KR20090079801A - Device for cooling a board-shaped body, and heat treatment system - Google Patents

Abstract

An apparatus for cooling a board-shaped body and a heat treatment system are provided to uniformly cool off a heat treated board-shaped body. An apparatus for cooling a board-shaped body comprises the following units. A board-shaped body arranging unit(20) is equipped with a ventilation unit arranging part(30) consisting of a plurality of ventilation units(40) at some distance from each other. When a board-shaped body is taken out, a fork pole(13) of a transfer loading unit(11) requires to be inserted into an operating region(25) located on the ventilation unit arranging part. A supporting pin(23) increases the flux of the air passing through a substrate in order to improve cooling efficiency.

Description

Device for cooling a board-shaped body, and heat treatment system

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plate-like cooling device for cooling after heat-treating a plate-like body such as a glass substrate, or a heat treatment system employing the plate-like body cooling device.

Background Art Conventionally, a heat treatment system having a heat treatment apparatus for heat-treating a plate-like body such as a glass substrate and a plate-shaped body cooling apparatus for cooling the heat-treated plate-like body is a liquid crystal display (LCD: Liquid Crystal Display) or a plasma display (PDP: It is used in the manufacture of flat panel displays (FPDs) such as plasma displays and organic EL displays. As an example of the plate-shaped object cooling apparatus employ | adopted in such a heat processing system, there exist some which are disclosed by following patent document 1. As shown in FIG.

In the prior art disclosed in Patent Literature 1, the heat treatment tank for heating and heat treatment of the plate-shaped body and the cooling tank for cooling are separately carried out, and the plate-like body after heat treatment is conveyed from the heat treatment tank to the cooling tank for cooling. In the case where the heat treatment is performed continuously with such an apparatus, since the temperature of the heat treatment tank can be cooled almost without decreasing, the energy used in the heat treatment tank can be reduced.

[Patent Document 1] Japanese Unexamined Patent Publication No. 2002-71936

In the case of a device in which the heat treatment tank and the cooling tank are separated as in the above-described prior art, if the treatment capacity of the process in each tank is not made to about the same degree, one capacity remains and efficient treatment cannot be performed. And if the cooling time in a cooling tank is long, the number of sheets of plate-shaped object which can be cooled per unit time will become small. For this reason, in the case of employing the configuration as in the prior art, there is a problem that the cooling tank is enlarged in order to secure processing capacity in the cooling tank.

In addition, as disclosed in Patent Literature 1, the cooling of the platelets is generally performed by arranging the platelets at intervals, supplying air for cooling from one side between the platelets, and flowing them to the other. . For this reason, when it is set as such a structure, the airflow in the vicinity of air flow downstream will become slow, time will be required for cooling of a plate-shaped object, and cooling of a plate-shaped object will become uneven according to a site | part, There was a problem that the temperature became higher than the upstream side.

Accordingly, an object of the present invention is to provide a plate cooling device capable of smoothly cooling a heat-treated plate-like object, and a heat treatment system having the plate-shaped cooling device.

The 1st aspect of the plate-shaped object cooling apparatus of this invention provided in order to solve the said subject has plate-shaped body arrangement means by which the plate-shaped object which is cooling object is arrange | positioned, and a blowing means, The said plate-shaped object is attached to the said plate-shaped body arrangement means. The plate-shaped body cooling apparatus which can draw in and out from the side, and is arrange | positioned on the said plate-shaped object placement means, The said plate-shaped object arrangement | positioning means has the support means which supports the said plate-shaped object from below, The said blowing means is a said plate-shaped object. It is characterized in that the air can be blown toward the plate-like body from a position close to the vertical direction.

In the plate body cooling device of the present invention, the blowing means is capable of blowing air toward the plate body from a position proximate to the plate body placed on the plate body arrangement means. For this reason, in the plate-shaped object cooling apparatus of this invention, the wind from the blowing means passes through the narrow space formed between the plate-shaped object and the blowing means. Therefore, in the plate-shaped body cooling apparatus of this invention, low temperature air flows in sequence between a plate-shaped body and a blowing means, and the plate-shaped body is cooled smoothly by that much.

As mentioned above, in the plate-shaped object cooling apparatus of this invention, a plate-shaped object can be cooled smoothly one by one. For this reason, if it is set as above-mentioned structure, in order to ensure the cooling process capability of a plate-shaped object, it is not necessary to enlarge a plate-shaped cooling apparatus more than necessary, and a plate-shaped cooling apparatus can be provided compactly.

The plate-shaped body cooling apparatus of the present invention described above has an operating area on the side of the air-blowing means, the movable loading and unloading device of the plate-shaped body being operable, and the plate-shaped body and the air-blowing means supported by the supporting means. It is preferable that the height of the gap is lower than the height of the operating region.

Moreover, the 2nd aspect of the plate-shaped object cooling apparatus of this invention provided in order to solve the same subject can be blown toward the plate-shaped body arrangement means by which the plate-shaped object which is cooling object is arrange | positioned, and the plate-shaped body arrange | positioned at the said plate body arrangement means. A plate-shaped body cooling device which has a blowing means, is capable of dispensing the plate-like body from the side with respect to the plate-like body arranging means, and arranged above the blower means, wherein the plate-like body arranging means supports the plate-like body from below. And a blowing means arranging portion in which the blowing means is disposed so as to be capable of blowing from below toward the plate-like body supported by the supporting means, and an operating area formed on the side of the blowing means arranging portion. In characterized in that the mobile device for loading and unloading the plate-shaped body is operable.

In the plate-shaped body cooling device of the present invention, the blower means is disposed in the blower means arrangement portion formed in the plate-like body arrangement means. On the other hand, the plate-shaped object arranging means has an operating area on the side of the blowing means arranging part, and this operating area can be effectively used as an area for operating the mobile loading apparatus in order to put the plate-shaped object in and out. For this reason, the apparatus structure of the plate-shaped object cooling apparatus of this invention is compact.

In addition, as described above, when the operating region for the mobile loading apparatus is formed on the side of the blower, the operating region having a size sufficient to operate the mobile loading apparatus can be formed even if the height of the supporting means is lowered by that amount. It can be secured. Therefore, in the plate-shaped body cooling apparatus of this invention, the space | interval of the plate-shaped body supported by the support means and the blowing means can be made small. Moreover, the blowing means employ | adopted in the plate-shaped object cooling apparatus of this invention is arrange | positioned so that air can be blown from below toward a plate-shaped object. For this reason, in the plate-shaped object cooling apparatus of this invention, the wind from the blower means passes through the narrow space formed between the plate-shaped member and the blower means. Therefore, in the plate-shaped body cooling apparatus of this invention, the wind speed of the wind which flows between a plate-shaped body and a blowing means is fast, and the plate-shaped body is cooled smoothly by that much.

It is preferable that the plate-shaped object cooling apparatus of this invention mentioned above is equipped with the air cooling means which can cool the air which flows from a blowing means toward a plate-shaped object, and flows along a plate-shaped object.

According to this structure, it is possible to cool the air blown from the blowing means by the air cooling means for cooling the plate-like body, and the plate-like body can be cooled more smoothly.

In addition, in the plate-shaped body cooling device of the present invention described above, a plurality of blowing means are arranged in the plate-shaped body arranging means at intervals, and are located above the blowing means via a space formed at a position adjacent to the blowing means. It is preferable that air can pass between the space on the side and the space on the lower side.

In the plate-shaped body cooling device of the present invention, the air blown from the blowing means toward the plate-like body, and the air heated by heat exchange is directed from the space above the blowing means toward the space below through the space formed on the side of the blowing means. I can pass it. For this reason, in the plate-shaped object cooling apparatus of this invention, air which became hot by heat exchange is hard to be caught between a blowing means, a plate-shaped object arrangement means, and a plate-shaped object. Therefore, according to this invention, a plate-shaped object can be cooled smoothly.

In addition, with the above-described configuration, since a plurality of blowing means are arranged for the plate body, the air that has become hot due to heat exchange with the plate body locally between the blowing means, the plate arrangement means and the plate body. Can be prevented. For this reason, according to this invention, the plate-shaped object cooling apparatus which can cool a plate-shaped object almost uniformly regardless of a site | part can be provided.

In the above-described plate-like body cooling device, a plurality of blower means is provided in the plate-like body arrangement means, and in the state where the plate-like body is arranged above the plate-like body arrangement means, the plate-like body is formed in the region on the outer peripheral side of the plate-like body. It is preferable that the wind speed of the air which flows along the board | substrate is slower than the wind speed of the air which flows along the said plate-shaped object in the area | region at the center side of the said plate-shaped object.

According to the above-described configuration, usually, the cooling ability at the center side portion can be increased with respect to the peripheral portion of the plate-like body in which heat dissipation is likely to be greatly cooled, and the temperature distribution as the whole plate-like body can be almost uniform. Therefore, according to the plate-shaped object cooling apparatus of this invention, a plate-shaped object can be cooled smoothly regardless of a site | part.

In the above-described plate-shaped body cooling device of the present invention, the plate-shaped body arranging means has a skeletal structure configured by combining a quantity and a horizontal amount, and the blowing means arranging portion formed between adjacent kinds of quantities is blown to Means are provided, and it is possible that the side of the blowing means arranging portion is formed such that an operating region capable of operating the device for loading and unloading the plate-like body is elongated along the amount thereof.

Moreover, the plate-shaped body cooling apparatus of this invention mentioned above has the air supply means which can supply air with respect to a hollow plate-shaped object arrangement means, and a plate-shaped object arrangement means is equipped with the air blower which functions as a blowing means. In addition, it is also possible to set the blower to have a blower that can discharge air introduced into the plate-shaped body arranging means and eject the air to the plate-shaped body.

In addition, the heat treatment system of the present invention includes a heat treatment apparatus for heat treatment of the plate-like body, the above-described plate-shaped body cooling device, and a mobile loading device for extracting the heat-treated plate-shaped body and carrying it into the plate-shaped body cooling device. Doing.

Since the heat processing system of this invention is equipped with the plate-shaped body cooling apparatus mentioned above, the plate-shaped object heat-processed by the heat processing apparatus can be cooled smoothly. For this reason, according to the heat processing system of this invention, a series of operations from heat processing of a plate-shaped object to cooling can be performed efficiently.

According to the present invention, it is possible to provide a plate cooling device which has a compact device configuration, which is capable of cooling the heat-treated plate-shaped body almost uniformly and smoothly, and the plate-shaped body cooling device.

Subsequently, the heat treatment system 1 and the plate-shaped cooling device 10 according to one embodiment of the present invention will be described in detail with reference to the drawings.

As shown in FIG. 1, the heat treatment system 1 includes a heat treatment apparatus 2, a plate cooling apparatus 10 (hereinafter, simply referred to as a cooling apparatus 10), and a mobile loading apparatus 11 configured in a robot hand. ). The heat treatment apparatus 2 inputs the board | substrate (plate-shaped object), such as a glass plate, into the heat treatment apparatus 2, and heat-processes it.

The cooling apparatus 10 is for cooling the board | substrate heat-processed by the heat processing apparatus 2. As shown in FIG. The cooling device 10 has a configuration in which a plurality of plate-shaped object arranging means 20 are arranged at predetermined intervals in the vertical direction. As shown in FIG. 3, FIG. 4B, FIG. 4C etc., the operation area | region 25 is formed in each plate-shaped arrangement | positioning means 20. As shown in FIG. Moreover, the blowing means arrangement | positioning part 30 is formed in each plate-shaped arrangement | positioning means 20. As shown in FIG. The blowing means 40 is arranged in the blowing means placing unit 30.

More specifically, as shown in FIG. 3, the plate-shaped body arranging means 20 arranges the ten sub-quantities 21 in substantially parallel at predetermined intervals, and the horizontal amounts 22 at both ends thereof. It has a skeletal structure equipped with. As for the plate-shaped object placement means 20, the amount of quantity 21 extends toward the depth direction (up-down direction in FIG. 3) of the cooling apparatus 10, and the horizontal quantity 22 is the width direction (FIG. Of the cooling apparatus 10). It is arrange | positioned so that it may extend to left and right directions in 3).

A plurality of support pins 23 are arranged in the vertical amount 21 at predetermined intervals in the longitudinal direction thereof. In addition, when the amount 21 is set to the amount 21a to 21j in the order of arranging the plate-shaped arrangement means 20 in the width direction, the amount-of-amount 21a, 21j located at both ends of the plate-shaped arrangement means 20 in the width direction. ) Forms an outer frame of the plate-shaped body disposing means 20. An operating region 25 is formed between the vertical amounts 21a and 21j and the vertical amounts 21b and 21i at positions adjacent to the inner side in the width direction thereof. Similarly, the operating region 25 is also formed between the sub-21c and 21d, between the sub-2121 and 21f and between the sub-21g and 21h. The operating region 25 extends linearly along the amounts 21a to 21j, respectively.

Moreover, the plate-shaped object arranging means 20 is a ventilation means arrangement | positioning part 30 between the sub-quantities 21b and 21c, between the sub-quantities 21d and 21e, between the sub-quantities 21f and 21g, and between the sub-quantities 21h and 21i. Has As shown in FIG. 3 and FIG. 4A, each blower means arrangement | positioning part 30 is provided with four blower means 40 by every predetermined space | interval in the longitudinal direction of sub-quantity 21b-21i. Moreover, the air cooling means 50 is arrange | positioned with respect to each blowing means 40 adjacent to the longitudinal direction both sides of the amount 21b-21i.

As shown in FIG. 5A, the blowing means 40 includes a blowing fan 41 and a filter 43. The blowing fan 41 is mounted in a posture in which the inlet port 45 faces downward, and the exhaust port 46 faces upward. The filter 43 is composed of a conventionally known HEPA filter (High Effciency Particulate Air Filter), and is disposed above the exhaust port 46 of the blower fan 41. For this reason, the blowing means 40 can clean | clean the air sucked in from the intake port 45 located below through the filter 43, and can discharge | release upward from the upper surface 47 of the filter 43. Do. In addition, the upper surface 47 of the filter 43 is located at a position slightly lower than the distal end portion of the support pins 23 provided in the respective types 21. Specifically, in the case where the substrate W is disposed on the support pin 23, the gap s between the rear surface of the substrate W and the upper surface 47 of the filter 43 is narrow, and the plate-shaped arrangement portion ( It is sufficiently low with respect to the height h from the bottom of 20) to the tip of the support pin 23. That is, compared with the height h of the operating area 25 on the side of the blowing means 40, the height of the gap s is sufficiently small. For this reason, as shown by the arrow at FIG. 5A, when the blowing fan 41 is operated in the state which has arrange | positioned the board | substrate W on the support pin 23, the upper surface 47 and the board | substrate of the filter 43 are board | substrate. Air flows through the space | interval a little gap s formed between (W).

The air cooling means 50 is comprised by the water-cooling cooling apparatus. The air cooling means 50 is connected to the water supply source which is not shown through the refrigerant circulation path 51 (FIG. 2). The air cooling means 50 can cool the air by heat exchange with water (refrigerant) circulating through the refrigerant circulation path 51. As shown by the arrow in FIG. 5A, the air discharged toward the board | substrate W from the blowing means 40 located in the position adjacent to the air cooling means 50 is the upper side of the plate-shaped arrangement | positioning means 20. FIG. After flowing along the substrate W, it is introduced into the air cooling means 50. For this reason, the air cooling means 50 can cool the air discharged | emitted from the blowing means 40. FIG.

Next, the processing method of the board | substrate W by the heat processing system 1 is demonstrated centering on the operation | movement of the cooling apparatus 10. FIG. The substrate W processed by the heat treatment system 1 is fed into the heat treatment apparatus 2 using a robot hand or the like. Then, the board | substrate W is exposed and heat-processed in the atmosphere adjusted to predetermined temperature (230 degreeC-250 degreeC in this embodiment) over predetermined time.

When the heat treatment by the heat treatment apparatus 2 is completed as described above, the substrate W is extracted from the heat treatment apparatus 2 by the mobile loading apparatus 11. The board | substrate W of heat processing completion is arrange | positioned on the thing which did not cool the board | substrate W among the several plate-shaped object arrangement means 20 which comprises the cooling apparatus 10. FIG. More specifically, the mobile loading apparatus 11 has a fork portion 12 having five fork pawls 13 as shown in FIG. 1, and the fork portion 12 is subjected to a heat treatment apparatus. The substrate W can be extracted from the heat treatment apparatus 2 by being pulled up below the substrate W in (2) and pulled out from the heat treatment apparatus 2.

When the substrate W is extracted from the heat treatment apparatus 2 as described above, the fork portion 12 of the mobile stacking apparatus 11 faces the cooling apparatus 10 side with the substrate W mounted thereon. . Thereafter, the fork portion 12 of the mobile stacking device 11 is fitted above the non-cooling process of the substrate W in the plate-shaped body arranging means 20 constituting the cooling device 10. At this time, the height of the fork part 12 is adjusted so that the board | substrate W may not interfere with the support pin 23 provided in the plate-shaped object mounting means 20. As shown in FIG. Moreover, the fork part 12 is adjusted to the position which each fork pawl 13 can penetrate into each operation area | region 25 which comprises the plate-shaped object arrangement means 20. As shown in FIG. After adjusting in this way, the fork part 12 is inserted from the front side (one side amount 22 side) of the plate-shaped arrangement | positioning means 20 adjacent up and down toward the inside (the other side amount 22 side). On the ground, each fork pole 13 of the fork portion 12 is slowly lowered in the operating area 25. Thereby, the board | substrate W mounted in the fork part 12 will be in the state loaded on the support pin 23 provided in the plate-shaped arrangement | positioning means 20 many. Thereafter, each fork pole 13 of the fork portion 12 is horizontally moved in the opposite direction to the front along the respective amounts 21, and is ejected from each of the operating regions 25.

When the blower fan 41 of the blowing means 40 provided in the plate-shaped arrangement means 20 is provided in the state in which the board | substrate W was arrange | positioned in the plate-shaped arrangement means 20, it will be at the arrow of FIG. 5A. As shown in the drawing, a circulation flow of air occurs. In detail, when the blower fan 41 is operated, the air sucked from the inlet port 45 provided on the bottom face becomes an upward flow and flows from the exhaust port 46 toward the filter 43. The air discharged from the exhaust port 46 is further purified through the filter 43 and then blown out from the upper surface 47 of the filter 43 toward the substrate W above.

Here, as described above, the gap s between the upper surface 47 of the filter 43 and the substrate W is extremely small. For this reason, the air discharged from the filter 43 flows in order without being pushed between the upper surface 47 and the back surface of the board | substrate W, and cools the board | substrate W. FIG. Air passing through the back surface of the substrate W is then cooled by the air cooling means 50 at positions adjacent to both sides of each blowing means 40. The air which flowed in and cooled by the air cooling means 50 flows out to the bottom face side of the plate-shaped object arrangement means 20. The air cooled in this way is sucked from the inlet port 45 of the blowing means 40 at the position adjacent to each air cooling means 50, and is used for cooling the board | substrate W. As shown in FIG.

When the substrate W is cooled to a predetermined temperature by the circulation flow generated by the operation of the blower fan 41, the mobile stacking device 11 is fitted below the substrate W. At this time, the mobile loading apparatus 11 is fitted in the same operation as when the substrate W is placed on the plate-shaped body arranging means 20 for the cooling treatment. That is, in each of the operating regions 25 formed in the plate placement means 20 supporting the substrate W of the cooling treatment, each fork pole 13 of the mobile stacking device 11 is provided with plate-like placement means ( It fits along each quantity 21 from the side of 20). When each fork pole 13 is fitted to the inner side of the plate-shaped arrangement means 20, each fork pole 13 is lifted upward in each operating area 25. Thereafter, each fork pawl 13 of the mobile stacking device 11 is horizontally moved along each type 21, and ejected from each working area 25. Thereby, the board | substrate W is taken out from the plate-shaped object cooling apparatus 10, and a series of cooling processes are completed.

As mentioned above, in the cooling apparatus 10 of this embodiment, the blowing means 40 is arrange | positioned at the blowing means arrangement | positioning part 30 formed in the plate-shaped object arrangement means 20. As shown in FIG. Moreover, the operation area | region 25 is formed in the side of the blowing means 40 of the plate-shaped object placement means 20, and can use this effectively for the taking-out of the board | substrate W. As shown in FIG. Therefore, the apparatus of the plate-shaped object cooling apparatus 10 is compact.

In addition, since the cooling device 10 can effectively use the space formed on the side of the blower means 40 as the operating region 25 for the mobile stacking device 11, the height of the support pin 23 is moved. It can be made sufficiently lower than the height required for the operation of the device 11 (ie, the height of the operating area 25). Therefore, in the cooling apparatus 10, when the board | substrate W is arrange | positioned on the plate-shaped object placement means 20, the air blown off to the board | substrate W according to the operation of the blower fan 41 is the upper surface of the filter 43. The slight gap s formed between the 47 and the substrate W passes at high speed, and the substrate W is smoothly cooled.

Although the blowing means 40 was equipped with the filter 43 on the blowing fan 41, this invention is not limited to this. Specifically, the filter 43 may not be provided with respect to one part or all part of the ventilation means 40 provided in multiple numbers, and the filter 43 may be attached to another site | part.

The above-mentioned cooling apparatus 10 adjusts the magnitude | size of the space | interval s of each blowing means 40 and the board | substrate W, and adjusts the wind speed of the air which flows between the blowing means 40 and the board | substrate W appropriately. Can be adjusted. Specifically, by reducing the gap s between the blowing means 40 and the substrate W, the air velocity between the air can be increased. More specifically, for example, by adjusting the thickness of the filter 43 or by adjusting the height of the air blowing means 40, the size of the gap s between the air blowing means 40 and the substrate W is adjusted. It is also possible to adjust the wind speed of the air blown from the blowing means 40 toward the substrate W and flowing between the upper surface 47 of the filter 43 and the substrate W.

In addition, in the case where the air blowing means 40 having different thicknesses of the filter 43 is provided as described above, the flow resistance of air is different from each other under the influence of the thickness of the filter 43. For this reason, in this case, if the rotation speed of the blower fan 41 is the same, the air velocity or the substrate W of the air blown out from the blower means 40 toward the substrate W by the air flow resistance are different. ) Cooling efficiency is different. Therefore, in the case of adjusting the size of the gap s by the thickness of the filter 43, the difference in the magnitude of the flow resistance of the air due to the difference in the thickness of the filter 43 is added, It is preferable to adjust the rotation speed.

In the cooling device 10 disclosed in the above embodiment, the plurality of blower means 40 provided in the plate-shaped object placing means 20 may be capable of blowing all toward the substrate W at the same wind speed. On the other hand, in the case where the occurrence of the temperature gap of the substrate W is to be prevented further reliably, the blowing speed at the blowing means 40 at the position corresponding to the outer circumferential side of the substrate W is increased. It is preferable to adjust so that it may become slower than the blowing speed in the blowing means 40 located below the center area | region.

The said cooling apparatus 10 has the air cooling means 50, and can cool the air which flowed along the board | substrate W and became high temperature by this. For this reason, according to this embodiment, low-temperature air can be always assigned to the board | substrate W, and the board | substrate W can be cooled rapidly. Moreover, in the said embodiment, although the structure which provided the air cooling means 50 in the both sides of each air blowing means 40 was illustrated, this invention is not limited to this, The air provided in multiple in the said embodiment is provided. A portion of the cooling means 50 may not be provided, or as shown in FIG. 6, the air cooling means 50 may not be provided at all. In addition, as shown in FIG. 5B, the air cooling means 50 is provided below or above the blowing means 40 (downward in FIG. 5B), or the cooling means 40 is comprised like FIG. 5C. The air cooling means 50 may be provided instead of the filter 43.

As described above, when a part or all of the air cooling means 50 is not provided, as shown in FIG. 6, a space 55 communicating vertically is formed in this portion. In this way, when a space communicating in the vertical direction of the plate-shaped body arranging means 20 is formed at a position adjacent to the blowing means 40, a part of the air heated by the cooling of the substrate W via this. Can be sent from the space above the blowing means 40 toward the space below. Therefore, also in the case of employing the configuration as shown in FIG. 6, the air heated by the cooling of the substrate W is hardly caught on the back surface of the substrate W, and the substrate W can be cooled smoothly without a gap. In addition, in this case, if a blower is provided separately in the side of the cooling apparatus 10, and it is set as the structure which sends an outside air by this blower, further cooling effect can be improved.

The above-mentioned cooling apparatus 10 cools the board | substrate W only from the downward side by each blowing means 40, but this invention is not limited to this. Specifically, for example, in the cooling device 10, the blower means 40 and the blower fan 41 are provided on the bottom surface side of the other plate member placing means 20 above each plate member placing means 20. It is good also as a structure which installed the equivalent thing. With such a configuration, the air can be ejected and cooled not only from below the substrate W but also from above, and the cooling efficiency can be further increased.

For example, as shown in FIG. 7, the blower means 40 is provided in the lower surface side of the plate-shaped object placement means 57 provided so that it may be arranged in the up-down direction, and the airflow by this adjoins a downward side. It is good also as a structure which sprays and cools to the board | substrate W arrange | positioned on the support pin 23 provided in the plate-shaped object mounting means 57 in this. As shown in FIG. 7, when the blowing means 40 is arrange | positioned in the position which adjoins with respect to the board | substrate W, and the space | interval of both is made small, the wind which generate | occur | produced by the operation of the blowing means 40 will be blown means 40 ) And the substrate W in order at high speed, so that the substrate W is smoothly cooled.

In addition, when the blower means 40 is installed in the position close to the upper direction with respect to the board | substrate W as shown in FIG. 7, the fork pole 13 of the mobile loading apparatus 11 is inserted, and the board | substrate W is taken in and out. In this case, there is a possibility that the distance between the substrate W and the blowing means 40 becomes narrower with respect to the height required for the substrate W or the mobile loading apparatus 11 to move up and down. When such a state is assumed, it is preferable to make the support pin 23 expandable and contractible in the up-down direction, or to make it the structure which can enlarge the space | interval of the plate-shaped body arrangement means 57 adjacent to upper and lower sides.

In the above embodiment, a plurality of blower means 40 including a blower fan 41 are separately provided to the plate-shaped body arrangement means 20 having a skeletal structure formed by combining the sub-quantity 21 and the transverse amount 22. Although one structure was illustrated, this invention is not limited to this. Specifically, for example, the plate-like body arranging means 65 and the plate-like body cooling device 60 (hereinafter also referred to simply as the cooling device 60) shown in Figs. 8A, 8B and 9, An air supply unit 66 capable of supplying air to the cooling apparatus main body 67, and a blowing unit 68 (blowing means) that functions as a blowing means to the plate-shaped body arranging means 65, or a mobile loading apparatus 11; It is also possible to form an operating region 70 for operation.

In more detail, in the cooling apparatus 60 shown in FIG. 9, the left side is the inlet side of the cooling apparatus 60, and the right side is the back side in the figure. The cooling device 60 is able to take out and take out the board | substrate W by advancing the fork pawl 13 to the depth direction from an entrance side. The plate-shaped object arranging means 65 constituting the cooling device 60 is hollow as shown in Figs. 8A and 8B. The connection port 65a is provided in the bottom face side of the plate-shaped object placement means 65, and the air introduced through this can spread | diffused widely in the whole inside of the plate-shaped object placement means 65. As shown in FIG. The connection port 65a is unevenly distributed on the back side of the cooling device 60.

The air supply means 66 is pipe-connected to the connection port 65a. The air supply means 66 has a blower 66a and a filter 66b. The blower 66a sucks air in the cooling device main body 67 and feeds it toward the plate-shaped body arranging means 65 side. In addition, the filter 66b is comprised from what is called a HEPA filter like the filter 43 employ | adopted in the cooling apparatus 10 mentioned above. The filter 66b is arrange | positioned between the blower 66a and the plate-shaped object arrangement | positioning means 65, and it is possible to capture the dust contained in the air conveyed by the blower 66a.

Moreover, the air cooling means 69 is provided in the plate body arranging means 65 in the position adjacent to the connection port 65a. The air cooling means 69 is for cooling the air introduced into the plate member arranging means 65 from the connection port 65a. As the air cooling means 69, a suitable thing such as water cooling or the like can be adopted as the air cooling means 50 included in the cooling device 10 described above.

As shown in FIG. 8A and FIG. 8B, the bottom face of the plate-shaped object arranging means 65 is inclined so that it may go upward as it moves toward the advancing direction front side of the fork pawl 13 from the connection port 65a. Thereby, the plate-shaped object arranging means 65 becomes narrow in cross section in the plate-shaped object arranging means 65 which becomes an air flow path as it goes to the downstream side from the upstream of the flow direction of air.

Further, a plurality of blowers 68 are formed on the top surface side of the plate-shaped body arranging means 65. The blower part 68 is a rectangular parallelepiped part which protruded upwards from the top surface side of the plate-shaped object mounting means 65, as shown to FIG. 8A and FIG. 8B. In addition, as shown in FIG. 9, the blower part 68 has a plurality of vertically and horizontally in the state which looked at the plate-shaped body arrangement means 65 from the top surface side in plan view (four each in the vertical and horizontal directions in the example shown in FIG. 9). It is formed to enumerate.

In the top surface 68a of each blower 68, a plurality of blowers 68b formed of small holes are formed. In addition, support pins 23 are placed in four corners of each blower portion 68, and the substrate W can be arranged above this. For this reason, each air blower 68 has a structure which can discharge the air introduced into the plate-shaped object arranging means 65 upwards from the air blower 68b, and can blow out toward the board | substrate W. As shown in FIG.

In the state shown in FIG. 9, when the part in which four air blowers 68 were arrange | positioned in the horizontal direction is assumed to be the air blow means arrange | position part 71, respectively, the both sides parts of each air blow means arrange | position part 71 are a board | substrate. It becomes an area used as the operating area 70 for moving the mobile loading apparatus 11 forward and backward for the withdrawal of (W). The portion where the operating region 70 is formed is further lower than the blower portion 68. The sum of the heights of the support pins 23 and the blower parts 68 installed in the blower unit 68, that is, the distance between the front end of the support pins 23 and the bottom surface of the operating region 70, is taken out of the substrate W. The mobile loading device 11 is of sufficient height to operate.

Next, the cooling processing method of the board | substrate W using the cooling device 60 is demonstrated centering on the operation | movement of the cooling device 60. FIG. The cooling device 60 is usable in place of the cooling device 10 in the heat treatment system 1 described above, and is used to cool the substrate W on which the heat treatment by the heat treatment device 2 is completed. When cooling the board | substrate W by the cooling apparatus 60, the fork part 12 of the mobile loading apparatus 11 which mounts the board | substrate W is fitted above the plate-shaped object mounting means 65. As shown in FIG. At this time, the height of the fork part 12 is adjusted so that the board | substrate W may not interfere with the support pin 23 installed in the blower part 68. FIG. In addition, the fork part 12 is positioned so that each fork pawl 13 can penetrate into each operation region 70. Thereafter, the fork portion 12 is fitted from the inlet side (left side in FIG. 9) of the cooling device 60 toward the inside (right side in FIG. 9).

When the fork portion 12 enters the inside of the cooling device 60, the fork portion 12 is slowly lowered in the operating region 70. Thereby, the board | substrate W will be in the state which moved to the support pin 23 from the fork part 12. When the movement loading of the board | substrate W is completed, the fork part 12 will move horizontally and will be taken out from the operation area 70. FIG.

As described above, when the blower 66a of the air supply means 66 is operated in the state where the substrate W is set on the plate-like arrangement means 65, as shown by arrows in FIG. 8A, Air is introduced into the connector 65a. After this air is cleaned through the filter 66b, the air is introduced into the plate member arranging means 65. Air introduced into the plate-like arrangement means 65 flows toward the blower portion 68 provided on the top surface side of the plate-like arrangement means 65. The air which has reached each blowing part 68 blows toward the board | substrate W located upward from the blowhole 68b provided in the top surface 68a, as shown by the arrow at FIG. 8B.

Air blown toward the substrate W flows toward the periphery of the blower 68. Here, as mentioned above, the blower part 68 protrudes in a rectangular parallelepiped shape from the top surface side of the plate-shaped object placement means 65, and comprises the part which comprises the operation area 70, and the blower means arrangement | positioning part 71 The part between blower parts 68 listed in the () is further lower than the blower part 68. For this reason, the air blown toward the board | substrate W is not interposed between the blower part 68 and the board | substrate W, but arrange | positions a plate-shaped object through the lower groove-shaped area | region formed in the side of the blower part 68. It flows toward the outer peripheral side of the means 65. Then, this air is discharged toward the outer side of the plate-shaped object arranging means 65.

As described above, when the substrate W is cooled to a predetermined temperature by the air flow blown out of the blower 68, the mobile stacking device 11 is fitted into the operating region 70, and the substrate (W) is lifted. Thereafter, when the substrate W is discharged from the cooling device 60 by the mobile loading device 11, a series of cooling treatments are completed.

As described above, in the cooling device 60, a plurality of air blowers 68 protruding upward are provided on the top surface side of the plate-shaped object arranging means 65. In addition, there is an operating region 70 on the side of the blowing means arranging portion 71 formed by arranging the blowing portions 68 in a line, and the operating region 70 is effective as an operating space of the mobile loading apparatus 11. Available. For this reason, in the cooling device 60, the height of the support pin 23 can be suppressed to the minimum.

Moreover, in the cooling device 60, since the height of the support pin 23 may be minimum, the space | interval of the board | substrate W arrange | positioned on the support pin 23 and the top surface 68a of the air blower 68 is small. . For this reason, in the cooling device 60, the low temperature air which flows out from the tuyeres 68b of the blower part 68 flows in a high speed between the board | substrate W and the top surface 68a. Therefore, according to the cooling device 60, the board | substrate W can be cooled rapidly.

In the cooling device 60, since the blower part 68 is higher than another part, the part between the blower parts 68 in the position which adjoins longitudinally and horizontally in the state seen from the plane is used for letting air pass. It functions as a home. For this reason, the air blown toward the board | substrate W from the air blower 68 in the cooling device 60 is not caught between the air blower 68 and the board | substrate W, and it is the side of the air blower 68. The groove-shaped portion formed in the flows toward the outer circumferential side of the plate-shaped body arranging means 65 and is discharged. Therefore, in the cooling device 60, the air heated by heat exchange with the board | substrate W is discharged | emitted smoothly toward the outer side of the plate-shaped object placement means 68. FIG. In addition, in the cooling device 60, since the air heated by cooling of the board | substrate W is discharged | emitted smoothly from under the board | substrate W, the board | substrate W is cooled almost uniformly without gap.

The cooling device 60 does not need to provide a plurality of blowing means 40, air cooling means 50, and filters 43 like the cooling device 10 described above. In addition, if it is set as the structure similar to the cooling apparatus 60, as a blower 66a, the thing larger than the blowing fan 41 employ | adopted by the blowing means 40 can be used. For this reason, if it is set as the structure similar to the cooling apparatus 60, manufacturing cost can be held down.

In the cooling device 60, the bottom face of the plate-shaped object arranging means 65 is inclined upwardly toward the downstream side in the flow direction of air (left side in Figs. 8A and 8B), and the cross-sectional area of the portion through which air flows. Is gradually smaller. For this reason, the flow velocity of the air which flows in the plate-shaped arrangement | positioning means 65, and the air which blows out from each blowing part 68 is a part of the upstream side which is close to the connection port 65a, and the downstream side separated from the connection port 65a. It is almost uniform with no big difference in part. Therefore, in the cooling apparatus 60, air can be blown toward the board | substrate W with a substantially uniform wind speed with respect to the board | substrate W regardless of a site | part, and the board | substrate W can be cooled almost uniformly without the gap. have. Moreover, in the above-mentioned cooling apparatus 60, although the structure which made the bottom surface of the plate-shaped object placement means 65 incline in consideration of making the flow velocity of the air blown out from each blower part 68 almost uniform, The invention is not limited to this, and the bottom face of the plate-shaped arrangement means 65 may be substantially horizontal.

In the said embodiment, although the structure which provided the connection port 65a was provided in the bottom face of the plate-shaped object placement means 65, this invention is not limited to this, The connection port 65a is provided in the side surface of the plate-shaped object placement means 65. ) May be formed. In addition, in the example shown to FIG. 8A and FIG. 8B, although the connection port 65a is formed in the position unevenly distributed in the outer peripheral side of the plate-shaped object arranging means 65, this invention is not limited to this, An example is shown. For example, you may make it the structure formed in the vicinity of the center of the bottom face of the plate-shaped arrangement | positioning means 65. FIG.

In the above-mentioned cooling apparatus 60, the blowing means arranging part 71 for a plurality of rows (four rows in the example shown in FIG. 9) via the plate-shaped object arranging means 65 integrally formed through the operation area | region 70. FIG. Although the structure which formed () was illustrated, this invention is not limited to this. Specifically, the blower means arrangement | positioning part which consists of parts corresponded to the blower means arrangement | positioning part 71 in the said plate-shaped object arrangement | positioning means 65 like the plate-shaped object arrangement | positioning means 80 shown in FIG. A plurality of 81s are arranged at predetermined intervals, and the air supply means 66 is piped to each blowing means placing portion 81, and the spaces on both sides of each blowing means placing portion 81 are moved. It may be utilized as the operating region 82 for operating the stacking device 11. In the case of the configuration as shown in Fig. 10, instead of providing the air cooling means 69 on the downstream side of the air supply means 66 as in the example shown in Figs. When the air cooling means 83 is provided on the upstream side of the air supply means 66, the air cooling means 83 does not need to be provided for each air blowing means placement portion 81, and the apparatus configuration can be simplified. have.

In the example shown in FIG. 9 and FIG. 10, although the opening diameter and arrangement density of the tuyeres 68b provided in each ventilation part 68 are the same regardless of a site | part, this invention is not limited to this, A tuyeres The opening diameter and the arrangement density of the 68b may be different depending on the sites. Specifically, the opening diameter of the air vent 68b provided in the air blower 68 located in the position corresponding to the center side of the board | substrate W in the state which arrange | positioned the board | substrate W upwards, for example, is a board | substrate. On the outer circumferential side of the blower 68 at a position corresponding to the center side of the substrate W, or larger than the blower 68b provided on the blower 68 at the position corresponding to the outer circumferential side of (W). It is good also as a structure which provided more ventilation openings 68b than the blowing section 68 located in a corresponding position. With such a configuration, it is possible to raise the cooling capacity at the center portion rather than the peripheral portion of the substrate W, which is normally assumed to be largely easy to radiate heat, and to cool the entire substrate W almost uniformly without a gap.

BRIEF DESCRIPTION OF THE DRAWINGS The apparatus block diagram which shows the heat processing system which concerns on one Embodiment of this invention.

Fig. 2 is an apparatus block diagram showing the internal structure of the plate-shaped cooling device.

3 is a plan view showing the plate-shaped body disposing means;

4A is a sectional view taken along the line A-A of FIG. 3, FIG. 4B is a sectional view taken along the line B-B of FIG. 3, and FIG. 4C is a sectional view taken along the line C-C of FIG.

FIG. 5A is a side view schematically showing the structure and air flow in the vicinity of the blowing means in the plate-shaped arrangement means shown in FIG. 3, and FIGS. 5B and 5C are modified examples of the arrangement of the blowing means and the air cooling means, respectively. Side view showing the.

FIG. 6 is a plan view showing a modification of the plate-shaped body disposing means shown in FIG. 3. FIG.

7 is an enlarged side view of a main portion of a modification of the plate-shaped body disposing means;

8A is a device configuration diagram showing a modification of the plate cooling apparatus shown in FIG. 2, and FIG. 8B is an enlarged cross-sectional view of part A of FIG. 8A.

9 is a plan view of the plate cooling apparatus shown in FIGS. 8A and 8B.

10 is a plan view illustrating a modification of the plate cooling apparatus shown in FIGS. 8A, 8B, and 9.

Explanation of symbols on the main parts of the drawings

1: heat treatment system

2: heat treatment device

10, 60: plate cooling device (cooling device)

11: mobile loading device

20, 65, 80: plate placement means

23: support pin (support means)

25, 70, 82: operating area

40: blowing means

41: blower fan

43: filter

50, 69, 83: air cooling means

55: space

68: blower (blowing means)

W: Substrate

Claims (10)

Plate-like arrangement means on which the plate-like object to be cooled is arranged; Have a means of blowing, As a plate-shaped object cooling apparatus which can take out said plate-shaped object from the side with respect to the said plate-shaped object arrangement | positioning means, and can arrange | position it on the said plate-shaped body arrangement | positioning means, The plate-shaped body arranging means has support means for supporting the plate-shaped body from below, And said blower means is capable of blowing toward said plate body from a position proximate to the up and down direction with respect to said plate body. The method of claim 1, On the side of the blowing means, it has an operating area in which the mobile stacking device for putting in and out of the plate-shaped body is operable, The plate-shaped body cooling apparatus characterized by the height of the clearance gap of the plate-shaped object supported by the support means and the blowing means being lower than the height of the said operation area | region. Plate-like arrangement means on which the plate-like object to be cooled is arranged; It has a blowing means capable of blowing toward the plate-like body disposed in the plate-like body arrangement means, As a plate-shaped object cooling apparatus which can take out said plate-shaped object from the side with respect to the said plate-shaped body arrangement means, and can arrange | position above the said blowing means, The plate-like arrangement means, Support means for supporting the plate body from below; A blowing means arranging portion in which the blowing means is disposed so as to be capable of blowing from below toward the plate-like body supported by the supporting means; Has an operating area formed on the side of the blowing means arrangement, The plate-shaped body cooling apparatus, characterized in that the movable loading and unloading device for the plate-shaped body in the operating area. The method of claim 3, wherein The plate-shaped body cooling apparatus characterized by the height of the clearance gap of the plate-shaped object supported by the support means and the blowing means being lower than the height of the said operation area | region. The method according to any one of claims 1 to 4, And an air cooling means for cooling air that is blown from the air blowing means toward the plate body and flows along the plate body. The method according to any one of claims 1 to 4, A plurality of blowing means are arranged in the plate-shaped body arranging means at intervals, and the air is spaced between the space above and the space below the blowing means via a space formed at a position adjacent to the blowing means. The plate cooling device characterized in that the passage. The method according to any one of claims 1 to 4, The fan-shaped means is provided with a plurality of blowing means, In a state where the plate body is disposed above the plate body placing means, the wind speed of air flowing along the plate body in the region on the outer circumferential side of the plate body is along the plate body in the region on the center side of the plate body. A plate cooling device characterized by a lower speed than the wind speed of the flowing air. The method according to any one of claims 1 to 4, The plate-like body disposing means has a skeletal structure configured by combining a longitudinal quantity and a horizontal quantity, Blowing means is provided in the blowing means arrangement portion formed between adjacent sub-quantities, A side plate cooling device characterized in that the side of the blowing means arrangement portion is formed so as to extend along a vertical amount an operating region in which the mobile stacking device for putting in and out of the plate body can operate. The method according to any one of claims 1 to 4, Has an air supply means capable of supplying air to the hollow plate-like arrangement means, The plate-shaped body arranging means has a blowing part that functions as a blowing means, A fan-shaped cooling device, characterized in that the blower has an air inlet for discharging air introduced into the plate-like body disposing means to blow out the plate-like body. Having a heat treatment apparatus for heat-treating a plate-shaped object, the plate-shaped body cooling apparatus in any one of Claims 1-9, and a mobile loading apparatus which extracts the heat-treated plate-shaped body and carries it into the said plate-shaped body cooling apparatus. Heat treatment system.

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