著各縱樑21插入移載裝置11之各又形爪13。各叉形 爪13成為插入至板狀體配置機構2 〇之裏側為止之狀態後， 各叉形爪13將於各動作區域25内被升起至上方。其後，移 & 載裝置11之各又形爪13沿著各縱樑21進行水平移動，並自 各動作區域25中退出。藉此，基板w變成自板狀體冷卻裝 置10中取出之狀態，一系列之冷卻處理結束。 如上所述’本實施形態之冷卻裝置10,於設於板狀體配 置機構20之送風機構配置部30中配置著送風機構40。又， 於板狀體配置機構20之送風機構40之側方設置有動作區域 25，且可將該動作區域25有效用於基板W之取出和放入。 因此，就板狀體冷卻裝置10而言，裝置構成較為緊密。 又，冷卻裝置10，因形成於送風機構40之側方之空間能 136346.doc •15- 200940933 夠有效用作移載裝置11用之動作區域25，因而，可使支持 銷23之高度充分低於移載裝置η之動作所需之高度（亦 即’動作區域25之高度）。因此，若於冷卻裝置1〇中將基 板w配置於板狀體配置機構20上，則隨著送風扇41之動作 而喷附至基板w後之空氣，將高速通過形成於濾網43之上 表面47與基板W之間之狹小間隙s，使得基板w得以順利冷 卻》 上述送風機構40係於送風扇41上安裝有濾網43者，但本 ® 發明並非僅限於此。具體而言，複數個經設置之送風機構 4〇之一部分或者全部，既可不設置濾網43，亦可將濾網43 安裝於其它部位。 上述冷卻裝置1〇，可藉由調整各送風機構4〇與基板w之 間隙s之大小，來適當調整流動於送風機構4〇與基板w之 間之空氣之風速。具體而言，可藉由縮小送風機構4〇與基 板W之間隙s，來提高兩者間之空氣之風速。進一步具體 φ 而言，例如亦可藉由調整濾網43之厚度，或者調整送風機 構40之高度，來調整送風機構4〇與基板w之間隙s之大 小，由此對自各送風機構40朝向基板冒喷附後流經據網“ 之上表面47與基板W之間之空氣之風速進行調整。 再者，以如上方式設置濾網43之厚度不同之送風機構仂 之情形時’會因據網43之厚度影響，而使空氣之流動阻力 不同。因此，該情形時，若使送風扇41之旋轉數相同，則 僅空氣之流動阻力不同便會使自送風機構4〇朝向基板⑼ 附之空氣之風速或基板貿之冷卻效率不同。由此，利用濾 136346.doc 16 200940933 網43之厚度來調整間隙s之大小之情形時，較理想的是， 追加利用因濾網43之厚度不同而引起之空氣之流動阻力之 大小不同，來調整送風扇41之旋轉數。 於上述實施形態所示之冷卻裝置10中，多個設置於板狀 體配置機構20中之送風機構40，均可以相同之風速對基板 W送風《而另一方面，若需進一步確切地防止基板|之溫 度不均之產生，則較理想的是，將位於相當於基板w之外 周側之位置上之送風機構40之送風速度，調整為低於位於 © 上述板狀體之中央側區域之下方之送風機構4〇之送風速 度。 上述冷卻裝置10具有空氣冷卻機構5〇，藉此可將沿著基 板W流動並達到高溫之空氣冷卻。因此，根據本實施形 態，可始終使低溫之空氣接觸基板w，故可使基板w迅速 冷部。再者，上述實施形態中，例示了於各送風機構4〇之 兩側設置空氣冷卻機構5〇之構成，但本發明並非限定於[Technical Field] The present invention relates to a plate-shaped body cooling device that cools a plate-like body such as a glass substrate after heat treatment, and a heat treatment system using the plate-shaped body cooling device. [Prior Art] A heat treatment system for heat-treating a plate-like body such as a glass substrate and a heat treatment system for a plate-shaped parameter cooling device for cooling the heat-treated plate-shaped body, for use in a liquid crystal display (LCD: Liquid Crystal Display) or electro-convex display (PDP: Plasma Display), organic EL display, etc. (FPD: Flat Panel Display). An example of the plate-like body cooling device used in such a heat treatment system is disclosed in Patent Document 1 below. In the prior art disclosed in Patent Document 1, the heat treatment tank for heat-treating the plate-shaped body is separated from the cooling tank for cooling, and the plate-shaped body after the heat treatment is transferred from the heat treatment tank to the cooling tank for cooling. When the continuous heat treatment is carried out by means of the apparatus as described, the temperature of the heat treatment tank can be cooled almost without cooling. Thus, the energy used in the heat treatment tank can be lowered. [Patent Document 1] JP-A-2002-71936 SUMMARY OF INVENTION [Problems to be Solved by the Invention] As described in the above prior art, in the case of a device in which a heat treatment tank is separately provided from a cooling bath, If the processing capacity of the processes in the respective tanks is 136346.doc 200940933, the capacity of one of them will be excessive, which will result in ineffective treatment. Further, if the cooling time in the cooling bath is long, the number of sheets which can be cooled in each unit time will be small. Therefore, in the case of adopting the constitution of the prior art, there is a problem that the cooling tank is enlarged to ensure the processing capability in the cooling tank. Further, as for the cooling of the plate-like body, as disclosed in Patent Document 1, generally, the plate-like body is arranged at intervals, and air for cooling is supplied between the plate-like bodies from one side thereof, and the The air flows toward the other side for cooling. Therefore, in the case of such a configuration, there is a problem in that the air flow in the vicinity of the downstream side in the flow direction of the air becomes slow, so that the cooling of the plate-like body takes time 'or the cooling of the plate-shaped body is different depending on the location. It is not uniform, so that the temperature on the downstream side becomes higher than the upstream side. Accordingly, it is an object of the present invention to provide a plate-shaped body cooling device capable of smoothly cooling a heat-treated plate-like body, and a heat treatment system including the plate-shaped body cooling device. [Means for Solving the Problem] The first aspect of the plate-shaped body cooling device of the present invention, which is provided to solve the above problems, is characterized in that it includes a plate-like body arrangement mechanism for arranging a plate-like body to be cooled The air blowing mechanism extracts and inserts the plate-like body arrangement mechanism from the side plate, and is disposed on the plate-shaped body arrangement mechanism, and the plate-shaped body arrangement mechanism supports the plate-shaped body from below In the support mechanism, the air blowing means can blow air to the plate-shaped body from a position close to the plate-like body in the up-and-down direction. In the plate-like body cooling device of the present invention, the air blowing means can blow the plate-like body from the position of the plate-like body disposed on the plate-like body 136346.doc -6 - 200940933. Therefore, in the plate-shaped body cooling device of the present invention, the wind sent from the air blowing means passes through a narrow space formed between the plate-shaped body and the air blowing means. Therefore, in the plate-like body cooling device of the present invention, the low-temperature air continuously flows between the plate-like body and the air blowing means, and only the portion of the plate-like body is smoothly cooled. As described above, the plate-like body cooling device of the present invention can continuously and smoothly cool the plate-like body. Therefore, with the above configuration, it is not necessary to increase the size of the plate-shaped body cooling device excessively to ensure the cooling processing capability of the plate-shaped body, which contributes to downsizing of the plate-shaped body cooling device. Preferably, the plate-shaped body cooling device according to the present invention has a plate-shaped body supported by a support mechanism in an action region in which the plate-shaped body is taken out and placed in the side of the air blowing mechanism and supported by the support mechanism. The gap height with the air blowing mechanism is lower than the height of the above-mentioned action area. In a second aspect of the plate-shaped body cooling device of the present invention, which is provided to solve the same problem, the present invention includes a plate-like body arrangement mechanism for arranging a plate-like body to be cooled, and The air blowing mechanism for the plate-shaped body blowing on the plate-like body arranging mechanism is taken out from the plate-like body arranging mechanism and placed in the plate-like body, and is disposed above the air blowing mechanism, and the plate-shaped body is disposed The mechanism includes: a support mechanism that supports the plate-shaped body from below; and a blower mechanism arranging portion that is configured to be configured to blow air from the bottom toward the plate-shaped cymbal supported by the support mechanism; And an operation area provided on the side of the air blowing mechanism arrangement portion; in the operation area, the transfer device for taking out and placing the plate-shaped body can operate. In the plate-shaped helium cooling device of the present invention, the air blowing mechanism is disposed in the air blowing mechanism arranging portion provided in the plate-like body arranging mechanism. On the other hand, the plate-like body arrangement mechanism has an operation region on the side of the air-sending mechanism arrangement portion, and the action region can be effectively used as a region for moving the transfer device to take out and put the plate-shaped body. Therefore, the apparatus of the plate-like body cooling device of the present invention is relatively small in construction. Further, if the operation region for operating the transfer device is provided on the side of the air blowing means as described above, the movement of the transfer device can be operated only if the height of the support mechanism is lowered. region. Therefore, in the plate-like body cooling device of the present invention, the distance between the plate-shaped body and the air blowing mechanism supported by the support mechanism can be reduced. Further, the air blowing mechanism used in the plate-shaped body cooling device of the present invention is arranged such that the plate-like body can be blown from below. Therefore, in the plate-shaped crucible cooling device of the present invention, the wind sent from the air blowing means can pass through a narrow space formed between the plate-shaped body and the air blowing means. Therefore, in the plate-like body cooling device of the present invention, the wind speed of the wind flowing between the plate-shaped body and the air blowing means is fast, and only the portion of the plate-like body is smoothly cooled. Preferably, the plate-like body cooling device of the present invention includes an air cooling mechanism which cools the air which is sent from the air blowing mechanism toward the plate-like body and flows along the plate-like body. According to this configuration, it is possible to cool the plate-shaped body by cooling the air which is supplied from the air blowing means by cooling the plate-shaped body by the air cooling means, and the plate-shaped body cooling device of the present invention is preferably required. In the plate shape 136346.doc 200940933, a plurality of air blowing mechanisms are disposed at intervals in the body arrangement mechanism, and a space formed at a position adjacent to the air blowing mechanism can be provided on a space higher than the air blowing mechanism and a lower side. Air can pass between the spaces. In the plate-shaped body cooling device of the present invention, the air heated by the air blowing means to the plate-shaped body and heated by the heat exchange can pass through the space formed on the side of the air blowing means to the space on the lower side of the space from the air blowing means. by. Therefore, in the plate-like body cooling device of the present invention, it is difficult for air to reach a high temperature by heat exchange to stay between the air blowing mechanism or the plate-like body arrangement mechanism and the plate-like body. Therefore, according to the present invention, the plate-shaped body can be smoothly obtained. cool down. In addition, since the plurality of air blowing mechanisms are disposed in the plate-shaped crucible by the above-described configuration, it is possible to prevent the local retention of the air blowing mechanism or the plate-like body arrangement mechanism and the plate-like body due to heat exchange with the plate-shaped body. High temperature air. Therefore, according to the present invention, it is possible to provide a plate-like body cooling device which can substantially uniformly cool the plate-shaped Zhao regardless of the position. In the plate-shaped body cooling device, it is preferable that a plurality of air blowing mechanisms are provided in the plate-like body arrangement mechanism, and a plate-like body is disposed above the plate-shaped body arrangement mechanism, and the outer peripheral side of the plate-shaped body is disposed. The wind speed of the air flowing along the plate-like shape in the region is lower than the wind speed of the air flowing along the plate-like body in the central side region of the plate-like body. According to the above configuration, the cooling capacity of the center side portion is generally increased for the peripheral portion of the plate-shaped body which is large in heat release and is easily cooled, and the temperature distribution of the entire plate-like body is substantially uniformized. Therefore, the plate-like body cooling device ' according to the present invention can smoothly cool the plate-like body at any portion. In the above-described plate-shaped body cooling device of the present invention, the plate-like body arrangement mechanism is a combination of 136346.doc -9-200940933 and a skeleton structure formed by the cross member and the cross member, and is provided in the air blowing mechanism arrangement portion formed between the adjacent longitudinal beams. The air blowing means is formed on the side of the air blowing means arranging portion so as to be movable along the longitudinal beam in an operation region in which the plate-like body is taken out and placed. Further, the plate-shaped body cooling device according to the present invention includes an air supply mechanism that can supply air to the hollow plate-shaped body arrangement mechanism, and the plate-shaped body arrangement mechanism includes a blower portion that can serve as a blower mechanism, and the blower portion can have The air introduced into the plate-like body arrangement mechanism is released, and the air blown to the plate-like body is 10 〇. Further, the heat treatment system of the present invention includes: a heat treatment device which performs heat treatment of a plate-like body; the plate-shaped body cooling device; and a transfer device which takes out the heat-treated plate-like body and then carries the plate into the plate In the cooling device. Since the heat treatment system of the present invention includes the above-described plate-shaped body cooling device, the plate-shaped body heat-treated by the heat treatment device can be smoothly cooled. Therefore, according to the heat treatment system of the present invention, it is possible to efficiently carry out a series of operations from the heat treatment of the plate-shaped body to the cooling. [Effects of the Invention] According to the present invention, it is possible to provide a plate-shaped body cooling device which is small in size, can substantially uniformly and smoothly cool a heat-treated plate-like body, and a heat treatment system including the plate-shaped body cooling device. [Embodiment] Next, a heat treatment system 1 and a plate-like body cooling device 10 according to an embodiment of the present invention will be described in detail with reference to the drawings. 136346.doc -10- 200940933 The heat treatment system 1 shown in Fig. 1 includes a heat treatment device 2, a plate-shaped body cooling device 10 (hereinafter also referred to simply as a cooling device 1), and a transfer device 11 including a robot hand. In the heat treatment apparatus 2, a substrate (plate-like body) such as a glass plate is placed in the heat treatment apparatus 2 to perform heat treatment. The cooling device 10 is for cooling the substrate heat-treated by the heat treatment device 2. The cooling device 1 is configured such that a plurality of plate-like body arrangement mechanisms 20 are arranged in the vertical direction with a predetermined interval therebetween. As shown in Fig. 3 or Fig. 4 (b), (c) and the like, the operation region 25 is provided in each of the plate-like body arrangement mechanisms 20. Further, in each of the plate-like body arrangement mechanisms 20, a blower mechanism arranging portion 30 is provided. The air blowing mechanism 4 is disposed in the air blowing mechanism arranging unit 30. Furthermore, as shown in FIG. 3, the plate-shaped dam arrangement mechanism 20 has a skeleton structure in which ten vertical beams 21 are arranged substantially in parallel at a predetermined interval, and the longitudinal beams 21 are arranged. A beam 22 is attached to both ends. The plate-like body arrangement mechanism 20 is disposed such that the stringer 21 extends in the depth direction of the cooling device 1 (upward and downward direction in Fig. 3), and the beam 22 extends in the width direction of the cooling device 10 (left-right direction in Fig. 3). In the stringer 21, a plurality of support pins 23 are arranged at regular intervals along the longitudinal direction thereof. Further, when the stringers 21 are arranged in the width direction of the plate-like body arrangement mechanism 20 as the stringers 21a to 21j, the stringers 21a and 2jj are located at both ends in the width direction of the plate-like body arrangement mechanism 20, It becomes the outer edge of the plate-like body arrangement mechanism 20. An operation region 25 is formed between the longitudinal beams 21a and 2jj and the longitudinal beams 21b and 21i at positions adjacent to the longitudinal beams 21a and 21j on the inner side in the width direction. Similarly, an action 136346.doc 200940933 is also formed between the longitudinal beams 21c, 21d or between the longitudinal beams 21e, 21f and the longitudinal beams 21g, 21h. The action area 25 is along the longitudinal beams 2U to 21j, respectively. Extends in a straight line. Further, the plate-shaped body arrangement mechanism 20 has a blower arrangement portion 30 between the side members 21b and 21c or between the side members 21d and 21e, between the side members 21f and 21g, and between the side members 21h and 21i. 3 or as shown in Fig. 4 (a), in each of the air blowing mechanism arranging portions 30, four air blowing mechanisms 4 are provided at regular intervals along the longitudinal direction of the side members 21b to 21i. Further, air cooling means 50 is disposed at a position adjacent to each of the air blowing means 40 on both sides in the longitudinal direction of the side members 2ib to 21i. As shown in Fig. 5 (a), the air blowing means 4 is provided with a blower fan 41 and a screen 43. The blower fan 41 is mounted with the intake port 45 facing downward and the exhaust port 46 facing upward. Further, the filter screen 43 is composed of a previously known HEPA filter (High Efficiency Particulate Air Filter) and is disposed above the exhaust port 46 of the blower fan 41. Therefore, the air blowing mechanism 40 allows the air taken in from the lower suction port 45 to pass through the screen 43 to be cleaned and discharged upward from the upper surface 47 of the screen 43. Further, the upper surface 47 of the screen 43 is located slightly lower than the front end portion of the support pin 23 provided in each of the longitudinal beams 21. Specifically, when the substrate W is disposed on the support pin 23, the gap s between the back surface of the substrate W and the upper surface 47 of the screen 43 is narrower than the bottom of the plate-like body arrangement portion 20 to the support pin 23 The height h from the front end. That is, the height of the gap s is sufficiently smaller than the height h of the action region 25 located on the side of the blower mechanism 4. Therefore, as shown by the arrow in Fig. 5(a), if the blower fan 41 is operated while the substrate W is placed on the support pin 23, the air will rapidly flow on the upper surface 47 of the screen 43 and the substrate W. The gap between the gaps S formed by 136346.doc -12· 200940933. The air 7 mechanism 50 includes a water-cooled cooling device. The air cooling is connected to a water supply source (not shown) via the refrigerant circuit 51 (Fig. 2). The air cold section mechanism 50 can cool the air by heat exchange with the refrigerant passing through the refrigerant circuit. As shown by the arrow in Fig. 5 (4), the self-position: the air blown toward the base (4) by the air blowing mechanism 40 adjacent to the air cooling mechanism 5A, flows along the substrate w on the upper side of the plate-like body arrangement mechanism 20 The air cooling mechanism for the H air cooling mechanism 50' can cool the air discharged from the air blowing mechanism 4 (). Next, the treatment method of the old substrate w of the heat treatment system will be described centering on the operation of the cooling device 10. The substrate W' processed by the heat treatment system 1 is placed in the heat treatment apparatus 2 by a hand or the like. Thereafter, the substrate W is subjected to heat treatment in a gas atmosphere adjusted to a specific temperature (230 ° C to 250 ° C in the present embodiment) for a specific period of time. After the heat treatment by the heat treatment apparatus 2 is completed as described above, the substrate W is taken out from the heat treatment apparatus 2 by the transfer device 11. The heat-treated substrate W' is placed on a plurality of plate-like body arrangement mechanisms 20 constituting the cooling device 1 and is not subjected to the cooling process of the substrate W. More specifically, the transfer device 11 has a fork portion 12' having five fork-shaped claws 13 as shown in FIG. 1, and the shape portion 12 is inserted under the substrate w located in the heat treatment device 2 and lifted up, The substrate W is taken out from the heat treatment device 2 by pulling the fork portion 12 from the heat treatment device 2. When the substrate W is taken out from the heat treatment apparatus 2 as described above, the fork portion 12 of the transfer device 11 is directed toward the cooling device 136346.doc -13· 200940933 on the side of the device 10 with the substrate 搭载 mounted thereon. Thereafter, the fork portion 12 of the transfer device 11 is inserted into the upper portion of the plate-like body arrangement mechanism 20 constituting the cooling device 10 without cooling the substrate W. At this time, the height of the fork portion 12 is adjusted so that the substrate w does not interfere with the support pin 23 provided in the plate-like body arrangement mechanism 20. Further, the position of the shape portion 12 is adjusted so that the respective fork claws 13 can enter a position in each of the operation regions 25 constituting the plate-like body arrangement mechanism 20. When the position adjustment is performed in this manner, the fork portion 12 is inserted from the front side (the side of the beam 22 of one of the upper and lower sides) of the plate-like body arrangement mechanism 20 adjacent to the upper and lower sides (the side of the other beam 22), and the shape portion 12 is further formed. Each of the fork fingers 13 will slowly descend in the action region 25. As a result, the substrate W mounted on the fork portion 12 is placed on a plurality of support pins 23 provided on the plate-like body arrangement mechanism 20. Thereafter, the respective claws 13 of the fork portion 12 are horizontally moved in the opposite direction from the longitudinal members 21, and are withdrawn from the respective action regions 25. The substrate W is disposed in the plate-like body arrangement mechanism 20 In the state in which the plurality of blowers 41 provided in the air blowing mechanism 40 of the plate-like body arrangement mechanism 20 operate, the backflow of the air indicated by the arrow in Fig. 5(a) occurs. Further, when the blower fan 41 is operated, the air sucked from the intake port 45 provided on the bottom surface side thereof will be an upward flow, and will flow from the exhaust port 46 toward the mesh 43. The air discharged from the exhaust port 46 is further cleaned by the screen 43, and then sprayed from the upper surface 47 of the screen 43 toward the substrate w provided above. Here, as described above, the gap s between the upper surface 47 of the screen 43 and the substrate W is extremely narrow. Therefore, the air discharged from the screen 43 does not stay between the upper surface 47 and the inner side of the substrate W, but continuously flows to cool the base 136346.doc -14·200940933 plate w. The air passing through the inner side of the substrate w is then cooled in the air cooling mechanism % located at a position adjacent to both sides of each of the air blowing mechanisms 40. The cooled air that has flowed into the air cooling mechanism 50 flows out to the bottom surface side of the plate-like body arrangement mechanism 20. The air cooled in this manner is sucked into the air intake port 45 of the air blowing mechanism 4A at a position adjacent to each air cooling mechanism 50, and is used for cooling of the substrate. After the substrate | is cooled to a specific temperature by the recirculation of the i by the action of the blower 41, the transfer device u will be inserted under the stomach of the β-plate. At this time, the transfer device 11 It is inserted in the same operation as when the substrate _ is placed on the plate-like body arranging mechanism 20 to perform the cooling process. That is, in each of the operation regions 25 provided in the plate-like body arrangement mechanism 20 that supports the cooling-processed substrate W, the side of the plate-like body arrangement mechanism 2 is inserted and transferred along each of the longitudinal beams 21. Each of the devices 11 is shaped by a claw 13. After the respective fork claws 13 are inserted into the inner side of the plate-like body arrangement mechanism 2, the fork-shaped claws 13 are lifted upward in the respective operation regions 25. Thereafter, the respective claws 13 of the shifting & loading device 11 are horizontally moved along the longitudinal beams 21, and are withdrawn from the respective operating regions 25. Thereby, the substrate w is taken out from the plate-like body cooling device 10, and a series of cooling processes are completed. In the cooling device 10 of the present embodiment, the air blowing mechanism 40 is disposed in the air blowing mechanism arrangement portion 30 provided in the plate-like body arrangement mechanism 20. Further, an operation region 25 is provided on the side of the air blowing mechanism 40 of the plate-like body arrangement mechanism 20, and the operation region 25 can be effectively used for taking out and placing the substrate W. Therefore, in the case of the plate-shaped body cooling device 10, the device is relatively tightly constructed. Further, the cooling device 10 is sufficiently effective as the operation region 25 for the transfer device 11 because the space energy 136346.doc • 15 - 200940933 formed on the side of the air blowing mechanism 40 is sufficient, so that the height of the support pin 23 can be sufficiently low. The height required for the movement of the transfer device η (i.e., the height of the 'action region 25). Therefore, when the substrate w is placed on the plate-like body arrangement mechanism 20 in the cooling device 1A, the air sprayed onto the substrate w as the blower 41 operates is formed at a high speed through the filter plate 43. The narrow gap s between the surface 47 and the substrate W allows the substrate w to be smoothly cooled. The air blowing mechanism 40 is attached to the blower fan 41 with the screen 43 attached thereto, but the present invention is not limited thereto. Specifically, part or all of the plurality of provided air blowing means 4 may be provided without the filter screen 43 or the screen 43 may be attached to other parts. In the above-described cooling device 1, the wind speed of the air flowing between the air blowing means 4A and the substrate w can be appropriately adjusted by adjusting the size of the gap s between each of the air blowing means 4'' and the substrate w. Specifically, the air velocity between the air blowing mechanism 4 and the substrate W can be reduced by narrowing the gap s between the air blowing means 4 and the substrate W. Further, for example, by adjusting the thickness of the filter screen 43 or adjusting the height of the air blowing mechanism 40, the gap s between the air blowing mechanism 4A and the substrate w can be adjusted, thereby facing the substrate from each of the air blowing mechanisms 40. After the squirting, the air velocity of the air between the upper surface 47 and the substrate W is adjusted by the net. Further, when the air supply mechanism having the thickness of the filter 43 is different as described above, the data is obtained. The influence of the thickness of 43 is different, and the flow resistance of the air is different. Therefore, in this case, if the number of rotations of the blower fan 41 is the same, only the flow resistance of the air is different, and the air supplied from the air blowing mechanism 4 toward the substrate (9) is attached. The cooling rate of the wind speed or the substrate trade is different. Therefore, when the thickness of the filter 136346.doc 16 200940933 mesh 43 is used to adjust the size of the gap s, it is preferable that the additional use is caused by the thickness of the filter 43. The number of rotations of the blower fan 41 is different depending on the magnitude of the flow resistance of the air. In the cooling device 10 shown in the above embodiment, a plurality of air blowers provided in the plate-like body arrangement mechanism 20 are provided. The structure 40 can supply air to the substrate W at the same wind speed. On the other hand, if it is necessary to further prevent the temperature unevenness of the substrate from being generated, it is preferable to be located at a position other than the outer side of the substrate w. The air blowing speed of the upper air blowing mechanism 40 is adjusted to be lower than the air blowing speed of the air blowing mechanism 4A located below the center side region of the plate-shaped body. The cooling device 10 has an air cooling mechanism 5〇, whereby the edge can be moved along Therefore, according to the present embodiment, since the air of the low temperature is always brought into contact with the substrate w, the substrate w can be quickly cooled. Further, in the above embodiment, the air is exemplified in each of the embodiments. The air cooling mechanism 5 is disposed on both sides of the mechanism 4, but the invention is not limited thereto.
此上述實施形態既可構成為不設置複數個經設置之空氣 冷部機構50中之一部分，亦可如圖6所示構成為完全不設 置空氣冷卻機構5G。又，如圖5(b)所示，既可構成為於送 風機構40之下方或者上方(圖5⑻為下方)設置空氣冷卻機 構〇 '亦可如圖5(c)所示構成為取代構成冷卻機構4〇之濾 網43而設置空氣冷卻機構50。 所述於構成為不設置空氣冷卻機構5〇之一部分或 清形時，則如圖6所示，於此部分形成上下連通 之空間55。若以心山 此方式’於與送風機構40鄰接之位置 I36346.doc 200940933 上’形成板狀體配置機構2〇之上下方向連通之空間，則可 經由此空間，將隨著基板W之冷卻而被加熱之空氣之—部 分自送風機構40之上方側空間釋放至下方側之空間。因 此’即便採用如圖6之構成時，隨著基板w之冷卻而升溫 之空氣亦難以滯留於基板W之裏侧，使得基板W均衡順利 地得到冷卻。又，於該情形時，若構成為於冷卻裝置1〇之 側方另外設置送風裝置，並藉由該送風裝置吹送外部氣 體，則可進一步提昇冷卻效果。 上述冷卻裝置10係藉由各送風機構40僅自下方側對基板 W進行冷卻者，但本發明並非僅限於此。具體而言，例如 亦可構成為於冷卻裝置1〇中，於位於各板狀體配置機構2〇 之上方之其它板狀體配置機構20之底面側設置相當於送風 機構40或送風扇41者。若如此構成，則不僅可自基板贾之 下方’而且亦可自上方喷附空氣進行冷卻，由此便可進一 步提南冷卻效率。 又’例如圖7所示’亦可構成為於上下方向上排列設置 之板狀體配置機構57之下表面側，設置送風機構40,將該 送風機構40之送風噴附至位於與下方側鄰接之位置上之板 狀體配置機構57中所設置之支持銷23上所配置之基板W， 使之得以冷卻。如圖7所示，若將送風機構4〇配置於接近 基板W之位置上，使兩者之間隔縮小，則隨著送風機構4〇 之動作而產生之風將不斷地高速流動於送風機構4〇與基板 W之間’使基板w得以順利冷卻。 再者’如圖7所示，於送風機構40設置於上方接近基板 136346.doc •18· 200940933 w之位置上之情形時，當將移載裝置^之叉形爪13插入來 取出和放入基板W時’可使基板W與送風機構40之間隔， 窄於基板W或移載裝置11上下移動所需之高度。當假設如 此情況時’較理想的是使支持銷23為能夠於上下方向上進 行伸縮者’或者能夠將上下鄰接之板狀體配置機構57彼此 之間隔擴大之構成。 於上述實施形態，就對組合縱樑21或橫樑22而構成之骨 架構造狀之板狀體配置機構20,安裝著單獨具備送風扇41 之複數個送風機構40之構成進行了例示，但本發明並非僅 限於此。具體而言’亦可例如圖8或圖9所示之板狀體冷卻 裝置60(以下，亦簡稱為冷卻裝置6〇)般，於冷卻裝置本體 67内設置板狀體配置機構65、及對該板狀體配置機構65供 給空氣之空氣供給機構66，並且於板狀體配置機構65中形 成起到送風機構之作用之送風部68(送風機構）或移載裝置 11之動作用之動作區域70。 進而詳細進行說明，圖9所示之冷卻裝置60中，使圖中 左側為冷卻裝置60之入口側，右側為背面側。可使冷卻裝 置60藉由使叉形爪13自入口侧沿縱深方向前進後退來取出 和放入基板W。構成冷卻裝置60之板狀體配置機構65如圖 8所示為中空者。於板狀體配置機構65之底面側，設置有 連接口 65a ’故可使經由該連接口 65a而導入之空氣遍布整 個板狀體配置機構65内*連接口 65 a偏向存在於冷卻裝置 60之背面侧。 於連接口 65a中，以配管連接著空氣供給機構66。空氣 136346.doc •19- 200940933 供給機構66具有送風機66a與渡網66b。送風機66a係將位 於冷卻裝置本體67内之空氣吸入後朝板狀體配置機構65側 壓送者《«又，濾網66b，與採用上述冷卻裝置1〇之濾網43 相同，包含所謂HEPA濾網。濾網66b配置於送風機66a與 板狀體配置機構65之間，可捕獲由送風機66a壓送之空氣 中所含之粉塵。 又，板狀體配置機構65内且與連接口 65a鄰接之位置 上，設置著空氣冷卻機構69。空氣冷卻機構69係用以對自 ❹ 連接口 65 a導入至板狀體配置機構65内之空氣進行冷卻 者。於空氣冷卻機構69中，可採用與上述冷卻裝置1〇所具 備之空氣冷卻機構50相同之水冷式冷卻機構等適當者。 如圖8所示，板狀體配置機構65之底面朝向上方傾斜， 以可自連接口 65a脫離至叉形爪13之進退方向近前側。藉 此，板狀體配置機構65,隨著空氣之流動方向自上游側朝 向下游侧，作為空氣流路之板狀體配置機構65内之剖面面 積將變得狹窄。 參 又，於板狀體配置機構65之頂面側，設置著多個送風部 68。如圖8所示，送風部68係於板狀體配置機構65之頂面 側朝上方突出之長方體狀之部分。又，如圖9所示，送風 部68設置成於自頂面側對板狀體配置機構65進行平面觀察 之狀態下縱橫排列著複數個（圖9所示之例中為縱橫分別各 四個）。 各送風部68之頂面68a中，設置著多個由小孔構成之送 風口 68b。又’於各送風部68之四角豎立設置著支持銷 136346.doc -20- 200940933 23 ’於該支持銷23之上方可配置基板w。因此，各送風部 68之構造為可自送風口 681)朝上方將導入至板狀體配置機 構65内之空氣放出，對基板W進行喷附。 於圖9所示之狀態中，假設橫向排列著四個送風部68之 部分分別為送風機構配置部71，則各送風機構配置部71之 兩側部分’成為用作動作區域70之區域，其用以使移載裝 置11進退動作以便取出和放入基板W。形成有動作區域70 之部分’與送風部68相比低一個階梯。使豎立設置於送風 部68上之支持銷23以及送風部68之總高度，亦即支持銷23 之刖端與動作區域70之底面之間隔，為足以使移載裝置11 進行動作以取出和放入基板W之高度。 繼而’以冷卻裝置60之動作為中心，就使用著冷卻裝置 60之基板W之冷卻處理方法進行說明。冷卻裝置6〇係於上 述熱處理系統1中代替冷卻裝置10而使用者，用於對熱處 理裝置2所進行之熱處理結束後之基板臀進行冷卻處理。 當藉由冷卻裝置60對基板W進行冷卻之情形時，搭載著基 板W之移載裝置11之又形部丨2將插入至板狀體配置機構65 之上方。此時’將又形部12之高度調整為基板w不會對豎 立設置於送風部68上之支持銷23造成干擾。又，對叉形部 12進行位置調整，以使各叉形爪13能夠侵入至各動作區域 70中。其後’將叉形部12，自冷卻裝置6〇之入口側（圖9之 左側）朝裏側（圖9之右側）插入。 又形部12，若成為侵入至冷卻裝置6〇之裏側為止之狀 態，則將緩慢地於動作區域70内下降。藉此，基板w便成 136346.doc -21 · 200940933 為自叉形部12移載至各支持銷23上之狀態。當基板w之移 裁結束後，叉形部12將水平移動’並自動作區域70中退 出。 若以上述方式於基板W置於板狀體配置機構65中之狀態 下，空氣供給機構66之送風機66a進行動作，則如圖8(a)中 箭頭所示，空氣將自連接口 65a導入。該空氣，通過濾網 66b得以清潔化之後’將導入至板狀體配置機構65之内 側。導入至板狀體配置機構65内之空氣，朝著多個設置於 板狀體配置機構65之頂面侧上之送風部68流動。到達各送 風部68之空氣，如圖8(b)中箭頭所示，自設於頂面68a上之 送風口 68b對位於上方之基板W進行喷附。 對基板W喷附後之空氣，將朝著送風部68之周圍流動。 此處，如上所述，送風部68於板狀體配置機構65之頂面侧 突出成長方體狀，故構成動作區域70之部分、或者排列於 送風機構配置部71上之送風部68彼此之間之部分，與送風 部68相比低一個階梯。因此，對基板貿喷附後之空氣，不 會滯留於送風部68與基板W之間，而是通過形成於送風部 68側方之低一個階梯之溝狀區域，朝著板狀體配置機構“ 之外周侧流動。其後，該空氣朝板狀體配置機構65之外側 排出。 若以上述方式，藉由自送風部68中喷出之空氣流使基板 W成為冷卻至特定溫度為止之狀態，則將移載裝置11插入 至動作區域70内，並將基板w抬起。其後，藉由移載裝置 11使基板w自冷卻裝置6G中退出後，—系列之冷卻處理結 136346.doc -22- 200940933 束。 如上所述’於冷卻裝置60中’於板狀體配置機構65之頂 面側，排列設置著複數個朝上方侧突出之送風部68。又， 於由送風部68排列成一行而形成之送風機構配置部7丨之側 方存在著動作區域70’可將該動作區域7〇有效用作移載裝 置11之動作用之空間。因此，冷卻裝置中，可最小限度 地抑制支持銷23之高度。 ❹The above-described embodiment may be configured such that a part of the plurality of provided air cooling unit mechanisms 50 is not provided, and as shown in Fig. 6, the air cooling mechanism 5G may not be provided at all. Further, as shown in FIG. 5(b), the air cooling mechanism 〇' may be provided below or above the air blowing mechanism 40 (lower in FIG. 5 (8)), or may be configured as shown in FIG. 5(c) instead of cooling. An air cooling mechanism 50 is provided in the screen 43 of the mechanism. When the air cooling mechanism 5 is not provided with a portion or a clear shape, as shown in Fig. 6, a space 55 that communicates vertically is formed in this portion. If the space in which the upper side of the plate-like body arrangement mechanism 2 is connected is formed in the position I36346.doc 200940933 adjacent to the air blowing mechanism 40 in this way, the space W can be cooled with the substrate W. The portion of the heated air is partially released from the upper side space of the air blowing mechanism 40 to the space on the lower side. Therefore, even when the configuration shown in Fig. 6 is employed, it is difficult for the air heated by the cooling of the substrate w to stay on the back side of the substrate W, so that the substrate W is smoothly cooled in a balanced manner. Further, in this case, if the air blowing device is separately provided on the side of the cooling device 1 and the external air is blown by the air blowing device, the cooling effect can be further enhanced. In the above-described cooling device 10, the substrate W is cooled only from the lower side by the respective air blowing means 40, but the present invention is not limited thereto. Specifically, for example, in the cooling device 1A, the air blowing mechanism 40 or the blower fan 41 may be provided on the bottom surface side of the other plate-like body arrangement mechanism 20 located above each of the plate-like body arrangement mechanisms 2A. . According to this configuration, not only the lower side of the substrate but also the air can be sprayed from above for cooling, whereby the cooling efficiency can be further improved. Further, 'for example, as shown in Fig. 7,' may be configured such that the air blowing mechanism 40 is provided on the lower surface side of the plate-like body arrangement mechanism 57 arranged in the vertical direction, and the air blowing mechanism 40 is sprayed to the lower side. The substrate W disposed on the support pin 23 provided in the plate-like body arrangement mechanism 57 at the position is cooled. As shown in FIG. 7, when the air blowing mechanism 4 is disposed at a position close to the substrate W, and the interval between the two is reduced, the wind generated by the operation of the air blowing mechanism 4 不断 continuously flows to the air blowing mechanism 4 at a high speed. Between the crucible and the substrate W, the substrate w is smoothly cooled. Further, as shown in FIG. 7, when the air blowing mechanism 40 is disposed above the position of the substrate 136346.doc • 18·200940933 w, the fork claw 13 of the transfer device is inserted to be taken out and placed. In the case of the substrate W, the distance between the substrate W and the blower mechanism 40 can be made narrower than the height required for the substrate W or the transfer device 11 to move up and down. In this case, it is preferable that the support pin 23 is configured to be expandable in the up-and-down direction or the space between the vertically adjacent plate-like body arrangement mechanisms 57 can be enlarged. In the above-described embodiment, the plate-shaped body arrangement mechanism 20 having the skeleton structure in which the side member 21 or the beam 22 is combined is provided with a configuration in which a plurality of air blowing mechanisms 40 each having the blower fan 41 are attached, but the present invention is exemplified. Not limited to this. Specifically, for example, a plate-like body arrangement mechanism 65 and a pair of the plate-shaped body cooling device 60 (hereinafter also referred to simply as a cooling device 6) shown in FIG. 8 or FIG. 9 may be provided. The plate-shaped body arrangement mechanism 65 is supplied with the air supply mechanism 66 for air, and the air-moving portion 68 (air blowing mechanism) that functions as the air blowing mechanism or the operation region for the operation of the transfer device 11 is formed in the plate-shaped body arrangement mechanism 65. 70. Further, in the cooling device 60 shown in Fig. 9, the left side of the drawing is the inlet side of the cooling device 60, and the right side is the back side. The cooling device 60 can be taken out and placed in the substrate W by advancing and retreating the fork-shaped claw 13 from the inlet side in the depth direction. The plate-like body arrangement mechanism 65 constituting the cooling device 60 is hollow as shown in Fig. 8 . The connection port 65a is provided on the bottom surface side of the plate-like body arrangement mechanism 65. Therefore, the air introduced through the connection port 65a can be distributed throughout the entire plate-like body arrangement mechanism 65. The connection port 65a is biased toward the cooling device 60. Back side. In the connection port 65a, the air supply mechanism 66 is connected by a pipe. Air 136346.doc • 19- 200940933 The supply mechanism 66 has a blower 66a and a shuttle 66b. The blower 66a sucks the air in the cooling device main body 67 and presses it toward the plate-like body arrangement mechanism 65. Further, the filter 66b is the same as the filter 43 using the above-described cooling device 1 and includes a so-called HEPA filter. network. The screen 66b is disposed between the blower 66a and the plate-like body arrangement mechanism 65, and can capture the dust contained in the air pumped by the blower 66a. Further, an air cooling mechanism 69 is provided in the plate-like body arrangement mechanism 65 at a position adjacent to the connection port 65a. The air cooling mechanism 69 is for cooling the air introduced into the plate-like body arrangement mechanism 65 from the port 65a. In the air cooling mechanism 69, a water-cooling type cooling mechanism similar to the air cooling mechanism 50 provided in the above-described cooling device 1A can be employed. As shown in Fig. 8, the bottom surface of the plate-like body arrangement mechanism 65 is inclined upward, so as to be disengageable from the connection port 65a to the front side of the fork-shaped claw 13 in the advancing and retracting direction. As a result, the plate-like body arrangement mechanism 65 has a narrow cross-sectional area in the plate-like body arrangement mechanism 65 as the air flow path as the flow direction of the air flows from the upstream side to the downstream side. Further, a plurality of air blowing portions 68 are provided on the top surface side of the plate-like body arrangement mechanism 65. As shown in Fig. 8, the air blowing portion 68 is a rectangular parallelepiped portion that protrudes upward from the top surface side of the plate-like body arrangement mechanism 65. In addition, as shown in FIG. 9 , the air blowing unit 68 is provided in a plurality of vertical and horizontal directions in a state in which the plate-like body arrangement mechanism 65 is viewed from the top surface side (in the example shown in FIG. 9 , each of the four vertical and horizontal directions) ). A plurality of air blowing ports 68b each having a small hole are provided in the top surface 68a of each of the air blowing portions 68. Further, a support pin 136346.doc -20-200940933 23' is disposed at four corners of each of the air blowing portions 68. The substrate w can be disposed above the support pin 23. Therefore, each of the air blowing portions 68 is configured such that the air introduced into the plate-like body arrangement mechanism 65 can be discharged upward from the air supply port 681), and the substrate W can be ejected. In the state shown in FIG. 9, it is assumed that the portions of the four air blowing portions 68 that are horizontally arranged are the air blowing mechanism arranging portions 71, and the both side portions ' of the respective air blowing mechanism arranging portions 71 become the regions serving as the operating regions 70. It is used to move the transfer device 11 forward and backward to take out and put in the substrate W. The portion 'with the action region 70 formed' is one step lower than the blower portion 68. The total height of the support pin 23 and the blower portion 68 that are erected on the blower portion 68, that is, the distance between the end of the support pin 23 and the bottom surface of the action region 70 is sufficient for the transfer device 11 to be moved out and released. Enter the height of the substrate W. Next, the cooling processing method using the substrate W of the cooling device 60 will be described focusing on the operation of the cooling device 60. The cooling device 6 is used in the heat treatment system 1 instead of the cooling device 10, and is used to cool the substrate hip after the heat treatment by the heat treatment device 2 is completed. When the substrate W is cooled by the cooling device 60, the shape portion 2 of the transfer device 11 on which the substrate W is mounted is inserted above the plate-like body arrangement mechanism 65. At this time, the height of the shape portion 12 is adjusted so that the substrate w does not interfere with the support pin 23 that is erected on the blower portion 68. Further, the fork portions 12 are positionally adjusted so that the respective fork claws 13 can intrude into the respective motion regions 70. Thereafter, the fork portion 12 is inserted from the inlet side (the left side in Fig. 9) of the cooling device 6A toward the back side (the right side in Fig. 9). When the shape portion 12 enters the inner side of the cooling device 6〇, it will gradually descend in the operation region 70. Thereby, the substrate w is 136346.doc - 21 · 200940933 in a state of being transferred from the fork portion 12 to each of the support pins 23. When the cutting of the substrate w is completed, the fork portion 12 will move horizontally' and automatically exit in the region 70. When the blower 66a of the air supply mechanism 66 is operated in a state where the substrate W is placed in the plate-like body arrangement mechanism 65 as described above, air is introduced from the connection port 65a as indicated by an arrow in Fig. 8(a). This air is cleaned by the screen 66b and will be introduced to the inner side of the plate-like body arrangement mechanism 65. The air introduced into the plate-like body arrangement mechanism 65 flows toward the plurality of air blowing portions 68 provided on the top surface side of the plate-like body arrangement mechanism 65. The air reaching the respective blowing portions 68 is ejected from the upper substrate W by the air blowing port 68b provided on the top surface 68a as indicated by an arrow in Fig. 8(b). The air sprayed on the substrate W flows toward the periphery of the blower portion 68. Here, as described above, the air blowing portion 68 protrudes in a rectangular shape on the top surface side of the plate-like body arrangement mechanism 65, so that the portion constituting the operation region 70 or the air blowing portion 68 arranged on the air blowing mechanism arranging portion 71 is interposed therebetween. The portion is lower by one step than the blower portion 68. Therefore, the air that has been sprayed on the substrate is not retained between the blower portion 68 and the substrate W, but is formed in a groove-like region formed at a lower step on the side of the blower portion 68, and is disposed toward the plate-like body. "The outer peripheral side flows. Thereafter, the air is discharged to the outside of the plate-like body arrangement mechanism 65. As described above, the substrate W is cooled to a specific temperature by the air flow ejected from the blower portion 68. Then, the transfer device 11 is inserted into the action area 70, and the substrate w is lifted up. Thereafter, after the substrate w is ejected from the cooling device 6G by the transfer device 11, the series of cooling processing knots 136346.doc -22- 200940933. As described above, in the cooling device 60, a plurality of air blowing portions 68 projecting upward are arranged side by side on the top surface side of the plate-like body arrangement mechanism 65. Further, the air blowing portions 68 are arranged in the air blowing portion 68. The side of the air blowing mechanism arranging portion 7 that is formed in a row has an operating region 70 ′ that can effectively use the operating region 7 用作 as a space for the operation of the transfer device 11 . Therefore, the cooling device can be minimized. Suppress the support pin 23 . ❹
又’冷卻裝置60中，因支持銷23之高度以最小限度形 成，故而，配置於支持銷23上之基板w與送風部68之頂面 68a之間隔較小。因此，冷卻裝置6〇中自送風部68之送 風口 68b噴出之低溫之空氣將不斷地以高速流動於基板w 與頂面68a之間。因此，根據冷卻裝置⑼，便可使基板w 迅速得以冷卻。 冷卻裝置60中，因送風部68與其它部分相比高 梯因此，平面觀察之狀態下位於縱橫鄰接之位置上之送 几部68彼此之間之部分，可起到使空氣通過之溝之作用。 友此於冷卻裝置60中，自送風部68對基板w喷附後之空 ^不會滯留於送風部68與基板W之間，而是朝著板狀體 邙八機構65之外周側於送風部68之側方上所形成之溝狀 w刀中進行流動後排出。因此，冷卻裝置60中，因與基板 、、、交換而被加熱之空氣將朝著板狀體配置機構68之外 侧順利排出。 、，、 ,^ 。又’冷卻裝置6〇中’隨著基板W之冷卻而被 加熱之空氣蔣6 财目基板貨之下方順利排出，故基板W將均衡 且大致均—地得到冷卻。 136346.doc 23- 200940933 冷部裝置60’無需如上述冷卻裝置】〇般設置多個送風機 構4〇或空氣冷卻機構50、滤網43。又，若如冷卻裝置⑽ 構成則可使用與作為送風機構4〇而被採用之送風扇川目 比更大型者作為送風機66a ^因此，若如冷卻裝置般構 成’則可抑制製造成本。 於冷卻裝置60中，板狀體配置機構65之底面，隨著空氣 之流動方向朝向下游側（圖8中為左侧）而向上方傾斜，使得 空氣流動之部分之剖面面積緩慢變小。因此，板狀體配置 β 機構65内流動之空氣以及自各送風部68中喷出之空氣之流 速，於接近連接口 65a之上游側部分、及離開連接口 65a之 下游側部分差距不大，為大致均一。因此，冷卻裝置60 中，可將以相對基板W無論任何部位均大致均一之風速將 空氣朝基板W喷附，故而使基板w均衡地大致均一地得到 冷卻。再者’上述冷卻裝置60中例示著如下構成，即，考 慮到為使各送風部68中喷出空氣之流速大致均一，而使板 _ 狀體配置機構65之底面傾斜之構成，但本發明並非僅限於 此’板狀體配置機構65之底面亦可為大致水平者。 於上述實施形態中，例示了板狀體配置機構65之底面上 設置著連接口 65 a之構成，但本發明並非僅限於此，亦可 為板狀體配置機構65之側面上設置著連接口 65a之構成。 又’如圖8所示之例’連接口 65a，設於偏向板狀體配置機 構65之外周侧之位置上’但本發明並非僅限於此，例如亦 可為設於板狀體配置機構65之底面之中央附近之構成。 上述冷卻裝置60中例示了如下構成，即，經由動作區域 136346.doc •24 200940933 70將複數行（圖9所示之例為4行）之送風機構配置部7i設置 於一體性形成之板狀體配置機構65上之構成但本發明並 非僅限於此。具體而言，例如圖1〇所示之板狀體配置機構 80般，可於上述板狀體配置機構65中，隔開特定之間隔， 配置複數個包含相當於送風機構配置部71之部分之送風機 構配置部81，並於各送風機構配置部81中以配管連接空氣 供給機構66，並且，將位於各送風機構配置部“兩侧之空 間，用作用以使移載裝置！〗動作之動作區域82。再者，於 〇 圖10所示之構成之情形時，若如圖8或圖9所示之例，構成 為取代於空氣供給機構66之下游側設置空氣冷卻機構69， 而於空氣供給機構66之上游側設置空氣冷卻機構83，則無 需於每一個送風機構配置部81中設置空氣之冷卻用機構， 故可簡化裝置構成。 於圖9或圖10所示之例中，設於各送風部68中之送風口 68b之開口徑或配置密度於任何部位均為相同，但本發明 p 並非僅限於此，送風口 68b之開口徑或配置密度亦可因部 位不同而不同。具體而言，可構成如下：例如於上方配置 著基板W之狀態下，使位於相當於基板w中央側之位置上 之送風部68中所設置之送風口 68b之開口徑，大於位於相 當於基板w外周側之位置上之送風部68中所設置之送風口 68b之開口徑，或者於位於相當於基板w中央側之位置上 之送風部68，設置如下送風口 68b，其數量多於位於相當 於外周側之位置上之送風部68。若如此構成，則通常情況 下’與認為放熱大且易於冷卻之基板|之周邊部相比能 136346.doc •25· 200940933 夠提高中央侧之部分之冷卻能力，使基板w整體均衡且大 致均一地得到冷卻。 【圖式簡單說明】 圖1係表示本發明之一實施形態之熱處理系統之裝置構 成圖。 圖2係表示板狀體冷卻裝置之内部構造之裝置構成圖。 •圖3係表示板狀體配置機構之平面圖。 圖4(a)係圖3之A-A剖面圖，圖4(b)係圖3之B-B刮面圖， © 圖4(c)係圖3之C-C剖面圖》 圖5(a)係模式性表示圖3所示之板狀髏配置機構中之送風 機構附近之構造以及空氣流向之側面圖，圖5(b)、係分 別表示送風機構與空氣冷卻機構之配置之變形例的側面 圖。 圖6係表示圖3所示之板狀體配置機構之變形例的平面 圖。 ❹ 圖7係板狀體配置機構之變形例之主要部分擴大後之側 面圖。 圖8(a)係表示圖2所示之板狀體冷卻裝置之變形例之裝置 • 構成圖’圖8(b)係（a)之A部擴大後之剖面圖。 圖9係表示圖8所示之板狀體冷卻裝置之平面圖。 ® 1 〇係表示圖8及圖9所示之板狀體冷卻裝置之變形例的 平面圖。 【主要元件符號說明】 1 熱處理系統 136346.doc -26- 200940933Further, in the cooling device 60, since the height of the support pin 23 is minimized, the distance between the substrate w disposed on the support pin 23 and the top surface 68a of the blower portion 68 is small. Therefore, the low-temperature air ejected from the air supply port 68b of the air blowing portion 68 in the cooling device 6 is continuously flowing between the substrate w and the top surface 68a at a high speed. Therefore, according to the cooling device (9), the substrate w can be quickly cooled. In the cooling device 60, since the air blowing portion 68 is higher than the other portions, the portion between the plurality of portions 68 located at the position adjacent to the longitudinal and lateral directions in the state of the planar view can function as a groove through which the air passes. . In the cooling device 60, the air that has been ejected from the substrate w by the air blowing portion 68 does not stay between the air blowing portion 68 and the substrate W, but is blown toward the outer peripheral side of the plate-like body mechanism 65. The grooved w-blade formed on the side of the portion 68 flows and is discharged. Therefore, in the cooling device 60, the air heated by the exchange with the substrate is smoothly discharged toward the outside of the plate-like body arrangement mechanism 68. ,,, ,^. Further, in the "cooling device 6", the air heated by the cooling of the substrate W is smoothly discharged below the substrate, so that the substrate W is cooled and substantially uniformly cooled. 136346.doc 23- 200940933 The cold unit 60' does not need to be provided with a plurality of blowers 4 or air cooling mechanisms 50 and screens 43 as in the above-described cooling device. Further, if the cooling device (10) is configured, it is possible to use the blower 66a as a larger fan than the blower fan used as the air blowing means 4, and therefore, if it is configured as a cooling device, the manufacturing cost can be suppressed. In the cooling device 60, the bottom surface of the plate-like body arrangement mechanism 65 is inclined upward as the flow direction of the air flows toward the downstream side (the left side in Fig. 8), so that the cross-sectional area of the portion where the air flows is gradually decreased. Therefore, the flow rate of the air flowing in the plate-like body arrangement mechanism 65 and the air ejected from each of the air blowing portions 68 is not large at the upstream side portion close to the connection port 65a and the downstream side portion away from the connection port 65a. It is roughly uniform. Therefore, in the cooling device 60, air can be sprayed toward the substrate W at a wind speed substantially uniform with respect to any portion of the substrate W, so that the substrate w is substantially uniformly cooled in a uniform manner. In the above-described cooling device 60, a configuration is adopted in which the bottom surface of the plate-shaped body arrangement mechanism 65 is inclined so that the flow velocity of the air blown from each of the air blowing portions 68 is substantially uniform, but the present invention is It is not limited to this, and the bottom surface of the plate-shaped body arrangement mechanism 65 may be substantially horizontal. In the above-described embodiment, the configuration in which the connection port 65a is provided on the bottom surface of the plate-like body arrangement mechanism 65 is exemplified. However, the present invention is not limited thereto, and a connection port may be provided on the side surface of the plate-shaped body arrangement mechanism 65. The composition of 65a. Further, as shown in FIG. 8, the connection port 65a is provided at a position on the outer peripheral side of the plate-like body arrangement mechanism 65. However, the present invention is not limited thereto, and may be provided, for example, in the plate-like body arrangement mechanism 65. The structure near the center of the bottom surface. In the cooling device 60, the air blowing mechanism arranging portion 7i of the plurality of rows (the example shown in FIG. 9 is four rows) is provided in a plate shape integrally formed via the operation region 136346.doc • 24 200940933 70. The configuration of the body arrangement mechanism 65 is not limited to this. Specifically, for example, in the plate-like body arrangement mechanism 80 shown in FIG. 1A, a plurality of portions corresponding to the air blowing mechanism arrangement portion 71 may be disposed in the plate-like body arrangement mechanism 65 at a predetermined interval. In the air blowing mechanism arranging portion 81, the air supply mechanism 66 is connected to each of the air blowing mechanism arranging portions 81, and the space on both sides of each air blowing mechanism arranging portion is used as an action for moving the transfer device! Further, in the case of the configuration shown in FIG. 10, as shown in FIG. 8 or FIG. 9, the air cooling mechanism 69 is provided instead of the air supply mechanism 66, and the air is provided in the air. Since the air cooling mechanism 83 is provided on the upstream side of the supply mechanism 66, it is not necessary to provide an air cooling mechanism in each of the air blowing mechanism arranging portions 81, so that the device configuration can be simplified. In the example shown in Fig. 9 or Fig. 10, The opening diameter or the arrangement density of the air supply port 68b in each of the air blowing portions 68 are the same at any position. However, the present invention p is not limited thereto, and the opening diameter or the arrangement density of the air blowing port 68b may be different depending on the location. Specifically, for example, in the state in which the substrate W is placed above, the opening diameter of the air blowing port 68b provided in the air blowing portion 68 at the position corresponding to the center side of the substrate w is larger than the corresponding opening. The opening diameter of the air blowing port 68b provided in the air blowing portion 68 at the position on the outer peripheral side of the substrate w or the air blowing portion 68 located at the position corresponding to the center side of the substrate w is provided with the following air blowing port 68b, which is more than the number of the air blowing ports 68b. It is equivalent to the air blowing portion 68 at the position on the outer peripheral side. In this case, it is generally 136346.doc •25·200940933, which is higher than the peripheral portion of the substrate that is considered to have a large heat release and is easy to cool. The cooling capacity is such that the substrate w is uniformly balanced and substantially uniformly cooled. [Brief Description of the Drawings] Fig. 1 is a view showing a configuration of a heat treatment system according to an embodiment of the present invention. Fig. 2 is a view showing a plate-shaped body cooling device. Fig. 3 is a plan view showing a plate-like body arranging mechanism. Fig. 4(a) is a cross-sectional view taken along line AA of Fig. 3, and Fig. 4(b) is a BB scraping view of Fig. 3, © Fig. 4 ( c) FIG. 5(a) is a side view showing the structure in the vicinity of the air blowing mechanism and the air flow direction in the plate-shaped weir arrangement mechanism shown in FIG. 3, and FIG. 5(b) Fig. 6 is a plan view showing a modification of the arrangement of the plate-like body shown in Fig. 3. Fig. 6 is a plan view showing a modification of the plate-like body arrangement mechanism. Fig. 8(a) is a view showing a modification of the plate-like body cooling device shown in Fig. 2. Fig. 8(b) is a cross-sectional view of the enlarged portion A of (a) Fig. 9 is a plan view showing the plate-shaped body cooling device shown in Fig. 8. The Fig. 1 is a plan view showing a modification of the plate-shaped body cooling device shown in Figs. 8 and 9. [Main component symbol description] 1 Heat treatment system 136346.doc -26- 200940933
10 ' 60 11 2 20 、 65 ' 80 23 25 、 70 、 82 30 、 71 、 81 40 © 41 43 50 、 69 、 83 55 68 W 板狀體冷卻裝置（冷卻裝置） 移載裝置 熱處理裝置 板狀體配置機構 支持銷（支持機構） 動作區域 送風機構配置部 送風機構 送風扇 濾網 空氣冷卻機構 空間 送風部（送風機構） 基板 136346.doc -27-10 ' 60 11 2 20 , 65 ' 80 23 25 , 70 , 82 30 , 71 , 81 40 © 41 43 50 , 69 , 83 55 68 W Plate cooling device (cooling device ) Transfer device heat treatment device plate body Configuration mechanism support pin (support mechanism) Action area air supply mechanism arrangement part air supply mechanism fan filter air cooling mechanism space air supply unit (air supply mechanism) substrate 136346.doc -27-